JPH01278004A - Mounting construction for coil - Google Patents
Mounting construction for coilInfo
- Publication number
- JPH01278004A JPH01278004A JP10679288A JP10679288A JPH01278004A JP H01278004 A JPH01278004 A JP H01278004A JP 10679288 A JP10679288 A JP 10679288A JP 10679288 A JP10679288 A JP 10679288A JP H01278004 A JPH01278004 A JP H01278004A
- Authority
- JP
- Japan
- Prior art keywords
- flange
- coil
- board
- aperture
- chip coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010276 construction Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims description 15
- 238000005476 soldering Methods 0.000 abstract description 3
- 230000002542 deteriorative effect Effects 0.000 abstract 2
- 230000002093 peripheral effect Effects 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Landscapes
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、集積回路用のプリント配線基板へチップコイ
ルを実装するだめの構造に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a structure for mounting a chip coil on a printed wiring board for an integrated circuit.
従来の技術とその課題
一般に、チップコイルは、第３図に示す様に、両端にフ
ランジ１１．１２を有するボビン１０の胴部にコイル線
１３を巻回したものが提供されている。このものはプリ
ント配線基板１５上にフランジ１１を載置し、基板１５
上の配線部の電極とフランジ１１に設けた電極とを半田
付けすることにより実装されていた。BACKGROUND ART AND THEIR PROBLEMS Generally, as shown in FIG. 3, a chip coil is provided in which a coil wire 13 is wound around the body of a bobbin 10 having flanges 11 and 12 at both ends. In this case, the flange 11 is placed on the printed wiring board 15, and the board 15
It was mounted by soldering the electrode of the upper wiring part and the electrode provided on the flange 11.
しかしながら、この様な実装構造では、実装時の高さが
チップコイルの全長しに基板厚さＤを加えた値となり、
集積回路の背高を低くする点では障害となっていた。な
お、背高を低くするためには、基板１５のフランジ載置
部分を薄くするこが考えられているが、これではその部
分の基板強度が弱くなる。However, in such a mounting structure, the height when mounted is the total length of the chip coil plus the substrate thickness D,
This has been an obstacle in reducing the height of integrated circuits. Note that in order to reduce the height, it has been considered to make the flange mounting portion of the substrate 15 thinner, but this would weaken the substrate strength in that portion.
そこで、本発明の課題は、基板強度を弱めることなく全
体としての高きを低くすることのできるコイルの実装構
造を提供することにある。Therefore, an object of the present invention is to provide a coil mounting structure that can reduce the overall height without weakening the substrate strength.
課題を解決するための手段と作用
以上の課題を解決するため、本発明に係るコイルの実装
構造は、
（ａ）ボビンに設けた一方のフランジの面積を他方のフ
ランジの面積よりも大きくしたコイルと、（ｂ）他方の
フランジが挿通可能であると共に一方のフランジが縁部
に当接可能な開口を形成した基板とから構成され、
（Ｃ）他方のフランジを挿通させた前記開口の縁部に一
方のフランジを当接させ、一方のフランジに設けた電極
と開口の縁部に設けた電極とを半田付けしたこと、
を特徴とする。Means and Effects for Solving the Problems In order to solve the above problems, the coil mounting structure according to the present invention includes: (a) a coil in which the area of one flange provided on the bobbin is larger than the area of the other flange; and (b) a substrate formed with an opening through which the other flange can be inserted and one flange can abut the edge, and (C) the edge of the opening through which the other flange is inserted. One flange is brought into contact with the opening, and the electrode provided on the one flange and the electrode provided on the edge of the opening are soldered.
以上の構造によれば、第２図に示す如く、コイルは基板
の開口に挿通された状態で面積の広い方のフランジが基
板開口の縁部に挿通方向側から当接し、半田付けされる
。従って、基板の厚さはコイルの全長にいわば吸収きれ
、実質的高さは基板厚さ分だけ低くなる。According to the above structure, as shown in FIG. 2, when the coil is inserted into the opening of the substrate, the flange having a larger area contacts the edge of the opening of the substrate from the insertion direction side, and is soldered. Therefore, the thickness of the substrate can be absorbed by the entire length of the coil, and the actual height is reduced by the thickness of the substrate.
尖貫刻
以下、本発明に係るフィルの実装構造の実施例につき、
添付図面を参照して説明する。Below, examples of the fill mounting structure according to the present invention are as follows:
This will be explained with reference to the attached drawings.
第１図、第２図において、チップコイル１はボビン２の
胴部にコイル心線５を巻回したもので、ボビン２の両端
部にはフランジ３，４を有している。フランジ３はフラ
ンジ４よりも−回り大きい面積とされている。一方、プ
リント配線基板６はその表面６ａ側（第１図では下向き
とされている）に他の電子部品を実装する様にしたもの
で、チップコイル１の取付は月間ロアはフランジ４より
も大きく、かつ、フランジ３よりも小さい面積に形成さ
れている。1 and 2, a chip coil 1 has a coil core 5 wound around the body of a bobbin 2, and the bobbin 2 has flanges 3 and 4 at both ends. The flange 3 has a circumferentially larger area than the flange 4. On the other hand, the printed wiring board 6 has other electronic components mounted on its surface 6a side (facing downward in FIG. 1), and the lower part of the chip coil 1 is larger than the flange 4. , and is formed to have a smaller area than the flange 3.
従って、チップコイル１は基板６の裏面側からフランジ
４を開ロアへ挿通させ、面積の大きいフランジ３を開ロ
アの縁部に当接させることにより取り付けられ、フラン
ジ３の側部から第１図中実面にわたって設けた電極３ａ
、 ３ａと、基板６の開口縁部に設けた電極８，８（い
ずれも第１図中斜線で示す）とをリフロー炉を使用して
半田付けすることにより、電気的、機械的に接続される
。Therefore, the chip coil 1 is attached by inserting the flange 4 into the open lower part from the back side of the board 6, and bringing the large-area flange 3 into contact with the edge of the open lower part, and from the side of the flange 3 as shown in FIG. Electrode 3a provided over the solid surface
, 3a and electrodes 8, 8 (both indicated by diagonal lines in FIG. 1) provided on the edge of the opening of the substrate 6 are soldered using a reflow oven to electrically and mechanically connect them. Ru.
以上の実装構造にあっては、チップコイル１は基板６に
開ロアを貫通した状態で実装され、全体としての高さは
チップコイル１の全長しとなり、基板６の厚さＤはコイ
ル全長りに吸収されることとなる。また、基板６は新た
に開ロアが形成されるのみであり、フランジ３の載置部
分を薄肉化することと比較しても強度的に損なわれるこ
となく、全体としての高さも一層低くなる。In the above mounting structure, the chip coil 1 is mounted on the board 6 with the open lower part passing through it, the overall height is equal to the entire length of the chip coil 1, and the thickness D of the board 6 is equal to the entire length of the coil. It will be absorbed into. Further, the substrate 6 is only newly formed with an open lower portion, and the overall height is further reduced without any loss in strength compared to thinning the mounting portion of the flange 3.
なお、本発明に係るコイルの実装構造は前記実施例に限
定されるものではなく、その要旨の範囲内で種々に変更
することができる。It should be noted that the mounting structure of the coil according to the present invention is not limited to the above embodiments, and can be variously modified within the scope of the gist.
例えば、フランジ３．４は円形であってもよく、この場
合には開ロアも円形とすることが望ましい。For example, the flange 3.4 may be circular, in which case it is desirable that the opening lower portion also be circular.
但し、角形であってもフランジ４が挿通可能でフランジ
３の挿通を阻止する形状であればよい。However, even if it is rectangular, any shape that allows the flange 4 to be inserted and prevents the flange 3 from being inserted may be used.
発明の効果
以上の説明で明らかな様に、本発明によれば、基板の開
口にフィルの他方のフランジを挿通させた状態で一方の
フランジを当接させ、互いの電極を半田付けする様にし
たため、コイル実装時の高さをコイル自体の全長に抑え
ることができ、しかも基板の厚さは従来と同じであり、
ことさら基板強度を損なうこともない。Effects of the Invention As is clear from the above explanation, according to the present invention, the other flange of the fill is inserted into the opening of the substrate, one flange is brought into contact with the other, and the electrodes are soldered to each other. As a result, the height when mounting the coil can be kept to the full length of the coil itself, and the thickness of the board is the same as before.
There is no particular loss in substrate strength.
第１図、第２図は本発明に係るコイルの実装構造の一実
施例を示し、第１図は分解斜視図、第２図は実装された
状態の部分断面図である。第３図は従来のコイル実装構
造を示す正面図である。
１・・・チップコイル、２・・・ボビン、３，４・・・
フランジ、３ａ・・・電極、５・・・コイル心線、６・
・・基板、７・・・開口、８・・・電極。
特許出願人 株式会社村田製作所1 and 2 show an embodiment of a coil mounting structure according to the present invention, with FIG. 1 being an exploded perspective view and FIG. 2 being a partial sectional view of the mounted state. FIG. 3 is a front view showing a conventional coil mounting structure. 1... Chip coil, 2... Bobbin, 3, 4...
Flange, 3a... Electrode, 5... Coil core wire, 6.
... Substrate, 7... Opening, 8... Electrode. Patent applicant Murata Manufacturing Co., Ltd.
Claims (1)
ンジの面積よりも大きくしたコイルと、他方のフランジ
が挿通可能であると共に一方のフランジが縁部に当接可
能な開口を形成した基板とから構成され、 他方のフランジを挿通させた前記開口の縁部に一方のフ
ランジを当接させ、一方のフランジに設けた電極と開口
の縁部に設けた電極とを半田付けしたこと、 を特徴とするコイルの実装構造。1. Consisting of a coil in which the area of one flange is larger than the area of the other flange provided on the bobbin, and a substrate that has an opening through which the other flange can be inserted and which allows one flange to come into contact with the edge. One flange is brought into contact with the edge of the opening through which the other flange is inserted, and the electrode provided on the one flange and the electrode provided on the edge of the opening are soldered. Coil mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10679288A JPH01278004A (en) | 1988-04-28 | 1988-04-28 | Mounting construction for coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10679288A JPH01278004A (en) | 1988-04-28 | 1988-04-28 | Mounting construction for coil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01278004A true JPH01278004A (en) | 1989-11-08 |
Family
ID=14442744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10679288A Pending JPH01278004A (en) | 1988-04-28 | 1988-04-28 | Mounting construction for coil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01278004A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0563011U (en) * | 1992-01-24 | 1993-08-20 | デルタ エレクトロニクス インコーポレイティド | Noise filter |
| JP2011146531A (en) * | 2010-01-14 | 2011-07-28 | Tdk-Lambda Corp | Substrate |
| AT14667U1 (en) * | 2014-03-26 | 2016-03-15 | Tridonic Gmbh & Co Kg | Printed circuit board with coil unit and a mounting method therefor |
| US20180226185A1 (en) * | 2015-12-02 | 2018-08-09 | Intel IP Corporation | Electronic package with coil formed on core |
-
1988
- 1988-04-28 JP JP10679288A patent/JPH01278004A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0563011U (en) * | 1992-01-24 | 1993-08-20 | デルタ エレクトロニクス インコーポレイティド | Noise filter |
| JP2011146531A (en) * | 2010-01-14 | 2011-07-28 | Tdk-Lambda Corp | Substrate |
| AT14667U1 (en) * | 2014-03-26 | 2016-03-15 | Tridonic Gmbh & Co Kg | Printed circuit board with coil unit and a mounting method therefor |
| US20180226185A1 (en) * | 2015-12-02 | 2018-08-09 | Intel IP Corporation | Electronic package with coil formed on core |
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