JPH09251166A - Liquid crystal element and production of this liquid crystal element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the conduction between metallic wirings and transparent electrodes by preventing the peeling of these metallic wirings and the leakage of light during driving of a liquid crystal panel. SOLUTION: The metallic wirings 22,... are formed of a three-layered structure. A material having a good adhesion property is used for the first layers 22a,.... As a result, the peeling of the metallic wirings 22 is prevented. A light opaque material is used for the first layers 22a and the first layers 22a are formed broader than the other layers and are so arranged as to close the spacings S,... between the transparent electrodes. As a result, the leakage of the light from the spacings S during driving of the liquid crystal panel is prevented and the image quality is improved. Further, a hardly oxidizable material is used for the third layers 22c,.... As a result, the surface of the metallic wirings 22 are not oxidized and the electrical conductivity with the transparent electrodes 6,... is assured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal device in which delay of a voltage waveform is prevented by being driven by first and second electrodes, and a method for manufacturing the liquid crystal device.

[0002]

2. Description of the Related Art Conventionally used electrode substrates for liquid crystal display elements have been constructed by forming a transparent electrode such as ITO on a glass substrate.

That is, FIG. 1 (a) is a sectional view showing the structure of a liquid crystal element (hereinafter referred to as "liquid crystal panel").
The liquid crystal panel P ₁ includes a pair of electrode substrates 1 and 1 (hereinafter referred to as “embedded wiring substrate 1,
1 "), these embedded wiring boards 1 and 1 were adhered to each other by a sealing material 2, and a ferroelectric liquid crystal 3 was held in an internal gap thereof.

On the other hand, each embedded wiring board 1 has a glass substrate 5, and stripe-shaped ITO transparent electrodes 6, ... Are formed on the surface of the glass substrate 5 (see FIG. )). In addition, these transparent electrodes 6, ...
Are covered with an insulating film 7 and an orientation control film 9.

In addition, such a liquid crystal panel P ₁ is driven by applying a voltage to the transparent electrodes 6, ....

By the way, in recent years, there has been a demand for higher definition and larger area of the liquid crystal panel, but since the resistance value (specific resistance) of the transparent electrodes 6, ... Is as high as about 200 to 4000 × 10 ⁻⁶ Ωm. However, the delay of the voltage waveform was a problem.

As a method of solving such a delay of the voltage waveform, a method of thickening the transparent electrodes 6, ... Is conceivable. According to this method, the transmittance is lowered and the transparent electrodes 6 ,. This is not practical because it causes problems such as deterioration in display quality, time and cost required for film formation, and poor adhesion of the transparent electrodes 6, ... To the substrate.

Therefore, as a liquid crystal panel for avoiding such a voltage waveform delay, a liquid crystal panel having a structure shown in FIGS. 2A and 2B is disclosed in Japanese Patent Laid-Open No. 2-63019. .

As shown in FIG. 2A, the liquid crystal panel P ₂ has a pair of electrode substrates 1 arranged so as to face each other.
0, 10 (hereinafter, referred to as “embedded wiring boards 10, 10”), and these embedded wiring boards 10, 1
The reference numeral 0 is attached by the sealing material 2, and the ferroelectric liquid crystal 3 is held in the internal gap.

Further, each embedded wiring board 10 is shown in FIG.
As shown in detail in (b), it has a glass substrate 11,
On the surface of the glass substrate 11, there are stripe-shaped metal wirings 1.
2, ... Are arranged with a predetermined gap therebetween. Further, the gap between the metal wirings 12, ... Is filled with a resin 13 ,.
One surface is formed on this surface and each metal wiring 1
The transparent electrodes 6, ... Are arranged along the lines 2 ,.
Furthermore, the transparent electrodes 6, ... Are covered with an insulating film 7 and an orientation control film 9.

Next, a method of manufacturing such a liquid crystal panel will be described with reference to FIGS. 3 (a) to 3 (h). (First Electrode Forming Step) First, metal wirings 12 having a thickness of about 1 μm are formed on the surface of the glass substrate 11 by using a sputtering method, a photolithography method, or the like, and then, as shown in FIG.
A wiring board A ₁ as shown in (b) is obtained (hereinafter, the surface of the wiring board A _{1 on which} the metal wirings 12, ... Are formed is referred to as a “wiring surface 15”). (Resin Filling Step) Next, a predetermined amount of the resin monomer liquid 13L such as an ultraviolet curable resin is dropped on the smooth surface of the smooth plate 16 by using the dispenser 17 as a constant amount supply device (see FIG. 3A). Hereinafter, this resin 13 will be referred to as "UV curable resin 13", the liquid resin before being cured will be represented by reference numeral 13L, and the resin after curing will be represented by reference numeral 13S. Resin 13 ").

Then, the surface of the smooth plate onto which the resin 13L has been dropped is aligned with the wiring surface 15 of the wiring board A ₁ (FIG. 1 (b)).
Resin) by the smooth plate 16 and the wiring board A _1.
L is sandwiched between (hereinafter, wiring board A
₁ and the structure formed by the smooth plate 16 and "the pressure body A _2"). As a result, the resin 13L is supplied to the wiring surface 15 of the wiring board A ₁ , that is, the portion where the metal wirings 12, ... Are formed.

In this step, a press machine 19 as shown in FIGS. 3 (c) and 3 (d) is used. This press machine 19
Includes a lower plate 19b on which the body A ₂ to be pressed is placed,
Above it, an upper plate 19a driven in the direction of arrow F ₁
Is arranged.

Then, in this step, the above-mentioned pressed body A ₂ is set between the upper plate 19a and the lower plate 19b of the press machine 19 and the press machine 19 is driven. This allows
The upper plate 19a is driven in the direction of the arrow F ₁ (see FIG. 7D), and the pressure-sensitive body A ₂ is pressed by the upper plate 19a and the lower plate 19b. At this time, the surface of the metal wiring 12, ...
The resin 13L supplied to the gap between the metal wirings 12, ... Is in contact with the smooth plate 16, and the surface of these is pressed by the smooth plate 16. The pressure is applied uniformly over the entire surface of the substrate and at a predetermined pressure or more.

As a result, the resin 13L is removed from the surfaces of the metal wirings 12, ... And filled in the gap between the metal wirings 12, .. The UV curing resin 13L and the metal wirings 12 ,. It will be. It is important to remove the resin 13L from the surfaces of the metal wirings 12, ... In this way in order to ensure electrical continuity with the transparent electrodes 6 ,. (Resin Curing Step) Next, the pressure applied by the press machine 19 is released, and the body A ₂ to be pressed is taken out of the press machine 19. Then, the glass substrate 1 is attached to the UV curable resin 13L of the pressed body A _2.
Ultraviolet ray L1 from the 1 side (hereinafter referred to as "UV light L1")
Is irradiated to completely cure the resin 13L (see (e) in the same figure). (Peeling step) After that, a releasing jig (not shown)
A force is applied in the direction of arrow F ₂ shown in (f) to separate the smoothing plate 16 from the wiring board A ₁ (see (g) in the figure). (Other steps) After that, the second electrode forming step is performed to form the transparent electrodes 6, ... (Refer to FIG. 6 (h)), and further the insulating film 7 and the orientation control film 9 are formed, as shown in FIG. Create a liquid crystal panel like this. The resin 13S is the metal wiring 1
Since it is excluded from the surface of 2, ..., Transparent electrodes 6, ...
The metal wirings 12, ... Are satisfactorily contacted with each other to ensure electrical conductivity.

By the way, it is necessary to use a material having a low resistance, a thin film thickness (deposition), and a low material cost for the above-mentioned metal wirings 12 ,. Copper (Cu) that is as low as 0.0 × 10 ⁻⁸ Ωm and satisfies other conditions was used.

[0017]

However, Cu
Has poor adhesion to a glass substrate or a resin such as an insulating layer or a color filter, and the metal wirings 12, ... May also be peeled together with the smooth plate 16 when the smooth plate 16 is peeled in the peeling step. There were many. Therefore, there is a problem that the manufacturing yield is significantly reduced.

Further, since Cu is a metal that is easily oxidized, the surfaces of the metal wirings 12, ... Are oxidized until the transparent electrodes 6, ... Are formed, and the transparent electrodes 6 ,.
There was a problem that electrical continuity with ... could not be obtained.

On the other hand, FIG. 4 is an enlarged sectional view showing the structure of the embedded wiring board 10.
In order to prevent a short circuit, the gaps S, ... Are provided between the adjacent transparent electrodes 6 ,.
However, when such gaps S, ... Are provided, the liquid crystal 3 in the portions corresponding to those gaps S ,.
There is a problem that leaked light as indicated by reference numeral L2 is generated and the image quality of the liquid crystal panel is deteriorated.

Therefore, an object of the present invention is to provide a liquid crystal element in which the delay of the voltage waveform is eliminated and which is capable of achieving high definition and large area.

It is another object of the present invention to provide a liquid crystal device which is manufactured at a low cost by improving the manufacturing yield by reducing the peeling of the first electrode.

A further object of the present invention is to provide a low cost liquid crystal device with reduced material cost.

Still another object of the present invention is to provide a liquid crystal element having excellent display quality by ensuring conduction between the first electrode and the second electrode.

It is another object of the present invention to provide a liquid crystal element that prevents light from leaking from the gap between the second electrodes.

A further object of the present invention is to provide a color liquid crystal device having the above-mentioned various effects.

Still another object of the present invention is to provide a method for manufacturing a liquid crystal element having the above-mentioned various effects.

Another object of the present invention is to provide an inexpensive method for manufacturing a liquid crystal element.

A further object of the present invention is to provide a method of manufacturing a liquid crystal device which manufactures a liquid crystal device having excellent corrosion resistance.

[0029]

The present invention has been made in view of the above circumstances, and includes a transparent substrate and a plurality of first electrodes formed on the surface of the transparent substrate with a predetermined gap left therebetween. A liquid crystal device including a resin filled in a gap between the plurality of first electrodes, and a plurality of second electrodes formed on the surfaces of the first electrode and the resin with a predetermined gap left therebetween. In, the first electrode has at least a first layer arranged so as to be in contact with the surface of the transparent substrate, and a second layer laminated on the first layer, wherein the first layer is It is formed of a material having strong adhesion to a transparent substrate, and the second layer transmits a drive signal together with the second electrode.
It is characterized by the following. In this case, the first layer is formed of Ni, M
It may be formed of o or an alloy thereof to increase the adhesion between the first layer and the transparent substrate.

On the other hand, the first electrode has a third layer laminated so as to cover the second layer, and the third layer is formed of a material which is less likely to be oxidized than the second layer. It may be done. In this case, the third layer is N
It may be formed of i, Mo or an alloy thereof.

On the other hand, it is preferable that the first layer is formed of a non-translucent material and is arranged so as to shield at least a part of the gap between the second electrodes. In this case, the first layer of the first electrode may be formed wider than the second layer and the third layer.

On the other hand, the second layer of the first electrode may be made of copper. Further, the transparent substrate may be a glass substrate. Furthermore, the transparent substrate may include a glass substrate and a color filter layer formed on the surface of the glass substrate. Furthermore, the resin may be an ultraviolet curable resin that is cured by being irradiated with ultraviolet rays. Further, the second electrode may be a transparent electrode made of ITO or the like.

On the other hand, in the method of manufacturing a liquid crystal element according to the present invention, a first electrode forming step of forming a plurality of first electrodes on a surface of a transparent substrate with a predetermined gap therebetween, and a step of forming the plurality of first electrodes A resin filling step of filling the resin into the mutual gap,
A method of manufacturing a liquid crystal element, comprising: a resin curing step of curing the resin; and a second electrode forming step of forming a plurality of second electrodes on the surfaces of the first electrode and the resin with a predetermined gap left therebetween. In the step of forming the first electrode, a first layer arranged so that the first electrode is in contact with the surface of the transparent substrate by using a vacuum film forming technique such as a sputtering method,
And a second layer laminated on the first layer, and
The first layer is formed of a material having a strong adhesion to the transparent substrate.

In this case, in the step of forming the first electrode, the third layer is laminated so as to cover the second layer, and the third layer is made of a material which is less likely to be oxidized than the second layer. It may be formed. Further, the first layer may be formed of a non-translucent material and arranged so as to shield at least a part of the gap between the second electrodes. Further, the first layer may be formed by a vacuum film forming technique such as a sputtering method, and the second layer and the third layer may be formed by a wet plating method. Furthermore, in the first electrode forming step, after forming the second layer into a predetermined shape, the third layer is formed by an electroplating method, and the side surface of the second layer is covered with the third layer. You may do it.

Since the portion of the first electrode that comes into contact with the transparent substrate is made of a material having a strong adhesion to the transparent substrate, peeling of the first electrode is prevented.

[0036]

Embodiments of the present invention will be described below with reference to the drawings.

First, a first embodiment of the present invention will be described with reference to FIGS.

FIG. 5A is a diagram showing the structure of the liquid crystal panel (liquid crystal element) according to the present embodiment. The liquid crystal panel P ₃ is a pair of electrode substrates 2 arranged so as to face each other.
0, 20 (hereinafter, referred to as "embedded wiring boards 20, 20"). These embedded wiring boards 20, 2
The reference numeral 0 is attached by the sealing material 2, and the ferroelectric liquid crystal 3 is held in the internal gap.

FIG. 5B is a detailed sectional view showing the structure of the embedded wiring board 20.
Has a transparent glass substrate (transparent substrate) 11. The glass substrate 11 is formed of, for example, soda-lime glass or boro-silicate glass (for example, # 7059 manufactured by Corning, which is alkali-free) having a thickness of 0.5 to 1.1 mm.

On the surface of the glass substrate 11, a large number of substantially striped metal wirings (first electrodes) 22, ... Are formed with a predetermined gap. This metal wiring 2
2, ... are the first layers 22a, ...
(Hereinafter, referred to as “underlayer 22a, ...”) and the underlayer 22
The second layers 22b, ... (hereinafter referred to as “Cu layers 22b, ...”) formed of Cu on the surfaces of a ,.
The third layer 22c formed so as to cover the ...
"Protective layer 22c, ...") and three layers.

Here, the base layers 22a, ... Are made of a non-translucent material which has a strong adhesion to the glass substrate 11 and the Cu layers 22b ,. Specifically, Ti, C
It is formed of a metal thin film such as r, Mo, W, Al, Ta, Ni or an alloy thereof. The base layers 22a, ... Are formed to have a width wider than that of the Cu layers 22b, ... And the protective layers 22c, ..., and shield all (or at least a part) of the gaps S ,. And a thickness that does not transmit visible light (for example, 100
0 Å).

The Cu layers 22b, ... Have a thickness of 1 μm.
The drive signal is transmitted together with the transparent electrodes (second electrodes) 6, which will be described later.

Further, the protective layers 22c, ... Are the Cu layers 22.
It is formed of a metal that is slower to oxidize than b, ... and is less likely to be oxidized, for example, a metal such as Mo, Ta, W, Ti, Cr, Ni, Au or an alloy film thereof, and the thickness thereof is 1000Å It is set to a degree. The protective layers 22c, ... Are formed to have substantially the same width as the Cu layers 22b ,.

Then, the metal wiring 22 having such a configuration,
Are filled with resin 13, and the surfaces of the resins 13, ... And the surfaces of the metal wirings 22, .. .. (that is, the surfaces of the protective layers 22c, ...) Are substantially smooth surfaces. Is formed. A UV-curable resin that is cured by being irradiated with UV light is used for the resins 13, ...

Further, a large number of transparent electrodes (second electrodes) 6, ... Made of ITO or the like are formed on this smooth surface. The transparent electrodes 6, ... Are formed in stripes, respectively, are arranged with a predetermined gap S, ... And are formed along the respective metal wirings 22 ,.

Furthermore, these transparent electrodes 6, ...
It is covered with the insulating film 7 and the orientation control film 9.

Next, the liquid crystal panel P in the present embodiment.
The manufacturing method of ₃ will be described with reference to FIG. (First Electrode Forming Step) In this step, the glass substrate 1
A large number of metal wirings 22, ... Are formed on the surface of 1 in a state in which a predetermined gap is formed (see FIG. 2B).

In forming these metal wirings 22, ..., First, a metal such as Ti, Cr, Mo, W, Al, Ta, Ni or an alloy thereof is used by using a vacuum film forming technique such as a sputtering method. The thin film (first layer) is the glass substrate 1
1, a Cu film (second layer) is formed by a thick film forming technique such as a sputtering method or a wet plating method, and Ti, Cr, Mo, W, Al, Ta, N
i or a metal thin film (third layer) of their alloy or the like, C
A film is formed on the surface of the u film.

Then, the three metal layers are patterned by the photolithography method to form the metal wirings 22, ... With the above-described shape (hereinafter, the glass substrate having the metal wirings 22 ,. 11 to “wiring board B
₁ ", and the surface of the wiring board B _{1 on which} the metal wirings 22 are formed is referred to as a" wiring surface 25 ").

The protective layers 22c, ... Are made of Mo, Ta,
When it is composed of a metal such as W, Ti, Cr, or Ni and an alloy film thereof, a vacuum film forming technique such as a sputtering method is used, and the protective layers 22c, ... Are made of Ni, Ni alloy, Au.
When it is composed of the above, a wet plating method or the like is used.

Further, the underlayers 22a, ..., The Cu layer 22b,
As the pattern forming method for the protective layers 22c, ..., Chemical etching method, dry etching method, mask plating method, lift-off method, etc. may be used. (Resin filling step) Next, a large number of these metal wirings 22, ...
The resin 13L is filled in the gap between the two.

At the time of this filling, the dispenser 17
A predetermined amount of resin monomer liquid 13L such as UV curable resin is dripped onto the smooth surface of the smooth plate 16 by using
reference).

Then, the surface of the smooth plate onto which the resin 13L has been dropped is aligned with the wiring surface 25 of the wiring board B ₁ ((b) in the same figure).
Resin) by the smooth plate 16 and the wiring board B _1.
L is sandwiched between them (hereinafter, the structure constituted by the wiring board B ₁ and the smooth plate 16 is referred to as “pressurized body B ₂ ”).

Next, the above-mentioned pressed body B ₂ is set between the upper plate 19a and the lower plate 19b of the press machine 19 as shown in FIGS. To drive. As a result, the upper plate 19a is driven in the direction of the arrow F ₁ , and the body B _{2 to} be pressed is pressed by the upper plate 19a and the lower plate 19b. At this time, the resin 13L supplied to the surfaces of the protective layers 22c, ... And the gaps between the metal wirings 22 ,.
, And their surfaces are pressed by the smooth plate 16. The pressure is applied uniformly over the entire surface of the substrate and at a predetermined pressure or more.

As a result, the resin 13L is removed from the surfaces of the protective layers 22c, ... And filled in the gaps between the metal wirings 22 ,. The UV curable resin 13L and the protective layers 22c ,. It will be. The protective layers 22c, ...
It is important to remove the resin 13L from the surface of the above in order to secure electrical continuity with the transparent electrodes 6, ... (Resin Curing Step) Next, the pressure applied by the press machine 19 is released, and the body B ₂ to be pressed is taken out of the press machine 19. Then, the glass substrate 1 is attached to the UV curable resin 13L of the body B _{2 to} be pressed.
UV light L1 is irradiated from the side of No. 1 to cure the resin 13L (see (e) in the figure). (Peeling process) After that, a releasing jig (not shown)
A force is applied in the direction of arrow F ₂ shown in (f) to separate the smoothing plate 16 from the wiring board B ₁ . When the resin 13 is thus hardened, the metal wirings 22, ... And the resin 13 form a substantially smooth surface (see FIG. 9 (g)). (Second electrode forming step) Next, the metal wirings 22, ... And the resin 1
A large number of transparent electrodes 6, ... Are formed with a predetermined gap S, ..

When forming the transparent electrodes 6, ..., a thin film of ITO or the like is formed by sputtering 12 or the like.
A film is formed to a thickness of about 00Å, and then a pattern is formed by etching using the photolithography method. Here, when a continuity check was performed between the metal wirings 22, ... And the transparent electrodes 6, ..., it was confirmed that all the wirings had continuity. (Other Steps) After that, the insulating film 7 and the orientation control film 9 are formed on the surfaces of the transparent electrodes 6, ... And the liquid crystal panel P ₃ is produced.

Next, the function and effect of this embodiment will be described.

According to the present embodiment, the metal wirings 22, ...
However, since the drive signal is transmitted together with the transparent electrodes 6, ..., So-called voltage waveform delay is eliminated. As a result, the liquid crystal panel P ₃ can cope with high definition and large area. In the present embodiment, since the low resistance Cu layers 22b, ... Are provided in a part (second layer) of the metal wirings 22, .., more than in the case of using other metal materials. The delay of the voltage waveform is eliminated.
Further, by utilizing the original characteristics of Cu, the Cu layer 22b,
Can be formed thin, and as a result, the material cost of the liquid crystal panel P ₃ can be reduced.

Further, in the present embodiment, the Cu layer 2
.. are arranged between the glass substrate 11 and the base layers 22a ,.
It is formed of a metal thin film such as r, Mo, W, Al, Ta, Ni or an alloy thereof. Since these metal thin films have strong adhesion to the glass substrate 11 and the Cu layers 22b, ...
.. are prevented from being peeled off together with the smooth plate 16, and as a result, the manufacturing yield of the liquid crystal panel is improved. When the present inventor actually manufactured the liquid crystal panel by the above method, no peeling of the metal wirings 22, ... Was observed.

Further, the underlayers 22a, ... Are made of a non-translucent material that does not transmit light, and are formed to a thickness (for example, about 1000 Å) that does not transmit light, and the underlayers 22a ,. Are Cu layers 22b, ..., Protective layers 22c,
Formed with a width wider than that of the transparent electrodes,
It is designed to block all (or at least some) of ... As a result, at the time of driving the liquid crystal panel, it is possible to prevent light from leaking from the gaps S, ... Between these transparent electrodes, and to improve the image quality as compared with a liquid crystal panel without such a base layer 22a.

Furthermore, the surfaces of the Cu layers 22b, ...
The protective layer 22 whose oxidation progresses slower than the Cu layers 22b, ...
Since it is covered with c, ..., The metal wiring 22 ,.
The surface of the metal is hard to be oxidized, and electrical continuity between the metal wirings 22, ... And the transparent electrodes 6 ,. As a result, the image quality and the like are improved.

In particular, the base layers 22a, ... And the protective layers 22c,
When ... Is formed of Ni, Mo, or an alloy thereof, these metals have strong adhesion to the glass substrate 11 or Cu, and therefore peeling in the metal wiring or the metal wiring 2
.. and the glass substrate 11 are more reliably prevented from peeling off, and the yield is further improved. In addition, the base layer 22a,
When these metals are used for the protective layer 22c and the like, the material cost of the liquid crystal panel can be further reduced.

On the other hand, the apparatus for carrying out the wet plating method is generally cheaper than the apparatus for carrying out the vacuum film forming method. Therefore, the Cu layers 22b, ...
When c, ... Are formed by the wet plating method, the manufacturing cost is lower than when these are formed by the vacuum film forming method.

Further, in the case of the wet plating method, the film forming speed is high, so that even if the Cu layers 22b, ... Are thickly formed, high-throughput production is possible and the production cost can be reduced.

Although the metal wirings 22, ... Are directly formed on the surface of the glass substrate 11 in the above-described embodiment, the present invention is not limited to this. Figure 7
FIG. 9 is a diagram showing a structure of a liquid crystal panel as another application example of the present embodiment. This liquid crystal panel P ₄ has electrode substrates 30, 30 (hereinafter, referred to as “embedded wiring”) having the structure shown in FIG. Substrate 30, 30 ″). The embedded wiring substrate 30 has a transparent glass substrate 31,
On the surface of the glass substrate 31, color filter layers 32 of R, G, and B colors are formed. Then, the metal wirings 22, ... Similar to the above-described embodiment are formed on the surface of the color filter layer 32. That is, in this application example, the laminated structure of the glass substrate 31 and the color filter layer 32 functions as a transparent substrate.

As the color filter layer 32, for example, a photosensitive resin layer in which a pigment is dispersed, a layer in which a pigment in which a thermosetting resin is dispersed is used as an ink to form a pattern, or an ink receiving layer is formed. After that, a layer in which the dye ink was colored by a method such as an inkjet method was used.

Here, Ti, Cr, Mo, W, Al, T
Since the metal thin film of a, Ni, or an alloy thereof has a strong adhesion to the color filter layer 32, the metal wiring 2
The peeling of 2, ... Is prevented. When the present inventor actually manufactured the color filter layer 32 and the metal wiring 22,
No peeling off was observed.

Next, a second embodiment of the present invention will be described with reference to FIG.

FIG. 8 is a diagram showing a method of manufacturing a liquid crystal panel according to this embodiment.

In the present embodiment, the glass substrate 11
As the material, soda lime glass having a thickness of 1.1 mm was used.

The glass substrate 11 is thoroughly washed,
A first layer made of a Ni-Mo (8.3 mol%) alloy film was formed on the surface of the substrate 11. A sputtering method is used for this film formation, and the sputtering target is N
i-Mo (8.3 mol%) alloy is used and the film thickness is 100.
I made it 0 Å. Further, other sputtering conditions are as shown in the table below.

[0072]

[Table 1] Next, by photolithography method, OFPR- manufactured by Tokyo Ohka Co., Ltd.
The 800 photoresist was patterned and the first layer was etched using a ferric chloride etchant to form the underlying layers 22a, ... Having a predetermined shape (see FIG. 8 (a)).

Next, as shown in FIG. 8B, the underlayer 22
Plating resist 50 so that only part of a, ... Is exposed.
Was formed. Further, this substrate 11 was immersed in an electroless copper plating bath, and wet plating was performed so that electroless copper had a thickness of 0.3 μm. The plating solution used is O
Using PC-750M, the plating temperature was 23 ° C. and the immersion time was 20 minutes.

Next, the glass substrate 11 is held by a plating jig so that an electric current flows through each of the wirings, and the glass substrate 11 is held.
Is dipped in a copper sulfate plating solution (Copper Gream CLX) made by Nippon Rironal Co., and electrolytic copper plating is performed to a thickness of 1 μm.
Wet plating is carried out to a certain degree and C shown in Fig. 8 (c)
The u layers 22b, ... Are formed. The plating conditions at this time are
A plating treatment was performed for 2 minutes at a current of 0.02 A / cm ² .

Then, after washing with pure water, it was immersed in a Ni sulfate sulfuric acid Ni plating solution (Nical PC-3) manufactured by Rironal Japan Co., Ltd.
The protective layers 22c made of a Ni film were formed to have a film thickness of 1000 Å at a current of 0.01 A / cm ² .

Then, the plating resist 50 was removed with a stripping solution to obtain a wiring pattern substrate shown in FIG. 8 (e).

Next, a UV curable resin 13 is embedded between the metal wirings, an ITO film is formed on the flat surface by a sputtering method in a thickness of 1200Å, patterned by a photolithography method, and the transparent electrodes 6, ... Are formed by an etching process. did.

Next, the effect of this embodiment will be described.

According to this embodiment, the same effect as that of the above-described first embodiment can be obtained.

Further, in the present embodiment, the underlayer 2
.. and the protective layers 22c .. are formed by a wet plating method, so that the liquid crystal panel can be manufactured inexpensively and easily.

The inventor of the present invention uses the manufacturing method shown in FIG.
When applied to the color liquid crystal panel shown in, the same effect was obtained.

Next, a third embodiment of the present invention will be described with reference to FIG.

FIG. 9 is a diagram showing a method of manufacturing a liquid crystal panel according to this embodiment.

In the present embodiment, a Ni—Mo alloy film is formed on the surface of the glass substrate 11 by sputtering to a thickness of 1000 Å, and is patterned by photolithography to form a Mi—Mo alloy film. Underlayer 2
2a, ... Are formed (see (a) in the figure).

Next, a plating resist 50 was patterned on the surface of the glass substrate 11. The plating resist 50 is formed so that only a part of the underlayers 22a, ... Is exposed (see FIG. 11A).

Further, the film thickness is 1 by the wet plating method.
A copper plating film with a thickness of approximately μm is formed (see Fig. 1 (a)). Then, by removing the plating resist 50, as shown in FIG.
A substrate as shown in (b) is obtained.

The wiring pattern was held by a plating jig so that it could be uniformly energized, and immersed in Ni plating solution Nical PC-3 manufactured by Japan Rironard Co.
Electroplating was performed with a current of cm ² until the thickness of the plating film reached 1000 Å to form protective films 52c, ...

That is, in the present embodiment, the patterning of the underlayers 22a, ... And the Cu layers 22b ,.
The protective films 52c, ... Are formed with the side surfaces of a, ..., 22b, ... Exposed.

Next, the UV curable resin 13 is pressed between the metal wirings with a smooth die, and after the UV curing step, the smooth die is released to form a buried wiring with a flat surface as shown in FIG. 9D. A substrate was produced.

Next, effects of the present embodiment will be described.

According to the present embodiment, since the third layer of Ni is plated by electroplating with the plating resist 50 removed, the side surfaces of the Cu layers 22b, ... Are also protected by the protective layers 52c ,. To be done. Therefore, the corrosion resistance of the Cu layers 22b, ... Is improved, and a liquid crystal panel having excellent durability can be obtained.

The inventors of the present invention conducted a test at a temperature of 75.degree.
When a high temperature and high humidity test with a humidity of 100% was performed for 200 hours, no occurrence of corrosion was observed and it was confirmed that the durability was excellent.

In each of the above-mentioned embodiments, the metal wirings 22, ... Have a three-layer laminated structure, but needless to say, it is not limited to this and may have a four-layer or more laminated structure. .. and Cu layers 22b, ..
It may have a layered structure, and in that case, peeling of the metal wirings 22, ... Is prevented.

On the other hand, in each of the above-mentioned embodiments,
Although the UV curable resin is used as the resin 13, it is not limited to this, and a thermosetting resin may be used.

[0095]

EXAMPLES The present inventor conducted experiments to determine the optimum materials for the underlayers 22a, ... And the protective layers 22c ,.
The contents will be described below.

In this example, experiments were carried out on the transparent substrate (glass substrate 11) shown in FIG. 5 (b) and the transparent substrate 33 with a color filter layer shown in FIG. 7 (b). In addition, soda-lime glass was used for the glass substrate 11, and the color filter layer 32 was formed of a photosensitive resin in which a pigment was dispersed.

First, a large number of glass substrates 11 shown in FIG. 5B and transparent substrates 33 with color filters shown in FIG. 7B were prepared. Then, on the surface of each substrate, Ti, Mo,
A metal material such as W, Al, Ta, Ni, and Cr was formed into a film having a thickness of 1000 Å by a sputtering method to form a first layer. Then, a Cu film having a thickness of 1 μm was formed on the surface of the first layer to form a second layer. Further, the same metal material as that of the first layer was formed into a film having a thickness of 1000 Å on the surface of the second layer by a sputtering method to obtain a metal thin film having a three layer structure.

Next, the metal thin film having the three-layer structure is shown in FIG.
As shown in (b) and FIG. 7 (b), that is,
The second layer and the third layer have the same width, and the first layer is wider than the second layer and the third layer, and etching is performed by a photolithography method to form the underlayers 22a, ..., Cu layers 22.
, and the metal wirings 22, ...
Was formed.

The etching of the third layer (protective layers 22c, ...) Is performed using an etchant that does not etch the second layer (Cu layers 22b, ...). For example, the red blood salt alkaline etchant has a selectivity that etches Cr, Al, W, Mo, etc. but does not etch Cu. However, such an etchant is used to etch the third layer (protective layer 22c, ...). Used for. Similarly, the second layer (Cu layer 22
b) and the third layer (base layers 22a, ...) Are etched.

Next, the resin 13L is filled in the gap between the metal wirings 22, ...
After the V cure, the smooth plate 16 was released to obtain the substrate shown in FIG. 6 (g).

Then, the surface of the substrate (metal wiring 22,
... or resin 13, ... is placed on the surface) and a cutter is used to make vertical and horizontal cuts (cross cuts) at intervals of 5 mm.
The metal wirings 22, ... And the resin 13, ... Are cut into 5 mm square. The cut portion was 25 mm square.

Next, an adhesive tape (cellophane tape made by Nichiban) was attached to the cut portion, and the tape was peeled off. This operation was repeated 10 times to check the number of peeled off portions. The results are shown in Table 1 below.

[0103]

[Table 2] From this experiment, it was found that peeling of the metal wiring was observed when W or Al was used for the underlayers 22a, ....

Next, ITO is sputtered on the above-mentioned notched portion of the substrate by 1000 Å.
After being formed, a continuity check between the ITO film and the metal wirings 22, ... Was conducted. In this experiment, poor conduction occurred in the sample using Al.

From the above results, Ti and M used in the experiment
Of O, W, Al, Ta, Ni, and Cr, W and Al are easily peeled off, and particularly Al has a poor electrical connection with the ITO film, and is used as a material for the base layers 22a, ... And the protective layers 22c ,. Turned out not suitable. Further, among other materials, Ti and Ta are 2 to 3 times more expensive than other materials, and Cr is a toxic substance, so that the cost of treating the etching waste liquid is higher than that of other materials. turn into.

Therefore, it has been confirmed that Mo and Ni are excellent as materials for the underlayers 22a, ... And protective layers 22c, ..

Incidentally, Ni of these is a magnetic material,
In the magnetron sputtering method which is a general sputtering method, there is a constraint that the thickness of the sputtering target cannot be increased. However, this Ni has M
By adding 8.3 mol% of o to form a Ni-Mo alloy, the magnetic flux density can be reduced to 1000 Gauss or less, and the thickness of the sputtering target can be increased even in the magnetron sputtering method, so that it can be used. In addition, the present inventor actually used this composition of Ni--Mo.
When the metal wirings 22, ... Are formed using an alloy and the above-mentioned respective tests are carried out, good results are obtained in the adhesion test and the continuity test.

[0108]

As described above, according to the present invention,
Since the second layer of the first electrode is configured to transmit the drive signal together with the second electrode, so-called voltage waveform delay is eliminated. As a result, the liquid crystal element can cope with high definition and large area.

Further, since the first layer having a strong adhesion to the transparent substrate is interposed between the second layer and the transparent substrate, peeling between the first electrode and the transparent substrate in the manufacturing process is prevented. Therefore, the manufacturing yield of the liquid crystal device is improved.

Furthermore, when this first layer is formed of Ni, Mo or an alloy thereof, peeling between the first electrode and the transparent substrate can be reliably prevented, and the manufacturing yield is further improved. Furthermore, the material cost of the liquid crystal element can be reduced.

Further, when the second layer is formed of copper, the delay of the voltage waveform is further eliminated and the second layer can be formed thin as compared with the case where another metal material is used. It is easy, and as a result, the material cost of the liquid crystal element is reduced.

On the other hand, when the second layer is covered with the third layer which is less likely to be oxidized than the second layer, the surface of the first electrode is less likely to be oxidized and the first electrode and the second electrode are not easily oxidized. Continuity is secured.

On the other hand, when the first layer is formed of a non-translucent material and is arranged so as to shield at least a part of the gap between the second electrodes, when the liquid crystal element is driven. At, to prevent the leakage of light from these gaps,
The image quality can be improved as compared with a liquid crystal element that does not have such a first layer. Such an effect is obtained by applying the first layer to
It can also be obtained when it is formed with a width wider than that of the second layer or the third layer.

When the third layer is made of Ni, Mo or an alloy thereof, the adhesion between these metals and copper is strong, so that the second layer and the third layer are separated from each other. The peeling is prevented and the yield is further improved.
Further, the material cost of the liquid crystal element can be further reduced.

On the other hand, when the transparent substrate is composed of a glass substrate and a color filter formed on the surface of the glass substrate, a color liquid crystal element having various effects described above can be obtained.

On the other hand, when the wet plating method is used for forming the first electrode, the manufacturing cost is reduced as compared with the vacuum film forming method. Further, according to this wet plating method, since the film forming speed is high, it is possible to perform the production with high throughput and reduce the manufacturing cost.

On the other hand, when the third layer is formed by the electroplating method after forming the second layer into a predetermined shape, the side surface of the second layer is also covered with the third layer. As a result, the corrosion resistance of the liquid crystal element is improved.

[Brief description of drawings]

FIG. 1 is a diagram for explaining the structure of a conventional liquid crystal panel.

FIG. 2 is a diagram for explaining the structure of a conventional liquid crystal panel.

FIG. 3 is a diagram for explaining a conventional liquid crystal panel manufacturing method.

FIG. 4 is a diagram for explaining a problem in a conventional liquid crystal panel.

FIG. 5 is a diagram for explaining the structure of a liquid crystal panel according to the present invention.

FIG. 6 is a diagram for explaining a method of manufacturing a liquid crystal panel according to the present invention.

FIG. 7 is a diagram for explaining the structure of a color liquid crystal panel according to the present invention.

FIG. 8 is a diagram for explaining another embodiment of the method of manufacturing a liquid crystal panel.

FIG. 9 is a diagram for explaining another embodiment of the method of manufacturing a liquid crystal panel.

[Explanation of symbols]

6, ... Transparent electrode (second electrode) 10 Embedded wiring substrate 11 Glass substrate (transparent substrate) 13, ... UV curable resin (ultraviolet curable resin) 20 Embedded wiring substrate 22, ... Metal wiring (first electrode) 22a, ... Underlayer (first layer) 22b, ... Cu layer (second layer) 22c, ... Protective layer (third layer) 30 Embedded wiring board 31 Glass substrate 32 Color filter layer 33 Transparent substrate 50 Plating resist P ₃ Liquid crystal panel ( Liquid crystal element) P ₄ Liquid crystal panel (liquid crystal element) S, ... Gap between the second electrodes

Claims (16)

[Claims] 1. A transparent substrate, a plurality of first electrodes formed on a surface of the transparent substrate in a state where a predetermined gap is opened, a resin filled in a gap between the plurality of first electrodes, and a predetermined number. In a liquid crystal element comprising the first electrode and a plurality of second electrodes formed on the surface of the resin with a gap left therebetween, the first electrode is arranged so as to contact the surface of the transparent substrate. At least a first layer and a second layer laminated on the first layer, the first layer is formed of a material having a strong adhesion to the transparent substrate, and the second layer is A liquid crystal element, which transmits a drive signal together with the second electrode. 2. The liquid crystal according to claim 1, wherein the first layer is formed of Ni, Mo or an alloy thereof to increase the adhesion between the first layer and the transparent substrate. element. 3. The first electrode has a third layer laminated so as to cover the second layer, and the third layer is made of a material which is less likely to be oxidized than the second layer. The liquid crystal element according to claim 1 or 2, characterized in that 4. The liquid crystal element according to claim 3, wherein the third layer is formed of Ni, Mo or an alloy thereof. 5. The first layer is formed of a non-translucent material, and is arranged so as to shield at least a part of a gap between the second electrodes. 5. The liquid crystal element according to any one of items 4 to 4. 6. The liquid crystal element according to claim 5, wherein the first layer of the first electrode is formed to have a width wider than that of the second layer and the third layer. 7. The liquid crystal element according to claim 1, wherein the second layer of the first electrode is formed of copper. 8. The liquid crystal device according to claim 1, wherein the transparent substrate is a glass substrate. 9. The liquid crystal device according to claim 1, wherein the transparent substrate includes a glass substrate and a color filter layer formed on the surface of the glass substrate. 10. The liquid crystal device according to claim 1, wherein the resin is an ultraviolet curable resin that is cured by being irradiated with ultraviolet rays. 11. The liquid crystal device according to claim 1, wherein the second electrode is a transparent electrode formed of ITO or the like. 12. A first electrode forming step of forming a plurality of first electrodes on a surface of a transparent substrate in a state where a predetermined gap is formed, and a resin filling step of filling a resin into a gap between the plurality of first electrodes. And a resin curing step of curing the resin, and a second electrode forming step of forming a plurality of second electrodes on the surfaces of the first electrode and the resin with a predetermined gap left therebetween, In the manufacturing method, a vacuum film forming technique such as a sputtering method is used in the first electrode forming step, and the first electrode is arranged so as to be in contact with the surface of the transparent substrate, and the first layer. And a second layer laminated on the transparent substrate, and the first layer is formed of a material having a strong adhesion to the transparent substrate. 13. The second electrode is formed in the first electrode forming step.
13. The method for manufacturing a liquid crystal element according to claim 12, wherein a third layer is laminated so as to cover the layer, and the third layer is formed of a material that is less likely to be oxidized than the second layer. . 14. The first layer is formed of a non-translucent material and is arranged so as to shield at least a part of the gap between the second electrodes. A method for producing the liquid crystal element according to claim 1. 15. The liquid crystal according to claim 12, wherein the first layer is formed by a vacuum film forming technique such as a sputtering method, and the second layer and the third layer are formed by a wet plating method. Device manufacturing method. 16. The second electrode is formed in the first electrode forming step.
16. After forming a layer in a predetermined shape, the third layer is formed by an electroplating method, and the side surface of the second layer is covered with the third layer. A method for producing the liquid crystal element according to claim 1.