JP2005134543A - Method for inspecting substrate for electrooptical device, and method for manufacturing substrate for electrooptical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for inspecting a substrate for an electrooptical device with which physical properties of a transparent electrode can be inspected during manufacturing steps of the substrate for the electrooptical device, and with which the substrate for the electrooptical device etc. with excellent long-term reliability are provided, and a method for manufacturing the substrate for the electrooptical device using the inspecting method. <P>SOLUTION: The method for inspecting the substrate for the electrooptical device to evaluate the physical properties of the transparent electrode formed on the substrate for the electrooptical device and the method for manufacturing the substrate containing the inspecting method, include a transparent electrode forming step to form the transparent electrode by laminating a transparent conductive material on a glass substrate including a protective film formed on a place corresponding to a display region on the glass substrate, and carrying out a first etching treatment on the transparent conductive material by using an etching processing liquid, and an evaluating step to carry out a second etching treatment as a test for etching treatment on the transparent electrode by using the etching processing liquid and to evaluate the physical properties of the transparent electrode on a non-flat part of the glass substrate including the protective film. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for inspecting an electro-optical device substrate and a method for manufacturing an electro-optical device substrate. In particular, it is possible to adjust the manufacturing conditions of the electro-optical device substrate to appropriate conditions by evaluating the physical properties of the transparent electrode, for example, adhesion, in the manufacturing stage of the electro-optical device substrate, and long-term reliability The present invention relates to a method for inspecting a substrate for an electro-optical device that can provide an electro-optical device substrate having excellent properties, and a method for manufacturing a substrate for an electro-optical device.

2. Description of the Related Art Conventionally, a substrate for an electro-optical device used for an electro-optical device such as a liquid crystal display device is composed of a reflective film, a color filter, a protective film, a transparent electrode, an alignment film, and the like formed on a glass substrate. . That is, a protective film is formed on a glass substrate on which a reflective film, a color filter, etc. are formed, and serves to suppress the growth of crystal particles in the reflective film or to flatten the surface of the substrate for an electro-optical device. After that, a crystalline or non-crystalline transparent electrode and an alignment film are laminated.
Here, it is sufficient that the protective film is formed in a display region where a reflective film, a color filter, and the like are formed. Since the electro-optical device substrate, the electro-optical device, and the like can be thinned, an electro-optical device substrate in which a protective film is selectively formed only in the display region is disclosed. More specifically, as shown in FIG. 10, in the electro-optical device 390 in which a pair of electro-optical device substrates 320 and 321 are bonded together via a seal material 390, a protective film (outside the seal frame and the seal frame) There are disclosed electro-optical device substrates 320 and 321 in which protective films 375 and 303 are formed so as to cover the reflective film 302 and the color filter 374 only in the seal frame without providing the flattening film 375 (for example, , See Patent Document 1).
Japanese Patent Laid-Open No. 2002-49033 (FIG. 10)

However, in the electro-optical device substrate disclosed in Patent Document 1, when a transparent electrode is laminated on a glass substrate including a selectively formed protective film, the transparent electrode and the protective film are protected at the boundary portion of the protective film. There was a problem that the adhesion between the film and the film tends to be lowered. That is, on the glass substrate, there are a portion where the protective film is formed and a portion where the protective film is not formed, and a non-flat portion (inclined portion) is formed in the vicinity of the boundary. And since the crystal | crystallization state etc. of the transparent electrode formed differ, stress tends to concentrate on the transparent electrode in this non-flat part, and the problem that this transparent electrode peeled or disconnected was seen.
In addition, the crystal state of the transparent electrode has a characteristic that it changes (progresses) with time. Even if it is not possible to detect an initial contact failure of the transparent electrode, the electro-optical device or the electronic There has been a problem that disconnection or loss occurs due to such poor adhesion after being incorporated into a device or the like.
On the other hand, since no suitable inspection method that can detect such a poor adhesion of the transparent electrode in advance in the manufacturing stage has been found, and no implementation has been carried out at all, There was also a problem that long-term reliability of optical devices and the like was poor.

  Therefore, the present invention was made to solve such problems, and in the manufacturing stage, evaluated physical properties such as adhesion of the transparent electrode in the non-flat portion of the glass substrate including the protective film, It is an object of the present invention to provide an inspection method capable of confirming the presence or absence of defective formation of a transparent electrode, and a method for manufacturing a substrate for an electro-optical device including the inspection method. In addition, when an electro-optical device or an electronic device is assembled by appropriately adjusting the manufacturing conditions of the electro-optical device substrate based on the evaluation result of the physical properties, the electro-optical device can provide excellent long-term reliability. It is an object of the present invention to provide a method for inspecting a substrate and a method for manufacturing a substrate for an electro-optical device including the inspection method.

According to the present invention, there is provided an inspection method for an electro-optical device substrate for evaluating the physical properties of a transparent electrode formed on the electro-optical device substrate,
A transparent conductive material is laminated on a glass substrate including a protective film formed at a position corresponding to a display region on the glass substrate, and a first etching process is performed on the transparent conductive material using an etching treatment liquid. A transparent electrode forming step of forming a transparent electrode by performing,
An evaluation process for evaluating the physical properties of the transparent electrode in the non-flat portion of the glass substrate including the protective film by performing a second etching treatment as an etching treatment test on the transparent electrode using the etching treatment liquid;
The method for inspecting a substrate for an electro-optical device is provided, and the above-described problems can be solved.
The non-flat portion means a portion where a step is generated in a plane on the glass substrate including the protective film, and mainly the protective film when the protective film is selectively formed on the glass substrate. The point including the end of

  In carrying out the method for inspecting a substrate for an electro-optical device of the present invention, it is preferable to perform the evaluation step a plurality of times.

  Further, in carrying out the method for inspecting a substrate for an electro-optical device of the present invention, in the evaluation process, a cross-cut test conforming to JIS K5400 is performed, or the erodibility of the transparent electrode is observed, whereby the properties of the transparent electrode are measured. It is preferable to evaluate the adhesion.

  In carrying out the method for inspecting a substrate for an electro-optical device of the present invention, it is preferable to provide an inclined portion at the end of the protective film in the transparent electrode forming step.

  In carrying out the method for inspecting a substrate for an electro-optical device according to the present invention, it is preferable to form a transparent electrode through an underlayer in the transparent electrode forming step.

  In carrying out the method for inspecting a substrate for an electro-optical device of the present invention, in the transparent electrode forming step, it is preferable that the protective film is made of a photocurable acrylic resin and the transparent electrode is made of an indium tin oxide film. .

  In carrying out the method for inspecting a substrate for an electro-optical device according to the present invention, it is preferable that, in the evaluation step, hydrochloric acid and iron chloride are included as components of the etching treatment liquid used for the first and second etching treatments.

  Further, in carrying out the method for inspecting a substrate for an electro-optical device of the present invention, in the evaluation step, when the etching treatment liquid is treated on the transparent electrode, the etching treatment liquid is sprayed or immersed in the etching treatment liquid. It is preferable to make it.

Another aspect of the present invention is a protective film forming step of forming a protective film at a position corresponding to a display region on the glass substrate, a transparent conductive material is laminated on the glass substrate including the protective film, and transparent A transparent electrode forming step of forming a transparent electrode by performing a first etching process on a conductive material, and a method for manufacturing an electro-optical device substrate,
An electro-optical device, further comprising an evaluation step of performing a second etching process as an etching process test on the transparent electrode and evaluating the physical properties of the transparent electrode in the non-flat portion of the glass substrate including the protective film. It is a manufacturing method of the board | substrate.

  Further, in carrying out the method for manufacturing a substrate for an electro-optical device according to the present invention, the evaluation results of the physical properties of the transparent electrode obtained in the evaluation step are expressed as a protective film forming step and a transparent electrode forming step, or any one of the forming steps. It is preferable to feed back the manufacturing conditions.

  In carrying out the method for manufacturing a substrate for an electro-optical device of the present invention, the evaluation process is provided in parallel with the transparent electrode forming process, and the electro-optical apparatus in which the transparent electrode is formed in the transparent electrode forming process It is preferable to arbitrarily collect a substrate for use and evaluate the physical properties of the transparent electrode.

Hereinafter, an embodiment relating to a method for inspecting a substrate for an electro-optical device of the present invention and a method for manufacturing a substrate for an electro-optical device including the inspection method will be described in detail with reference to the drawings.
However, this embodiment shows one aspect of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the present invention.

[First Embodiment]
The first embodiment is an inspection method of the electro-optical device substrate 12 for evaluating the physical properties of the transparent electrode 19 formed on the electro-optical device substrate 12, as illustrated in FIGS.
Then, the transparent conductive material 19X is laminated on the glass substrate 13 including the protective film 215 formed at a position corresponding to the display area on the glass substrate 13, and an etching treatment liquid is used for the transparent conductive material 19X. A transparent electrode forming step of forming the transparent electrode 19 by performing the first etching process;
The transparent electrode 19 is subjected to a second etching treatment as an etching treatment test using an etching treatment liquid, and the physical properties of the transparent electrode 19 in the non-flat portions 80a and 80b of the glass substrate 13 including the protective film 215 are measured. An evaluation process to evaluate;
It is characterized by including.
Hereinafter, regarding the method for inspecting a substrate for an electro-optical device according to the first embodiment, a glass substrate (first film) including a protective film (planarization film) in a color filter substrate (first substrate) as a substrate for an electro-optical device. A case where a transparent electrode (first transparent electrode) is formed on a glass substrate will be described as an example.

1. Inspection Object As shown in FIG. 1D, the color filter substrate 12 as the inspection object is basically a glass substrate 12, a colored layer 16, a protective film (planarization film) 215, and a first transparent substrate. The electrode 19 and the alignment film 217 are preferably used. Although not shown, it is also preferable to provide an insulating layer for improving electrical insulation in the color filter substrate 12.
Further, when the color filter substrate 12 requires a reflection function, for example, in a transflective liquid crystal device used for a mobile phone or the like, a transflective reflection is provided between the glass substrate 12 and the colored layer 16. A reflective layer 212 having a function is preferably provided. In addition, the reflective layer includes a first reflective base having a plurality of convex portions independently formed on the surface of the substrate and a continuous layer having a relatively gentle surface state formed thereon. 2 reflective bases, and a reflective film made of a metal thin film formed thereon is preferably included.

In addition, the colored layer 16 usually has a predetermined color tone by dispersing a coloring material such as a pigment or a dye in a transparent resin. An example of the color tone of the colored layer is a primary color filter composed of a combination of three colors R (red), G (green), and B (blue), but is not limited to this. ), M (magenta), C (cyan), and other various color tones.
Further, as shown in FIG. 1D, it is preferable that a black light shielding film (black matrix or black mask) 18 is formed in an inter-pixel region between the colored layers 16 formed for each pixel.
As this black light-shielding film 18, for example, a colorant such as a black pigment or dye dispersed in a resin or other base material, or three colors of R (red), G (green), and B (blue) A material in which a coloring material is dispersed in a resin or other base material can be used.
Various pattern shapes such as a stripe arrangement, an oblique mosaic arrangement, or a delta arrangement can be adopted as the arrangement pattern of the colored layers.

Further, as shown in FIG. 1D, it is preferable to form a first transparent electrode 19 made of ITO (indium tin oxide) or the like on the protective film (planarizing film) 215. It is preferable that the first transparent electrode 19 has a stripe shape, and a plurality of the first transparent electrodes 19 are arranged in parallel.
An alignment film 217 made of polyimide resin or the like is preferably formed on the first transparent electrode 19. This is because by providing the alignment film 217 in this way, when the color filter substrate 12 is used in a liquid crystal display device or the like, voltage driving of the liquid crystal material can be easily performed.

2. Transparent electrode forming step The transparent electrode forming step according to the first embodiment is performed by laminating a transparent conductive material on a glass substrate including a protective film formed at a position corresponding to a display region on the glass substrate, and the transparent conductive material. Is a step of forming a transparent electrode by performing a first etching process using an etching process liquid. Hereinafter, taking a case where a transparent electrode is formed on a first glass substrate including a protective film in a color filter substrate (first substrate) as an example, with reference to FIGS. 3A to 3G as appropriate. explain.

First, as shown in FIGS. 3A to 3B, a protective film 215 formed in a region on the glass substrate 13 where the color filters 16r, 16g, 16b and the like are formed, that is, in a portion corresponding to the display region. It is preferable to form a transparent conductive layer 19X made of a transparent conductive material over the entire surface of the glass substrate 13 including the above.
At this time, as shown in FIGS. 3 and 7, it is preferable to have an inclined portion 80 at the end of the protective film 215. The reason for this is that when the transparent electrode is formed on the glass substrate including the protective film by having such an inclined portion, the stress concentration is reduced compared to the case where the end of the protective film is vertical. This is because it can be relaxed. Therefore, it is possible to effectively prevent disconnection, omission, and the like.
FIG. 7 is a partial vertical cross-sectional view of the XX cross section of FIG.
In addition, as the transparent conductive material, ITO (indium tin oxide), IZO (indium zinc oxide), tin oxide, zinc oxide, tin oxide / antimony oxide, etc. can be used. As shown, it is preferable to use ITO (indium tin oxide). As an example, this transparent conductive layer can be formed by sputtering.

Further, when laminating the transparent conductive layer, it is preferable to laminate after forming the base layer 81 made of Ta ₂ O ₅ , SiO ₂ or the like, as shown in FIG. This is because the crystal state of the transparent electrode on the protective film and the glass substrate can be made uniform, and the adhesion of the transparent conductive layer can be improved.
Then, as shown in FIGS. 3C to 3G, the transparent conductive layer 19X is patterned using a photolithography technique, and as shown in FIGS. 1D and 3G, It is preferable to form the transparent electrode (first transparent electrode) 19. Specifically, first, a resist material 86 subjected to predetermined patterning is laminated on the transparent conductive layer 19X. Next, the transparent conductive material 19X other than the portion covered with the resist material 86 is subjected to an etching process (first etching process) using an etching process liquid, whereby a transparent electrode (first pattern) having a predetermined pattern is formed. Transparent electrode) 19 can be formed.
Note that FIG. 1D shows a view of the YY cross section of FIG.

3. Evaluation Step As shown in FIGS. 2A to 2C, the evaluation step according to the first embodiment is a first etching process for making the transparent conductive material a transparent electrode having a predetermined shape with respect to the transparent electrode 19. Etching process (second etching process) different from that of the first transparent electrode 19 in the non-flat portion 80 of the first glass substrate 13 including the protective film (flattening film) 215, for example, adhesion This is a process for inspecting.
That is, when the adhesiveness of the transparent electrode is poor, the etching solution can be easily infiltrated into the portion, and the transparent electrode can be excessively eroded. Therefore, it becomes easy to find a defective formation of the transparent electrode in the manufacturing stage of the substrate for the electro-optical device. Therefore, when such a formation defect is found, it is possible to interrupt the incorporation of the electro-optical device substrate manufactured under the same conditions into the electro-optical device or the like. In addition, it is possible to feed back to the manufacturing conditions of the substrate for the electro-optical device and quickly adjust the manufacturing conditions to an appropriate range.
In addition, since the adhesion failure or disconnection of the transparent electrode is particularly likely to occur at a location corresponding to the non-flat portion of the protective film, the transparent electrode is subjected to severe conditions by performing the second etching treatment as an etching treatment test at the location. The formation state of can be evaluated. Accordingly, the long-term reliability of the obtained electro-optical device substrate, electro-optical device, and the like can be significantly increased.
Hereinafter, the etching process test for the transparent electrode and the evaluation test for the transparent electrode will be described separately.

(1) Etching treatment test (second etching treatment)
(1) -1 Outline In the etching treatment test, the transparent electrode formed on the glass substrate including the protective film is etched (second etching process), and the characteristics of the transparent electrode, for example, the glass including the protective film. This is a process for quickly and accurately evaluating the adhesion to the substrate. That is, by performing an etching treatment test, an etching treatment liquid can be infiltrated into a place where the adhesion of the transparent electrode is poor due to poor formation or the like, and the transparent electrode at the place can be excessively eroded.
Here, the etching treatment test may be performed by using the transparent conductive layer etching treatment (first etching treatment) line in the transparent electrode forming step described above, that is, by again throwing it into the existing etching line. preferable.
On the other hand, it is also preferable that a part of the etching line is branched and an inspection line for an etching process test is provided. That is, an evaluation process for performing an etching treatment test is provided in parallel with the transparent electrode forming process, and an electro-optical device substrate on which the transparent electrode in the transparent electrode forming process is formed is arbitrarily collected, and the transparent It is preferable to evaluate the physical properties of the electrode.
This is because the electro-optical device substrate manufacturing apparatus and the etching treatment liquid used in the etching process of the transparent conductive layer can be used together in the manufacturing process and the evaluation process. This is because the etching treatment test can be performed quickly and efficiently. Further, the physical properties of the transparent electrode on the electro-optical device substrate being manufactured can be quickly inspected, and the manufacturing conditions can be adjusted immediately to improve the yield of the electro-optical layer device substrate. .

(1) -2 Components of etching treatment liquid It is preferable that the components of the etching treatment liquid used for the etching treatment test include hydrochloric acid and iron chloride. That is, in the transparent electrode forming step, it is preferable to use the same etching treatment liquid as that used for the first etching treatment of the transparent conductive layer.
The reason for this is that, by carrying out in this way, it becomes possible to carry out the etching treatment test by using a part of the etching treatment line in the manufacturing process as it is. Therefore, a predetermined etching process test can be performed without providing an inspection apparatus or the like separate from the manufacturing apparatus.

(1) -3 Baume value Further, regarding the etching treatment liquid to be used, it is preferable to set the Baume value relating to the specific gravity within a range of 40 to 70 °.
This is because when the Baume value of the etching processing solution is less than 40 °, it may be difficult to evaluate the formation failure of the transparent electrode quickly and accurately. On the other hand, if the Baume value of the etching processing solution exceeds 70 °, it may not be defectively formed but may erode up to an appropriate transparent electrode, which may make it difficult to accurately evaluate the physical properties of the transparent electrode. It is.
Therefore, the Baume value of the etching treatment liquid to be used is more preferably set to a value within the range of 45 to 65 °, and further preferably set to a value within the range of 50 to 60 °.

(1) -4 pH value Moreover, it is preferable to make pH value into the value within the range of 2-5 regarding the etching process liquid to be used, and it is more preferable to set it as the value within the range of 2.5-4.
This is because when the pH value of the etching treatment liquid is less than 2, it may be difficult to evaluate the formation failure of the transparent electrode quickly and accurately. On the other hand, if the concentration of the etching treatment liquid exceeds 5, it may be difficult to accurately evaluate the physical properties of the transparent electrode as a result of erosion to an appropriate transparent electrode rather than poor formation. .

(1) -5 Treatment Method Further, when the etching treatment liquid is treated on the transparent electrode, as shown in FIG. 4A, the etching treatment liquid 90 is sprayed on the first transparent electrode 19, It is preferable to spray.
The reason for this is that by carrying out in this way, a small amount of the etching treatment liquid can be used and the etching treatment liquid can be accurately infiltrated into a desired portion of the transparent electrode. Further, it is not necessary to make a large space for performing the etching treatment test, and space can be saved. Therefore, when the adhesiveness of the transparent electrode is poor, it can be surely lifted from the protective film or the glass substrate.
In addition, when the etching solution is processed on the transparent electrode, it is also preferable to immerse the electro-optical device substrate 12 in the etching solution 90 as shown in FIG.
The reason for this is that, by carrying out in this way, the processing can be reliably performed regardless of the area and pattern of the transparent electrode. Therefore, the transparent electrode can be efficiently eroded when the adhesion of the transparent electrode is poor. Therefore, it becomes possible to easily find a defective formation of the transparent electrode.

(1) -6 Temperature Moreover, when performing an etching process test, it is preferable to make the temperature of an etching process liquid into the value within the range of 10-50 degreeC.
This is because the transparent electrode can be rapidly eroded by carrying out in this way. Moreover, it is because crystallinity etc. of a transparent electrode can be changed efficiently using some manufacturing apparatuses, etching processing liquids, etc. Therefore, it is possible to quickly and surely detect the adhesion failure of the transparent electrode.
Therefore, the temperature of the etching treatment liquid is more preferably set to a value within the range of 12 to 40 ° C, and further preferably set to a value within the range of 15 to 30 ° C.
In addition, it is preferable to implement on the temperature conditions similar to the etching process in a transparent electrode formation process. Therefore, by setting the temperature of the etching processing solution to a value within the range of 10 to 50 ° C., it is possible to make the manufacturing conditions the same as the actual manufacturing conditions, and the evaluation results can be easily fed back.

(1) -7 hours Moreover, when performing an etching process test, it is preferable to make the processing time by an etching processing liquid into the range of 40 to 300 seconds.
This is because when such a processing time is less than 40 seconds, the adhesion failure of the transparent electrode may not be accurately measured. On the other hand, if the processing time exceeds 300 seconds, the entire evaluation process is excessively time-consuming and the efficiency is lowered.
Therefore, the treatment time with the etching treatment liquid is more preferably in the range of 50 to 240 seconds, and further preferably in the range of 60 to 180 seconds.

(1) -8 times Although it is possible to sufficiently evaluate the adhesion failure of the transparent electrode and the like only by performing the etching treatment test once under appropriate conditions, it is also preferable to perform the test multiple times.
The reason for this is that by carrying out in this way, it is possible to quickly and efficiently find such a contact failure or the like according to the degree of contact failure or the like of the transparent electrode.
Further, when the etching treatment test is performed a plurality of times, it may be repeated as it is without changing the above-described conditions such as pH value, concentration, temperature, etc., but the conditions such as pH value, concentration, temperature, etc. It is also preferable to carry out the process a plurality of times after changing. For example, several types of etching processing solutions having different concentrations are prepared, and the adhesiveness of the transparent electrode can be objectively determined based on the concentration of the transparent electrode peeled off.

(2) Characteristic evaluation Next, characteristic evaluation of the transparent electrode subjected to the etching treatment test, for example, adhesion evaluation between the transparent electrode partially eroded by the etching treatment liquid and the glass substrate including the protective film is performed. . That is, the transparent electrode with poor adhesion etc. is in a state where adhesion failure can be easily found because it is excessively eroded, partially floated from the protective film or glass substrate, or peeled off by the etching treatment test. It has become.
For example, when evaluating such adhesion, it is preferable to perform a cross-cut test in accordance with JIS K5400. Specifically, as shown in FIG. 2 (b), after forming 100 1 μm square grids on the transparent electrode 19 formed on the non-flat portion 80 on the glass substrate 13 including the protective film 215, It is preferable to evaluate by applying the adhesive tape 92 and then peeling off the adhesive tape 92 and measuring the number of grids of the transparent electrode 19 remaining on the substrate as shown in FIG. 2 (c). .
This is because the adhesiveness of the transparent electrode can be evaluated by a simple method by carrying out in this way. Moreover, it is because the adhesiveness on severer conditions can be evaluated by evaluating in the non-flat part which tends to produce the adhesion defect.
Therefore, as a result of the cross-cut test, for example, when the cross-cut number of the transparent electrode remaining on the substrate is less than 80 out of 100, the adhesion of the transparent electrode is evaluated as poor. It is preferable to stop incorporating an electro-optical device substrate manufactured under the same conditions into an electro-optical device or the like.

On the other hand, in evaluating the adhesion of the transparent electrode, it is also preferable to evaluate the transparent electrode in the non-flat portion by observing it using a microscope or the like. This is because the degree of erosion of the transparent electrode can be directly recognized and the adhesion can be easily evaluated by carrying out in this way.
Therefore, as a result of observing the transparent electrode in the non-flat part and comparing the transparent electrode before the etching treatment test shown in FIG. 5A and after the etching treatment test shown in FIG. When the ratio of the transparent electrode exceeds about 20%, it is preferable to evaluate that the adhesion of the transparent electrode is poor and stop incorporating the electro-optical device substrate manufactured under the same conditions into the electro-optical device. .

[Second Embodiment]
In the second embodiment, a protective film forming step of forming a protective film at a position corresponding to a display region on the glass substrate, a transparent conductive material is laminated on the glass substrate including the protective film, and the transparent conductive material And a transparent electrode forming step of forming a transparent electrode by performing a first etching process on the electro-optical device substrate.
And it is characterized by further including the evaluation process which performs the 2nd etching process as an etching process test with respect to a transparent electrode, and evaluates the physical property of the transparent electrode in the non-flat part of the glass substrate containing a protective film.
That is, this is a method for manufacturing a substrate for an electro-optical device, including the same evaluation process as described in the first embodiment.
Hereinafter, as a method for manufacturing a substrate for an electro-optical device according to the second embodiment, a method for manufacturing a color filter substrate is taken as an example, and the contents already described in the first embodiment with reference to FIGS. Explanation will be given while omitting appropriately.

1. Overall Configuration (1) Pre-process First, as shown in FIG. 6, it is preferable to perform a pre-process (S1 process) for forming a color filter or the like on a glass substrate. Specifically, as shown in FIG. 1A, the reflective layer 212, the colored layer 16, and the black light-shielding layer (black) are provided at locations corresponding to the image display area on the first glass substrate 13 in the color filter substrate. Matrix) 18 is preferably formed sequentially.
Here, the reflective layer 212 having the opening 212a is formed by depositing a metal material or the like on the substrate by a vapor deposition method or a sputtering method, and then patterning using a photolithography technique. Further, the black light shielding layer (black matrix) 18 is formed by applying a photosensitive resin made of a transparent resin or the like in which a coloring material such as a pigment or a dye is dispersed, and sequentially performing pattern exposure and development processing thereon.
For the colored layer 16, a photosensitive resin made of a transparent resin or the like in which a coloring material such as a pigment or a dye is dispersed is applied on the reflective layer 212 or the like, and pattern exposure and development processing are sequentially performed thereon. Can also be formed.
In addition, when forming the colored layer 16 of several colors in an array, the said process is repeated for every color.

(2) Formation of Protective Film Next, as shown in FIG. 6, it is preferable to carry out a protective film forming step (S2 step) for forming a protective film at a location corresponding to the display region on the glass substrate. Specifically, first, as shown in FIG. 1B, a light-transmitting protective layer 215X is formed on the entire surface of the first glass substrate 13 on which the colored layer 16 and the like are formed. This translucent protective layer 215X can be made of, for example, an acrylic resin, an epoxy resin, a polyimide resin, a fluororesin, or the like. Among them, it is preferable to use a photocurable acrylic resin because it is excellent in transparency and can be efficiently cured.
These resins are applied onto the substrate in an uncured state having fluidity, and are cured by appropriate means such as drying, photocuring, and thermosetting. As a coating method, a spin coating method, a printing method, or the like can be used.

Next, the light transmissive protective layer 215X is patterned using a photolithography technique to form a protective film (planarization film) 215 limited to the image display area A as shown in FIG. Through this process, the translucency from above the translucent protective layer 215X to the area other than the image display area A, that is, the area substantially the same as the area C disposed outside the seal frame B and the seal frame shown in FIG. Material is missing.
That is, by forming the protective film (flattening film) 215 selectively only in the image display region in this way, the cell gap between the pair of substrates for the electro-optical device facing each other in the electro-optical device is made uniform. Can be achieved.

Here, when the protective film is selectively formed on the first glass substrate, it is preferable to provide an inclined portion 80 at the end of the protective film 215 as shown in FIG.
The reason for this is that when the transparent electrode is formed on the glass substrate including such a protective film by having an inclined part at the end of the protective film, the edge of the protective film is in a vertical shape. This is because the stress concentration can be relaxed. Therefore, it is possible to prevent the disconnection or missing from being effectively prevented by preventing a decrease in the adhesion of the transparent electrode.
Further, for example, as shown in FIG. 1B, the inclined portion at the end of the protective film is first patterned into a predetermined shape with respect to the light transmitting protective layer 215X laminated on the front surface on the glass substrate. The applied resist material is laminated. Thereafter, by photocuring, the light partly travels also to the lower side of the resist material, and the light-transmitting protective layer of the part is cured to form.
A portion including the inclined portion 80 of the protective film 215 becomes a non-flat portion in the first glass substrate 13 including the protective film 215.

(3) Transparent electrode formation process Next, as shown in FIG. 6, it is preferable to implement a transparent electrode formation process (S3 process-S10 process). Since the transparent electrode forming step can be the same as that already described in the first embodiment, a detailed description is omitted, but the general flow is as follows.
That is, first, as shown in FIGS. 3A to 3B, a transparent conductive layer 19X made of a transparent conductive material is entirely formed on the first glass substrate 13 including the protective film 215 (FIG. 6). Step S4). Here, as shown in FIG. 3B, it is also preferable to form a base layer 81 made of Ta ₂ O ₅ , SiO ₂ or the like in advance when laminating the transparent conductive layer 19X (step S3 in FIG. 6). . This is because the crystallinity and the like of the formed transparent conductive layer 19X can be made uniform, and the adhesion of the transparent conductive layer to the protective film and the glass substrate can be improved.
Next, as shown in FIG. 3C, after applying a predetermined resist material 86 'on the transparent conductive layer 19X (step S5 in FIG. 6), as shown in FIG. 3D, a predetermined mask pattern is formed. After applying 87 and exposing (step S6) and developing (S7), as shown in FIG. 3E, a resist material 86 is applied and then patterned into a predetermined shape. Then, as shown in FIG. 3 (f), after the etching process (first etching process) is performed on the transparent conductive material 19X (step S8), the resist material 86 is exposed again (step S9), and Development (S10) is performed to remove the resist material.
In this way, it is preferable to form a transparent electrode (first transparent electrode) 19 having a predetermined pattern (not shown) as shown in FIGS. 3 (g) and 1 (d).
FIG. 1D is a cross-sectional view of the YY cross section of FIG. 3G viewed in the direction of the arrow, and shows an example of a transparent electrode patterned in a stripe shape. However, the pattern shape of the transparent electrode is not limited to this. For example, the transparent electrode pattern is formed on the entire surface of the substrate such as the transparent electrode on the first substrate in an electro-optical device using a TFT element (Thin Film Transistor). Even in the case of lamination, the inspection method and the manufacturing method of the present invention can be applied.

(4) Post process Next, it is preferable to implement the post process (S11 process) for forming the alignment film etc. which consist of a polyimide resin etc. with respect to the 1st glass substrate in which the transparent electrode etc. were formed.
As described above, the electro-optical device substrate is manufactured through the respective steps.

2. Evaluation Step The evaluation step according to the second embodiment can be the same as the evaluation step already described in the first embodiment. That is, it is a step of performing an etching treatment test (second etching treatment) and evaluating the adhesion of the transparent electrode.
And as shown in FIG. 6, it is preferable to implement this evaluation process in the process after the 1st etching process (S8 process) in a transparent electrode formation process. That is, it is because an etching process liquid can be penetrate | invaded with respect to the location where adhesiveness in each transparent electrode pattern formed in the predetermined shape is scarce. Accordingly, it becomes possible to accurately evaluate the adhesion of the transparent electrode, and to efficiently manufacture a substrate for an electro-optical device that is less likely to cause disconnection or missing due to defective formation of the transparent electrode. it can.

Here, the evaluation step can be performed at each stage in the manufacturing process as long as the transparent electrode is formed in a predetermined shape. For example, as shown in FIG. In addition, it is preferable to carry out with the resist material remaining.
This reason is because it can prevent effectively that the transparent electrode of locations other than the location with poor adhesiveness is eroded by implementing in this way. Moreover, it is because the adhesion defect of the said transparent electrode resulting from the patterning conditions of a transparent electrode can be discovered from the lamination | stacking step of a transparent conductive material by implementing an evaluation process at this step.
Therefore, the evaluation results of the evaluation process A mainly consist of protective film formation (S2 process), underlayer formation (S3 process), transparent conductive material lamination (S4 process), resist coating (S5 process), exposure (S6 process), It is preferable to adjust appropriately by feeding back to each condition setting in the development (step S7) and the first etching process (step S8).

In addition, as shown in the evaluation step B in FIG. 6, it is also preferable to carry out after removing the resist material. That is, also in the evaluation step B, the transparent electrode in a portion having poor adhesion to the protective film or the glass substrate is eroded more vigorously than the other portions, so that the adhesion evaluation can be suitably performed. . And in the evaluation process B, after carrying out after peeling the resist material at the time of patterning a transparent conductive material (after S10 process), it originates in the conditions of each process after the 1st etching process (S8 process). This is because an adhesion failure of the transparent electrode can be found.
Therefore, it is preferable to adjust the evaluation result of the evaluation step B mainly by feeding back to the respective condition settings in the re-exposure (step S9) and development (step S10).
And it is also preferable to implement these evaluation steps A to B in a plurality of stages. This is because the physical properties of the transparent electrode, for example, by performing an evaluation process in each process in the process of manufacturing the substrate for an electro-optical device, feeding back the inspection results, and adjusting the manufacturing conditions quickly and accurately, for example, This is because an electro-optical device substrate having excellent adhesion of the transparent electrode can be efficiently produced.

3. As described above, the substrate for an electro-optical device manufactured by clearing the evaluation criteria for the adhesion of the transparent electrode is, for example, an electro-optical device or an electronic device as shown in FIGS. It can be suitably incorporated into the device.
That is, when the color filter substrate 12 and the scanning substrate 14 shown in FIGS. 8 and 9 are manufactured by the above-described method for manufacturing a substrate for an electro-optical device, disconnection or missing due to defective formation of the transparent electrode occurs. Since there is little possibility, it becomes possible to provide an electro-optical device having excellent long-term reliability.

As described above, according to the method for inspecting a substrate for an electro-optical device of the present invention, a glass substrate including a transparent electrode and a protective film in the manufacturing stage of the substrate for an electro-optical device by including a predetermined evaluation step. It has become possible to quickly and accurately evaluate the adhesion between the two. Therefore, when the transparent electrode is evaluated as being poorly formed, the manufacturing conditions of the electro-optical device substrate can be quickly adjusted, and as a result, the yield of the electro-optical device substrate can be significantly increased. became.
In addition, according to the inspection method, since the formation failure of the transparent electrode can be found in advance in the manufacturing stage of the electro-optical device substrate, the reliability of the obtained electro-optical device substrate can be improved, As a result, the reliability of the electro-optical device or electronic apparatus in which it is incorporated can be improved.
Therefore, personal computers, mobile phones, other liquid crystal televisions, viewfinder type / monitor direct-view type video tape recorders, car navigation devices, pagers, electrophoresis devices, electronic notebooks, calculators, word processors, workstations, video phones, POSs. Used for inspection methods for electro-optical device substrates used in terminals, electronic devices equipped with touch panels, electron-emitting devices (FED: Field Emission Display, SCEED: Surface-Conduction Electron-Emitter Display), and manufacturing methods thereof be able to.

(A)-(d) is a figure provided in order to demonstrate the manufacturing process concerning the inspection method of the board | substrate for electro-optical devices of 1st Embodiment. (A)-(c) is a figure provided in order to demonstrate the evaluation process concerning the inspection method of the board | substrate for electro-optical devices of 1st Embodiment. (A)-(g) is a figure provided in order to demonstrate the formation method of a transparent electrode. (A)-(b) is a figure which shows the etching processing method. (A) is a top view which shows the shape of the transparent electrode in the non-flat part before an etching process test, (b) is a top view which shows the shape of the transparent electrode in the non-flat part after an etching process test. It is a figure provided in order to demonstrate the manufacturing process concerning the manufacturing method of the board | substrate for electro-optical devices which concerns on 2nd Embodiment. It is a vertical sectional view near the end of the protective film. It is a perspective view of the liquid crystal panel which concerns on 3rd Embodiment. It is a schematic sectional drawing of the liquid crystal panel which concerns on 3rd Embodiment. It is sectional drawing for demonstrating the board | substrate for conventional electro-optical apparatuses.

Explanation of symbols

12: first substrate, 13: first glass substrate, 14: second substrate, 18: black matrix, 19: first transparent electrode (scanning electrode), 20: second transparent electrode (pixel electrode) 22:25: element second electrode (second metal film), 23: insulating film, 24: element first electrode (first metal film), 26: electrical wiring (data electrode), 27: second glass substrate , 31a: first TFD element, 31b: second TFD element, 80: non-flat part (inclined part), 81: base layer (SiO ₂ ), 90: etching treatment liquid, 92: adhesive tape, 200: liquid crystal Panel, 215: Protective film

Claims (11)

An inspection method for an electro-optical device substrate for evaluating the physical properties of a transparent electrode formed on the electro-optical device substrate,
A transparent conductive material is laminated on a glass substrate including a protective film formed at a position corresponding to a display region on the glass substrate, and a first etching process is performed on the transparent conductive material using an etching treatment liquid. A transparent electrode forming step of forming the transparent electrode by performing;
An evaluation process for evaluating the physical properties of the transparent electrode in the non-flat portion of the glass substrate including the protective film by performing a second etching treatment as an etching treatment test on the transparent electrode using an etching treatment liquid. When,
A method for inspecting a substrate for an electro-optical device, comprising:   The method for inspecting a substrate for an electro-optical device according to claim 1, wherein the evaluation step is performed a plurality of times.   2. The adhesion is evaluated as a physical property of the transparent electrode by performing a cross-cut test based on JIS K5400 or observing the erodibility of the transparent electrode in the evaluation step. Or a method for inspecting a substrate for an electro-optical device according to 2;   The method for inspecting a substrate for an electro-optical device according to claim 1, wherein an inclined portion is provided at an end of the protective film in the transparent electrode forming step.   The method for inspecting a substrate for an electro-optical device according to claim 1, wherein the transparent electrode is formed through an underlayer in the transparent electrode forming step.   The said transparent electrode formation process WHEREIN: While comprising the said protective film from a photocurable acrylic resin, the said transparent electrode is comprised from an indium tin oxide film, It is characterized by the above-mentioned. Inspection method for substrate for electro-optical device.   7. The electro-optical device according to claim 1, wherein, in the evaluation step, hydrochloric acid and iron chloride are included as components of an etching solution used for the first and second etching processes. 8. Substrate inspection method.   In the said evaluation process, the said etching process liquid is sprayed with respect to the said transparent electrode, or the said transparent electrode is immersed in the said etching process liquid, It is any one of Claims 1-7 characterized by the above-mentioned. Inspection method for a substrate for an electro-optical device. A protective film forming step of forming a protective film in a position corresponding to a display region on the glass substrate, a transparent conductive material is laminated on the glass substrate including the protective film, and a first etching process is performed on the transparent conductive material A transparent electrode forming step of forming the transparent electrode by performing a method for manufacturing a substrate for an electro-optical device,
The method further includes an evaluation step of performing a second etching process as an etching process test on the transparent electrode and evaluating physical properties of the transparent electrode in a non-flat portion of the glass substrate including the protective film. A method for manufacturing a substrate for an electro-optical device.   The evaluation result of the physical properties of the transparent electrode obtained in the evaluation step is fed back to the manufacturing conditions of the protective film forming step and the transparent electrode forming step, or any one of the forming steps. The manufacturing method of the board | substrate for electro-optical apparatuses of description.   The evaluation step is provided in parallel with the transparent electrode forming step, and an electro-optical device substrate on which the transparent electrode is formed in the transparent electrode forming step is arbitrarily collected, and the physical properties of the transparent electrode are evaluated. The method of manufacturing a substrate for an electro-optical device according to claim 9 or 10.

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