JPH09215920A - Method for treating halogen compound - Google Patents
Method for treating halogen compoundInfo
- Publication number
- JPH09215920A JPH09215920A JP4828396A JP4828396A JPH09215920A JP H09215920 A JPH09215920 A JP H09215920A JP 4828396 A JP4828396 A JP 4828396A JP 4828396 A JP4828396 A JP 4828396A JP H09215920 A JPH09215920 A JP H09215920A
- Authority
- JP
- Japan
- Prior art keywords
- halogen compound
- alkali metal
- reaction
- concentration
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明はポリ塩化ビフェニル
(以下PCBと略記する)類等のハロゲン化合物をアル
カリ金属分散体により、脱ハロゲン分解させて処理する
方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of dehalogenating and decomposing halogen compounds such as polychlorinated biphenyls (hereinafter abbreviated as PCB) with an alkali metal dispersion.
【0002】[0002]
【従来の技術】有機溶媒中でハロゲン化合物をアルカリ
金属分散体により脱ハロゲン分解させるにあたって、反
応条件によっては、高分子副反応生成物が生成し易くな
り、反応後の処理が煩雑となったり、又高分子副反応生
成物の脱ハロゲン反応が遅い為一度生成してしまうと反
応完結に時間がかかる等の問題があった。ハロゲン化合
物をアルカリ金属分散体で脱ハロゲン分解する方法は特
開昭49−82570等に記載されているが、実施例に
よれば反応は100℃以上の温度で行われており、この
様な条件では高分子副反応生成物が生成し、後処理は手
間のかかるものであった。2. Description of the Related Art When dehalogenating a halogen compound in an organic solvent with an alkali metal dispersion, a side reaction product of a polymer is likely to be produced depending on the reaction conditions, and the post-reaction treatment becomes complicated. Further, since the dehalogenation reaction of the side reaction product of the polymer is slow, there is a problem that once it is generated, it takes time to complete the reaction. A method of dehalogenating and decomposing a halogen compound with an alkali metal dispersion is described in JP-A-49-82570 and the like, but according to the examples, the reaction is carried out at a temperature of 100 ° C. or higher. However, a high-molecular side reaction product was produced, and the post-treatment was troublesome.
【0003】[0003]
【発明が解決しようとする課題】本発明は高分子副反応
生成物の生成を抑えて、速やかに、効率的にかつほぼ完
全に、ハロゲン化合物をアルカリ金属分散体により脱ハ
ロゲン分解することを目的とする。The object of the present invention is to dehalogenate a halogen compound with an alkali metal dispersion quickly, efficiently and almost completely by suppressing the formation of a polymer side reaction product. And
【0004】[0004]
【課題を解決するための手段】本発明者等は有機溶媒中
でハロゲン化合物とアルカリ金属分散体を反応させる際
に、10℃以上70℃以下の低温で、反応液中のハロゲ
ン化合物濃度が1%以下の低濃度で反応を行うことによ
り、高分子副反応生成物の生成を抑え、ほぼ完全に脱ハ
ロゲン分解出来ることを見出した。Means for Solving the Problems When the halogen compound and the alkali metal dispersion are reacted in an organic solvent at a low temperature of 10 ° C. or higher and 70 ° C. or lower, the inventors of the present invention have a halogen compound concentration of 1 It was found that by carrying out the reaction at a low concentration of not more than 100%, the production of side reaction products of the polymer can be suppressed and the dehalogenation decomposition can be carried out almost completely.
【0005】[0005]
【発明の実施の形態】本発明は有機溶媒中で10℃以上
70℃以下の温度、反応液中のハロゲン化合物濃度1%
以下の条件でハロゲン化合物とアルカリ金属分散体とを
反応させることで達成されるが、必要であれば活性水素
化合物を添加することにより反応速度が速くなる為さら
に効果を高めることができる。活性水素化合物は有機溶
媒に均一に混じる必要はなく、後処理に影響の少ない
水、メタノ−ルのようなものが適している。ハロゲン化
合物、アルカリ金属分散体及び活性水素化合物の添加順
序は特に限定されず、そのうちの1ないし幾つかを最後
に滴下して加えることも可能である。BEST MODE FOR CARRYING OUT THE INVENTION The present invention is carried out in an organic solvent at a temperature of 10 ° C. or higher and 70 ° C. or lower at a halogen compound concentration of 1% in the reaction solution.
This can be achieved by reacting a halogen compound with an alkali metal dispersion under the following conditions, but if necessary, an active hydrogen compound may be added to increase the reaction rate, so that the effect can be further enhanced. The active hydrogen compound does not need to be uniformly mixed with the organic solvent, and water, methanol, etc., which have little influence on the post-treatment, are suitable. The order of adding the halogen compound, the alkali metal dispersion, and the active hydrogen compound is not particularly limited, and one or some of them may be added dropwise at the end.
【0006】アルカリ金属分散体の添加量はハロゲン化
合物に対して理論量の1〜50倍、好ましくは1.05
〜20倍量が用いられる。又活性水素化合物の添加量は
アルカリ金属分散体に対し2.0倍モル以下、好ましく
は0.1〜1.5倍モルが用いられる。The addition amount of the alkali metal dispersion is 1 to 50 times the theoretical amount with respect to the halogen compound, preferably 1.05.
~ 20 times the amount used. The amount of the active hydrogen compound added is 2.0 times or less, preferably 0.1 to 1.5 times the mol of the alkali metal dispersion.
【0007】又反応時間は反応が完結する任意の時間を
選択出来るが、0.5〜3時間が好ましい。ただしハロ
ゲン化合物濃度が高い時は反応液中のハロゲン化合物濃
度が1%以下になるようハロゲン化合物を滴下する必要
がある為、必要に応じて反応時間を長くとるのが好まし
い。The reaction time may be any time at which the reaction is completed, but is preferably 0.5 to 3 hours. However, when the concentration of the halogen compound is high, it is necessary to add the halogen compound so that the concentration of the halogen compound in the reaction solution becomes 1% or less. Therefore, it is preferable to extend the reaction time if necessary.
【0008】有機溶媒としては灯油、トランスオイル、
ベンゼン、トルエン、キシレンのような脂肪族、芳香族
炭化水素等が用いられる。本発明は安全の為にアルゴ
ン、窒素等の不活性ガスの雰囲気下で操作することが好
ましい。As the organic solvent, kerosene, transformer oil,
Aliphatic or aromatic hydrocarbons such as benzene, toluene and xylene are used. For safety, the present invention is preferably operated under an atmosphere of an inert gas such as argon or nitrogen.
【0009】アルカリ金属分散体としてはナトリウム、
カリウム、リチウム、ルビジウム、セシウム又はこれら
の合金を灯油、トランスオイル、ベンゼン、トルエン、
キシレンのような脂肪族、芳香族炭化水素等の不活性有
機溶媒中に分散させたものが用いられるが、その際の溶
媒としては前述のハロゲン化合物の分解反応に用いるも
のと同一でも良いし又異なっていても良い。又事前にス
テアリン酸アルミ等の分散剤、凝集防止剤を加えても良
く、溶媒として高粘度溶媒の様なアルカリ金属分散体を
安定化させるものを用いる場合には、分散剤、凝集防止
剤を加えなくとも良い。Sodium as the alkali metal dispersion,
Potassium, lithium, rubidium, cesium or their alloys with kerosene, trans oil, benzene, toluene,
A solvent dispersed in an inert organic solvent such as an aliphatic or aromatic hydrocarbon such as xylene is used, and the solvent at that time may be the same as that used in the decomposition reaction of the halogen compound described above, or It can be different. Further, a dispersant such as aluminum stearate and an anti-aggregation agent may be added in advance. When a solvent that stabilizes an alkali metal dispersion such as a high viscosity solvent is used as the solvent, the dispersant and the anti-aggregation agent are No need to add.
【0010】アルカリ金属分散体中のアルカリ金属濃度
は任意の濃度のものが使用可能であるが、5〜50%程
度のものが好ましい。The alkali metal concentration in the alkali metal dispersion may be any concentration, but is preferably about 5 to 50%.
【0011】反応後は大量のメタノ−ル、水又はハロゲ
ン化アルカリ金属水溶液を添加、又はその中に反応液を
添加することにより、アルカリ金属分散体を分解し、そ
の後に中和、分液等必要な後処理をして処理を完了す
る。After the reaction, a large amount of methanol, water or an aqueous solution of alkali metal halide is added or the reaction solution is added therein to decompose the alkali metal dispersion, and then neutralize or separate liquids. The necessary post-processing is performed to complete the processing.
【0012】反応条件が不適当な場合には、大量の不溶
性高分子副反応生成物が生成し、分液を困難にし又その
除去の為ろ過を行う場合でも相当の困難をともなう。高
分子副反応生成物中のハロゲンが抜けにくい為、ほぼ完
全に脱ハロゲン分解しようとすればさらに長時間の反応
を要する。本発明の反応条件である、低温でハロゲン化
合物濃度が低濃度のときは、高分子副反応生成物はほと
んど生成しないため容易に脱ハロゲン反応が完了する。
高分子副反応生成物は、GPCカラムによるHLC分析
等で確認できる。When the reaction conditions are inappropriate, a large amount of insoluble polymer side reaction product is produced, which makes liquid separation difficult and also involves considerable difficulty in performing filtration for removal thereof. Since halogen in the polymer side reaction product is hard to escape, if a nearly complete dehalogenation decomposition is required, a longer reaction time is required. When the halogen compound concentration is low at a low temperature, which is the reaction condition of the present invention, the dehalogenation reaction is easily completed because polymer side reaction products are scarcely produced.
The polymer side reaction product can be confirmed by HLC analysis using a GPC column.
【0013】[0013]
実施例1 温度計、撹拌器を付けた200ml3っ口フラスコに、
核置換塩素数が平均3個であるPCB(鐘淵化学工業株
式会社製、商品名カネクロ−ル300)(以下KC−3
00と略記する)0.02gをデカリン50mlに溶か
した400ppmKC−300デカリン溶液50mlを
仕込み、撹拌下アルゴンガスをながし、反応容器内が十
分アルゴンガスで置換された後、分散剤としてステアリ
ン酸アルミをナトリウムに対し1%添加してデカリン溶
媒でつくった平均粒子径10μmの40wt%ナトリウ
ム分散体(以下SDと略記する)0.6gを添加し、5
0℃で1時間反応させた。 反応後50℃以下に冷却し
た後、さらに冷却しながら水10mlを滴下し、残存し
ているSDを分解した。その後水50mlを添加した後
濾過した。濾過不溶物はほとんどなかった。濾過母液は
分液し、有機層はさらに水50mlで2回洗浄し分液し
た。水層を集めそのうちの一部を希硝酸で中和し、硝酸
銀滴定で塩素イオンを分析したところ、回収率はほぼ1
00%であった。又有機層のうち1mlをとりヘキサン
溶媒でシリカゲルカラムクロマト処理後、1ppmのP
CBが検出できる条件でECD検出器付ガスクロマトで
分析したがPCBは検出されなかった。Example 1 In a 200 ml three-necked flask equipped with a thermometer and a stirrer,
PCB with an average of 3 nuclear substitution chlorine (Kanebuchi Chemical Co., Ltd., trade name Kanechlor 300) (hereinafter KC-3
(Abbreviated as 00) 0.02 g was dissolved in 50 ml of decalin and charged with 50 ml of a 400 ppm KC-300 decalin solution, and argon gas was swirled under stirring. 0.6 g of a 40 wt% sodium dispersion (hereinafter abbreviated as SD) having an average particle diameter of 10 μm, which was prepared by adding 1% to sodium and using a decalin solvent, was added, and
The reaction was performed at 0 ° C. for 1 hour. After the reaction, the mixture was cooled to 50 ° C. or lower, and then 10 ml of water was added dropwise while further cooling to decompose the remaining SD. After that, 50 ml of water was added and then filtered. There was almost no insoluble matter by filtration. The filtered mother liquor was separated, and the organic layer was further washed twice with 50 ml of water and separated. The water layer was collected, a part of it was neutralized with dilute nitric acid, and the chloride ion was analyzed by silver nitrate titration.
00%. After taking 1 ml of the organic layer and subjecting it to silica gel column chromatography with a hexane solvent, 1 ppm of P was added.
Analysis by gas chromatography with an ECD detector under conditions where CB could be detected, but PCB was not detected.
【0014】実施例2 実施例1と同様の方法で400ppmKC−400トラ
ンスオイル溶液50ml、水0.05gを仕込み、50
℃で分散剤を入れずにトランスオイル中でつくった10
%SD2.6gを加え、50℃、1時間反応させた。実
施例1と同様に後処理したが、実施例1と同様濾過不溶
物はほとんどなく、水層中の塩素イオン回収率はほぼ1
00%で、有機層中にPCBは検出されなかった。Example 2 In the same manner as in Example 1, 50 ml of 400 ppm KC-400 transformer oil solution and 0.05 g of water were charged, and 50
Made in transformer oil without dispersant at ℃ 10
% SD2.6g was added and it was made to react at 50 degreeC for 1 hour. The post-treatment was carried out in the same manner as in Example 1, but as in Example 1, there was almost no filtration insoluble matter, and the chlorine ion recovery rate in the aqueous layer was almost 1.
At 00%, no PCB was detected in the organic layer.
【0015】参考例1 実施例1と同様の方法で、20000ppmKC−30
0デカリン溶液50mlを仕込み、100℃で、実施例
1と同様にしてつくった40wt%SD50.1gを添
加し、100〜120℃で1時間反応させた。 反応後
50℃以下に冷却した後、さらに冷却しながらメタノ−
ル60mlを滴下し、残存しているSDを分解した。そ
の後水100mlを添加した後濾過乾燥し0.36gの
ステアリン酸アルミを含む高分子化合物を得た。濾過母
液は分液し、有機層はさらに水50mlで2回洗浄し分
液した。水層の塩素イオンを分析したところ、回収率は
79.4%であった。有機層中にPCBは検出されなか
った。又有機層中の高分子化合物を Shodex GPC KF-802
カラム(Eluent THF)を用いたHLC分析で分析したと
ころ、多量の高分子化合物の存在を示した。Reference Example 1 By the same method as in Example 1, 20000 ppm KC-30
50 ml of 0 decalin solution was charged, 50.1 g of 40 wt% SD prepared in the same manner as in Example 1 was added at 100 ° C., and the mixture was reacted at 100 to 120 ° C. for 1 hour. After the reaction, the temperature was cooled to 50 ° C or lower, and then, while further cooling, methanol was added.
60 ml was added dropwise to decompose the remaining SD. Then, 100 ml of water was added and the mixture was filtered and dried to obtain 0.36 g of a polymer compound containing aluminum stearate. The filtered mother liquor was separated, and the organic layer was further washed twice with 50 ml of water and separated. When the chlorine ion of the water layer was analyzed, the recovery rate was 79.4%. No PCB was detected in the organic layer. In addition, the polymer compound in the organic layer was used as Shodex GPC KF-802.
Analysis by HLC analysis using a column (Eluent THF) showed the presence of large amounts of polymeric compounds.
【0016】参考例2 参考例1と同様の反応において、反応温度を室温1時
間、100〜120℃1時間とした。参考例1と同様の
後処理を行い、濾過乾燥物0.27gを得た。塩素イオ
ン回収率は91.9%で、有機層中にPCBは検出され
ず、有機層中に高分子化合物が少量存在するのが確認さ
れた。Reference Example 2 In the same reaction as in Reference Example 1, the reaction temperature was room temperature for 1 hour and 100 to 120 ° C. for 1 hour. The same post-treatment as in Reference Example 1 was performed to obtain 0.27 g of a dried filter product. The chlorine ion recovery rate was 91.9%, PCB was not detected in the organic layer, and it was confirmed that a small amount of the polymer compound was present in the organic layer.
【0017】参考例3 参考例1と同様の方法で50000ppmKC−300
デカリン溶液20mlを仕込み、50℃で40%SD2
7.4gを添加し、50℃4時間反応させた。参考例1
と同様に後処理し、濾過乾燥物0.36gを得た。塩素
イオン回収率は 80%で、有機層中にPCBは検出さ
れなかった。Reference Example 3 50,000 ppm KC-300 was prepared in the same manner as in Reference Example 1.
Charge 20 ml of decalin solution, 40% SD2 at 50 ℃
7.4 g was added and reacted at 50 ° C. for 4 hours. Reference example 1
Post-treatment was carried out in the same manner as above to obtain 0.36 g of a filtered and dried product. The chlorine ion recovery rate was 80%, and PCB was not detected in the organic layer.
【0018】実施例3 参考例3と同じ反応を、PCB溶液は1時間で滴下する
様にして行った。参考例3と同様に後処理し、濾過乾燥
物0.12gを得た。塩素イオン回収率は95%で、有
機層中にPCBは検出されなかった。Example 3 The same reaction as in Reference Example 3 was carried out by dropping the PCB solution in 1 hour. Post-treatment was carried out in the same manner as in Reference Example 3 to obtain 0.12 g of a dried filter product. The chlorine ion recovery was 95%, and PCB was not detected in the organic layer.
【0019】[0019]
【発明の効果】ハロゲン化合物とアルカリ金属分散体と
の反応において、副生物の生成を抑え、後処理を容易に
し、ほぼ完全に脱ハロゲン分解出来る。INDUSTRIAL APPLICABILITY In the reaction between a halogen compound and an alkali metal dispersion, generation of by-products can be suppressed, post-treatment can be facilitated, and dehalogenation decomposition can be carried out almost completely.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 神山 昌士 神奈川県小田原市高田345 日本曹達株式 会社小田原研究所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masashi Kamiyama 345 Takada, Odawara-shi, Kanagawa Odawara Research Institute, Nippon Soda Co., Ltd.
Claims (4)
度1%以下の条件で、ハロゲン化合物と分散状態にある
アルカリ金属とを反応させることを特徴とするハロゲン
化合物を脱ハロゲン分解する方法1. A method for dehalogenating a halogen compound, which comprises reacting the halogen compound with an alkali metal in a dispersed state at a temperature of 10 ° C. to 70 ° C. and a halogen compound concentration of 1% or less.
請求項1に記載の方法2. The method according to claim 1, wherein the reaction temperature is 45 ° C. or higher and 55 ° C. or lower.
%以下である請求項1または2に記載の方法3. The concentration of the halogen compound in the reaction solution is 0.1.
% Or less, The method according to claim 1 or 2.
の難分解性ハロゲン化合物である請求項1、2または3
に記載の方法4. The halogen compound is a hardly decomposable halogen compound such as polychlorinated biphenyls.
Method described in
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4828396A JPH09215920A (en) | 1996-02-09 | 1996-02-09 | Method for treating halogen compound |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4828396A JPH09215920A (en) | 1996-02-09 | 1996-02-09 | Method for treating halogen compound |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09215920A true JPH09215920A (en) | 1997-08-19 |
Family
ID=12799119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4828396A Pending JPH09215920A (en) | 1996-02-09 | 1996-02-09 | Method for treating halogen compound |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09215920A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002255860A (en) * | 2001-02-26 | 2002-09-11 | Nippon Soda Co Ltd | Method for carrying out decomposition treatment of slightly decomposable halogen compound |
JP2006193482A (en) * | 2005-01-14 | 2006-07-27 | Kobelco Eco-Solutions Co Ltd | Method and apparatus for treating organohalogen compound |
-
1996
- 1996-02-09 JP JP4828396A patent/JPH09215920A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002255860A (en) * | 2001-02-26 | 2002-09-11 | Nippon Soda Co Ltd | Method for carrying out decomposition treatment of slightly decomposable halogen compound |
JP2006193482A (en) * | 2005-01-14 | 2006-07-27 | Kobelco Eco-Solutions Co Ltd | Method and apparatus for treating organohalogen compound |
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