JPH09283930A - Structure and manufacture of multilayer printed-wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a multilayer printed-wiring board in which the influence of emitted noise and of crosstalk noise is eliminated and which acts as a high- speed signal transmission line by a method wherein a coaxial circuit of a strip structure in which a signal circuit conductor is covered completely with a grounding circuit is formed on the multilayer printed-wiring board. SOLUTION: A multilayer printed-wiring board is constituted of a filmlike bonding base material 3 constituted in such a way that copper-clad laminated boards 1 in which grounding circuit conductors 15 are formed and a filmlike copper-clad laminated board 2 on which grounding conductors 22 and signal circuit conductors 23 are formed are laminated and of a hole 41 for a through hole. Thereby, a coaxial circuit of a strip structure in which the signal circuit conductors 23 are covered completely with the grounding circuit conductors 15 can be formed, and it is possible to obtain the multilayer printed-wiring board in which the influence of a radiant noise and of a cross talk noise is eliminated and which acts as a high-speed signal transmission line.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a structure and a manufacturing method of a multilayer printed wiring board.

[0002]

2. Description of the Related Art There are various structures of multilayer printed wiring boards, and a conventional example will be described below.

(1) A microstrip structure having a signal wiring structure on the surface layer of the multilayer printed wiring, or a strip structure having a signal wiring structure on the inner layer sandwiched between the power supply layer and the ground layer of the multilayer printed wiring board.

(2) A structure in which a jumper or the like is added on the printed wiring board in order to switch the device number (for example, 1 to 4) of the device.

(3) There was an inner layer via hole (IVH) structure of a multilayer printed wiring board formed by drilling holes and electrolytic copper plating.

[0006]

[Problems to be Solved by the Invention]

(1) In the case of the microstrip structure of the conventional example (1),
The amount of crosstalk noise (crosstalk) that is emitted from the signal wiring in the air as electromagnetic waves and induces the malfunction of other devices, and the distance between the wiring patterns on the printed wiring board is short and the signal speed is high, the adjacent pattern Becomes large and, in the worst case, malfunctions.

Further, in the strip structure, the influence of the crosstalk is unavoidable.

(2) In the configuration of the conventional example (2), it is necessary to provide one through hole for each machine number in order to perform the jumper. Further, there is a problem that the jumper is soldered.

(3) The method of the conventional example (3) has a problem that it takes time for drilling and productivity is deteriorated.

[0010]

[Means for Solving the Problems]

(1) A strip-structured coaxial circuit in which a signal circuit conductor is completely covered with an earth circuit is formed on a multilayer printed wiring board.

(2) By forming a plurality of separated through-holes at the same through-hole position and inserting a short-circuit pin having a contact at a desired through-hole, the device number and the like can be set.

(3) The interlayer connection is made possible by forming a via hole for interlayer connection between inner layers by copper plating and etching without drilling. The above problem is solved by the above.

[0013]

FIG. 1 is a structural diagram of a multilayer printed wiring board according to a first embodiment of the present invention, in which a copper clad laminate 1 having a ground circuit conductor 15 formed thereon, a ground circuit conductor 22 and a signal. Film-shaped copper clad laminate 2 having circuit conductor 23 formed
And a film-shaped adhesive substrate 3 for laminating the copper-clad laminate 1 and the film-shaped copper-clad laminate 2, and a through-hole hole 41.

2 and 3 are sectional views showing a method for manufacturing a multilayer printed wiring board according to a second embodiment of the present invention, which will be described below.

First, an etching resist 11 is applied to a copper clad laminate 1 (glass cloth base epoxy resin), and a conductor escape portion 12 of a through hole is formed by the steps of exposure, development, etching and peeling. .

Next, the plating resist 13 is applied, exposed and developed, and the plating resist stripped portion is plated with copper 1 by a pattern plating method of plating only a required pattern.
Apply 4. In the final step of plating, high-current plating is applied for a short time to form the ground circuit conductor 15 in which the surface of the plating is plated with granular copper. This is manufactured in the required number.

In parallel with this step, the etching resist 2 is formed on the film-like copper-clad laminate 2 in the B stage state (a state in which the curing is not completely completed, that is, a semi-cured state).
1 is applied, and the steps of exposure, development, etching, and peeling are performed to form the ground circuit conductor 22 and the signal circuit conductor 23.

Next, the copper-clad laminate 1 having the ground circuit conductor 15 formed thereon and the film-shaped copper-clad laminate 2 having the earth circuit conductor 22 and the signal circuit conductor 23 formed thereon are temporarily laminated and integrated, Check for misalignment.

Next, the temporary lamination product of the copper clad laminate 1 and the film-shaped copper clad laminate 2 and the B-stage film adhesive base material 3 are used for final lamination, and final lamination 40 is performed to integrate them. And a circuit conductor having a coaxial structure is formed.

Finally, a through hole drilling 41 is performed,
Through-hole plating 42 is performed by a panel plating method for plating the entire panel, an etching resist 43 is applied, and a surface circuit is formed by exposing, developing, etching, and peeling steps to complete a multilayer printed wiring board. .

FIG. 4 is a perspective view showing a third embodiment of the present invention, in which the through holes 51 are formed in the ground circuit conductor portions 15 and 22 of FIG. 2 at an appropriate pitch (for example, ground around the signal conductor circuit). (Provided at a pitch between the circuits), a more reliable coaxial printed wiring board can be obtained.

As described above, a coaxial circuit having a strip structure in which the signal circuit conductor is completely covered with the ground circuit conductor is formed.

Therefore, it can be applied when the multilayer printed wiring board according to the present invention is used as a high-speed signal transmission line.
It can also be applied to a case where a circuit in which a high level signal exists near a low level signal is composed of a multilayer printed wiring board.

FIG. 5 is a structural view of a multilayer printed wiring board according to a fourth embodiment of the present invention, in which a copper clad laminate 10 having through holes 104 and lands 105 and the lands 1 are formed.
The non-flow type prepreg 20 is formed with a hole 201 having a diameter equal to the diameter of 05. The prepreg is a glass cloth impregnated with an epoxy resin to be semi-cured.

FIG. 6 is a sectional view showing a method for manufacturing a multilayer printed wiring board according to the fifth embodiment of the present invention, which will be described below.

First, the copper clad laminate 10 is perforated 101, through-hole plating 102 is applied by a panel plating method, an etching resist 103 is applied, and exposure / development /
The through hole 104 and the land 105 are formed by performing the etching / peeling process, and a required number of these are manufactured.

In parallel with this step, a perforation 201 having a diameter equal to the diameter of the land 105 of the copper clad laminate 10 is formed in the non-flow type prepreg 20. After that, the copper clad laminate 10 having the through holes 104 formed therein and the perforations 201 are formed.
The non-flow type prepreg 20 on which the above is formed is temporarily laminated 30.

The positions of the through holes 104 of the copper clad laminate 10 and the holes 201 of the non-flow type prepreg 20 are confirmed, and the required number of temporary laminates 30 are superposed and the main lamination 40 is formed.
Through hole 1 integrated and separated into the same hole position
A multilayer printed wiring board on which 04 is formed is completed.

At this time, the lamination press condition at the time of temporary lamination is 80
It is several minutes under the condition of ° C and 10 kg / cm ² . The lamination press condition during the main lamination is set to 170 ° C. and 20 kg / cm ² for 60 minutes to 120 minutes.

FIG. 7 is a view showing the arrangement of jig pin holes in the mirror plate used for lamination in this embodiment during the lamination, and the jig pin hole 60 is provided in the central portion of the mirror plate, so that the through hole is formed. It is possible to minimize the positional deviation of the holes 104.

FIG. 8 is a diagram showing an example of using the short-circuit pin 50.
Conduction is achieved by inserting the metal short-circuit pin 50 having the contact portion 501 of the spring structure into the desired through hole 104 of the multilayer printed wiring board 40.

As described above, according to the present embodiment, since a plurality of separated through holes are present at the same through hole position, contacts corresponding to the number of layers to be connected to the short-circuit pins are provided and inserted. This makes it possible to set the required machine number.

Therefore, the machine number of the device is set (for example, 0 system,
It is applied when the 1-system) is performed on a multilayer printed wiring board.

FIG. 9 is a structural view of a multilayer printed wiring board according to a sixth embodiment of the present invention, in which a copper clad laminate 7 in which an inner layer circuit of a signal circuit 73 and a via hole land 74 is formed.
0 and the land 74 at a portion corresponding to the land 74.
A film-shaped copper clad plate 80 on which a conductor land 82 having the same diameter as the above, the copper clad laminate 70 and the film-shaped copper clad plate 8
0 is composed of a film-like adhesive base material 3 having a laminated structure.

FIG. 10 is a sectional view showing a method for manufacturing a multilayer printed wiring board according to the seventh embodiment of the present invention, which will be described below.

First, an etching resist 72 is applied to the copper clad laminate 70, and an inner layer circuit (signal circuit 73, via hole land 74) is formed by the steps of exposure, development, etching, and peeling.

Next, a plating resist 75 is applied, exposed and developed to perform electrolytic plating 76 having a diameter of about 0.2 mm smaller than the land diameter on the land 74 for the via hole, and high current plating is performed in the final step of copper plating. It is applied for a short time and copper plating 77 having coarse particles is applied. The required number of inner layer circuits are manufactured through the above steps.

In parallel with this step, the film-shaped copper clad plate 8
0 is coated with an etching resist 81, and a conductor (land 82) having the same diameter as the via hole land 74 is applied to a portion corresponding to the via hole land 74 of the copper clad laminate 70 by the steps of exposure, development, etching, and peeling. To form.

Next, a circuit-formed land 7 for a via hole is formed.
The copper clad laminate 70 plated with 4 and the film-like copper clad plate 80 in the B stage having the lands 82 are temporarily laminated 9
0 (100 ° C., 10 kg / cm ² for several minutes), and inspect for positional deviation.

After that, the circuit for the temporary laminated product 90 is formed and the copper clad laminated plate 70 having the land 74 for the via hole plated and the film-like adhesive base material 3 in the B stage form the structure for main lamination. , Main lamination (170 ℃, 20kg / c
m ² for 60 minutes to 120 minutes) to obtain the multilayer product 41, and the multilayer printed wiring board is completed.

As described above, the B-staged film-shaped copper clad plate and the B-staged film-bonded base material are formed between the circuit-formed copper-clad laminated plate on which the land for the via hole is plated. By performing the, connection between layers is achieved.

[0042]

As described above, according to the present invention, the following effects can be obtained.

(1) A multilayer printed wiring board as a high-speed signal transmission line which can form a strip-structured coaxial circuit in which the signal circuit conductor is completely covered with the ground circuit conductor and is free from the effects of radiation noise and crosstalk noise. can get.

(2) Since a plurality of separated through-holes are formed at the same through-hole position, the short-circuit pins are provided with contacts corresponding to the number of layers to be connected, and the short-circuit pins are inserted to obtain the required machine number. Can be set.

(3) A B-staged film-shaped copper clad plate and a B-staged film-bonded base material are formed between copper-clad laminated plates on which circuits are formed and plated on the via holes lands, and a lamination press is performed. This makes it possible to connect the layers.

[Brief description of drawings]

FIG. 1 is a structural diagram of a multilayer printed wiring board according to a first embodiment of the present invention.

FIG. 2 is a sectional view (1) showing a method for manufacturing a multilayer printed wiring according to a second embodiment of the present invention.

FIG. 3 is a sectional view (No. 2) showing the method for manufacturing the multilayer printed wiring board according to the second embodiment of the present invention.

FIG. 4 is a perspective view showing a third embodiment of the present invention.

FIG. 5 is a structural diagram of a multilayer printed wiring board according to a fourth embodiment of the present invention.

FIG. 6 is a sectional view showing a method for manufacturing a multilayer printed wiring board according to a fifth embodiment of the present invention.

[Fig. 7] Layout plan of holes for jig pins

FIG. 8 is a diagram showing a usage example of the short-circuit pin.

FIG. 9 is a structural diagram of a multilayer printed wiring board according to a sixth embodiment of the present invention.

FIG. 10 is a sectional view showing a method of manufacturing a multilayer printed wiring board according to a seventh embodiment of the present invention.

[Explanation of symbols]

 1,10,70 Copper-clad laminate 2 Film-like copper-clad laminate 3 Film-like adhesive base material 12 Conductor relief part 15,22 Earth circuit conductor 20 Non-flow type prepreg 23 Signal circuit conductor 41 Through hole 50 Short-circuit pin 501 Contact point 51, 104 Through hole 60 Jig pin hole 73 Signal circuit 74, 82, 105 Land 80 Film copper clad plate 201 Drilling

Claims (7)

[Claims] 1. A copper clad laminate having an earth circuit conductor formed thereon, a film-shaped copper clad laminate having an earth circuit conductor and a signal circuit conductor formed thereon, the copper clad laminate and the film-like copper clad laminate. A structure of a multilayer printed wiring board, comprising a film adhesive base material having a laminated structure and holes for through holes, wherein a coaxial circuit structure is formed on the multilayer printed wiring board. 2. A copper clad laminate is coated with an etching resist to form conductor escape portions of through-hole holes by the steps of exposure, development, etching, and peeling. Next, a plating resist is coated and exposed. After development, copper plating is applied to the plating resist stripped portion by the pattern plating method, high current plating is applied for a short time in the final step of plating, and a ground circuit conductor with granular copper plating on the plating surface is formed. In parallel with this, an etching resist is applied to the film-like copper clad laminate in the semi-cured state, and the steps of exposure, development, etching and peeling are performed to form the ground circuit conductor and signal circuit conductor, and then the ground circuit. The copper-clad laminate having a conductor formed thereon and the film-shaped copper-clad laminate having an earth circuit conductor and a signal circuit conductor formed are temporarily laminated and integrated, and the positional deviation and the like are inspected. Next, a temporary laminate of the copper-clad laminate, the film-like copper-clad laminate, and a B-stage film-like adhesive base material is used for final lamination, and final lamination is performed to integrate the circuit conductor with a coaxial structure. Finally, through holes for through holes are formed, through holes are plated by the panel plating method, etching resist is applied, and the surface circuit is formed through the steps of exposure, development, etching, and peeling, and multilayer printing is performed. A method for manufacturing a multilayer printed wiring board, which comprises completing the wiring board. 3. The method for manufacturing a multilayer printed wiring board according to claim 2, wherein through holes are formed in the ground circuit conductor at an appropriate pitch. 4. A copper clad laminate having a through hole and a land formed therein and a non-flow type prepreg having a hole equivalent to the diameter of the land formed therein. A multilayer printed wiring board structure characterized in that a short-circuit pin having a contact portion is inserted at a desired position to enable setting of a device number and the like. 5. A copper clad laminate is perforated, through-hole plating is performed by a panel plating method, an etching resist is applied, and exposure, development, etching, and peeling steps are performed to form through-holes and lands. In parallel with this step, a non-flow type prepreg is formed with a hole having a diameter equal to the diameter of the land of the copper-clad laminate, and then a hole is formed with the copper-clad laminate with through holes. Temporarily stack the non-flow type prepregs, check the through holes of the copper clad laminate and the hole positions of the non-flow type prepregs, stack the necessary number of temporary laminates, and then perform main lamination to integrate them and place them in the same hole position. A method of manufacturing a multilayer printed wiring board, comprising: completing a multilayer printed wiring board having separated through holes. 6. A copper clad laminate in which an inner layer circuit having a signal circuit and a land for a via hole is formed, and a conductor land having the same diameter as the land for the via hole is formed in a portion corresponding to the land for the via hole. A structure of a multilayer printed wiring board, comprising a film-shaped copper clad board, a film adhesive base material for laminating the copper clad laminate and the film-shaped copper clad board, and enabling connection between inner layers. 7. A copper clad laminate is coated with an etching resist to form a signal circuit and an inner layer circuit of a via hole land by the steps of exposure, development, etching and peeling, and then a plating resist is coated, After exposure / development, electrolytic plating is applied to the land for via holes, high current plating is applied for a short time in the final step of copper plating, copper plating with rough particles is applied, and the required number of inner layer circuits are manufactured in the above steps. In parallel with the process, an etching resist is applied to the film-shaped copper clad board, and the same diameter as the via hole land is applied to the part corresponding to the via hole land of the copper clad laminate by the process of exposure, development, etching and peeling. , And then the circuit-formed copper-clad laminate with the via-hole lands plated and the semi-cured film-like copper-clad laminate with the lands formed are temporarily laminated. After inspecting the misalignment, after that, a circuit corresponding to the temporary laminated product is formed and a copper clad laminated plate plated on the land for the via hole and a film-like adhesive base material in a semi-cured state are configured for main lamination, A method for manufacturing a multilayer printed wiring, which comprises completing a multilayer printed wiring board.