JPH09289186A - Cleaning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable both the front and rear of a target substrate to be precisely cleaned, by a method wherein the target substrate is kept rotating in a horizontal state, cleaning liquid is sprayed on the front of the substrate together with high-frequency sonic waves, and cleaning liquid is sprayed against the rear of the substrate at the same time. SOLUTION: A semiconductor wafer 64 placed on a support block 20 located on the upper ends of four support rods 18 fixed to a rotating disc 16 is rotated. In this state, cleaning liquid or pure water is sprayed upwards on the rear of the semiconductor wafer 64 from jet orifices 26 provided to the upper part of a shower nozzle 27. On the other hand, pure water is sprayed on the surface of the rotating wafer 64 together with high-frequency sonic waves from a circular jet orifice 45 of a nozzle case 46 fitted to the lower end of a cylindrical main body 43 making high-frequency sonic waves penetrate through the semiconductor wafer 64. At the same time, a high-frequency nozzle 41 is made to reciprocate in a range which is corresponding to the radius of the wafer 64 as shown by an arrow A.

Description

Detailed Description of the Invention

[0001]

[0001] The present invention relates to a liquid crystal glass substrate,
The present invention relates to a cleaning device for cleaning a substrate to be cleaned such as a semiconductor wafer and a magnetic disk.

[0002]

2. Description of the Related Art Conventionally, liquid crystal glass substrates, semiconductor wafers,
In order to clean an object to be processed such as a magnetic disk, a plurality of the substrates to be cleaned are set upright in a processing tank, a cleaning liquid is stored in the processing tank, and then a vibrator is placed at the bottom of the processing tank. It is practiced to vibrate and radiate high frequency sound waves to the cleaning liquid to clean a plurality of substrates to be cleaned in the processing tank at one time.

However, the above method has a problem that it becomes difficult to uniformly clean the entire object to be processed as the area of the liquid crystal glass substrate increases and the diameter of the semiconductor wafer increases, which causes uneven cleaning. In addition, as the thin film transistors formed on the liquid crystal glass substrate and the elements formed on the semiconductor wafer are miniaturized and highly integrated, not only the front surface side (element forming surface side) of the substrate is precisely cleaned but also the back surface side. Is also required to be precision washed.

Therefore, the substrate to be cleaned (for example, a semiconductor wafer) is conveyed in a single-wafer type, and the rinse path, the chemical solution scrub, the pure water scrub, the high frequency cleaning nozzle, the pure water shower, and the spin are conveyed along the transfer path. Drying and washing are performed.

However, in scrub cleaning, a pair of sponge-like rolls are mechanically brought into contact with the front and back surfaces of a semiconductor wafer for cleaning, so that scratches are generated on the front and back surfaces of the wafer and contaminant particles ( There was a problem of reattachment and recontamination of particles.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to provide a high frequency cleaning apparatus capable of simultaneously precisely cleaning the front and back surfaces of a substrate to be cleaned such as a semiconductor wafer. Another object of the present invention is to provide a cleaning apparatus that prevents recontamination of a substrate to be cleaned such as a semiconductor wafer due to scattering of the cleaning liquid without using a large-sized shielding member.

[0007]

A cleaning apparatus according to the present invention comprises a holding means for holding a substrate to be cleaned in a horizontal state, a rotating means for rotating the holding means, and a positioning means arranged above the holding means. A first cleaning liquid ejecting means for ejecting a cleaning liquid riding on high frequency sound waves toward the surface of the substrate supported by the holding means; and the object supported by the holding means arranged below the holding means. Second cleaning liquid ejecting means for ejecting the cleaning liquid toward the back surface of the cleaning substrate;
It is characterized by including.

Another cleaning apparatus according to the present invention is a holding means for holding a substrate to be cleaned in a horizontal state; a rotating means for rotating the holding means; a holding means arranged below the holding means, First cleaning liquid ejecting means for ejecting a cleaning liquid on a back surface of the supported substrate to be cleaned, the cleaning liquid having a high frequency sound wave; and the substrate disposed above the holding means and supported by the holding means. And a second cleaning liquid ejecting means for ejecting the cleaning liquid toward the surface of the.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The cleaning apparatus according to the present invention will be described in detail below. This cleaning apparatus includes a holding means for holding the substrate to be cleaned in a horizontal state. The holding means is rotated by the rotating means. A high-frequency vibrating nozzle, which is a first cleaning liquid ejecting unit for ejecting the cleaning liquid on the high-frequency sound waves toward the surface of the substrate to be cleaned held by the holding unit, is arranged above the holding unit.
The second cleaning liquid ejecting unit for ejecting the cleaning liquid toward the back surface of the substrate to be cleaned held by the holding unit is disposed below the holding unit.

The high-frequency vibrating nozzle (first cleaning liquid jetting means) is of a cylindrical type and is structured to reciprocate between the rotation center of the substrate and the radial direction, and has a rectangular shape having an elongated cleaning liquid discharge port. A so-called bar type having a is used.

The holding means has a structure including a rotation support member for rotatably engaging a cylindrical fixed shaft which also serves as a cleaning liquid supply portion and horizontally supporting the substrate to be cleaned.

The rotating means has a structure including, for example, a cylindrical fixed shaft which also serves as a cleaning liquid supply section, and a drive mechanism for rotating the rotary support member about the fixed shaft. The drive mechanism includes a driven timing pulley attached to the rotation support member, a driving timing pulley, a timing belt pivotally supported between the pulleys, and a motor for rotating the driving timing pulley. Consists of.

The second cleaning liquid ejecting means has, for example, a cleaning liquid circulating portion which is integrally connected in a horizontal direction to the cylindrical fixed shaft which also serves as a cleaning liquid supply portion and which communicates with the hollow portion of the fixed shaft. A plurality of cleaning liquid injection holes that communicate with the circulation portion are formed by a shower nozzle having an opening at the top.

In the cleaning apparatus according to the present invention described above, the substrate to be cleaned, which is held horizontally by the holding means, for example, a semiconductor wafer, is rotated by the rotating means, and at the same time, is placed above the semiconductor wafer, for example, a cylindrical type. The high frequency vibration nozzle is not swept in the radial direction of the wafer, but the cleaning liquid on the high frequency sound wave passing through the wafer is sprayed from the vibration nozzle toward the surface of the semiconductor wafer. At this time, the cleaning liquid carried by the high frequency sound waves is sprayed from the high frequency vibration nozzle onto the entire surface of the semiconductor wafer. Therefore, the particles on the surface of the wafer are washed away together with the cleaning liquid, and reattachment of the particles is prevented, so that precise cleaning is performed.

Further, at the same time as the cleaning liquid riding on the high frequency sound waves from the high frequency vibration nozzle is sprayed onto the surface of the semiconductor wafer, the cleaning liquid is sprayed from the second cleaning liquid spraying means arranged below the semiconductor wafer, for example, a shower nozzle. When jetted toward the back surface of the wafer, the high-frequency sound wave from the high-frequency vibration nozzle also acts on the particles existing on the back surface of the semiconductor wafer through the semiconductor wafer, and the particles are generated by the liquid film of the cleaning liquid sprayed from the shower nozzle. Can be washed away. At this time, the high frequency sound waves that have reached the liquid film are reflected by an air layer having a large difference in acoustic impedance, pass through the inside of the wafer while acting on the particles on the back surface of the wafer, and return to the front surface side. The high frequency sound waves returning to the surface side are reflected at the interface between the liquid film and the air layer on the wafer surface, and then attenuated while repeating the same reflection as described above. Thus, by spraying the cleaning liquid from the shower nozzle to the back surface of the semiconductor wafer and forming a liquid film, the back surface of the semiconductor wafer is simultaneously precisely cleaned without disposing a high-frequency vibration nozzle below the semiconductor wafer, that is, on the back surface side. It becomes possible to do.

It is preferable that the high frequency sound waves passing through the wafer be matched in frequency so as to have a wavelength of 1 / 2λ of the resonance frequency of the wafer. Specifically, using a 5-inch wafer (thickness: 0.55 mm), the sound velocity is 8000.
When m / sec, the frequency is a positive multiple of 7.27 MHz and a 6-inch wafer (thickness: 0.65 mm) is used.
When the sound velocity is 8000 m / sec, the frequency is 6.1.
Positive multiple of 5MHz, 8-inch wafer (thickness: 0.75m
m) and the sound velocity is 8000 m / sec, the frequency is set to a positive multiple of 5.33 MHz.

Next, another cleaning apparatus according to the present invention will be described in detail. This cleaning apparatus includes a holding means for holding the substrate to be cleaned in a horizontal state. The holding means is rotated by the rotating means. The bar type high frequency vibration nozzle, which is a first cleaning liquid ejecting unit that ejects the cleaning liquid on the high frequency sound wave in a strip shape toward the back surface of the substrate to be cleaned supported by the holding unit, is arranged below the holding unit. There is. The second cleaning liquid ejecting unit for ejecting the cleaning liquid toward the surface of the substrate to be cleaned supported by the holding unit is disposed above the holding unit.

The holding means has a structure including a rotation supporting member that is rotatably engaged with, for example, a cylindrical fixed shaft and horizontally supports the substrate to be cleaned. The rotating means has a structure including, for example, the cylindrical fixed shaft and a drive mechanism for rotating the rotation support member about the fixed shaft. The drive mechanism includes, for example, a driven timing pulley attached to the rotation support member, a driving timing pulley, a timing belt pivotally supported between the pulleys, and a driving timing pulley. It consists of a motor.

The bar type high frequency vibrating nozzle (first cleaning liquid jetting means) is, for example, a rectangular nozzle having one end side fixed to the upper end of the cylindrical fixed shaft of the rotating means and having an elongated cleaning liquid discharge port on the upper surface. A rectangular block having a hole, a vibrator disposed in the block on the bottom side of the nozzle hole so as to face the discharge port, and a cleaning liquid flow formed in the block so as to communicate with the nozzle hole. And a road. The vibrator is connected to a power feeding cable introduced through the inside of the cylindrical fixed shaft. The flow path is connected to a cleaning liquid supply pipe introduced through the inside of the cylindrical fixed shaft.

The second cleaning liquid jetting means is, for example, a bar type shower nozzle having a horizontally elongated nozzle body having a plurality of jetting openings at the bottom, or a cylinder having a cylindrical nozzle body having a jetting opening at the lower end. Type shower nozzles can be used. Particularly, when a cylindrical shower nozzle is used as the second cleaning liquid ejecting means, it is preferable that the shower nozzle is arranged above the center of the substrate to be cleaned.

In the other cleaning apparatus according to the present invention described above, the substrate to be cleaned, which is held by the holding means by the rotating means, for example, the semiconductor wafer, is placed below the semiconductor wafer while being rotated in a horizontal state. A strip-shaped cleaning liquid, which is carried by high-frequency sound waves passing through the wafer, is jetted from the elongated cleaning liquid discharge port of the bar-type high-frequency vibration nozzle toward the back surface of the semiconductor wafer. At this time, the entire back surface of the semiconductor wafer is sprayed with the cleaning liquid on the high frequency sound wave from the high frequency vibration nozzle. Therefore, the particles on the surface of the wafer are washed away together with the cleaning liquid, and reattachment of the particles is prevented, so that precise cleaning is performed.

Further, at the same time as jetting the strip-shaped cleaning liquid on the back surface of the semiconductor wafer on the high frequency sound wave from the high frequency vibrating nozzle, the cleaning liquid is ejected from the second cleaning liquid ejecting means arranged above the semiconductor wafer, for example, the shower nozzle. When jetted toward the front surface of the semiconductor wafer, high-frequency sound waves pass through the semiconductor wafer from the back side and the high-frequency sound waves reflected on the surface are the same as in the above-described cleaning device in which the high-frequency vibration nozzle is arranged above and the shower nozzle is arranged below. By repeating the action of transmitting light from the side to the back side, the front side of the semiconductor wafer can be simultaneously precision cleaned.

Therefore, according to another cleaning apparatus of the present invention, the front and back surfaces of the semiconductor wafer can be simultaneously precisely cleaned. Further, when cleaning the semiconductor wafer with the high-frequency vibration nozzle, it is generally advantageous in terms of efficient cleaning to spray the cleaning liquid on the vibration nozzle close to the semiconductor wafer and carry a high-frequency sound wave. In the cleaning apparatus according to the present invention, the bar-type high-frequency vibrating nozzle arranged below can be brought close to the back surface of the semiconductor wafer, and the second cleaning liquid ejecting means arranged above, such as a shower nozzle, is similar to the high-frequency vibrating nozzle. It is possible to dispose a certain distance without being close to the semiconductor wafer.
As a result, when the semiconductor wafer after cleaning is taken out from the holding means, the semiconductor wafer can be taken out without disturbing the vibrating nozzle as in the case where the high frequency vibrating nozzle is arranged above, so that the handling property is improved. It

Further, when the cylindrical high-frequency vibrating nozzle is arranged above the semiconductor wafer and the vibrating nozzle is driven in the radial direction of the semiconductor wafer by the driving member, particles fall from the driving member to contaminate the semiconductor wafer. There is a fear. In still another cleaning apparatus according to the present invention, by disposing a bar type high frequency vibration nozzle below a semiconductor wafer, particles of a semiconductor wafer such that a swept cylindrical high frequency vibration nozzle is arranged above the semiconductor wafer. Contamination due to can be avoided.

The high frequency sound waves passing through the wafer are preferably matched in frequency so that they have a wavelength of 1 / 2λ of the resonance frequency of the wafer. Specifically, using a 5-inch wafer (thickness: 0.55 mm), the sound velocity is 8000.
When m / sec, the frequency is a positive multiple of 7.27 MHz and a 6-inch wafer (thickness: 0.65 mm) is used.
When the sound velocity is 8000 m / sec, the frequency is 6.1.
Positive multiple of 5MHz, 8-inch wafer (thickness: 0.75m
m) and the sound velocity is 8000 m / sec, the frequency is set to a positive multiple of 5.33 MHz.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the drawings. (Embodiment 1) FIG. 1 is a sectional view showing a cleaning apparatus according to Embodiment 1 of the present invention, and FIG. 2 is a first drawing used in the cleaning apparatus of FIG.
FIG. 4 is a cross-sectional view showing a high-frequency vibrating nozzle that is a cleaning liquid ejecting unit.

A motor 2 having a drive shaft 1 extending vertically.
Are housed in a cylindrical support member 3. The support plate 4 is
It is fixed on the tubular support member 3 by a plurality of screws 5. Further, holes 6 and 7 are formed in the support plate 4 at a position corresponding to the drive shaft 1 and a part extending leftward from the support member 3, respectively. A disk-shaped plate 10 having a hole 8 in the center and an annular projection 9 around the hole 8 is provided on the support plate 4 and screwed from the lower surface of the support plate 4 toward the plate 9. It is fixed by screws 11.

The processing tank 12 is arranged above the disk-shaped plate 10. The processing tank 12 has a bottomed cylindrical shape, and has a cylindrical portion 13 protruding upward at the center of the bottom. The discharge pipe 14 is connected to the bottom of the processing tank 12 near the left side wall. The processing tank 12 is supported and fixed by a mount (not shown) so that the cylindrical portion 13 is positioned concentrically with the hole 8 of the disc-shaped plate 10.

A rotating disk 16 having a cylindrical body 15 protruding downward in the center is horizontally arranged in the processing tank 12, and the cylindrical body 15 is concentric with the cylindrical portion 13 of the processing tank 12. It passes like a line and extends to the outside of the processing tank 12. On the inner peripheral surface near the lower part of the cylindrical body 15,
The annular engaging portion 17 projects in the horizontal direction. For example, four support rods 18 whose upper and lower parts are threaded are inserted into the peripheral edge of the rotary disc 16 so as to extend vertically at an equal circumferential angle (90 °), and the lower face of the rotary disc 16 is inserted. The nut 19 is screwed onto the threaded portion of the lower portion of the support rod 18 protruding from the fixed rod 18 to be fixed to the rotary disc 16. The cylindrical support blocks 20 are screwed into the threaded portions above the support rods 18 so as to be located on the same horizontal plane.

A cylindrical fixed shaft 22 having an annular flange 21 in the vicinity of the middle and having a threaded outer periphery is concentric with the inside of the cylindrical body 15 of the rotary disk 16 from the inside of the processing tank 12. And is inserted into the hole 8 of the disc-shaped plate 10. The tubular fixed shaft 22 is fixed to the plate 10 by screwing a nut 23 into a lower portion protruding downward from the lower surface of the plate 10.
In addition, at the lower end opening of the fixed shaft 22, there is formed a joint portion 24 with the cleaning liquid supply pipe. A cleaning liquid supply pipe (not shown) is connected to the joint portion 24.
The shower nozzle 27, which is a second horizontally extending cleaning liquid ejecting means having a cleaning liquid circulating portion 25 formed therein and a plurality of injection ports 26 communicating therewith and which is opened at the upper portion, is provided at a peripheral portion of the rotary disc 16. It is located in the space surrounded by the four inserted and fixed support rods 18, and is integrally formed at the tip of the fixed shaft 22 so that the hollow portion 28 and the flow portion 25 communicate with each other. Two bearings 29a, 2
9b is an inner surface of the cylindrical body 15, an outer peripheral surface of the fixed shaft 22, an annular flange 21 of the fixed shaft 22, and the plate 10.
The annular spacer 3 in the space defined by the annular protrusion 9 of
It is arranged at a desired interval up and down via 0.
In addition, the lower surface of the upper bearing 29 a has the annular engaging portion 1 formed on the inner peripheral surface near the lower portion of the cylindrical body 15.
7, the upper surface of the lower bearing 29b is engaged with the lower surface of the annular engaging portion 17. Rubber V
The ring 31 is interposed between the upper inner peripheral surface of the cylindrical body 15 of the rotating disk 16 and the fixed shaft 22, and cleaning liquid from a shower nozzle, which will be described later, is used for the bearings 29a and 29b.
The inner peripheral surface of the cylindrical body 15 on which the
It prevents it from flowing in between.

The driven side timing pulley 32 is fitted around the lower portion of the cylindrical body 15 and fixed to the cylindrical body 15 by a plurality of screws 33. The drive side timing pulley 34 is fitted to the drive shaft 1 of the motor 2 and is fixed to the drive shaft 1 by a locking tool 35 attached between them. The timing belt 36 is pivotally supported between the timing pulleys 32 and 34. Therefore, when the drive shaft 1 of the motor 2 is rotated and the drive side timing pulley 34 fixed to the drive shaft 1 is rotated, the rotational force thereof is transmitted through the timing belt 36 to the driven side timing pulley. The cylindrical body 1 which is transmitted to 32 and to which the timing pulley 32 is attached
A rotating disc 16 having 5 is rotated about the fixed shaft 22.

A holding for holding the substrate to be cleaned horizontally by a plurality of the supporting rods 18 fixed vertically to the rotating disc 16 and the supporting blocks 20 attached to the upper ends of the supporting rods 18, respectively. Constitutes a means. Further, the drive shaft 1, the motor 2, the rotating disk 16, the fixed shaft 22, the bearings 29a, 29.
b, the timing pulleys 32 and 34, and the timing belt 36 constitute a rotating means for rotating the holding means.

A cylindrical high-frequency vibrating nozzle 41, which is a first cleaning liquid jetting means, is arranged above the rotating disc 16,
It reciprocates within the range corresponding to the radius of the rotating disk 16 as shown by arrow A. As shown in FIG. 2, the cylindrical high-frequency vibrating nozzle 41 is provided with a cylindrical main body 43 in which the inner peripheral surfaces of the upper and lower parts are threaded and a cleaning liquid introduction hole 42 is formed in the side wall near the lower part. An annular engaging portion 44 horizontally projects on the inner peripheral surface near the lower portion of the tubular body 43. A nozzle housing 46 having a circular cleaning liquid discharge port 45 at the lower end is screwed to the lower portion of the cylindrical main body 43. The cleaning liquid introducing pipe 47 is inserted into the cleaning liquid introducing hole 42 of the cylindrical main body 43 and is brazed to the main body 4
It is fixed to 3. The disk-shaped vibrator 48 is arranged inside the cylindrical body 43 with a ring-shaped liquid-tight packing 49 locked to the annular engaging portion 44. The ring-shaped collar 50, which also functions as a retainer and a ground, is provided with the vibrator 4
It is arranged so as to abut the peripheral edge of 8. The pressing metal fitting 51 having an outer peripheral surface threaded is abutted on the upper surface of the annular collar 50 by being screwed into the cylindrical main body 43 from its upper end. A cable fitting member 54 having a through hole 52 in the center and a threaded portion 53 on the upper side is brought into contact with the pressing fitting 51 via a ring-shaped copper plate 55 in the cylindrical main body 43. An inverted conical groove 56 is formed on the upper end of the screw portion 53 of the fitting member 54. An inverted conical ferrule 58 made of, for example, a fluororesin and having a hole 57 in the center is fitted in an inverted conical groove 56 at the upper end of the screw portion 53 of the fitting member 54. The cap 60 having the hole 59 in the central portion is screwed into the screw portion 53 of the fitting member 54. The coaxial cable 61 has its tip inserted into the pressing fitting 51 through the hole 59 of the cap 60, the hole 57 of the ferrule 58, and the through hole 52 of the fitting member 54. In addition,
By rotating the cap 60 downward, the ferrule 58 is inserted into the groove 56, and the coaxial cable 61 is fixed to the fitting member 54 by its wedge effect. The center cable (plus side cable) 62 of the coaxial cable 61 is the pressing metal fitting 51.
And the vibrator 4 through the inside of the annular collar 60.
8 is connected to the upper surface. The peripheral cable (ground side cable) 63 of the coaxial cable 61 is the copper plate 55.
It is connected by soldering or the like. That is, the peripheral cable (ground side cable) 63 is connected to the peripheral edge of the vibrator 48 through the copper plate 55, the holding metal fitting 51 located below the copper plate 55, and the annular collar 50. The coaxial cable 61 is connected to a high frequency oscillator (not shown).

Next, the operation of the cleaning apparatus according to the first embodiment of the present invention will be described. Substrate to be cleaned, eg semiconductor wafer 6
4 is horizontally placed on a support block 20 attached to four support rods 18 provided on the rotating disc 16. When the motor 2 is driven to rotate the drive shaft 1 and the drive side timing pulley 34 fixed to the drive shaft 1 is rotated, the rotational force is generated via the timing belt 36 to the driven side timing pulley 32. The rotary disc 16 having the cylindrical body 15 to which the timing pulley 32 is attached is rotated about the fixed shaft 22. As a result, the semiconductor wafer 64 mounted on the support block 20 at the upper end of the four support rods 18 fixed to the rotating disk 16 is rotated.

When the semiconductor wafer 64 is thus rotated, a cleaning liquid, for example, pure water, is supplied to a cleaning liquid supply pipe (not shown) connected to the joint portion 24 of the cylindrical fixed shaft 22. The plurality of injection ports 2 above the nozzles 27 are introduced through the hollow portion 28 of the fixed shaft 22 into the circulation portion 25 of the shower nozzle 27 communicating with the hollow portion 28.
It is injected from 6 upward. The shower nozzle 2
Since 7 is located in the space surrounded by the four support rods 18 inserted and fixed in the peripheral portion of the rotating disc 16,
Pure water is sprayed from the shower nozzle 27 onto the back surface of the semiconductor wafer 60 which is placed on the support block 20 of the support rod 18 and rotated. A cleaning liquid, for example, pure water is introduced into the cleaning liquid introducing pipe 47 of the cylindrical high-frequency vibration nozzle 41, and the pure water is supplied into the cylindrical main body 43 through the cleaning liquid introducing hole 42. When high frequency power is applied from a high frequency oscillator (not shown) to the vibrator 48 arranged above the cleaning liquid introduction hole 42 of the cylindrical main body 43 through the coaxial cable 61, the vibrator 48 vibrates at a desired frequency. Pure water carried by high frequency sound waves is jetted from the circular discharge port 45 of the nozzle housing 46 attached to the lower portion of the cylindrical main body 43 onto the surface of the rotating semiconductor wafer 64, and the high frequency sound waves are generated by the semiconductor wafer 64.
Through. At the same time, when the high-frequency vibrating nozzle 41 is reciprocated within a range corresponding to the radius of the rotating disk 16, that is, the radius of the semiconductor wafer 64 as shown by an arrow A, the circular ejection port 45 of the nozzle housing 46 is ejected. A cleaning liquid that has been subjected to high-frequency sound waves is sprayed onto the entire surface of the semiconductor wafer 64. The pure water that has been sprayed from the nozzles 27 and 41 and after cleaning the front and back surfaces of the semiconductor wafer 64 is stored in the processing tank 12 and discharged to the outside through the discharge pipe 14.

As described above, while the semiconductor wafer 64 is held horizontally by the holding means and the rotating means and is rotated, the high frequency sound wave passing through the wafer 64 from the high frequency vibration nozzle 41 arranged above the semiconductor wafer 64. Pure water on the semiconductor wafer 64 is jetted toward the surface of the semiconductor wafer 64, and the high-frequency vibration nozzle 41 is reciprocated within a range corresponding to the radius of the semiconductor wafer 64 as shown by an arrow A. Wafer 6
Pure water carried by high frequency sound waves is jetted from the high frequency vibrating nozzle 41 over the entire surface of 4. Therefore, the wafer 6
The particles on the surface 4 can be washed away with pure water, and the particles can be prevented from redepositing for precision cleaning.

Pure water carried by high-frequency sound waves from the high-frequency vibration nozzle 41 is jetted toward the surface of the semiconductor wafer 64 and swept in the direction of arrow A, and at the same time, the shower nozzle 27 arranged below the semiconductor wafer 64. When pure water is sprayed from the semiconductor wafer 64 toward the back surface of the semiconductor wafer 64, the high-frequency sound waves from the high-frequency vibration nozzle 41 penetrate the semiconductor wafer 64 and act on the particles existing on the back surface of the semiconductor wafer 64. The particles can be washed away by the sprayed pure water film. Further, the high frequency sound waves that have reached the liquid film are reflected by the air layer having a large difference in acoustic impedance, and act on the particles on the back surface of the wafer 64 while operating on the wafer 64.
Passes through and returns to the surface side. The high frequency sound waves returning to the surface side are reflected at the interface between the liquid film and the air layer on the surface of the wafer 64, and then attenuated while repeating the same reflection as described above. In this way, pure water is sprayed from the shower nozzle 29 onto the back surface of the semiconductor wafer 64 to form a liquid film, and the semiconductor wafer 64 is disposed below the semiconductor wafer 64, that is, on the back surface side thereof without disposing a high-frequency vibration nozzle. It becomes possible to perform precision cleaning on the entire back surface of the at the same time.

In fact, it was confirmed by the following experiment using the cleaning apparatus of Example 1 that the front and back surfaces of the semiconductor wafer could be precisely cleaned. Experimental Example First, the front and back surfaces of an 8-inch silicon wafer whose both surfaces were polished were forcibly contaminated with silicon powder of 0.2 μm or more. The silicon wafer 64 was horizontally placed on a support block 20 attached to four support rods 18 provided on the rotary disc 16. By driving the motor 2 to rotate the drive shaft 1 and rotating the drive side timing pulley 34 fixed to the drive shaft 1, the rotational force is transmitted to the driven side timing pulley 32 via the timing belt 36. The rotary disc 16 having the cylindrical body 15 to which the timing pulley 32 is attached is transmitted and rotated about a cylindrical fixed shaft 22. As a result, the silicon wafer 6 placed on the support block 20 at the upper end of the four support rods 18 into which the rotary disc 16 is inserted and fixed.
4 was rotated at a speed of 1500 rpm. With the silicon wafer 64 rotated, pure water is supplied to a cleaning liquid supply pipe (not shown) connected to the joint portion 24 of the cylindrical fixed shaft 22, and the pure water is fed into the cavity of the fixed shaft 22. It is introduced into the flow section 25 of the shower nozzle 27 communicating with the shower nozzle 27 through the section 28, and pure water is supplied to the back surface of the silicon wafer 64 rotating from the plurality of injection ports 26 on the nozzle 27 at a flow rate of 2.4 liter / min. Jetted. Pure water is introduced into the cleaning liquid introducing pipe 47 of the cylindrical high-frequency vibration nozzle 41, and the pure water is supplied into the cylindrical body 43 through the cleaning liquid introducing hole 42. At the same time, high-frequency power is applied from the high-frequency oscillator (not shown) through the coaxial cable 61 to the vibrator 48 arranged above the cleaning liquid introduction hole 42 of the cylindrical body 43, whereby the vibrator 48 is applied.
Vibrates at a frequency of 1.5 kHz, and a high frequency of 1.5 kHz is generated from the circular ejection port 45 of the nozzle housing 46 attached to the lower portion of the cylindrical main body 43. Pure water carried by this high frequency sound wave is sprayed onto the surface of the rotating silicon wafer 64 at a flow rate of 0.8 liter / minute for 30 seconds, and at the same time, the high frequency vibration nozzle 41 is 3.0 m within the radius range of the silicon wafer 64. The silicon wafer 64 was cleaned by reciprocating at a speed of / minute.

(Comparative Example) In the above-mentioned cleaning apparatus of FIG. 1, an elongated shower nozzle was used in place of the high-frequency vibrating nozzle, and pure water was spun from the shower nozzle to the rotating silicon wafer at a flow rate of 0.8 liter / min. The silicon wafer was washed in the same manner as in the experimental example except that the spraying was carried out in 1. The number of particles and the removal rate of the front and back surfaces of the cleaned silicon wafer were measured by the experimental example and the comparative example.
The results are shown in Table 1 below.

[0040]

[Table 1]

As is clear from Table 1, the cleaning apparatus according to the first embodiment of the present invention can satisfactorily remove particles on the front and back surfaces of a silicon wafer and can perform precision cleaning. If the particle removal rate on the back surface of the silicon wafer is about 70%, it is possible to manufacture a semiconductor device having good characteristics free from contamination due to particles on the back side of the wafer.

After the above-mentioned cleaning of the silicon wafer 64, the injection of pure water from the shower nozzle 27 and the injection of pure water along with the high frequency sound wave from the high frequency vibration nozzle 41 are stopped, and the motor 2 drives the drive shaft 1 of the drive shaft 1. By increasing the rotation speed and rotating the rotating disk 16 at a high speed of, for example, 3000 rpm, the silicon wafer 64 placed on the support block 20 of the supporting rod 18 of the rotating disk 16 can be continuously spin-dried. .

In the first embodiment, a cylindrical type high frequency vibrating nozzle is used, and sweeping is performed within the radius of the substrate to be cleaned (eg, silicon wafer).
It is not limited to this. For example, instead of the cylindrical high-frequency vibrating nozzle, a bar-type high-frequency vibrating nozzle having a rectangular main body having an elongated cleaning liquid ejection port can be used to achieve the same effect.

(Embodiment 2) FIG. 3 is a sectional view showing a cleaning apparatus according to Embodiment 2 of the present invention, and FIG. 4 is a bar type high frequency vibrating nozzle which is a first cleaning liquid injection means incorporated in the cleaning apparatus of FIG. 5 is a sectional view taken along the line VV of FIG.

The motor 102 having the drive shaft 101 extending in the vertical direction is housed in a cylindrical support member 103.
The support plate 104 is fixed on the tubular support member 103 by a plurality of screws 105. Also, the support plate 1
Numeral 04 designates holes 10 at a portion corresponding to the drive shaft 101 and a portion extending leftward from the support member 103, respectively.
6, 107 are perforated. A disc-shaped plate 110 having a hole 108 in the center and an annular protrusion 109 around the hole 108 is a plurality of screws screwed onto the support plate 104 from the lower surface of the support plate 104 toward the plate 109. It is fixed by a screw 111.

The processing tank 112 is the disk-shaped plate 11 described above.
It is located above 0. The processing tank 112 has a cylindrical shape with a bottom, and has a cylindrical portion 113 projecting upward at the center of the bottom. The discharge pipe 114 is connected to a bottom portion of the processing tank 112 adjacent to the left side wall. The processing tank 112 is supported and fixed by a stand (not shown) such that the cylindrical portion 113 is positioned concentrically with the hole 108 of the disk-shaped plate 110.

Cylindrical body 11 protruding downward in the central portion
The rotating disk 116 having the number 5 is horizontally arranged in the processing bath 112. The cylindrical body 115 concentrically passes through the inside of the cylindrical portion 113 of the processing bath 112 and extends to the outside of the processing bath 112. The cylindrical body 115
An annular engaging portion 117 projects horizontally on the inner peripheral surface near the lower part of the. For example, four support rods 118 whose upper and lower parts are threaded are inserted into the peripheral edge of the rotating disc 116 so as to extend vertically at an equal circumferential angle (90 °), and the lower face of the rotating disc 116 is inserted. The nut 119 is screwed onto the threaded portion of the lower portion of the support rod 118 protruding from the rotary rod 116 to be fixed to the rotary disc 116. The cylindrical support blocks 120 are screwed into the threaded portions above the support rods 118 so that they are located on the same horizontal plane.

A cylindrical fixed shaft 122 having an annular flange 121 near the middle and having a threaded outer periphery is
The disk-shaped plate 1 is passed from the inside of the processing tank 112 through the cylindrical body 115 of the rotating disk 116 concentrically.
It is inserted into 10 holes 108. The cylindrical fixed shaft 12
2 is fixed to the plate 110 by screwing a nut 123 into a lower portion protruding downward from the lower surface of the plate 110. Two bearings 124a,
124b is an inner surface of the cylindrical body 115, the cylindrical fixed shaft 1
22 outer peripheral surface, the annular flange 121 of the fixed shaft 122,
Further, the plate 110 is arranged in a space defined by the annular protrusions 109 with an annular spacer 125 therebetween and is vertically arranged at a desired interval. The lower surface of the upper bearing 124a is engaged with the upper surface of the annular engaging portion 117 formed on the inner peripheral surface near the lower portion of the cylindrical body 115. The upper surface of the lower bearing 124b is engaged with the lower surface of the annular engaging portion 117. The rubber V-ring 126 is interposed between the upper inner peripheral surface of the cylindrical body 115 of the rotating disk 116 and the fixed shaft 22, and cleaning liquid from a bar-type high-frequency vibrating nozzle, which will be described later, is used for the bearing 12.
4a and 124b are prevented from flowing between the inner peripheral surface of the cylindrical body 115 and the fixed shaft 122.

The driven side timing pulley 127 is fitted on the outer periphery of the lower portion of the cylindrical body 115, and has a plurality of screws 128.
Is fixed to the cylindrical body 115. The drive side timing pulley 129 is used for the drive shaft 10 of the motor 102.
1, and is fixed to the drive shaft 101 by a locking tool 130 attached between them. The timing belt 131 is pivotally supported between the timing pulleys 127 and 129. Therefore, when the drive shaft 101 of the motor 102 is rotated and the drive side timing pulley 129 fixed to the drive shaft 101 is rotated, the rotational force is transmitted via the timing belt 131 to the driven side timing pulley. The cylindrical body 1 which is transmitted to 127 and to which the timing pulley 127 is attached
A rotating disk 116 having 15 is rotated about the cylindrical fixed shaft 122.

The plurality of support rods 118 fixed vertically to the rotating disc 116 and the support rods 118.
The support blocks 12 respectively attached to the upper ends of the
0 constitutes holding means for holding the substrate to be cleaned horizontally. In addition, the drive shaft 101 and the motor 1
02, the rotating disk 116, the fixed shaft 122, the bearings 124a and 124b, the timing pulley 1
27 and 129 and the timing belt 131 constitute a rotating means for rotating the holding means.

The bar type high frequency vibration nozzle 132 is fixed to the upper end of the cylindrical fixed shaft 122. The bar type high frequency vibration nozzle 132 includes a rectangular lower block 134 having a horizontally elongated recess 133 as shown in FIGS.
The upper surface has an elongated cleaning liquid discharge port 135, and the lower surface is provided with a rectangular upper block 137 in which a horizontally long nozzle hole 136 having an area smaller than the opening area of the upper surface of the recess 133 is opened. The upper block 136 includes the nozzle holes 13 of the upper block 137 on the lower block 134.
6 is fixed so as to face the recess 133 of the lower block 134 with a packing 138 sandwiched therebetween.
By fixing the upper block 137 to the lower block 134 in this way, the upper block 137 portion at the peripheral edge of the nozzle hole 136 is projected to the upper surface of the recess 133 in an eaves shape. The rectangular vibrating plate 139 is formed on the upper surface of the recess 133 so as to project like an eaves-shaped upper block 137.
It is disposed on the packing 138 on the lower surface. The rectangular frame-shaped cap 140 is disposed on the lower surface of the diaphragm 139, and the diaphragm 139 is attached to the lower block 137 by screwing a screw (not shown) from the cap 140 side to the eaves of the upper block 137. It is fixed between the recess 133 and the nozzle hole 136 of the upper block 137. The rectangular vibrator 141 is fixed to the lower surface of the diaphragm 139. The power supply cable 142 is inserted from the lower end of the cylindrical fixed shaft 122, and is connected to the lower block 1
34 Cable fitting member 1 attached to the lower surface
It extends through the lower block 134 through 43 into the recess 133. The power supply cable 142
The main terminal 144 has a tip connected to the vibrator 141. Further, the ground terminal 145 coaxially attached to the power feeding cable 142 is the cap 140.
Through the diaphragm 139. The power feeding cable 142 is connected to a high frequency oscillator (not shown). The first flow path 145 of the cleaning liquid is counterbored in the lower block 134 so as to open at the upper and lower surfaces thereof. The second flow path 146 for the cleaning liquid is counterbored in the upper block 137. The second flow path 146
Is opened on the lower surface of the upper block 137 and
A rising hole 147 communicating with the flow path 145, a cylindrical hole 148 formed in the longitudinal direction of the upper block 137 and communicating with the hole 147, and an oblique direction from the cylindrical hole 148 toward the nozzle hole 136. It is composed of a plurality of opened cleaning liquid outflow holes 149. Cleaning liquid supply pipe 1
50 is inserted from the lower end of the cylindrical fixed shaft 122, and communicates with the first flow path 145 of the lower block 134 through a fitting member 151 attached to the lower surface of the lower block 134.

The bar-shaped shower nozzle 152 having a L-shaped cross section, which is the second cleaning liquid jetting means, has the rotating disc 116.
It is arranged above. The shower nozzle 152
Is a cleaning liquid supply member 153, a horizontally elongated nozzle body 154 connected to the supply member 153, and
The cleaning liquid flow section 155 formed inside the main body 154.
And a plurality of injection ports 156 that are open to the lower surface of the main body 154 and communicate with the flow section 155.

Next, the operation of the cleaning apparatus according to the second embodiment of the present invention will be described. Substrate to be cleaned, eg semiconductor wafer 1
Four support rods 118 provided with 37 on the rotating disc 116
It is placed on the support block 120 attached to the above and horizontally placed on the support block 120. The motor 10
2 drives the drive shaft 101 to rotate, and when the drive side timing pulley 129 fixed to the drive shaft 101 rotates, the rotational force is transmitted to the driven side timing pulley 127 via the timing belt 131. Then, the rotating disc 116 having the cylindrical body 115 to which the timing pulley 127 is attached is rotated about the cylindrical fixed shaft 122. As a result, the semiconductor wafer 137 mounted on the support block 120 at the upper end of the four support rods 118 fixed to the rotating disk 116 is rotated.

When the cleaning liquid, for example, pure water is supplied to the cleaning liquid supply pipe 150 inserted in the cylindrical fixed shaft 122 while the semiconductor wafer 137 is thus rotated, the pure water passes through the fitting member 151. The first flow path 1 of the bar-type high-frequency vibration nozzle 132 communicating with this
45, introduced into the second flow path 146,
From the plurality of injection holes 149, the rectangular upper block 1
It is sprayed toward the vibrating plate 139 in the rectangular nozzle hole 136 of 37, and the inside of the nozzle 136 is filled with pure water. In this state, the lower and upper blocks 13 are passed from the high frequency oscillator (not shown) through the power feeding cable 142.
The vibrator 1 attached to the lower surface of the vibrating plate 139 between Nos. 4 and 137.
When high frequency power is applied to 41, the oscillator 141 vibrates at a desired frequency. Therefore, high-frequency sound waves are generated from the vibration plate 139 to which the vibrator 141 is attached, toward the elongated ejection port 135 on the upper surface of the rectangular nozzle hole 136 of the upper block 137. As a result, as shown in FIGS. 3 and 5, the elongated discharge port 1 of the upper block 137 is formed.
Pure water carried by high frequency sound waves from 35 is jetted in a band shape on the surface of the rotating semiconductor wafer 157. At this time, the high frequency sound waves pass through the semiconductor wafer 157. At the same time, a cleaning liquid is supplied to the cleaning liquid supply unit 153 of the shower nozzle 152 arranged above the semiconductor wafer 157.
For example, when pure water is supplied, the horizontally elongated nozzle body 154
Of the nozzle body 154.
Pure water is jetted in a strip shape from the plurality of jet holes 156 at the bottom onto the surface of the rotating semiconductor wafer 157. The pure water that has been sprayed from the nozzles 132 and 152 and after cleaning the back surface and the front surface of the semiconductor wafer 157 is the processing tank 1.
It is stored in 12 and is discharged to the outside through a discharge pipe 114.

As described above, while the semiconductor wafer 157 is held and rotated in the horizontal state by the holding means and the rotating means, the semiconductor wafer 157 passes through the wafer 157 from the bar type high frequency vibration nozzle 132 arranged below the semiconductor wafer 157. Pure water that has been subjected to high-frequency sound waves is applied to the semiconductor wafer 1
By spraying in a band shape toward the surface of 57, the particles on the entire back surface of the semiconductor wafer 157 can be washed away together with pure water, and the particles can be prevented from re-adhering and precision cleaning can be performed.

Pure water carried by high-frequency sound waves from the bar-type high-frequency vibration nozzle 132 is jetted toward the surface of the semiconductor wafer 157 in a strip shape, and at the same time, the semiconductor wafer 157 is discharged.
When pure water is sprayed toward the surface of the semiconductor wafer 157 from the shower nozzle 152 arranged above
The high-frequency sound wave from the high-frequency vibration nozzle 132 penetrates the semiconductor wafer 157 and also acts on particles existing on the surface thereof, and the particles can be washed away by the liquid film of pure water sprayed from the shower nozzle 152. . Further, the high frequency sound waves that have reached the liquid film are reflected by the air layer having a large difference in acoustic impedance, pass through the inside of the wafer 157 while acting on the particles on the surface of the wafer 157, and return to the back surface side. The high frequency sound waves returning to the back surface side are reflected at the interface between the liquid film and the air layer on the back surface of the wafer 157, and then attenuated while repeating the same reflection as described above. In this way, the pure water is sprayed from the shower nozzle 152 onto the surface of the semiconductor wafer 157 to form a liquid film, thereby forming the liquid film.
Above, that is, the entire surface of the semiconductor wafer 157 can be precisely cleaned at the same time without disposing a high frequency vibration nozzle on the surface side thereof.

Therefore, according to the cleaning apparatus of the second embodiment described above, the front and back surfaces of the semiconductor wafer 157 can be precisely cleaned at the same time. Furthermore, according to the cleaning apparatus of the second embodiment described above, the shower nozzle 152 is arranged above the semiconductor wafer 157, so that the high frequency vibration nozzle arranged above as in the first embodiment is arranged on the surface of the semiconductor wafer. It is possible to make a sufficient distance from the surface of the wafer 157 without bringing them close to each other. As a result, the semiconductor wafer 157 after cleaning can be easily taken out from the holding means, and the handleability can be improved.

Further, according to the cleaning apparatus of the second embodiment described above, there is no driving member for reciprocating the high-frequency vibration nozzle above the semiconductor wafer as in the first embodiment described above, and therefore the particles are removed from the driving member. It is possible to avoid the contamination of the semiconductor wafer 157 due to the fall of the.

Further, the bar type high frequency vibration nozzle 13 is provided.
2, the rectangular nozzle hole 1 from the plurality of injection holes 149 of the second flow path 146 in the upper block 137.
By injecting toward the vibration plate 139 in 36, it is possible to prevent air bubbles from being taken into the surface of the vibration plate 139. As a result, it becomes possible to efficiently vibrate the vibrating plate 139 during the vibration of the vibrating 141 and generate a high frequency sound wave toward the elongated ejection port 135. Although the semiconductor wafer is used as the substrate to be cleaned in the first and second embodiments, the invention can be similarly applied to a liquid crystal glass substrate, a semiconductor wafer, a magnetic disk and the like.

[0060]

As described above, according to the present invention, the front and back surfaces of a substrate to be cleaned such as a semiconductor wafer can be precisely cleaned at the same time, and contamination from the rear surface side of the substrate to be cleaned can be prevented and finely cleaned. Further, it is possible to provide a cleaning device that can be effectively used for manufacturing high density semiconductor devices, liquid crystal glass substrates, magnetic disks, and the like.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a cleaning device according to a first embodiment of the present invention.

2 is a cross-sectional view showing a high-frequency vibrating nozzle (first cleaning liquid ejecting means) used in the cleaning apparatus of FIG.

FIG. 3 is a sectional view showing a cleaning device according to a second embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a bar type high frequency vibrating nozzle which is a first cleaning liquid ejecting means incorporated in the cleaning apparatus of FIG.

FIG. 5 is a sectional view taken along the line VV in FIG. 4;

[Explanation of symbols]

 2, 102 ... Motor, 12, 112 ... Processing tank, 15, 115 ... Cylindrical body, 16, 116 ... Rotating disk, 18, 118 ... Support rod, 20, 120 ... Support block, 22, 122 ... Cylindrical fixed shaft , 27, 152 ... Shower nozzle, 29a, 29b, 14a, 124b ... Bearing, 32, 34, 127, 129 ... Timing pulley, 36, 131 ... Timing belt, 41 ... Cylindrical high frequency vibration nozzle, 64, 157 ... Silicon wafer 132 ... Bar type high frequency nozzle.

Claims (13)

[Claims] 1. A holding means for holding a substrate to be cleaned in a horizontal state; a rotating means for rotating the holding means; a substrate to be cleaned which is arranged above the holding means and supported by the holding means. A first cleaning liquid ejecting means for ejecting the cleaning liquid on the front surface, the cleaning liquid having a high frequency sound wave; and for ejecting the cleaning liquid toward the back surface of the substrate which is arranged below the holding means and is supported by the holding means. A cleaning device comprising: a second cleaning liquid ejecting unit; 2. The cleaning apparatus according to claim 1, wherein the first cleaning liquid ejecting means has a cylindrical shape and is reciprocated between a rotation center of the substrate and a radial direction. 3. The first cleaning liquid ejecting means includes a rectangular main body having a nozzle hole having an elongated cleaning liquid ejection port on a lower surface thereof, and a vibrator disposed inside the main body so as to face the ejection port. The cleaning device according to claim 1, further comprising: 4. The cleaning apparatus according to claim 1, wherein the holding unit has a structure including a rotation supporting member that horizontally supports the substrate to be cleaned. 5. The rotating means has a structure including a cylindrical fixed shaft that also serves as a cleaning liquid supply section, and a drive mechanism for rotating the rotation support member about the fixed shaft. The cleaning device according to claim 4. 6. The driving mechanism includes a driven-side timing pulley attached to the rotation supporting member, a driving-side timing pulley, a timing belt pivotally supported between the pulleys, and the driving-side timing pulley. The cleaning device according to claim 5, further comprising a motor for rotating the motor. 7. The second cleaning liquid jetting means has a cleaning liquid flow portion which is integrally connected in a horizontal direction to an upper end of the cylindrical fixed shaft which also serves as a cleaning liquid supply portion and which communicates with a hollow portion of the fixed shaft. The cleaning apparatus according to claim 1 or 5, wherein the cleaning nozzle is a shower nozzle having a plurality of cleaning liquid injection holes that communicate with the circulation portion and are opened at the top. 8. A holding means for holding the substrate to be cleaned in a horizontal state; a rotating means for rotating the holding means; a substrate to be cleaned which is arranged below the holding means and supported by the holding means. First cleaning liquid ejecting means for ejecting the cleaning liquid on the back surface in a band shape, the cleaning liquid being on the high frequency sound wave; and ejecting the cleaning liquid toward the front surface of the substrate which is arranged above the holding means and is supported by the holding means. Second to do
A cleaning device, comprising: a cleaning liquid ejecting means. 9. The cleaning apparatus according to claim 8, wherein the holding unit has a structure including a rotation supporting member that horizontally supports the substrate to be cleaned. 10. The cleaning apparatus according to claim 8, wherein the rotating means includes a cylindrical fixed shaft and a drive mechanism for rotating the rotation support member about the fixed shaft. 11. The drive mechanism includes a driven-side timing pulley attached to the rotation supporting member, a driving-side timing pulley, a timing belt pivotally supported between the pulleys, and the driving-side timing pulley. The motor for rotating is provided.
The cleaning device according to the above. 12. A rectangular block having a rectangular nozzle hole, one end of which is fixed to an upper end of the tubular fixed shaft, and a rectangular nozzle hole having an elongated cleaning liquid discharge port on an upper surface, A vibrator which is disposed on the bottom side of the nozzle hole so as to face the discharge port, and which is connected to a power supply cable introduced through the inside of the cylindrical fixed shaft,
11. The cleaning liquid flow path, which is formed in the block so as to communicate with the nozzle hole, and is connected to a cleaning liquid supply pipe introduced through the inside of the cylindrical fixed shaft. Cleaning equipment. 13. The second cleaning liquid jetting means, a cleaning liquid supply member, a horizontally elongated nozzle body connected to a lower end of the supply member and having a cleaning liquid flow portion, and a bottom of the main body communicating with the cleaning liquid flow portion. 9. The cleaning device according to claim 8, wherein the cleaning device is a shower nozzle having a plurality of cleaning liquid injection ports opened in the.