JPH09246677A - Substrate and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To contrive the enhancement of the strength of a substrate and a chassis part and the enhancement of the efficiency of assembly of an electronic apparatus by a method wherein slits are formed in the substrate leaving microscopic junction parts and these slits are latched onto bearing pieces provided on the chassis part. SOLUTION: Slits 12a to 12e formed in a substrate 10 are first fitted in bearing pieces 21a to 21e of a chassis part 20 in such a way that they respectively correspond to the bearing pieces 21a to 21e and the substrate 10 is made to paste to double-side tapes 24a to 24d to mount the substrate to the chassis part 20. After that, substrate pieces made to protrude from the outer edge parts of a mounting surface 23 of the chassis part 20 to the outside are pressed, whereby junction parts 11a to 11d are broken and the substrate pieces are separated from the substrate 10. Thereby, engaging holes and cut-and-raised pieces, which are required for mounting the substrate 10 to the chassis part 20, are dispersed with and the strength of the substrate and the chassis part can be prevented from being reduced. Moreover, the substrate 10 is fitted in the chassis part 20 to assemble an electronic equipment and the substrate pieces are pressed, whereby the unnecessary substrate pieces can be made to separate from the substrate 10 and the efficiency of assembly of the electronic apparatus is enhanced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate used in, for example, an electronic device and an electronic device using the substrate.

[0002]

2. Description of the Related Art FIG. 10 is an exploded perspective view showing a main part of a conventional board and electronic equipment disclosed in, for example, Japanese Utility Model Publication No. 5-1103, in which 1 is a board, which is a switch or an indicator ( Electrical components (not shown) are attached to form an electric circuit. Further, the substrate 1 is provided with cutouts 1a, 1b, 1c at the left side of the lower side and the left and right sides of the upper side, respectively, and the left and right positions of the center and the lower side of the right side are engaged with each other. Joints 1d, 1e,
1f is provided. 2 is a chassis part which is a base, 2
Reference numeral a denotes a mounting surface on which the substrate 1 is mounted. On the mounting surface 2a, cut-and-raised pieces (protrusions) 3a, 3b are formed at locations corresponding to the cutout portions 1a, 1b, 1c, respectively.
3c is provided, and cut-and-raised pieces (protrusions) 3d, 3e, and 3d are provided at positions corresponding to the engaging portions 1d, 1e, 1f, respectively.
3f is provided. These cut and raised pieces 3d, 3e,
The tip of 3f is formed in a hook shape as shown in the figure. Four
Is a printed wiring board and is disposed inside the chassis 2.

Reference numeral 5a denotes a male connector portion which is attached to the surface of the substrate 1 which faces the attachment surface 2a. A female connector 5b is attached so as to face the back surface of the mounting surface 2a of the printed wiring board 4. Further, a connector insertion hole 2b is provided in the mounting surface 2a of the chassis 2 located between the male connector portion 5a and the female connector portion 5b.
The connector male portion 5a and the connector female portion 5b are connected through the connector insertion hole 2b.

Next, a procedure for assembling an electronic device using a conventional board will be described. First, the cut-and-raised pieces 3a to 3f of the chassis 2 are fitted with the cut-and-blown portions 1a, 1b and 1c and the engaging portions 1d, 1e and 1f of the substrate 1 corresponding thereto, and the cut-and-raised pieces 3d and 3e are fitted. By bending the tip of 3f, each cut-and-raised piece 3
The tips of d, 3e, and 3f press the surface of the substrate 1 so that the substrate 1 is fixed to the chassis 2.

[0005]

Since the conventional board and electronic device are constructed as described above, at least the engaging portions 1d, 1e, for fixing the board 1 to the chassis 2,
1f and the cut-and-raised pieces 3d, 3e, and 3f are required, respectively, which results in a reduction in strength of the substrate 1 and the chassis 2 due to the formation of holes, and further, there is a problem in that labor during manufacturing increases. there were.

The present invention has been made to solve the above problems, and an object of the present invention is to obtain a board and an electronic device which can improve the strength of the board and the chassis and the assemblability.

[0007]

In the substrate according to the present invention, a slit is formed leaving a minute bonding portion, and the slit is engaged with a support piece provided on the base.

Further, the joint portion is provided near the outer edge portion of the substrate.

Further, at least one end of the slit is formed so as to reach the outer edge portion of the substrate.

Further, the joint portion is formed in a comb shape.

Further, in the electronic device according to the present invention, a slit is formed leaving a minute bonding portion, and the slit is engaged with a support piece provided on the substrate, and the substrate is provided on the substrate. A plurality of cutting and blowing parts which are formed on the extension of the provided supporting piece and which guide the above-mentioned joint, and the depth of at least a part of the cutting and blowing parts is made smaller than the height of the supporting piece. Is.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1. 1 is an exploded perspective view showing a substrate and an electronic device using the same according to an embodiment of the present invention, FIG. 2 is a perspective view during assembly of FIG. 1, and FIG. 3 is a perspective view after assembly of FIG. is there. 1 to 3, the same parts as or the parts in charge of the related art are designated by the same reference numerals and the description thereof will be omitted.

1 to 3, reference numeral 10 denotes a substrate in which slits 12a to 12e are formed while leaving minute bonding portions 11a to 11d, and 20 denotes slits 12a to 12 of the substrate 10.
support pieces 21a to 21e for inserting e to support the substrate 10
A chassis portion that is a base provided with a plurality of cutout portions 22a to which the joint portions 11a to 11d are guided between the support pieces 21a to 21e, that is, the extension thereof. 22d is formed.

A printed wiring board 4 is provided inside the chassis 20, and a mounting surface 2 for mounting the board 10 thereon.
The female connector portion 5b is provided on the third side. Further, the female connector portion 5b is coupled to the male connector portion 5a provided on the mounting surface 13 of the substrate 10 via the connector insertion hole 2b provided in the chassis portion 20, and by this coupling, the substrate 10 and the printed wiring board. 4 and 4 are electrically connected. Further, 24a to 24d are double-sided tapes provided at four locations on the mounting surface 23 of the chassis portion 20 for fixing the substrate 10 to the chassis portion 20.

Next, the assembly procedure will be described. First, as shown in FIG. 2, the support pieces 21a to 21e of the chassis portion 20.
The slits 12a to 12e of the substrate 10 are fitted into the respective substrates so as to correspond to each other, and the substrate 10 is attached to the double-sided tapes 24a to 24d and attached. After mounting as described above, by pressing the board piece 14 protruding outward from the outer edge portion of the mounting surface 23 of the chassis portion 20, the joint portions 11a to 11d are broken, and as shown in FIG. The substrate piece 14 can be separated.

With the above-mentioned configuration, the substrate 1
Since the engaging hole and the cut-and-raised piece for attaching 0 to the chassis portion 20 are unnecessary, the board 10 and the chassis portion 2 are not required.
It is possible to prevent a decrease in each strength caused by opening a hole or the like in 0, and further by fitting the board 10 into the chassis portion 20 to assemble it and pressing the board piece 14,
Since the unnecessary substrate piece 14 can be easily separated from the substrate 10, the assemblability is improved.

In the above embodiment, the double-sided tapes 24a to 24d are used for attaching the substrate 10 to the chassis portion 20.
However, the same effect can be obtained with an adhesive or the like.

Embodiment 2. FIG. 4 is an enlarged view of a main part of a board and a chassis part according to another embodiment of the present invention, and FIG. 5 is a state diagram showing a state during assembly of FIG. In the figure, the same or corresponding parts as those of the above-described embodiment are designated by the same reference numerals and the description thereof will be omitted.

In FIG. 4, 12f is a slit formed so that the bent portion of the slit 12d shown in FIG. 1 reaches the outer edge portion. Further, the notch portion 22d is formed so that its depth is smaller than the height of the support piece 21 so that the board 10 can be floated from the mounting surface 23. All cutouts 2
It goes without saying that the depth of 2a to 22d may be smaller than the height of the support piece 21, but the purpose can be achieved if at least a part of such is done. During assembly as in FIG. 1, the substrate 10 is brought into contact with the substrate 10 and then the substrate 10 is pressed to separate the substrate piece 14b. The assembled state is shown in FIG.

By configuring as described above, the substrate 1
By pressing force applied to the substrate 10 when the 0 and the chassis portion 20 are assembled, the substrate piece 14b hits the notch portion 22d and is automatically broken before the substrate 10 is fixed to the mounting surface 23 of the chassis portion 20. Does not need to fold the substrate piece 14b, which improves workability.

Embodiment 3 In the first embodiment,
In the cases 1 and 2, the joints 11a to 11d were formed in a single strip shape. However, as shown in FIG. 6, if the joint portions 11a to 11d are formed in a plurality of combs, the joint portions 11a to 11d are weaker than in the first and second embodiments. Since the joining portions 15c and 15d can be broken by the pressing force, the assembling property is further improved, and damage to the portion where the substrate 10 is fixed to the chassis portion 20 can be prevented.

Embodiment 4 In the above-described first to third embodiments, the chassis portion 20 has the structure in which the printed wiring board 4 is provided inside, but as shown in FIG. The effect is obtained. Furthermore, as shown in the figure, the joints 15a, 11
A configuration in which a single strip-shaped member such as b, 11c, and 15d and a plurality of strip-shaped members are used together may be used.

Embodiment 5 In the first embodiment,
4 to 4, the slits 12a to 12e and the supporting pieces 21a to 21e corresponding to the slits 12a to 12e are formed on three or more sides, but as shown in FIG. 8, the slits 12g, 12c, 12h and the supporting pieces are formed on only one side. 26a to 26c may be formed, and the same effect can be obtained.

Embodiment 6 FIG. In the first embodiment,
5 to 5, the slit of the substrate 10 was formed along the outer edge of the chassis portion 20, but the same effect can be obtained even if the slit is formed so as not to extend along the outer edge as shown in FIG.

[0025]

Since the present invention is constructed as described above, it has the following effects.

A slit is formed by leaving a minute joint,
Since the slit is engaged with the support piece provided on the base, the strength of the substrate and the base can be prevented from being lowered. Further, since the bonding portion is made minute, the substrate can be easily folded, and the assembling property is improved.

Further, since the joint portion is provided in the vicinity of the outer edge portion of the substrate, the area of the substrate piece can be reduced, and the waste of the substrate can be eliminated to reduce the cost of the substrate.

Further, since at least one end of the slit reaches the outer edge portion of the substrate, it is possible to prevent an extra force generated at the time of separation from being transmitted to the substrate, prevent damage to the substrate, and improve the assembling property.

Further, by forming the joint portion in the shape of a plurality of strips, the pressing force applied at the time of separating the substrates can be reduced, and the assemblability is further improved.

Further, a slit is formed with a minute joining portion left, and the slit is engaged with a supporting piece provided on a base, which is formed on an extension of the supporting piece provided on the base. In addition, since a plurality of notches for guiding the joint portion are provided, and the depth of at least a part of the notches is made smaller than the height of the support piece, the notches are formed only by the pressing force on the substrate. The joint portion of the substrate that abuts a part of the portion can be broken, and the workability is improved.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a substrate and an electronic device showing a first embodiment of the present invention.

FIG. 2 is a perspective view during assembly of FIG.

FIG. 3 is a perspective view of FIG. 2 upon completion of assembly.

FIG. 4 is an enlarged view of a main part of a substrate and a chassis part showing a second embodiment of the present invention.

FIG. 5 is a state diagram showing one state during assembly of FIG.

FIG. 6 is an enlarged view of a main part of a joining portion showing a third embodiment of the present invention.

FIG. 7 is an exploded perspective view of a substrate and an electronic device showing a fourth embodiment of the present invention.

FIG. 8 is an exploded perspective view of a substrate and an electronic device showing a fifth embodiment of the present invention.

FIG. 9 is an exploded perspective view of a substrate and an electronic device showing a sixth embodiment of the present invention.

FIG. 10 is an exploded perspective view showing a conventional substrate and electronic device.

[Explanation of symbols]

 10 Substrate 11a to 11d Single band joint 12a to 12h Slits 15a, 15c, 15d Plural comb joints 20 Chassis 21a to 21e Bearing piece 22a to 22d Cutout portion 26a to 26c Bearing piece

Claims (5)

[Claims] 1. A substrate characterized in that a slit is formed while leaving a minute bonding portion, and the slit is engaged with a support piece provided on a base. 2. The substrate according to claim 1, wherein the joint portion is provided near an outer edge portion of the substrate. 3. The substrate according to claim 1, wherein the slit is formed so that one end thereof reaches at least the outer edge portion. 4. The substrate according to claim 1, wherein the joint portion is formed in a comb shape. 5. A substrate, in which a slit is formed while leaving a minute bonding portion, and the slit is engaged with a support piece provided on a base, which is formed on an extension of the support piece provided on the base. An electronic device comprising: a plurality of notches for guiding the joint, wherein at least a part of the notches has a depth smaller than a height of the support piece.