JPH09246690A - Manufacture of coil-shaped constituent member for circuit board use - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a constituent member for electronic circuit wiring board use, which has a thick resin layer on a conductor foil and moreover, has little curling, by a method wherein a resin coating layer in a resin film or a sheet and the conductor foil are made to confront with each other to thermally pressure bond the conductor foil and the resin film or the sheet to each other. SOLUTION: A resin-containing solution is applied on a PET film 2, which is fed from a feeding roll 1, by a coater 4 and the PET film 2 is dried by a heating furnace 5. A resin coating PET film 6 having a resin coating layer 3 on the PET film 2 is fed between one pair of heating rolls 7, while a Cu foil 9 fed from a feeding roll 8 is fed between the one pair of the heating rolls 7. The layer 3 in the film 6 and the Cu foil 9 are made to confront with each other between the one pair of the heating rolls 7 and the film 6 and the Cu foil 9 are made to thermally pressure bond to each other. The layer 3 is thermally transferred to the side of the Cu foil 9 and a member 10 of a laminated structure, which consists of the Cu foil 9, the layer 3 and the PET film, is wound up on a wind-up roll 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a coil-shaped component for a circuit board, and more particularly to a component for an electronic circuit wiring board which has a thick resin layer on a conductor foil and has a small curl. Regarding technology that can be done.

[0002]

2. Description of the Related Art Substrates (Subs) are used to constitute electronic devices.
rate) is used. As the substrate, there are a resin substrate, a metal substrate, a ceramic substrate, and the like, and a multilayer substrate is also used because of a demand for high density wiring patterns on the substrate during mounting. The resin substrate is referred to as a printed wiring circuit board or the like, and is made of, for example, a so-called copper-clad laminate in which an electrolytic copper (Cu) foil is adhered on a resin laminate substrate, wiring pattern screen ink, and photosensitive paint. Print the resist, remove unnecessary Cu foil by etching,
The resist is peeled off with a solvent or the like to form a semiconductor integrated circuit device or the like. There is also a flexible substrate called a flexible substrate that can be bent. For example, a Cu foil is attached to a glass epoxy substrate formed by mixing glass fibers into a thin epoxy resin to form a conductor pattern as described above. There is a formed flexible substrate or the like. With the above-mentioned circuit boards in electronic equipment, when the mounting density increases, heat dissipation problems occur, and in order to improve this, heat dissipation from various aspects such as forced cooling with a fan is performed. The characteristics have been improved, and the heat dissipation characteristics from the substrate itself have also been improved. Since a metal has good thermal conductivity, a metal plate is sometimes used for the substrate. There is also provided a heat-dissipating metal substrate using the metal plate as a base substrate of the substrate. For example, a conductor made of a metal base (substrate) such as Al or Cu, a prepreg forming an insulating layer, and an electrolytic Cu foil as described above. Some have a laminated structure in which foils are laminated. When forming a prepreg, a prepreg having a thick resin coating layer may be required in order to improve the insulating property. Conventionally, when trying to make a prepreg having such a thick resin coating layer, a resin solution is repeatedly applied onto a copper (Cu) foil several times, and each time it is dried to form a thick resin layer to obtain a prepreg. Is being carried out. That is, a resin solution is applied onto a Cu foil and dried, and then a resin solution is applied onto the resin layer and dried to obtain a prepreg having a thick resin layer gradually. When it is overcoated and dried, the lower layer is affected by the heat of the second and third times (heat history), curing progresses, flexibility is lost, and cracks are generated. There is a drawback in that the upper layer and the lower layer may have different properties such as insulating properties due to the influence of the solvent from the upper layer, resulting in non-uniformity between the layers. Further, in the conventional example, there is a drawback that the surface is rough and the appearance is rough. Moreover, when the resin solution is directly applied on the conductor foil and heated and dried, even if it is flat in the heating furnace, when the conductor foil is subsequently cut and used, it curls, It is an obstacle to its use.

[0003]

SUMMARY OF THE INVENTION An object of the present invention is to provide a technique capable of solving the drawbacks of the prior art. The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0004]

DISCLOSURE OF THE INVENTION According to the present invention, a coil for a circuit board, characterized in that a resin film or a sheet having a resin coating layer on a conductor foil is confronted with the resin coating layer and thermocompression-bonded by a heating roll. The present invention relates to a method of manufacturing a constituent member. Further, the present invention is for a circuit board, characterized in that the resin film or sheet having a resin coating layer having a resin coating layer on a conductor foil is opposed to the resin foil, and the resin film or sheet is peeled off after thermocompression bonding with a heating roll. It relates to a manufacturing method of a coil-shaped component member.

The principle according to the present invention is as follows. That is, in the present invention, the resin foil-containing solution is not coated on the conductor foil side, but the resin film-containing solution is coated on the resin film or sheet side to form a coating layer. Then, the resin foil or the resin coating layer of the sheet is bonded to the conductor foil and thermocompression bonded by a heating roll. As a result, the resin film or the resin coating layer on the sheet side is thermally transferred to the conductor foil. In this case, in order to have a thick resin coating layer, if a thick resin coating layer is formed on the conductor foil side at a time, cracks will occur, and with heavy coating, cracks will occur as described above. In addition to the above, the lower layer side receives a thermal history, and the upper layer and lower layer have different insulation characteristics, and further, in the one obtained in this way,
Although curling occurs, in the present invention, the resin-containing solution is coated not on the conductor foil side but on the resin film or sheet side so that the resin film or sheet supports the coating layer. Alternatively, a thick resin coating layer can be formed on the sheet, and since it is thermally transferred to the conductor foil, a thick resin coating layer can be formed on the conductor foil, and since it is not necessary to apply heavy coating, heat history Little impact, no cracks,
It is possible to form a uniform layer on both the upper and lower layers, and
According to this method, a curl with a small amount can be obtained. It is surprising that there is no curl even if it is a coil that is thermocompression-bonded and wound up with a heating roll, and that the coil-shaped member is excellent in combination with usability. In addition, the point insulation property having a thick resin coating layer is also excellent. In the present invention, from the sandwich structure of the resin film or sheet obtained above, the thick resin layer and the conductor foil, the resin film or sheet can be appropriately peeled off, and the curlless having the thick resin coating layer can be obtained. As described above, since the conductor foil can be obtained without the need for heavy coating, the effect of heat history is small, cracks do not occur, and the upper and lower layers have a uniform layer over the entire circuit board coil. A shaped component can be obtained.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory view showing a process of an embodiment of the present invention. Supply roll 1 to PET film 2
Is supplied, the resin-containing solution 3 is applied to the PET film 2 by the coater 4, and dried by the heating furnace 5.
A resin coating PET film 6 having a resin coating layer 3 on a PET film 2 comprises a pair of heating rolls 7.
Supplied in between. In this case, it may be once wound on a winding roll (not shown). On the other hand, the Cu foil 9 provided from the supply roll 8 is supplied between the pair of heating rolls 7. Between the pair of heating rolls 7, the resin coating layer 3 of the resin coating PET film 6 and the Cu foil 9 are opposed to each other and thermocompression bonded. By the thermocompression bonding, the resin coating layer 3 in the resin coating PET film 6 is thermally transferred to the Cu foil 9 side, and the member 10 having a laminated structure including the Cu foil 9, the resin coating layer 3 and the PET film 2 is a winding roll. It is wound up in 11.

Since the resin coating layer 3 of the resin coating PET film 6 is thermally transferred to the Cu foil 9 side, the PET film 2 is peeled off and the resin coating layer 3 and the Cu foil 9 are removed as shown in FIG. A structural member 100 consisting of and is obtained. The members 10 and 100 obtained as described above can be used as the above-mentioned constituent members for an electronic circuit wiring board, and can be easily used as a coil-shaped prepreg material or the like. No cracks or heat history,
Uniform properties are obtained in the upper and lower layers, curling does not occur,
It is also excellent in performance.

The resin-containing solution used in the present invention is composed of, for example, an epoxy resin or an epoxy-phenol resin. The resin may be appropriately diluted with a solvent such as toluene or MEK. The resin-containing solution,
You may add a filler etc. For the filler, for example,
A filler having thermal conductivity and insulation is used, for example, alumina (Al ₂ O ₃ ) powder is used. Alumina (Al ₂ O ₃ ) is preferably used as the filler, but silica (Si ₂ ) is used to the extent that thermal conductivity is not impaired.
O ₂ ), talc, mica, clay and the like can also be used. In addition, a coupling agent or the like can be added to the resin-containing solution. As the resin film used in the present invention, a polyimide film or the like may be used in addition to the PET film. The conductor foil used in the present invention may be an Cu foil, an Al foil, or the like.

The component according to the present invention is, for example, Al,
It can be used as a prepreg member or the like of a heat-radiating metal substrate by adhering it to a base such as Cu. Cu
The circuit board can be formed by etching the foil 9.

[0010]

The present invention will be further described below with reference to examples. Embodiment 1 FIG. A PET film having a thickness of 50 μm, a kneaded mixture of 25 wt% epoxy phenolic resin, 75 wt% alumina (Al ₂ O ₃ ) filler powder, and a titanate coupling agent was mixed in a solvent of toluene: MEK = 5: 5. A resin-containing solution having a compounding composition obtained by diluting is applied with a coater to a thickness of 180 μm, dried in a heating furnace, and then temporarily
It was wound up on a winding roll. On the other hand, a Cu foil having a thickness of 70 μm was supplied between the pair of heating rolls, and the resin coating layer surface side of the PET film was brought into contact with the Cu foil to remove the Cu foil.
The foil and the PET film were thermocompression bonded by the heating roll. 180 μm when the thermocompression bonded product is wound up on a winding roll
A coil-shaped laminated member in which a thick resin coating layer was sandwiched between Cu foil and PET film was obtained. No crack was found in the resin layer of the laminated member, and there was almost no curling.

Embodiment 2 FIG. The PET film was peeled off from the laminated member obtained in Example 1 to obtain a coil-shaped member made of Cu foil having a resin coating layer. No cracks were found in the resin coating layer, and the curl was scarce.

Although the invention made by the present inventor has been specifically described based on the embodiments, the invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

[0013]

The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows. That is, according to the present invention, it is possible to form a thick resin coating layer on the conductor foil, and since it is not necessary to apply heavy coating unlike the conventional method, the influence of heat history is small, and cracks do not occur. A uniform layer can be formed over the entire upper and lower layers, and according to the method, a coil with less curl can be obtained, and a thick resin coating layer also has excellent point insulation properties, resulting in rough skin. It has no appearance and a good appearance can be obtained.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a process of an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Supply roll 2 ... Resin film (PET film) 3 ... Resin containing solution 4 ... Coater 5 ... Heating furnace 6 ... Resin coating PET film 7 ... Heating roll 8 ... Supply roll 9 ... Conductor foil (Cu foil) 10 ... Laminating member 100 ... Peeled film member

Claims (2)

[Claims] 1. A method for producing a coil-shaped component for a circuit board, comprising: facing a resin foil or a resin film having a resin coating layer on a conductor foil, and thermocompressing the resin foil with a heating roll. 2. A coil for a circuit board, characterized in that the resin film or sheet of a resin film or sheet having a resin coating layer is confronted with a conductor foil, thermocompression-bonded by a heating roll, and then the resin film or sheet is peeled off. Manufacturing method of dimensional components.