JP2000134517A - Substrate and digital still camera and method for mounting substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate and a method for mounting the substrate by effectively using a space, and making compact a shield structure. SOLUTION: When a linked part 13 is bent, a CCD1 and an integrated circuit 2 for driving are adjacently arranged. For example, when a substrate is mounted on a digital still camera, a space can be validly utilized, and the mounts of a shield member S for shielding the CCD1 and the integrated circuit 2 for driving can be reduced. Thus, the compact and low cost constitution can be obtained. Moreover, when a ground pattern GP is formed on the circuit board itself, the CCD1 and the integrated circuit 2 for driving can be covered with the ground pattern GP by bending the circuit board. Thus, it is not necessary to separately provide any conductive member S for shielding the CCD1 and the integrated circuit 2 for driving.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate on which an electric element such as an integrated circuit is mounted, and more particularly to a substrate on which an electric element can be efficiently arranged.

[0002]

2. Description of the Related Art For example, in a digital still camera, a CCD which is a solid-state image pickup device is provided.
The CD converts an optical image formed by an imaging lens into an electric signal, and can reproduce an image based on the converted signal. A general CCD is a DIP (Dua)
l In-line Package), which has a configuration in which two rows of leads extend from both sides of the main body, and the leads are fixed by soldering or the like and mounted on a circuit board. ing.

A digital still camera is often desired to be more compact because a photographer often picks up an image while holding it with his / her hand. Therefore, the space for arranging the electric elements mounted therein is often limited, and it is necessary to arrange the electric elements more efficiently.

[0004]

However, as described above, since CCDs are often of the DIP type, when they are mounted on a circuit board, a space is created between the circuit board and the CCD, and the There is a possibility that the space inside the still camera cannot be efficiently used.

Therefore, in the prior art, a small electric element such as a capacitor or a resistor is arranged between the CCD and the circuit board on the circuit board on which the CCD is mounted so that the limited space can be effectively used. I try to plan. However, on the back surface of the circuit board, through which the tips of the leads have penetrated, a relatively large electric element cannot be arranged due to the presence of the leads, and therefore, an unused space still remains.

[0006] On the other hand, a CCD or a driving integrated circuit sometimes generates electromagnetic waves at a specific frequency, although weak. If this electromagnetic wave propagates outside the digital still camera, it may be recognized as noise in other electric devices and the like. On the other hand, electromagnetic waves generated in other electric devices and the like propagate inside the digital still camera,
It may be recognized as noise in the CCD or the driving integrated circuit. Such an external or internal propagation characteristic of an electromagnetic wave is determined by using an EMC (Electromagnetic COM).
(patibility). On the other hand, there are various sources of static electricity outside the digital still camera, and when the static electricity generated there is transmitted to the digital still camera,
There is a possibility that the CCD or the driving integrated circuit may be damaged or malfunction. Such a phenomenon is caused by ES
D (Electrostatic Discharge)
That is, it is called electrostatic discharge, and is grasped as one phenomenon based on EMC. As a measure against such EMC or ESD, a shield structure for shielding a CCD and a driving integrated circuit is required.

As such a shield structure, a CCD is used.
It is conceivable to cover the periphery of the driving integrated circuit with, for example, a grounded conductive member. However, if the CCD and the driving integrated circuit are provided apart from each other, a large number of conductive members are required to cover the CCD, thereby increasing the cost of parts and increasing the size and weight of the digital still camera. There is.

The present invention has been made in view of the above-mentioned problems of the prior art, and has as its object to provide a substrate and a method of mounting the substrate, which can effectively utilize space and can make the shield structure compact.

[0009]

In order to achieve the above-mentioned object, a substrate according to the present invention comprises a main integrated circuit having a specific use and a sub-integrated circuit for driving the main integrated circuit. The substrate is at least partially bendable, and when the substrate is bent,
The main integrated circuit and the sub-integrated circuit are arranged close to each other.

The method for assembling a substrate according to the present invention comprises the steps of:
A step of attaching a solid-state imaging device and a driving circuit of the solid-state imaging device, and for each of the substrates, the solid-state imaging device,
The method includes a step of attaching the driving circuit to the digital still camera and a step of bending the substrate and disposing the drive circuit near the solid-state imaging device.

[0011]

According to the substrate of the present invention, at least a part thereof can be bent, and when the substrate is bent,
Since the main integrated circuit and the sub-integrated circuit are arranged close to each other, if it is mounted in a folded state, for example, in a digital still camera, the space can be effectively used, and the main integrated circuit and The amount of the conductive member for shielding the sub-integrated circuit is small, so that a compact and low-cost configuration can be obtained. Further, if the ground pattern is formed on the substrate itself, the main integrated circuit and the sub-integrated circuit can be covered with the ground pattern by bending the substrate, and thus it is necessary to separately provide a conductive member for shielding. Disappears.

According to the method of assembling a substrate of the present invention, a step of attaching a solid-state image sensor and a drive circuit of the solid-state image sensor to the substrate, and attaching the solid-state image sensor to the digital still camera for each substrate Steps and
Bending the substrate and disposing the drive circuit in the vicinity of the solid-state imaging device, so that the solid-state imaging device and the drive circuit can be mounted close to each other, thereby saving space. Can be used for
The amount of the conductive member for shielding the solid-state imaging device and the drive circuit is also small, so that a compact and low-cost configuration can be obtained. Furthermore, if the ground pattern is formed on the substrate itself, the solid-state imaging device and the drive circuit can be covered with the ground pattern by bending the substrate, so that there is no need to separately provide a conductive member for shielding. .

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a front view of the circuit board according to the present embodiment. FIG. 2 is a perspective view showing a CCD as a main integrated circuit. FIG. 3 is a rear view of such a circuit board. In FIG. 1, a circuit board 10 includes
A base part, a shield part, a connecting part connecting the base part and the shield part, and a shield part;
2 and a wiring portion 14 extending upward from the right end in FIG. The circuit board 10 is an FPC (Flexib)
Although it is formed of a flexible plate material called "le Print Circuitboard", only the base portion 14 is reinforced by, for example, an acrylic plate 15 (partially cut away and shown) having relatively high rigidity.

The base portion 14 is located near the upper and lower edges of the center thereof.
Two rows of small openings 11c are formed, and mounting holes 11b and 11a are formed at the lower left and upper right in FIG. DIP type CCD 1 shown in FIG.
Has lead portions 1a on both sides thereof. C
The CD 1 is attached to the base 14 by inserting the lead 1a into the small opening 11c and soldering.

The shield portion 12 has a ground pattern GP formed on the front side thereof by coating a conductive member. The ground pattern GP is formed on the circuit board 10.
Is mounted, for example, to the ground of the DC power supply terminal. Further, as shown in FIG. 3, the shield unit 12 has a driving integrated circuit (sub-integrated circuit) 2 for driving the CCD 1 mounted at the center on the back side.

As shown in FIG. 3, a wiring portion 14 has a connector portion 14 for connecting to another substrate at its end.
a. Although the wiring pattern is omitted in the figure, the connector 14a is connected to the lead 1 of the CCD 1.
a and a lead portion (not shown) of the driving integrated circuit 2.

A mode for mounting the circuit board 10 according to the present embodiment will be described. Figure 4 shows the CCD on the circuit board
FIG. 5 is a side view showing a state in which the circuit board is bent, and FIG. First, as shown in FIG. 4, a CCD 1 and a driving integrated circuit 2 are mounted on a flat circuit board 10. If the circuit board 10 is flat, the CCD 1 and the driving integrated circuit 2 are still separated from each other, so that the circuit board 10 can be easily attached to the front and back surfaces of the circuit board 10, respectively. At the time of mounting, the lead portion 1a of the CCD 1 projects through the small opening 11a (FIG. 1) of the circuit board 10 by a length P, and is soldered to the base portion 14 while maintaining the projected state. It will be.

After all the electric elements including the CCD 1 and the driving integrated circuit 2 are mounted on the circuit board 10, the CCD 1 together with the circuit board 10 is positioned with respect to an image pickup unit (a holding member for a photographing lens) (not shown). , Mounting hole 11
It is attached by bolts (not shown) via a and 11b.
Since the base portion 11 is reinforced by the acrylic plate 15, even if the base portion 11 has flexibility, the CCD 1
Can be attached to the imaging unit in a stable state.

Thereafter, the circuit board 10 is bent at the connecting portion 13 in the direction shown by the arrow in FIG. Then, as shown in FIG.
The driving integrated circuit 2 is inserted between the lead portions 1a, and a compact arrangement is possible. In this state, the connector portion 14a is attached to another circuit board (not shown), and an insulator is filled between the base portion 11 and the shield portion 12, and the attachment of the circuit board 10 is completed.

According to the present embodiment,
By bending the circuit board 10, the CCD 1 and the driving integrated circuit 2 can be arranged close to each other, and the driving integrated circuit 2 is placed in the space between the protruding lead portions 1a, which has been difficult to use conventionally. Since the arrangement can be performed, the electric element can be more efficiently mounted in the space inside the digital still camera. Further, as shown in FIG. 4, if the circuit board 10 is flat as in the prior art, a relatively large number of shield members S (illustrated by alternate long and short dash lines) as conductive members are required. According to the present embodiment, as shown in FIG. 5, it is sufficient to provide only a small amount of the shield member S. Further, since the ground pattern GP (FIG. 1) is formed in the shield portion 12 of the circuit board 10 in advance, it is not necessary to further provide the shield member S behind the shield portion 12 (to the right in FIG. 5). . Therefore, according to the present embodiment, the effect of the electromagnetic wave can be prevented by using the shield member S with a minimum amount. Since the influence of the electromagnetic wave is relatively small on the sides of the CCD 1 and the driving integrated circuit 2, the shielding member S
May be omitted. Therefore, in such a case,
There is no need to provide the shield member S separately,
Thereby, cost can be reduced as much as possible.

Further, according to the present embodiment, the circuit board 1
Before bending 0, the CCD 1 and the driving integrated circuit 2 are soldered to the circuit board 10. At this time, the CCD 1 and the driving integrated circuit 2 are connected to one side of the circuit board 10 (the right side in FIG. 4).
Can be soldered. Therefore, the automation of the soldering can be easily performed, and the manufacturing cost of the digital still camera can be reduced. Further, in a state where the circuit board 10 is bent, as shown in FIG.
a are all arranged on the front side (left side in FIG. 5), so that they are easy to assemble, and therefore have a low manufacturing cost.

As described above, the present invention has been described with reference to the embodiments. However, the present invention should not be construed as being limited to the above-described embodiments, and it is needless to say that the present invention can be appropriately changed / improved. is there. For example, the circuit board 10 does not need to be flexible as a whole, but it is sufficient if the connecting portion 13 is flexible.

[0023]

According to the substrate of the present invention, at least a part thereof can be bent, and when the substrate is bent, the main integrated circuit and the sub integrated circuit are arranged close to each other. Therefore, if it is mounted in a folded state, for example, in a digital still camera, the space can be used effectively, and the amount of conductive members for shielding the main integrated circuit and the sub-integrated circuit is small. Thus, a compact and low-cost configuration can be obtained. Further, if the ground pattern is formed on the substrate itself, the main integrated circuit and the sub-integrated circuit can be covered with the ground pattern by bending the substrate, and thus it is necessary to separately provide a conductive member for shielding. Disappears.

According to the method of assembling a substrate of the present invention, a step of attaching a solid-state image sensor and a drive circuit of the solid-state image sensor to the substrate, and attaching the solid-state image sensor to the digital still camera for each substrate Steps and
Bending the substrate and disposing the drive circuit in the vicinity of the solid-state imaging device, so that the solid-state imaging device and the drive circuit can be mounted close to each other, thereby saving space. Can be used for
The amount of the conductive member for shielding the solid-state imaging device and the drive circuit is also small, so that a compact and low-cost configuration can be obtained. Furthermore, if the ground pattern is formed on the substrate itself, the solid-state imaging device and the drive circuit can be covered with the ground pattern by bending the substrate, so that there is no need to separately provide a conductive member for shielding. .

[Brief description of the drawings]

FIG. 1 is a front view of a circuit board according to an embodiment.

FIG. 2 is a perspective view showing a CCD as a main integrated circuit.

FIG. 3 is a rear view of the circuit board according to the exemplary embodiment;

FIG. 4 is a side view showing a state in which a CCD or the like is attached to a circuit board before bending.

FIG. 5 is a diagram showing a state where a circuit board is bent.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 CCD 1a Lead part 2 Driving integrated circuit 10 Circuit board 11 Base part 12 Shield part 13 Connecting part 14 Wiring part 14a Connector part GP ground pattern S Shield member

Claims (10)

[Claims] 1. A substrate on which a main integrated circuit having a specific application and a sub-integrated circuit for driving the main integrated circuit can be mounted, wherein the substrate is at least partially bendable. A substrate, wherein the main integrated circuit and the sub-integrated circuit are arranged close to each other when bent. 2. The substrate according to claim 1, wherein the main integrated circuit is a solid-state imaging device. 3. The main integrated circuit is mounted on a front surface of the substrate, the sub-integrated circuit is mounted on a back surface of the substrate, and the sub-integrated circuit is bent by bending the substrate. The substrate according to claim 1, wherein the substrate is arranged with the substrate interposed therebetween. 4. The substrate according to claim 3, wherein when the substrate is bent, an electric element attached to the substrate is arranged on one side of the substrate. 5. The main integrated circuit has a plurality of leads for attaching to the substrate, and the sub-integrated circuit is arranged between the leads.
5. The substrate according to any one of items 1 to 4. 6. The substrate according to claim 1, wherein a ground pattern is formed in a region of the substrate on which the sub-integrated circuit is mounted. 7. The main integrated circuit and the sub integrated circuit,
The substrate according to claim 1, wherein the substrate is arranged on one side in a bent state. 8. The main integrated circuit and the sub integrated circuit are attached to the substrate by soldering before the substrate is bent, and the soldering is performed on one side of the substrate. The substrate according to claim 1, wherein: 9. A digital still camera provided with the substrate according to claim 1. 10. A step of attaching a solid-state imaging device and a drive circuit of the solid-state imaging device to a substrate; a step of attaching the solid-state imaging device to a digital still camera for each of the substrates; Disposing the drive circuit near the solid-state imaging device.