JPH09232699A - Jumper circuit on single-sided printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a jumper circuit whereby all jumper circuits can be formed en bloc on a single-sided printed circuit board, the length and the shape of the circuit can be set freely, a conductive path to a circuit pattern and jumper circuit can be formed at the same time and the insulation spacing in cross- jumpers can be secured. SOLUTION: A jumper circuit 24 is formed by printing a conductive paste on the opposite side to a circuit pattern face. To form a conductive path to connect the circuit pattern to the circuit 24, through-holes piercing a single-sided printed circuit board 11 are each formed like a polyhedral column at least two sides of which circumscribes a cylindrical through-hole formable into the circuit pattern and conductive paths formed at the through-holes and circuit 24 are formed en bloc as a unit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jumper circuit for connecting circuit patterns on a printed circuit board.

[0002]

2. Description of the Related Art As a jumper circuit in a conventionally used single-sided printed circuit board, a jumper circuit having a structure shown in FIGS. 7 and 8 is generally adopted. That is, FIG. 7 is a schematic perspective view of a single-sided printed circuit board on which the components of the conventional example are mounted,
FIG. 8 is an enlarged sectional view of a jumper pin portion of a conventional example. 7 and 8, reference numeral 71 indicates a single-sided printed circuit board, 72 is a transformer, 73, 74a and 74b are aluminum electrolytic capacitors, 75 is a choke coil, 76 is an X capacitor, 77 is a rectifying diode, 78 is a resistor, 7
9, 79a, 79b, 79c, 79d, 79e, 79
f and 79g are jumper pins, 82a and 82b are circuit patterns, 83a and 83b are through holes formed in the single-sided printed circuit board 71, and 87a and 87b are solders that connect the jumper pins 79 and the circuit patterns 82a and 82b.

In connection with a conventional pin jumper circuit,
Through holes 83a provided at connection positions of circuit patterns 82a and 82b formed on the back surface of the single-sided printed circuit board 71,
The jumper pin 79 is inserted into 83b automatically or manually by an inserter. Next, using an automatic soldering machine (usually a flow tank), jumper pins 79 and circuit pattern 8
2a and 82b are respectively soldered, solders 87a and 87b are formed at the joints, and the conventional jumper circuit for connecting the circuit patterns 82a and 82b is completed. When the automatic soldering device is not used, soldering is performed by hand.

[0004]

The problems to be solved by the invention will be clarified by referring to the problems in the above-mentioned conventional examples.

First, even if the jumper pin is manually inserted,
Even with automatic insertion, there is no choice but to insert one pin at a time, which causes a problem in that the mounting process is costly. In addition, the length of the jumper pin cannot be arbitrarily changed due to the process design, and the shape is limited to a straight shape. Therefore, if one jumper pin is used for connection, the relational position of the connection points of the circuit pattern to be connected is naturally limited. In order to overcome this, it is necessary to provide a relay point and divide one jumper pin into many to form a circuit. In FIG. 7, the jumper pin 79a and the jumper pin 79c are originally circuits that can be connected by one jumper pin, but since the resistance is in the middle, they are connected by two jumper pins by providing a relay point, and the jumper pin 79d , Jumper pin 79e, jumper pin 79f and jumper pin 79g
Is a circuit that can be connected by one jumper pin, but similarly, since the resistance is in the middle, it is connected by four jumper pins by providing three relay points.

In order to solve the above-mentioned problems with a print jumper circuit, there is a method of printing the jumper circuit on the same pattern surface as the circuit pattern. For example, in the case of a power circuit, when a jump jumper is used. May cause a problem in the insulation interval due to safety regulations.

In order to overcome this, it is necessary to provide a jumper circuit on the component side, but in that case, there is a problem that two processes of silver through-hole printing and jumper circuit printing are currently required.

It is an object of the present invention to form all jumper circuits on a single-sided printed circuit board at one time, to freely set the length and shape of the jumper circuit, to simultaneously form a conductive part with a circuit pattern and a jumper circuit, and An object of the present invention is to provide a jumper circuit that can clear the insulation interval in the jumper.

[0009]

A jumper circuit for a single-sided printed circuit board according to the present invention is a jumper circuit for electrically connecting two circuit patterns formed on a circuit pattern surface of a single-sided printed circuit board. A through hole formed by a conductive paste printed on the opposite surface of the circuit pattern surface and formed by penetrating the single-sided printed circuit board to form a conductive portion connecting the circuit pattern and the jumper circuit is formed on the circuit pattern. At least two surfaces are formed in the shape of a polygonal column on the outer periphery of the cylindrical through hole that can be formed, and the conductive portion formed in the through hole and the jumper circuit are integrally formed as a unit.

Further, the inner surface of the through-hole formed in the shape of a polygonal column may have a connection portion connected to each other by a curved surface at the connection portion between the surfaces, which is formed in the shape of a polygonal column. Further, at least one surface of the inner surface of the through hole that does not circumscribe the outer periphery of the cylindrical through hole may be formed in a curved shape.

The cross-sectional shape of the through hole is rectangular,
Three surfaces are circumscribed on the outer periphery of a cylindrical through hole that can be formed in a circuit pattern, and two parallel outer circumscribing surfaces extend into the circuit width of a jumper circuit connected to the through hole to form a through hole. Good.

The conductive paste may be a printed silver paste, may be composed of two layers of a printed copper paste and a solder paste, and the solder paste may be melted by heating after printing and solidified by cooling.

Further, the conductive paste may be a mixed paste of printed copper and solder, and even if the solder component in the paste is melted by heating after printing and combined with the copper component and solidified by cooling. Good.

Further, the conductive paste may be a mixture paste of silver and solder printed, and the solder component in the paste may be melted by heating after printing, combined with the silver component, and solidified by cooling. Good.

In the jumper circuit of the present invention, since the jumper circuit is formed on the component surface side opposite to the circuit pattern surface, the problem of insulation distance in the cross jumper does not occur.

The through hole for electrically connecting the jumper circuit and the circuit pattern is not a conventional cylindrical through hole, but is formed in a polygonal columnar shape having at least two surfaces circumscribing the outer periphery of the cylindrical through hole. By providing a circumscribing surface in the longitudinal direction of the jumper circuit and extending that surface within the jumper circuit profile, it is possible to increase the cross-sectional area of the through hole without increasing the circuit width or the space on the board surface. .

Since the through hole has a large cross-sectional area, it is not necessary to separately form the through hole and print the circuit, and the conductive portion can be integrally formed integrally with the jumper circuit in the step of printing the conductive paste.

A connecting portion connected by a curved surface is provided at a connecting portion between the inner surfaces of the through holes, or at least one surface of the inner surface of the through hole which does not circumscribe the outer periphery of the conventional cylindrical through hole. Since the conductive paste is formed into a curved surface, it becomes easier to fill the through holes with the conductive paste.

Since the jumper circuit is formed by printing the conductive paste, the two circuit patterns can be directly connected with almost no restrictions on the circuit length and pattern shape. Further, unlike the jumper pin, it is not necessary to insert one by one, and a plurality of circuits can be formed at once.

If silver paste is used as the conductive paste, the circuit can be formed by only one printing step.

When the conductive paste is composed of two layers of copper paste and solder paste, two printing steps are required, but the cost of the material can be reduced as compared with silver. Further, copper and solder have higher migration resistance than silver, and therefore reliability is improved. Further, by adding a heating step, the solder is melted and the electrical performance is improved by changing the conduction from the mechanical contact to the conduction by the metal fusion.

When the conductive paste is a mixture paste of copper or silver and solder, the printing step is performed once, and the heating step is further added to melt the solder component so that the solder component can be combined with the metal component. The electrical performance is improved by changing from conduction by contact to conduction by metal fusion. In this case, the conductive portion is also fused to the circuit pattern.

[0023]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic perspective view of a single-sided printed circuit board on which components according to an embodiment of the present invention are mounted, FIG. 2 is a schematic plan view of a jumper circuit portion of the single-sided printed circuit board of FIG. 1, and FIG. FIG. 3 is an enlarged plan view of the vicinity of a connecting portion between the jumper circuit and the circuit pattern of FIG. 2. 1 to 3, a reference numeral 11 indicates a single-sided printed circuit board, 12 is a transformer, 13, 14a and 14b are aluminum electrolytic capacitors, 15 is a choke coil, 16 is an X capacitor, 17 is a rectifying diode, 18 is a resistor, Reference numeral 23 is a through hole formed for conduction to a circuit pattern on the opposite surface of the jumper circuit 26 of the single-sided printed circuit board 11, 24
Reference numerals a, 24b, and 24c are jumper circuits based on the print pattern, which is a feature of the present invention, and 29 is a conventional through hole displayed for comparison. In this embodiment, for comparison, the configuration is the same as the conventional example except for the jumper circuit.

Through holes 23 for conduction are punched at the connection positions with the respective jumper circuits of the circuit pattern requiring the connection of the single-sided printed circuit board 11. The through hole 23 has a circular shape as shown by reference numeral 29 in the conventional through hole, but in the present embodiment, three sides circumscribe the outer periphery of the conventional circular hole 29 for conduction, One side is a rectangular hole that is separated outward in the longitudinal direction of the jumper circuit 24c. This is because the cross-sectional area of the hole is made larger than that of the conventional hole 29 in order to improve the filling property of the paste into the conductive portion formed by printing inside the through hole 29.
Even a square whose sides are circumscribed has a larger cross-sectional area than a circle, and may be a polygon other than a rectangle, or may be a complex shape with a curve in which the corners of the polygon are arcs inscribed on both sides.
Further, the side that does not circumscribe the conventional circular hole 29 may be a curved line. When the curves are combined, the filling property of the paste at the corners of the holes is improved, and the paste is supplied to the through holes 23 in a better state.

In the next step of printing the conductive paste on the component surface side of the one-sided printed circuit board 11 opposite to the circuit pattern surface, the jumper circuit 24 is formed, the through holes 23 are filled, and the circuit pattern is connected. And are done at the same time.

Since the jumper circuit is formed by printing, the length and route of the circuit can be freely set. Therefore, the one jumper circuit 24c shown in FIG. 1 has four jumper pins 79d, 79e shown in FIG. It fulfills the same function as 79f and 79g and eliminates the need for relay connection points which were required in three places. As a result, the space for the through hole at the relay connection point and the labor required for making can be saved, and this is also desirable from the viewpoint of electrical performance.

FIG. 4 is a schematic enlarged cross-sectional view of the vicinity of the through hole showing a jumper circuit forming process using the silver paste according to the first embodiment. FIG. 4A is a through hole 43a, 43b.
Is punched, (b) is a state in which the mask 45 for printing jumper circuit and the receiving jig 46 are mounted on the single-sided printed circuit board 41, (c) is a jumper circuit 44 portion, a through hole 43 portion and a through hole 43. The silver paste 47 is printed on the connection portion of the circuit pattern 42, and (d) shows the state in which the mask 45 and the receiving jig 46 are removed. In the figure, 41 is a single-sided printed circuit board, 42a and 42b are circuit patterns formed on the back surface of the single-sided printed circuit board 41 connected by a jumper circuit 44, and 43a and 43b are provided on circuit patterns 42a and 42b connected by the jumper circuit 44. The through holes, 44 is a jumper circuit, 45 is a jumper circuit printing mask, 46 is a jumper circuit printing receiving jig, and 47 is a silver paste.

In this jumper circuit forming step, the through hole 4
A jumper circuit printing mask 45 and a receiving jig 46 are attached to a single-sided printed circuit board 41 on which 3a and 43b are perforated, and a jumper circuit 44 portion, a through hole 43 portion, and a connecting portion between the through hole 43 and the circuit pattern 42 are formed. Silver paste 47 on
Print and let it solidify naturally. Since the cross-sectional shape of the through-holes 43a and 43b is configured to have a large cross-sectional area as described above, the filling property of the silver paste 47 is improved, and the jumper circuit 44 is formed and the through-hole 43 is formed in one printing step. The filling and the connection with the circuit pattern 42 are performed at the same time, and the circuit patterns 42a and 4 by the jumper circuit 44 are formed by natural solidification.
The connection of 2b is completed.

As described above, when the silver paste is used, the printing is performed only once and the ink is naturally solidified, so that a heating step is not necessary and a simple process can be performed.

FIG. 5 is a schematic enlarged cross-sectional view in the vicinity of the through hole showing a jumper circuit forming step in which the conductive paste according to the second embodiment is composed of two kinds of pastes, copper paste and solder paste. And (a) is a through hole 5
3a and 53b are punched, (b) is a state in which a mask 55 for printing copper paste and a receiving jig 56 for jumper circuit printing are mounted on the single-sided printed circuit board 51, (c) is a jumper circuit 54 portion, through hole A state in which the copper paste 57 is printed on the portion 53 and the through hole 53 and the connection portion of the circuit pattern 52, (d) is a state in which the mask 55 and the receiving jig 56 are removed, and (e) is a solder paste printing mask 58. Is attached to the jumper circuit 54 side of the single-sided printed circuit board 51, (f) is a state where the solder paste 59 is printed through the solder paste printing mask 58, (g) is a state where the solder paste printing mask 58 is removed, (H) shows the state of the jumper circuit 54 after the heating process.
In the figure, 51 is a single-sided printed circuit board, 52a and 52b are circuit patterns formed on the back surface of the single-sided printed circuit board 51 connected by a jumper circuit 54, and 53a and 53b are provided on circuit patterns 52a and 52b connected by the jumper circuit 54. Through hole 54, jumper circuit 54, copper paste printing mask 55, jumper circuit printing receiving jig 57, copper paste, solder paste printing mask 58, solder paste 59, and 59a by heating. It is a solder layer that is melted and then solidified into an aggregated state.

In this jumper circuit forming step, first of all,
In the same process as in the above embodiment, the formation of the jumper circuit 54 with the copper paste 57, the filling of the through hole 53, and the connection with the circuit pattern 52 are simultaneously performed. Through holes 53a, 5
Since the cross-sectional shape of 3b is formed with a large cross-sectional area as described above, the filling property of the copper paste 57 is improved, and the bonding with the circuit pattern on the facing surface is completed in one printing step.

Next, in a second step, the solder paste printing mask 58 is used for the jumper circuit 5 of the single-sided printed circuit board 51.
The solder paste 59 is printed on the copper paste of the jumper circuit 54 through the solder paste printing mask 58.

After removing the solder paste printing mask 58, the solder paste is melted through a heating process and then solidified to form a solder layer in an agglomerated state, and the connection of the circuit patterns 52a and 52b by the jumper circuit 54 is completed. To do.

Although the structure and process are more complicated than those of the first embodiment, the cost of the material is low because the conductive paste component is replaced by a low cost material such as silver and copper and solder. Can be lowered. Further, a great advantage of the second embodiment is that the solder can be melted by applying heat in the heating process after printing the copper paste and the solder paste to form the aggregation layer.
At this time, by forming the paste so that the solder and the copper are in contact with each other in the boundary layer, the resistance value can be remarkably reduced as compared with the case where only the conductor paste is used, which is very effective for improving the electric performance. Further, since the jumper circuit can be formed by the aggregation layer, the copper filling rate of the copper paste can be reduced and the supplyability of the copper paste to the through holes can be improved, which is also effective in improving the productivity.

FIG. 6 is a schematic view of the vicinity of the through hole showing a jumper circuit forming step in which the conductive paste of the third embodiment is composed of a mixture of two kinds of metals of copper and solder or silver and solder. It is an expanded sectional view, (a) is a through-hole 63.
a, 63b are perforated, (b) is a state in which a paste printing mask 65 and a jumper circuit printing receiving jig 66 are mounted on the single-sided printed circuit board 61, (c) is a jumper circuit 64 portion, through hole 63 A state in which the mixed paste 67 is printed on the portion and the connection portion between the through hole 63 and the circuit pattern 62, (d) shows a state in which the mask 65 and the receiving jig 66 are removed, and (e) shows that heat is applied in the heating step. It shows a state in which the solder is melted and copper or silver and the solder are metal-bonded. In the figure, 61 is a single-sided printed circuit board, 62a and 62b are circuit patterns formed on the back surface of the single-sided printed circuit board 61 connected by a jumper circuit 64, and 63a and 63b are provided on circuit patterns 62a and 62b connected by the jumper circuit 64. Through hole, 64 is a jumper circuit, 65 is a mask for printing paste, 66 is a receiving jig for printing jumper circuit, 6
Reference numeral 7 is a mixed paste composed of a two-metal mixture of copper and solder or silver and solder, 67a is copper or silver that constitutes the mixed paste 67, and 67b is solder that constitutes the mixed paste 67.

In this jumper circuit forming step, first of all,
In the same steps as those of the embodiment, the formation of the jumper circuit 64 with the mixed paste 67, the filling of the through holes 63, and the connection with the circuit pattern 62 are simultaneously performed. Through hole 63a,
Since the cross-sectional shape of 63b is configured to have a large cross-section as described above, the filling property of the mixed paste 67 is improved, and the combination with the circuit pattern on the opposite surface is completed in one printing step.

Next, in a second step, after the paste printing mask 65 and the receiving jig 66 are removed, the solder 67b in the mixed paste 67 is melted through a heating step, and copper or silver 67a in the mixed paste 67 is removed. Metal bond. Then, it is solidified and the connection of the circuit patterns 62a and 62b by the jumper circuit 64 is completed.

At this time, the solder 67b and the copper or silver 67a
The composition is such that the solder wets the copper or silver at the time of melting, and the density of the copper or silver is set so that the solder is not separated by the surface tension.

According to such a structure and process, since there is only one kind of paste, the printing process is one process, and if the constituent metals of the paste are copper and solder, the material cost can be further reduced. Further, a feature of this embodiment is that the solder is melted by applying heat in a heating process after printing and metal bond with copper or silver, so that contact conduction is lost as in the second embodiment, so that electrical performance is improved. Is improved. Furthermore, since the connection between the through hole and the circuit pattern is also in a metal-bonded state, the electrical characteristics are improved as compared with the second embodiment.

[0040]

As described above, according to the present invention, the conductive portion of the through hole and the jumper circuit can be formed at the same time through the through hole having a large cross-sectional area without using the jumper pin. is there. 1. Since the jumper circuit can be formed on the surface opposite to the circuit pattern surface, the insulation distance is not restricted. 2. Since the shape of the through hole is devised, the cross-sectional area of the through hole can be made large without expanding the circuit width or the space on the substrate surface, which can improve the filling property of the conductive paste and make the jumper The circuit and the conductive part of the through hole can be printed at the same time. 3. Even if there is an obstacle in the middle of the connection point, it is not necessary to provide a relay connection point like a jumper pin, and a jumper circuit can be formed at one time, which improves productivity. 4. Regarding the length and shape of the jumper circuit, there is no restriction on the length and linearity that the jumper pin has, and a free length and jumper pattern shape can be formed, which is advantageous in terms of design and manufacturing. 5. Since all the jumper circuits on the single-sided printed circuit board and the conductive portions of the through holes can be formed by printing once, the number of steps can be reduced and the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a mounted single-sided printed circuit board according to an embodiment of the present invention.

FIG. 2 is a schematic plan view of a jumper circuit portion of the single-sided printed circuit board shown in FIG.

FIG. 3 is an enlarged plan view of the vicinity of the connection between the jumper circuit and the circuit pattern of FIG.

FIG. 4 is a schematic enlarged cross-sectional view in the vicinity of a through hole showing a jumper circuit forming step using the silver paste according to the first embodiment. (A) shows a state in which the through holes 43a and 43b are punched. (B) is a mask 45 for printing jumper circuits
A state in which the receiving jig 46 and the receiving jig 46 are mounted on the single-sided printed circuit board 41 is shown. (C) shows a state in which the silver paste 47 is printed on the jumper circuit 44 portion, the through hole 43 portion, and the connection portion of the through hole 43 and the circuit pattern 42. (D) shows a state in which the mask 45 and the receiving jig 46 are removed.

FIG. 5 is a schematic enlarged cross-sectional view in the vicinity of a through hole showing a jumper circuit forming step using the silver paste according to the second embodiment. (A) shows a state in which the through holes 53a and 53b are punched. (B) shows a mask 55 for printing copper paste and a receiving jig 56 for jumper circuit printing on the single-sided printed circuit board 5.
1 shows the state of being attached. (C) is a jumper circuit 54 portion, a through hole 53 portion, and the through hole 53 and the circuit pattern 5
2 shows a state in which the copper paste 57 is printed on the second connecting portion. (D) shows a state in which the mask 55 and the receiving jig 56 are removed. (E) shows a state in which the solder paste printing mask 58 is mounted on the jumper circuit 54 side of the single-sided printed circuit board 51. (F) is a solder paste printing mask 58
The state where the solder paste 59 is printed is shown.
(G) shows a state in which the solder paste printing mask 58 is removed. (H) shows the state of the jumper circuit 54 after the heating process.

FIG. 6 is a schematic enlarged cross-sectional view in the vicinity of a through hole showing a jumper circuit forming process using a silver paste according to a third embodiment. (A) shows the state where the through holes 63a and 63b are perforated. (B) shows a one-sided printed circuit board 61 with a paste printing mask 65 and a jumper circuit printing receiving jig 66.
Shows a state where the camera is mounted on the camera. (C) is a jumper circuit 64 portion, a through hole 63 portion, a through hole 63 and the circuit pattern 6
2 shows a state in which the mixed paste 67 is printed on the connection portion with 2. (D) shows a state in which the mask 65 and the receiving jig 66 are removed. (E) shows a state where copper or silver and solder are metal-bonded by applying heat in a heating step to melt the solder.

FIG. 7 is a schematic perspective view of a mounted single-sided printed circuit board of a conventional example.

FIG. 8 is an enlarged cross-sectional view of a jumper pin portion of a conventional example.

[Explanation of symbols]

11, 41, 51, 61, 71 Single-sided printed circuit board 12, 72 Transformer 13, 14a, 14b, 73, 74a, 74b Aluminum electrolytic capacitor 15, 75 Choke coil 16, 76 X capacitor 17, 77 Rectifying diode 18, 78 Resistance 23 , 43a, 43b, 53a, 53b, 63a, 63
b, 83a, 83b through hole 24a, 24b, 24c, 44, 54, 64 jumper circuit 29 conventional hole 42a, 42b, 52a, 52b, 62a, 62b, 8
2a, 82b Circuit pattern 45 Jumper circuit printing mask 46, 56, 66 Jumper circuit printing receiving jig 47 Silver paste 55 Copper paste printing mask 57 Copper paste 58 Solder paste printing mask 59 Solder paste 59a Solder layer 65 Paste printing Mask 67 mixed paste 67a copper or silver 67b solder 79, 79a, 79b, 79c, 79d, 79e, 79
f, 79g Jumper pin 87a, 87b Solder

Claims (11)

[Claims] 1. A jumper circuit for electrically connecting two circuit patterns formed on a circuit pattern surface of a single-sided printed circuit board, wherein the jumper circuit is a conductive paste printed on a surface opposite to the circuit pattern surface. A through hole formed by penetrating the single-sided printed circuit board to form a conductive portion that connects the circuit pattern and the jumper circuit to each other. A jumper circuit for a single-sided printed circuit board, wherein at least two surfaces are formed into a polygonal columnar shape circumscribing, and the conductive portion formed in the through hole and the jumper circuit are integrally formed as a unit. 2. The jumper circuit for a single-sided printed circuit board according to claim 1, wherein a connecting portion that is connected by a curved surface is formed on the connecting portion between the inner surface of the through hole formed in the shape of a polygonal column and the surface. A jumper circuit for a single-sided printed circuit board having. 3. The jumper circuit for a single-sided printed circuit board according to claim 1 or 2, wherein at least one of the inner surfaces of the through holes formed in the shape of a polygonal column does not circumscribe the outer circumference of the cylindrical through hole. A jumper circuit for a single-sided printed circuit board, the surface of which is formed into a curved surface. 4. The jumper circuit for a single-sided printed circuit board according to claim 1, wherein the through hole has a rectangular cross-section, and a cylindrical through hole that can be formed in the circuit pattern. A single-sided printed circuit board having three surfaces circumscribing the outer periphery of the same and two surfaces circumscribing in parallel extend into the circuit width of the jumper circuit connected to the through hole to form the through hole. Jumper circuit. 5. The jumper circuit for a single-sided printed circuit board according to claim 1, wherein the conductive paste is a printed silver paste. Jumper circuit. 6. The jumper circuit for a single-sided printed circuit board according to claim 1, wherein the conductive paste comprises two layers of printed copper paste and solder paste. Characteristic single-sided printed circuit board jumper circuit. 7. The jumper circuit for a single-sided printed circuit board according to claim 6, wherein the solder paste is melted by heating after printing and solidified by cooling. 8. The jumper circuit for a single-sided printed circuit board according to claim 1, wherein the conductive paste is a mixed paste of printed copper and solder. A jumper circuit for a single-sided printed circuit board. 9. The jumper circuit for a single-sided printed circuit board according to claim 8, wherein the solder component in the paste is melted by heating after printing, combined with a copper component, and solidified by cooling. Printed circuit board jumper circuit. 10. The jumper circuit for a single-sided printed circuit board according to claim 1, wherein the conductive paste is a mixture paste of printed silver and solder. A jumper circuit for a single-sided printed circuit board. 11. The jumper circuit for a single-sided printed circuit board according to claim 10, wherein the solder component in the paste is melted by heating after printing, combined with a silver component, and solidified by cooling. Printed circuit board jumper circuit.