JPH09241601A - Liquid adhesive for electronic part and formation of insulated adhered layer using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an adhesive having excellent heat resistance, reliability and processability, etc., by dispersing a specific compound in a copolymer composition containing butadiene-acrylonitrile copolymers respectively having specific groups. SOLUTION: This liquid adhesive comprises an organic solvent solution containing a composition composed of at least one kind selected from a group of butadiene-acrylonitrile copolymers respectively having 1,000-200,000 weight- average molecular weight and being each (A) a carboxyl-containing copolymer of formula I, etc., (k') and (m') are respectively 0.3-93 and 1-175 to (n') of 1}, (B) an acrylic-containing copolymer of formula II, etc., (k") and (m") are respectively 0.3-93 and 1-175 to (n") of 1}, (C) an epoxy-containing copolymer and (D) a copolymer of formula III (a) is 1-175 to (b) of 1} and (E) a piperazinylethylaminocarbonyl-containing copolymer, and (F) a compound containing plural maleimides of formula IV, etc. The compound F in an amount of 10-900 pts.wt. based on 100 pts.wt. of total of the copolymers is dispersed into the solution.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component used for bonding members around a lead frame constituting a semiconductor device, for example, a lead pin, a semiconductor chip mounting substrate, a heat sink, and a semiconductor chip itself. The present invention relates to a liquid adhesive and a method for forming an insulating adhesive layer using the liquid adhesive.

[0002]

2. Description of the Related Art Conventionally, adhesive tapes and the like used in resin-sealed semiconductor devices include lead frame fixing adhesive tapes and TAB tapes. For example, in the case of lead frame fixing adhesive tapes, As shown in Figure 1,
It is used to fix the lead pins of the lead frame and to improve the production yield and productivity of the lead frame itself and the entire semiconductor assembly process.It is generally taped on the lead frame by the lead frame maker and brought to the semiconductor maker. After mounting the IC, resin sealing is performed. In addition, in FIG. 1, (a) is an overall view,
(B) is an enlarged view of a main part, 1 is a lead pin fixing position, 2 is a dam bar, 3 is a lead pin, and 4 is an island part. For this reason, the adhesive tape for fixing the lead frame has not only the general reliability at the semiconductor level and the workability at the time of taping, but also a sufficient room temperature adhesive force immediately after taping, and a sufficient resistance to heating during the semiconductor device assembly process. High heat resistance is required.

Conventionally, as an adhesive tape used for such an application, for example, a synthetic rubber resin such as polyacrylonitrile, polyacrylic ester or acrylonitrile-butadiene copolymer is formed on a support film such as a polyimide film. An adhesive such as the above, alone, or modified with another resin, or mixed with another resin is applied to be in a B-stage state.
In recent years, the package structure inside semiconductor devices has become complicated in order to increase the number of pins and heat dissipation, and the electrical and physical characteristics and handling of organic materials such as adhesive tapes used therein The requirements for characteristics are becoming more stringent.

[0004]

By the way, the conventional adhesive tape for electronic parts, which requires a base film, has problems in fixing lead pins and other uses. For example, in the case of using a conventional adhesive tape in which an adhesive is applied to a base film as a lead pin fixing tape in fixing a lead pin in a resin-encapsulated semiconductor device (semiconductor package) that has been conventionally developed as shown in FIG. In some cases, the heat resistance and electrical reliability were not sufficient. In FIG. 2, the lead pin 3 is fixed with the lead pin fixing tape 5,
The semiconductor chip 6 on the island portion 4 is connected with a bonding wire 7, and they are sealed with a molding resin 8. Moreover, when a polyimide resin tape or the like is applied, the taping temperature and pressure, the curing conditions of the polyimide resin, and the like are strict, and there is a risk of damaging the metal material such as the lead frame. Moreover, in the conventional tape form,
The taping required a certain amount of area in terms of punching die and precision, but it has become impossible to secure the required area as the number of pins increases and the package becomes smaller. Therefore,
It has become necessary to develop a material and system that can be applied to a narrower area than before and can fix lead pins.

Further, the dam bar 2 as shown in FIG. 1 was provided for the purpose of preventing the resin from squeezing out at the time of transfer molding, but thereafter, a step of cutting and removing is required. Furthermore, as the number of pins increases, the outer lead pitch becomes narrower, making it difficult to remove the metal dam bar itself. Therefore, attempts have been made to replace the metal dam bar by using the conventional adhesive tape for electronic parts, but the polyimide base film causes a defect such as a pin deformation during molding.

Further, in the case of a multilayer lead frame, for example, when a heat sink and a lead frame are adhered while maintaining insulation, a polyimide film is used as a central layer,
Although a tape having a three-layer structure in which an adhesive having high electrical reliability and generating less gas is applied to the top and bottom is used, it is difficult to reduce the cost of the multilayer lead frame because the process is complicated. . Therefore, there is a demand for the development of a liquid adhesive that can be used when bonding the heat sink and the lead frame.

Also, a double-sided adhesive tape for electronic parts is used to bond the lead pin and the semiconductor chip body to each other like the LOC structure and the COL structure. However, pressure, temperature and impact during taping are applied to the semiconductor chip. However, there was a problem in that it was difficult to reduce the cost. In addition, various adhesive tapes, adhesives, and organic insulating materials for electronic parts have some problems.

Therefore, in order to solve the above problems, development of a liquid adhesive for electronic parts having sufficient heat resistance, reliability, workability and workability is desired. Therefore, an object of the present invention is to provide a liquid adhesive for electronic parts having sufficient heat resistance, reliability, processability and workability, and a method for forming an insulating adhesive layer using the same.

[0009]

The liquid adhesive for electronic parts according to the present invention comprises (a) a formula (I-1) having a weight average molecular weight of 1,000 to 200,000 and a carboxyl group equivalent of 30 to 10,000. ) Carboxyl group-containing butadiene represented by
Acrylonitrile copolymer and / or formula (I-2)
A carboxyl group-containing butadiene-acrylonitrile copolymer represented by

Embedded image (Wherein k ′, m ′ and n ′ are molar ratios,
For n '= 1, m' = 1 to 175, k '= 0.3 to
Represents a number in the range of 93. (B) An acrylic group-containing butadiene-acrylonitrile copolymer represented by the formula (II-1) and / or a formula (II) having a weight average molecular weight of 1,000 to 200,000 and an acrylic group equivalent of 500 to 10,000. II-2) an acrylic group-containing butadiene-acrylonitrile copolymer,

Embedded image (In the formula, k ″, m ″, and n ″ are molar ratios, and
For n ″ = 1, m ″ = 1 to 175, k ″ = 0.3 to
Represents a number in the range of 93. (C) Piperazinylethylaminocarbonyl group-containing butadiene-acrylonitrile copolymer of the following component (e) or carboxyl group-containing butadiene of the above component (a)
Weight average molecular weight of 1,0 obtained by epoxy-modifying the piperazinylethylaminocarbonyl group or carboxyl group at the terminal or molecular chain of the acrylonitrile copolymer
00-200,000 and an epoxy group equivalent of 500-1
An epoxy group-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000, and (d) the following formula (III) having a weight average molecular weight of 1,000 to 200,000.

Embedded image (Where a and b are molar ratios and represent a number in the range of a = 1 to 175 with respect to b = 1) selected from the group consisting of butadiene-acrylonitrile copolymers. At least one copolymer, and (e) having a weight average molecular weight of 1,000 to 200,000 and an amino group equivalent of 500 to 10,000.
-1) Piperazinylethylaminocarbonyl group-containing butadiene-acrylonitrile copolymer and /
Or a piperazinylethylaminocarbonyl group-containing butadiene-acrylonitrile copolymer represented by the formula (IV-2)

Embedded image (In the formula, k, m and n are molar ratios, and for n = 1, represent numbers in the range of m = 1 to 175 and k = 0.3 to 93). The ratio of the component (e) to the total amount of the components (a) to (e) is 0 to 6
Less than 0% by weight of the copolymer or copolymer composition,
In a solution dissolved in an organic solvent, (f) the following formulas (V-1) to (V-6)

Embedded image

Embedded image The compound containing two or more maleimide groups selected from the compounds represented by the formula (1) is dispersed at a ratio of 10 to 900 parts by weight based on 100 parts by weight of the total amount of the above components (a) to (e). It is characterized by

In the method for forming an insulating adhesive layer of the present invention, the above-mentioned liquid adhesive for electronic parts is applied to an electronic part by a dispensing method or a screen printing method and then thermally cured to form an insulating pattern or insulating layer. Is formed.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below. The carboxyl group-containing butadiene-acrylonitrile copolymer represented by the above formula (I-1) and the carboxyl group-containing butadiene-acrylonitrile copolymer represented by the formula (I-2) used as the component (a) have a weight-average molecular weight. 1,000 to 200,000, carboxyl group equivalent 30 to 10,000, preferably 1,000 to
The range of 8,000 is used.

The above formula (II- used as the component (b)
1) The acrylic group-containing butadiene-acrylonitrile copolymer shown and the acrylic group-containing butadiene-acrylonitrile copolymer represented by the formula (II-2) have a weight average molecular weight of 1,000 to 200,000 and an acrylic group equivalent of 500. ~ 10,000, preferably 1,000-8,
A range of 000 is used.

The epoxy group-containing butadiene-acrylonitrile copolymer used as the component (c) has a weight average molecular weight of 1,000 to 200,000 and an epoxy group equivalent of 500 to 10,000, preferably 1,000 to 8. , 0
A range of 00 is used.

The above formula (III) used as component (d)
The butadiene-acrylonitrile copolymer shown has a weight average molecular weight of 1,000 to 200,000.

The above formula (IV- used as component (e)
1) a butadiene-acrylonitrile copolymer containing a piperazinylethylaminocarbonyl group represented by the formula (IV)
-2), the piperazinylethylaminocarbonyl group-containing butadiene-acrylonitrile copolymer has a weight average molecular weight of 1,000 to 200,000 and an amino group equivalent of 500 to 10,000, preferably 1,000 to 8 ，
A range of 000 is used. These copolymers can be synthesized by various methods or are commercially available. For example, the compound represented by the formula (IV-1) can be synthesized by amidating a butadiene-acrylonitrile copolymer having a carboxyl group at both ends with N-aminoethylpiperazine, or a commercially available product. Can be appropriately selected and used. Further, the compound represented by the formula (IV-2) is a butadiene containing a carboxyl group represented by the above formula (I-2).
It can be synthesized by condensing an acrylonitrile copolymer and N-aminoethylpiperazine in the presence of, for example, phosphite.

To prepare the liquid adhesive of the present invention,
One or more copolymers of any one of the above components (a), (b), (c) and (d) and the above component (a) are added to the total of the above components (a) to (e). It is blended so that the ratio of the component (e) to the amount is 0 to less than 60% by weight, and dissolved in an organic solvent. When the compounding amount of the above component (e) is 60% by weight or more, the storability of the obtained liquid adhesive is lowered and the workability is deteriorated. When the component (e) is contained, the preferable range is 20 to 40% by weight based on the total amount of the components (a) to (e).

The liquid adhesive of the present invention comprises the above-mentioned component (a).
To (e) in a solution of an organic solvent, a compound containing two or more maleimide groups selected from the compounds represented by the above formulas (V-1) to (V-6) as the component (f). , The total amount of the above components (a) to (e) is 100
10 to 900 parts by weight, preferably 20
It can be obtained by adding and dispersing at a ratio of up to 500 parts by weight. In this case, the amount of component (f) is 10
When the amount is less than the weight part, after the obtained liquid adhesive is applied and cured, the heat resistance of the adhesive, particularly Tg, Young's modulus, and electric insulation are significantly deteriorated.
If the amount is more than 00 parts by weight, when the adhesive is cured,
The adhesive itself becomes brittle and the workability is deteriorated, so that it is not suitable for the intended use.

In the present invention, the above components (a) to (e) are used.
And the component (f) are mixed in an organic solvent that dissolves the components (a) to (e) but does not dissolve the component (f). Organic solvents that can be used include benzene, toluene, xylene, ethylbenzene, butylbenzene, cumene, mesitylene, p-cymene, diethylbenzene, pentylbenzene, dipentylbenzene, dodecylbenzene, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxy. Ethanol, 1,4-dioxane, chlorobenzene, dichlorobenzene, carbon tetrachloride, nitrobenzene,
Isopropyl alcohol, γ-butyl lactone, methyl ethyl ketone, methyl formate, ethyl formate, propyl formate, butyl formate, isobutyl formate, pentyl formate, methyl acetate, ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, acetic acid Isobutyl, sec-butyl acetate, pentyl acetate, isopentyl acetate, benzyl acetate,
Examples thereof include methyl propionate, ethyl propionate, butyl propionate, isopentyl propionate, trichloroethylene, trichloroethane, tetrahydrofuran and pyridine. These may be used as a mixture of two or more.

In the present invention, the amount of these organic solvents is
Although it can be used in an appropriate ratio so that the viscosity can be controlled and mixed and dispersed easily, it is used in the range of 5 to 90%, preferably 30 to 60% by weight of the liquid adhesive. Is preferred.

In the liquid adhesive of the present invention, if necessary,
In order to promote the addition reaction between the above components (a) to (e) and the component (f) and the addition reaction between the components (f), diazabicyclooctane, or methyl ethyl ketone peroxide, cyclohexane peroxide, 3 ，
3,5-trimethylcyclohexanone peroxide,
Methyl cyclohexanone peroxide, methyl acetoacetate peroxide, acetylacetone peroxide, 1,1-bis (t-butylperoxy) -3,
3,5-trimethylcyclohexane, 1,1-bis (t
-Butylperoxy) cyclohexane, 2,2-bis (t-butylperoxy) octane, n-butyl-4,
4-bis (t-butylperoxy) valate, 2,2-
Bis (t-butylperoxy) butane, t-butyl hydroperoxide, cumene hydroperoxide,
Di-isopropylbenzene hydroperoxide, P
-Menthane hydroperoxide, 2,5-dimethylhexane-2,5-dihydroperoxide, 1,
1,3,3-Tetramethylbutyl hydroperoxide, di-t-butyl peroxide, t-butyl cumyl peroxide, di-cumyl peroxide, α, α ′
-Bis (t-butylperoxy-m-isopropyl) benzene, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, 2,5-dimethyl-2,5-di (t
-Butylperoxy) hexane, acetyl peroxide, isobutyl peroxide, octanoyl peroxide, decanoyl peroxide, benzoyl peroxide, lauroyl peroxide, 3,5,5-trimethylhexanoyl peroxide, succinic acid peroxide , 2,4-dichlorobenzoyl peroxide, m-toluoyl peroxide, di-isopropyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, di-n-properperoxydicarbonate, bis- (4- t-butylcyclohexyl) peroxydicarbonate, di-myristyl peroxydicarbonate, di-2-ethoxyethyl peroxydicarbonate, di-methoxyisopropyl peroxydicarbonate Bonate, di (3-methyl-3-methoxybutyl) peroxydicarbonate, di-allylperoxydicarbonate, t-butylperoxyacetate, t-butylperoxyisobutyrate, t-butylperoxypivalate, t-butyl peroxy neodecaneate, cumyl peroxyneododecaneate, t-
Butylperoxy-2-ethylhexanate, t-butylperoxy-3,5,5-trimethylhexanate,
t-butylperoxylaurate, t-butylperoxydibenzoate, di-t-butylperoxyisophthalate, 2,5-dimethyl-2,5-di (benzoylperoxy) hexane, t-butylperoxymalein Acid, t-butyl peroxyisopropyl carbonate,
Cumyl peroxy octate, t-hexyl peroxyneodecanate, t-hexyl peroxy pivalate,
Organic peroxides such as t-butyl peroxy neohexanate, t-hexyl peroxy neohexanate, cumyl peroxy neohexanate, acetylcyclohexyl sulfonyl peroxide, t-butyl peroxy allyl carbonate, 1,2- Dimethylimidazole,
1-methyl-2-ethylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-
Undecyl imidazole, 2-heptadecyl imidazole, 2-phenyl imidazole, 1-benzyl-2-methyl imidazole, 1-benzyl-2-phenyl imidazole, 1-benzyl-2-phenyl imidazole trimellitate, 1-benzyl 2-ethylimidazole, 1-benzyl-2-ethyl-5-methylimidazole, 2-ethylimidazole, 2-isopropylimidazole, 2-phenyl-4-benzylimidazole, 1
-Cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-isopropylimidazole, 1-cyanoethyl-2-phenylimidazole, 1 -Cyanoethyl-
2-methylimidazolium trimellitate, 1-cyanoethyl-2-ethyl-4-methylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2 ' −
Methylimidazolyl- (1) ']-ethyl-S-triazine, 2,4-diamino-6- [2'-ethyl-4-methylimidazolyl- (1)']-ethyl-S-triazine, 2,4- Diamino-6- [2'-undecylimidazolyl- (1) ']-ethyl-S-triazine, 2-methylimidazolium isocyanuric acid adduct, 2-phenylimidazolium isocyanuric acid adduct, 2,4-
Diamino-6- [2'-methylimidazole-
(1) ′]-Ethyl-S-triazine-isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4- Benzyl-5-hydroxymethylimidazole, 4,4'-methylene-bis- (2-ethyl-5-methyl-imidazole), 1-aminoethyl-2-methylimidazole, 1
-Cyanoethyl-2-phenyl-4,5-di (cyanoethoxymethyl) imidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 4,4 '
-Methylene-bis- (2-ethyl-5-methylimidazole), 2-methylimidazole-benzotriazole adduct, 1,2-dimethylimidazole-benzotriazole adduct, 1-aminoethyl-2-ethylimidazole, 1- (Cyanoethylaminoethyl) -2-methylimidazole, N, N '-[2-methylimidazolyl-
(1) -Ethyl] -adipoyldiamide, N, N'-bis- (2-methylimidazolyl-1-ethyl) urea, N
-[2-Methylimidazolyl-1-ethyl] -urea,
N, N '-[2-Methylimidazolyl- (1) -ethyl] dodecanedioyldiamide, N, N'-[2-Methylimidazolyl- (1) -ethyl] eicosanedioyldiamide, 1-benzyl-2- Phenylimidazole
Hydrochloric acid salt, 1-cyanoethyl-2-phenyl-4,
It is also possible to add imidazoles such as 5-di (cyanoethoxymethyl) imidazole and reaction accelerators such as triphenylphosphine. These reaction accelerators can be added within the range of 5% by weight of the whole.

In addition, the shape of the above components is maintained when they are melted,
20 μm particle size to improve the coating property of liquid adhesive
Hereafter, a spherical, crushed, flake-shaped, or amorphous filler having a particle size of preferably 5 μm or less can be included. As the filler, for example, silica, quartz powder, alumina, calcium carbonate, magnesium oxide, diamond powder, mica, kaolinite, fluororesin powder, silicone powder, polyimide powder, zircon powder and the like are used. These fillers may be used alone or in combination of two or more. The content of the filler is set within 70% by weight of the total solid content, preferably in the range of 5-40% by weight. If the content is more than 70% by weight, the viscosity at the time of processing is reduced, and the adhesive strength and strength after curing are reduced.

The liquid adhesive of the present invention contains, as an antioxidant, a high molecular weight hindered phenol having three or more tert-butylphenol groups in one molecule in an amount of 20% by weight or less based on the total solid content. be able to. Specifically, 1,3,5-tris (3,5-di-t-butyl-4-hydroxybenzyl) -s-triazine-2,
4,6- (1H, 3H, 5H) trione, 1,1,3-
Tris (2-methyl-4-hydroxy-5-t-butylphenyl) butane, tetrakis [methylene (3,5-di-t-butyl-4-hydroxyhydrocinnamate)] methane, 1,3,5-trimethyl -2, 4, 6-
Examples thereof include tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene.

Next, the case of using the above liquid adhesive for electronic parts of the present invention in various processing processes will be described. In order to produce an insulating adhesive layer such as a resin pattern using the liquid adhesive for electronic parts of the present invention, it is preferable to carry out processing according to the following steps. First, in the compounding step, any one of the components (a) to (d) and the component (e)
A solution obtained by dissolving at least one species in an organic solvent is prepared, and the component (f), accelerator, filler and the like are mixed therein, and mixed,
Disperse. In the dispersion step, the mixture is kneaded and dispersed by a ball mill, three rolls, a disperser or the like. The liquid adhesive obtained by this dispersion / kneading is filtered to 200 μm or more, preferably 5 μm by a filter, a mesh or the like.
The above particles (adjusted appropriately so that the particle diameter of the filler or the like is greater than or equal to) are removed. In the coating step, the liquid adhesive obtained, using a dispensing device or a screen printer, a metal coating object, for example, an electronic component such as a lead frame, after being applied in a predetermined pattern, in a drying step, By heating, the liquid adhesive is removed from the solvent or in a prepreg state, and then, in a pressing step, it is melted and pressed by a hot press to a predetermined coating thickness to obtain a predetermined pattern shape. After that, the liquid adhesive is heated and cured in a curing step to obtain a desired resin pattern or insulating layer. In the above process, the compounding step is a step of mixing a main agent, a curing agent, an elastomer, a filler, a solvent and other additives, and the order of addition is not particularly limited. The method of mixing is not particularly limited.

In the dispersing step, it is sufficient that the composition blended as described above becomes substantially uniform, and the compound having two or more maleimide groups has a particle diameter of 0.01 μm and is 50% by weight.
As described above, preferably 80 wt% or more is present, and the upper limit of the particle size is 200 μm, preferably 5 μm or less. The dispersion method is preferably a three-roll, ball mill, homogenizer or the like, but is not particularly limited as long as the above object can be achieved by another method.

In the step of applying the liquid adhesive of the present invention, a method such as a screen printing method or a combination of a dispensing method and a screen printing method can be applied, but it is particularly limited as long as the purpose of applying various shapes can be achieved. Not done. An outline of the dispensing method is shown in FIG. 6, and an outline of the screen printing method is shown in FIG.

In the case of the dispensing method, as shown in FIG. 6, the liquid adhesive is filled in a syringe and attached to a dispenser 11 equipped with an XY robot. next,
A substrate to which the liquid adhesive pattern is applied, for example, a lead frame 13 or the like is set at a predetermined position, and a dispensing program or the like is used to perform ejection while driving the dispensing unit or the substrate, thereby forming the target liquid adhesive on the substrate. The pattern 12 is formed. In the case of the screen printing method, as shown in FIG. 7, a liquid adhesive 15 is placed on a screen printing plate 14 provided with a predetermined pattern, and an electronic component for applying a pattern, for example, a lead frame 13 is arranged, and then a squeegee. The liquid adhesive pattern 12 is transferred onto the electronic component by moving the liquid adhesive pattern 12 onto the screen printing plate while pressing 16 onto the object to be coated.

When the adhesive contains a solvent component, the drying step is performed to remove the solvent component to some extent, and when the adhesive component does not contain the solvent component, the drying step can be performed to obtain a prepreg state to some extent. However, when the solvent is volatilized to some extent by leaving it after the application of the adhesive, or when a prepreg state is obtained by leaving it, the drying step can be omitted. Here, the drying method may be any method such as hot air heating or infrared heating as long as the above purpose is achieved.

In the pressing step, the liquid adhesive applied in a pattern by dispensing or screen printing is
This is a step performed for the purpose of adjusting to a predetermined shape by pressing while heating. For example, if the substrate has irregularities or gaps such as a lead frame and the resin pattern is completely embedded, the pressing step is effective, but it is not always necessary.

The curing step is a step carried out for the purpose of obtaining a thermoset resin pattern by heating the liquid adhesive pattern whose shape has been adjusted in the above step. As a heating method, heating on a heat block or in an atmosphere of air or nitrogen, heating by infrared rays, a method by a combination of these is possible, but if the resin is heated by another method, the object of the present invention Can be achieved.

Further, the case where the liquid adhesive of the present invention is applied to various electronic parts will be described with some examples. As a first example, a case of fixing a lead pin using the liquid adhesive of the present invention will be described.
The liquid adhesive of the present invention is applied in a pattern on the lead pins by a dispensing method or a screen printing method, and if necessary, a pressing step is performed, followed by heat curing to form a lead pin fixing resin pattern. Specifically, in the case of the dispensing method, even if the pattern is different, it can be handled simply by changing the needle or program of the dispensing device, and even in the case of the screen printing method, it can be handled by only exchanging the plate pattern. No conventional mold is required. Further, since it can be applied to a narrow area, it is possible to easily fix the lead pin even to a lead frame having a shape that has been impossible to taping.

By using the liquid adhesive of the present invention, the following 1) to 1) which occur with the increase in the number of pins and the miniaturization of the package when the conventional tape type is used.
Problems such as 4) are solved. 1) Since a die is required for each pattern, it is particularly costly for high-mix low-volume production. 2) A tape width of about 1 mm is required when taping.
Considering the taping accuracy and the taping accuracy, the taping area may not be secured in a small package. 3) Since a polyimide base film is required, the cost will increase accordingly. 4) Since the polyimide base film has a high hygroscopic property, it may cause a package crack when it absorbs moisture due to an external factor.

As a second example, a case of forming a dambar resin pattern using the liquid adhesive of the present invention will be described. When the liquid adhesive of the present invention is applied to the part of the dam bar by the above-mentioned applying step, the liquid adhesive also penetrates into the space between the lead pins to some extent and has a cross-sectional shape as shown in FIG. 9 (a). After that, the liquid adhesive is completely filled between the lead pins as shown in FIG. 9B by performing the above-mentioned pressing process, and the liquid adhesive can function as a dam bar. In addition, the thickness of the resin at this time becomes substantially equal to the thickness of the lead frame, and there is no possibility that extra pressure will be applied to the lead pins during molding. Further, through the curing step, the liquid adhesive of the present invention is further cross-linked and becomes a resin having a relatively high Young's modulus, so that it can have a function as a dam bar. When the liquid adhesive of the present invention is used, it is not necessary to remove the dam bar 2 shown in FIG. 1 when manufacturing a lead frame and remove the dam bar after transfer molding as in the conventional case, and the labor and cost are reduced. In addition, the following problems 1) to 3) in the case of using an insulating tape for electronic parts using a base film made of polyimide, which has a proven track record in pin fixing and insulating properties, are solved. 1) Since it is difficult for the adhesive to be completely filled between the pins, the function of the dam bar may not be fully achieved. 2) Since the Young's modulus of the cured adhesive is low, the cured adhesive in the dam portion may be pushed out by the pressure during molding, and the dam function may not be fulfilled. 3) Since the base film exists, the mold die may press the base film, and the lead pin may be bent due to the influence.

As a third example, a case where the liquid adhesive of the present invention is used in a multilayer lead frame as shown in FIG. 3 will be described. Note that in FIG. 3, the semiconductor chip 6 is
The heat sink 10 on which is mounted and the lead pin 3 of the lead frame are joined via the insulating adhesive layer 9 made of a liquid adhesive, the semiconductor chip and the lead pin are connected by a bonding wire, and they are sealed by the mold resin. As shown in FIG. 3, when the heat sink and the lead pin are adhered while maintaining insulation, the liquid adhesive of the present invention is applied to the heat sink and the lead pin or both by a predetermined pattern by a dispensing method or a screen printing method, and the heat sink and the lead pin are applied. After the frames are simply pasted together, the liquid adhesive is cured by heating, so that the adhesive can be adhered while maintaining the insulating property.

As a fourth example, the LOC as shown in FIG.
A case where the liquid adhesive of the present invention is used for a structure or a COL structure as shown in FIG. 5 will be described. FIG.
And in FIG. 5, the semiconductor chip 6 and the lead pin 3
Are bonded via an insulating adhesive layer 9 made of a liquid adhesive, and the semiconductor chip and the lead pin are connected by a bonding wire 7.

When the lead pins and the semiconductor chip body are adhered using the liquid adhesive of the present invention, a predetermined adhesive pattern is formed by dispensing or screen printing in the same manner as above, and then the semiconductor chip and the electronic parts are insulated. It can be adhered while maintaining its properties. In this case, problems such as pressure, temperature and impact at the time of taping that occur when the double-sided tape is used can be avoided. As described above, when the liquid adhesive of the present invention is used, it can be applied to various electronic components by a dispensing method or a screen printing method and adhesively cured to form a resin pattern or an insulating layer.

[0036]

【Example】

Example 1 Piperazinylethylaminocarbonyl group-containing acrylonitrile-butadiene copolymer represented by formula (IV-1) (Hycar ATBN, manufactured by Ube Industries, Ltd.) (n = 1, m = 5.1, weight) Average molecular weight 3,600, amino group equivalent 900) 25 parts by weight, carboxyl group-containing acrylonitrile-butadiene copolymer represented by formula (I-1) (Hycar CTBN, Ube Industries, Ltd.) (n ′ = 1)
With respect to m ′ = 2.7, weight average molecular weight 3,500,
Carboxyl group 2.40%, number of functional groups 1.85 / mol
(Carboxyl group equivalent 1,700) 5 parts by weight, formula (II
-1) Acrylonitrile-containing acrylonitrile-butadiene copolymer (Hycar VTBN, manufactured by Ube Industries, Ltd.) (for n "= 1, m" = 5.2, weight average molecular weight 3,800, acrylic group 3) 15 parts by weight of 80% by weight (acrylic group equivalent 1,900), (d) epoxy group-containing acrylonitrile-butadiene copolymer (Hycar)
37 wt% VTBN and epoxy resin (Epicoat 82
62, 75% by weight of triphenylphosphine and 0.25% by weight of triphenylphosphine at 100 ° C.
Modified for 0 hours) (weight average molecular weight 4300,
10 parts by weight of epoxy group equivalent 2150), and a butadiene-acrylonitrile copolymer represented by the general formula (III) (a = 6 with respect to b = 1, weight average molecular weight 70,
000) 10 parts by weight are dissolved in 200 parts by weight of toluene,
In the obtained solution, the compound 3 represented by the above formula (V-1) is added.
5 parts by weight, 1 part by weight of benzoyl peroxide and 20 parts by weight of spherical alumina having an average particle diameter of 0.25 μm are mixed, and further 1,3,5-tris (3,5-di-t-butyl-4-hydroxybenzyl) is mixed. ) -S-triazine-2,
0.3 parts by weight of 4,6- (1H, 3H, 5H) trione (Adeka Stub AO-20, manufactured by Asahi Denka Kogyo Co., Ltd.) was added and mixed to obtain a liquid adhesive.

Example 2 In Example 1, 25 parts by weight of the piperazinylethylaminocarbonyl group-containing acrylonitrile-butadiene copolymer was replaced with 10 parts by weight, and 35 parts by weight of the compound represented by the formula (V-1) was added. A liquid adhesive was obtained in the same manner as in Example 1 except that the weight part was replaced.

Example 3 25 parts by weight of the same piperazinylethylaminocarbonyl group-containing acrylonitrile-butadiene copolymer as in Example 1, 45 parts by weight of the same acrylic group-containing acrylonitrile-butadiene copolymer as in Example 1 and execution 5 parts by weight of the same butadiene-acrylonitrile copolymer as in Example 1 was dissolved in 200 parts by weight of toluene. Using the obtained solution,
A liquid adhesive was obtained in the same manner as in Example 1 except that the amount of the compound represented by the formula (V-1) was changed to 25 parts by weight.

Example 4 25 parts by weight of the same piperazinylethylaminocarbonyl group-containing acrylonitrile-butadiene copolymer as in Example 1, 25 parts by weight of the same acrylic group-containing acrylonitrile-butadiene copolymer as in Example 1 and execution The same epoxy group-containing acrylonitrile-butadiene copolymer as in Example 1 (25 parts by weight) was dissolved in toluene (200 parts by weight). Using the obtained solution, a liquid adhesive was obtained in the same manner as in Example 1, except that the amount of the compound represented by the formula (V-1) was changed to 25 parts by weight.

Example 5 25 parts by weight of the same piperazinylethylaminocarbonyl group-containing acrylonitrile-butadiene copolymer as in Example 1, 25 parts by weight of the same epoxy group-containing acrylonitrile-butadiene copolymer as in Example 1 and execution 25 parts by weight of the same butadiene-acrylonitrile copolymer as in Example 1 was dissolved in 200 parts by weight of toluene. Using the obtained solution, a liquid adhesive was obtained in the same manner as in Example 1, except that the amount of the compound represented by the formula (V-1) was changed to 25 parts by weight.

Example 6 25 parts by weight of the same piperazinylethylaminocarbonyl group-containing acrylonitrile-butadiene copolymer as in Example 1, 5 parts by weight of the same carboxyl group-containing acrylonitrile-butadiene copolymer as in Example 1 and execution 45 parts by weight of the same butadiene-acrylonitrile copolymer as in Example 1 was dissolved in 200 parts by weight of toluene. Using the obtained solution, a liquid adhesive was obtained in the same manner as in Example 1, except that the amount of the compound represented by the formula (V-1) was changed to 25 parts by weight.

Example 7 25 parts by weight of the same piperazinylethylaminocarbonyl group-containing acrylonitrile-butadiene copolymer as in Example 1 and 50 parts by weight of the same acrylic group-containing acrylonitrile-butadiene copolymer as in Example 1 were added to toluene. 200
It dissolved in parts by weight. Using the obtained solution, the above formula (V-
A liquid adhesive was obtained in the same manner as in Example 1 except that the amount of the compound represented by 1) was changed to 25 parts by weight.

Example 8 25 parts by weight of the same piperazinylethylaminocarbonyl group-containing acrylonitrile-butadiene copolymer as in Example 1 and 50 parts by weight of the same butadiene-acrylonitrile copolymer as in Example 1 were mixed with 200 parts by weight of toluene. Dissolved in. Using the obtained solution, a liquid adhesive was obtained in the same manner as in Example 1, except that the amount of the compound represented by the formula (V-1) was changed to 25 parts by weight. Example 9 A liquid adhesive in the same manner as in Example 1 except that the compound represented by the above formula (V-1) was used in place of the compound represented by the above formula (V-1). Got Example 10 A liquid adhesive was obtained in the same manner as in Example 2 except that 2-ethyl-4-methylimidazole was used instead of benzoyl peroxide. Example 11 In Example 3, 1,3,5-tris (3,5-di-
0.3 parts by weight of t-butyl-4-hydroxybenzyl-s-triazine-2,4,6- (1H, 3H, 5H) trione was added to tetrakis [methylene (3,5-di-t-butyl-4-hydroxy). Hydrocinnamate)] A liquid adhesive was obtained in the same manner as in Example 3 except that 5 parts by weight of methane (Adeka Stab AO-60, manufactured by Asahi Denka Kogyo Co., Ltd.) was used.

Examples 12 to 23 In Examples 1 to 11, instead of the piperazinylethylaminocarbonyl group-containing acrylonitrile-butadiene copolymer represented by the formula (IV-1), the formula (IV
-2) piperazinylethylaminocarbonyl group-containing acrylonitrile-butadiene copolymer (n = 1
In the same manner as above, except that m = 2.6, k = 0.05, weight average molecular weight 71,000, acrylonitrile content 27% by weight, amino group equivalent 4,000) were used, and liquid adhesion was performed in the same manner. I got an agent.

Example 24 In Example 1, 25 parts by weight of the piperazinylethylaminocarbonyl group-containing acrylonitrile-butadiene copolymer represented by the formula (IV-1) was added to the piperazinyl represented by the formula (IV-2). Ethylaminocarbonyl group-containing acrylonitrile-butadiene copolymer (m = 1 for n = 1
2.6, k = 0.05, weight average molecular weight 71,000,
Acrylonitrile content 27% by weight, amino group equivalent 4,
000) instead of 25 parts by weight, 4 parts by weight of 200 parts by weight of toluene
A liquid adhesive was obtained in the same manner as in Example 1 except that the amount was changed to 00 parts by weight.

Example 25 In Example 1, 25 parts by weight of the piperazinylethylaminocarbonyl group-containing acrylonitrile-butadiene copolymer represented by the formula (IV-1) was added to the piperazinyl represented by the formula (IV-2). Ethylaminocarbonyl group-containing acrylonitrile-butadiene copolymer (m = 1 for n = 1
2.6, k = 0.05, weight average molecular weight 71,000,
Acrylonitrile content 27% by weight, amino group equivalent 4,
000) 25 parts by weight, and 200 parts by weight of toluene were replaced with 400 parts by weight of xylene to obtain a liquid adhesive in the same manner as in Example 1.

Example 26 Carboxyl group-containing acrylonitrile-butadiene copolymer 10 parts by weight similar to Example 1 and acryl group-containing acrylonitrile-butadiene copolymer 2 similar to Example 1
5 parts by weight, 15 parts by weight of the same epoxy group-containing acrylonitrile-butadiene copolymer as in Example 1 and 15 parts by weight of butadiene-acrylonitrile were mixed with 200 parts of toluene.
It dissolved in parts by weight. Using the obtained solution, instead of 35 parts by weight of the compound represented by the formula (V-1) in Example 1, 15 parts by weight of the compound represented by the formula (V-1) and the compound represented by the formula (V-4) were used. A liquid adhesive was obtained in the same manner as in Example 1 except that 20 parts by weight of the compound described above was used.

Example 27 Carboxyl group-containing acrylonitrile-butadiene copolymer 10 parts by weight similar to Example 1, acrylic group-containing acrylonitrile-butadiene copolymer 2 similar to Example 1
5 parts by weight, 15 parts by weight of the same epoxy group-containing acrylonitrile-butadiene copolymer as in Example 1 and 15 parts by weight of butadiene-acrylonitrile were mixed with 200 parts of toluene.
It dissolved in parts by weight. Using the obtained solution, the same operation as in Example 1 was carried out to obtain a liquid adhesive.

Example 28 Carboxyl group-containing acrylonitrile-butadiene copolymer 5 parts by weight similar to Example 1, acrylic group-containing acrylonitrile-butadiene copolymer 25 similar to Example 1
10 parts by weight of the same epoxy group-containing acrylonitrile-butadiene copolymer as in Example 1 and 10 parts by weight of butadiene-acrylonitrile were dissolved in 200 parts by weight of toluene. Using the obtained solution, the above formula (V-
A liquid adhesive was obtained in the same manner as in Example 1 except that the amount of the compound represented by 1) was changed to 60 parts by weight.

Example 29 60 parts by weight of the same acrylonitrile-butadiene copolymer containing an acrylic group as in Example 1 and 15 parts by weight of the same acrylonitrile-butadiene copolymer containing an epoxy group as in Example 1 were added to 200 parts by weight of toluene. Dissolved. Using the obtained solution, a liquid adhesive was obtained in the same manner as in Example 1, except that the amount of the compound represented by the above formula (V-1) was changed to 25 parts by weight.

Example 30 40 parts by weight of the same acrylonitrile-butadiene copolymer containing an acrylic group as in Example 1 and the same acrylonitrile-butadiene copolymer 3 containing an epoxy group as in Example 1
5 parts by weight were dissolved in 200 parts by weight of toluene. Using the obtained solution, a liquid adhesive was obtained in the same manner as in Example 1, except that the amount of the compound represented by the above formula (V-1) was changed to 25 parts by weight.

Example 31 The same epoxy group-containing acrylonitrile-butadiene copolymer as in Example 1 (35 parts by weight) and butadiene-acrylonitrile (40 parts by weight) were dissolved in toluene (200 parts by weight). Using the obtained solution, a liquid adhesive was obtained in the same manner as in Example 1, except that the amount of the compound represented by the above formula (V-1) was changed to 25 parts by weight.

Example 32 The same butadiene-acrylonitrile as in Example 1 (75 parts by weight) was dissolved in toluene (200 parts by weight). Using the obtained solution, the amount of the compound represented by the above formula (V-1) was adjusted to 25
A liquid adhesive was obtained in the same manner as in Example 1 except that the weight part was changed.

Example 33 The same acrylic group-containing acrylonitrile-butadiene copolymer as in Example 1 (75 parts by weight) was dissolved in 200 parts by weight of toluene. Using the obtained solution, a liquid adhesive was obtained in the same manner as in Example 1, except that the amount of the compound represented by the above formula (V-1) was changed to 25 parts by weight.

Comparative Example 1 Epoxy acrylate (R-551, manufactured by Nippon Kayaku Co., Ltd.) 1
1 part by weight of benzoyl peroxide was added to 00 parts by weight to obtain a liquid adhesive. Comparative Example 2 Nylon epoxy adhesive (Toresin FS-410, manufactured by Teikoku Chemical Industry Co., Ltd.) (solid content 20% by weight, solvent: isopropyl alcohol: methyl ethyl ketone = 2: 1) 10
20 parts by weight of spherical alumina having an average particle diameter of 0.25 μm was added and mixed with 0 parts by weight, and dispersed to obtain a liquid adhesive. Comparative Example 3 Solid content 199 of 20% solution of N-methylpyrrolidone in polyimide varnish (Lark TPI, manufactured by Mitsui Toatsu Chemicals, Inc.)
A liquid adhesive was obtained by adding 20 parts by weight of alumina (UA-5105, Showa Denko KK) to parts by weight.

Comparative Example 4 Piperazinylethylaminocarbonyl group-containing acrylonitrile-butadiene copolymer represented by the above formula (IV-1) (Hycar ATBN, manufactured by Ube Industries, Ltd.) (n = 1, n = 5) .1, weight average molecular weight 3,600, acrylonitrile content 16.5% by weight, amino group equivalent 90
0) 65 parts by weight Dissolve in 200 parts by weight of toluene, and in the resulting solution, 35 parts by weight of the compound represented by the formula (V-1), 1 part by weight of benzoyl peroxide, and spherical alumina having an average particle size of 0.25 μm. 20 parts by weight were mixed and dispersed to obtain a liquid adhesive.

(Assembly of Package) The lead frame shown in FIG. 1 was produced by the following procedure. (A) Preparation of lead frame Using an XY robot dispenser, a liquid adhesive is applied to the site shown in FIG. 1 (a) to form an adhesive pattern, and the adhesive is dried and cured under the conditions shown in Table 1. I went.

[0058]

[Table 1]

Then, using the produced lead frame, a package was assembled in the following procedure. The reason why the pressure bonding condition and the curing condition are different at the time of assembling the lead frame is that the characteristics of each adhesive are different. Here, the optimum bonding condition was selected for each adhesive and the adhesive was cured based on it. (B) Die Bonding A semiconductor chip is bonded to a plane portion using a silver paste for die bonding and cured at 150 ° C. for 2 hours. (C) Wire bonding A wire bonder is used to connect the wire pad on the semiconductor chip and the silver-plated portion at the tip of the inner lead with a wire bonder. (D) Molding Transfer molding is performed with an epoxy molding material. (E) Finishing process Finishing the package, including processes such as homing, dam cutting, and outer lead plating.

(Evaluation of Adhesive) 1. Ink suitability The applicability of the liquid adhesive was evaluated by whether or not the shape and the like could be applied well. 2. Application stability The determination as to whether or not the viscosity change of the liquid adhesive during application is large is made by R.M. T. After 6 hours, it was evaluated by whether or not it was possible to dispense well. 3. Oxidation of lead frame Whether or not oxidation of the lead frame surface occurred during application, pressure bonding, or curing of the liquid adhesive was visually evaluated. 4. Adhesive strength It was evaluated whether or not there is sufficient adhesive strength and the variation is small. The 90 ° peel strength was measured at room temperature. 5. W / B property At the time of assembling the package, the wire bondability and adhesive strength on the lead frame during wire bonding of the gold wire were confirmed. 6. Electrical reliability 156 ℃ / 85% RH /
A bias voltage of 5 V was applied under the condition of 4 atm, and the time until short circuit was measured.

[0061]

[Table 2]

As is clear from the results shown in Table 2, in the case of the adhesive paste using the liquid adhesive of the present invention, a semiconductor package can be manufactured well. On the contrary,
In the case of the adhesive of the comparative example, the lead frame is oxidized, the gold wire cannot be wire-bonded, the electrical reliability is not increased, and the viscosity is remarkably increased.
T. After 6 hours, there was a problem that coating could not be performed.

(Application Examples to Other Electronic Components and Comparative Examples) Example 34 The liquid adhesive obtained in Example 1 was used for the purpose of producing a resin dam bar. As the substrate, the lead frame shown in FIG. 8 having no metal dam bar was used, and the pattern was originally applied to the part having the dam bar. In order to remove the solvent of the obtained adhesive pattern to some extent,
Nitrogen heated at 50 ° C. was blown for 30 seconds to perform drying. Use a press with a Teflon coat on the side that contacts the adhesive pattern, and
It was pressed for 0 seconds to embed the adhesive pattern in the gap between the lead pins, and was molded into a shape with no irregularities on the upper surface of the pattern. Further, in order to heat cure the adhesive pattern, the inside of the atmosphere is kept under a nitrogen atmosphere at 250 ° C. for 5 hours.
After heating for a minute, a lead frame with a target resin dam bar was obtained. Example 35 A lead frame with a resin dam bar was obtained by the same operation as in Example 34 except that the liquid adhesive obtained in Example 2 was used and the adhesive and the coating were applied by screen printing.

Comparative Example 5 A resin dam bar was prepared in the same manner as in Example 34, except that the nylon epoxy adhesive obtained in Comparative Example 2 was used and cured by heating in a hot air oven at 150 ° C. for 3 hours. I got the attached lead frame. Comparative Example 6 Conventional lead frame fixing tape (made by Tomagawa Paper Mill, R
-722) and taping the dam bar part,
It was heated and cured in a hot air oven at 150 ° C. for 3 hours to obtain a lead frame with a resin dam bar having a polyimide base film. Comparative Example 7 Using the liquid adhesive obtained in Comparative Example 4, except for the adhesive,
By the same operation as in Example 34, a lead frame with a resin dam bar was obtained.

(Evaluation) Examples 34 and 35 and Comparative Example 5
For ~ 7, each of the lead frames obtained is transfer-molded using an epoxy-based molding resin,
The following items were evaluated. The results are shown in Table 3.

1. Coating stability It was evaluated whether or not the viscosity change of the liquid adhesive during coating was large. R. T. Evaluation was made by whether or not the shape and the like can be satisfactorily applied after / 6 hours. 2. Shape of lead pin after application Evaluation whether there is any change in the lead pin after application. 3. Shape of lead pin after transfer molding Evaluation of lead pin deformation after transfer molding. 4. Extrusion of molding compound from between pins Evaluation of whether extrusion of molding compound from between pins occurs after transfer molding. 5. Extrusion of molding agent from areas other than between pins Evaluation of whether the molding agent extrudes from areas other than between pins after transfer molding 6. Detachment of dam bar Evaluation of whether or not there is detachment of dam bar after transfer molding 7. Shape of dam bar Evaluation of whether the shape of dam bar is good after transfer molding

[0067]

[Table 3]

As shown in Table 3, when a resin dam bar is formed by the dispensing method or the screen printing method using the liquid adhesive of the present invention, another adhesive or a conventional adhesive tape for electronic parts is used. Good characteristics can be obtained as compared with the case where there is.

[0069]

The liquid adhesive of the present invention can be bonded and cured at a relatively low temperature, and has heat resistance, reliability and stable processability. This can be applied to various electronic components by the dispensing method or screen printing method, and can be adhesively cured to form a resin pattern or an insulating layer, so various adhesive tapes and liquid adhesives for conventional electronic components can be used. Can solve problems.

Further, since the liquid adhesive of the present invention is particularly preferably used for bonding between members around the lead frame forming the semiconductor device, it can be used when forming a semiconductor device having a complicated structure. it can. Therefore, it also contributes to cost reduction.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a lead frame.
1A is an overall view, and FIG. 1B is an enlarged view of a main part.

FIG. 2 is a cross-sectional view of an example of a resin-sealed semiconductor device.

FIG. 3 is a cross-sectional view of another example of the resin-sealed semiconductor device.

FIG. 4 is a schematic diagram of a LOC structure.

FIG. 5 is a schematic diagram of a COL structure.

FIG. 6 is an explanatory diagram of a dispensing method.

FIG. 7 is an explanatory diagram of a screen printing method.

FIG. 8 is a schematic view of a part of a lead frame without a dam bar.

9A and 9B are explanatory views of manufacturing a resin dam bar with a liquid adhesive, FIG. 9A is a sectional view immediately after coating, and FIG. 9B is a sectional view after pressing.

[Explanation of symbols]

1 ... Lead pin fixing position, 2 ... Dam bar, 3 ... Lead pin, 4 ... Island portion, 5 ... Lead pin fixing tape, 6
... semiconductor chip, 7 ... bonding wire, 8 ... mold resin, 9 ... insulating adhesive layer, 10 ... heat sink, 11
... Dispenser, 12 ... Liquid adhesive pattern, 13 ...
Lead frame, 14 ... Screen printing plate, 15 ... Liquid adhesive, 16 ... Squeegee.

Claims (5)

[Claims] 1. A weight average molecular weight of 1,000 to 20.
50,000 and carboxyl group equivalent 30 to 10,000
A carboxyl group-containing butadiene-acrylonitrile copolymer represented by the formula (I-1) and / or a carboxyl group-containing butadiene-acrylonitrile copolymer represented by the formula (I-2): (Wherein k ′, m ′ and n ′ are molar ratios,
For n '= 1, m' = 1 to 175, k '= 0.3 to
Represents a number in the range of 93. (B) Acrylic group-containing butadiene-acrylonitrile copolymer represented by formula (II-1) and / or formula (II) having a weight average molecular weight of 1,000 to 200,000 and an acrylic group equivalent of 500 to 10,000. -2) an acrylic group-containing butadiene-acrylonitrile copolymer represented by: (In the formula, k ″, m ″, and n ″ are molar ratios, and
For n ″ = 1, m ″ = 1 to 175, k ″ = 0.3 to
Represents a number in the range of 93. (C) Piperazinylethylaminocarbonyl group-containing butadiene-acrylonitrile copolymer of the following component (e) or carboxyl group-containing butadiene of the above component (a)
Weight average molecular weight of 1,0 obtained by epoxy-modifying the piperazinylethylaminocarbonyl group or carboxyl group at the terminal or molecular chain of the acrylonitrile copolymer
00-200,000 and an epoxy group equivalent of 500-1
An epoxy group-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000, and (d) having the following formula (III) having a weight average molecular weight of 1,000 to 200,000: (Where a and b are molar ratios and represent a number in the range of a = 1 to 175 with respect to b = 1) selected from the group consisting of butadiene-acrylonitrile copolymers. At least one copolymer, and (e) having a weight average molecular weight of 1,000 to 200,000 and an amino group equivalent of 500 to 10,000.
-1) Piperazinylethylaminocarbonyl group-containing butadiene-acrylonitrile copolymer and /
Alternatively, a piperazinylethylaminocarbonyl group-containing butadiene-acrylonitrile copolymer represented by the formula (IV-2): (In the formula, k, m and n are molar ratios, and for n = 1, represent numbers in the range of m = 1 to 175 and k = 0.3 to 93). In a solution prepared by dissolving a copolymer or a copolymer composition in which the proportion of the component (e) is 0 to less than 60% by weight based on the total amount of the components (a) to (e) in an organic solvent, (f) ) The following formulas (V-1) to (V-6): [Chemical 6] The compound containing two or more maleimide groups selected from the compounds represented by the formula (1) is dispersed at a ratio of 10 to 900 parts by weight based on 100 parts by weight of the total amount of the above components (a) to (e). A liquid adhesive for electronic parts, which is characterized in that 2. The organic solvent is 5 to 9 of the total weight of the liquid adhesive.
The liquid adhesive for electronic parts according to claim 1, which is 0%. 3. The liquid adhesive for electronic parts according to claim 1, wherein the filler having a particle diameter of 20 μm or less is contained in an amount of 60% by weight or less of the total solid content. 4. The liquid for electronic parts according to claim 1, wherein a high molecular weight hindered phenol having three or more tert-butylphenol groups in one molecule is contained in an amount of 20% by weight or less based on the total solid content. adhesive. 5. An insulating pattern or an insulating layer is formed by applying the liquid adhesive for electronic parts according to claim 1 to an electronic part by a dispensing method or a screen printing method and then thermally curing the same. Method for forming an insulating adhesive layer in an electronic component.