JPH09213856A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve soldering strength and environmental property and easily perform the judgment on whether it is good or bad in inspection of external appearance by bringing outer leads into contact with one another by means of an auxiliary frame, and separating them from one another, being cut when being bonded to pads. SOLUTION: This semiconductor device consists of sealing resin 1 for insulation to package a semiconductor element, and outer leads 2 for external connection to serve as i/o terminals. The outer leads 2 are connected with one another by auxiliary frames (support bars) 10 and 10a provided at the sections not to be connected with a pad 6 out of several flanks. Then, they are separated from one another by the support bar 10a being cut and removed when they are connected to the pad 6. Hereby, the section to be cut of the outer lead 2 becomes a section separate from the section to be joined with a wiring board 5, and even in case that the outer lead 2 is plated in advance, the plating of the section to be joined with the wiring circuit board never peels off.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having an external connection outer lead as a terminal for transmitting an input / output signal of a semiconductor element outside the package.

[0002]

2. Description of the Related Art Conventionally, as a package structure in a semiconductor device, an insertion type and a mounting type such as DIP, FP, PLCC and ceramic packages are generally known. In these semiconductor devices, each of the terminals for transmitting the input / output signals is patterned in advance in an electrically independent state, and then the semiconductor element and the terminals for transmitting the input / output signals are connected by wire bonding, respectively. Packaged with insulating resin.

These terminals are called leads, those inside the package are called inner leads, those outside the package are called outer leads for external connection, and in the outer leads for external connection protruding outside the package, In order to be soldered to the pads of the printed circuit board,
It is lead-cut to the required length and then formed into a gull wing. The formed outer leads are arranged outside the package and solder-bonded to the pads of the printed circuit board.

3A and 3B are views showing an example of the configuration of a conventional semiconductor device. FIG. 3A is a plan view of the semiconductor device, and FIG. 3B is a plan view of the lead frame plate 9 shown in FIG. FIG. 3C is a diagram showing a state cut in FIG. 3C, and FIG. 7C is a sectional view showing a state where the semiconductor device shown in FIG.

As shown in FIG. 3, this prior art example is composed of an insulating sealing resin 101 which becomes a package of a semiconductor device and an outer connecting outer lead 102 which becomes an input / output terminal. The semiconductor device and the printed circuit board 105 are electrically connected by fixing the flat portion 104 provided at the tip of the lead 102 on the pad 106 provided on the printed circuit board 105 with the solder 108.

As shown in FIG. 3A, the outer lead 102 for external connection is connected to the insulating sealing resin 1 and the lead frame plate 109 is plated on the entire surface.
Is formed by cutting with a dedicated mold on the AA ′ surface.

[0007]

In the conventional semiconductor device as described above, in order to improve the manufacturing efficiency,
The outer leads for external connection are manufactured by a method of patterning the plate material of the lead material using a resist, or by a method of punching with a dedicated mold, on which the semiconductor element is mounted, and the terminal of the semiconductor element and the inner lead are respectively After they are connected by wire bonding or the like, they are packaged with an insulating resin.

The outer leads for external connection are plated to prevent surface oxidation and improve solderability.

Here, when the semiconductor device is connected to the printed circuit board, it is common that the outer leads and the pads on the printed circuit board are joined by solder.
In the subsequent steps, the outer leads for external connection are cut and bent by a dedicated die for lead formation so that the outer leads can be easily joined to the pads of the printed circuit board.

Therefore, the cut surface of the tip of the outer lead for external connection is a surface without plating.

As a result, the surface of the cut surface which is not plated is oxidized by being left after manufacturing, and as shown in FIG. 3 (c), the advanced oxidation causes a problem of solder wetting during soldering. Will end up.

Due to this solder wetting defect, the condition of forming the front fillet of the solder at the solder joint is deteriorated, which makes it difficult to judge the quality during the visual inspection.

Further, there is a problem in that the bonding strength is lowered and the environmental characteristics are lowered, and the reliability is lacking, so that highly reliable lead bonding is required.

The present invention has been made in view of the problems of the above-mentioned conventional techniques, and can improve the soldering strength and the environmental characteristics, and can judge the quality at the time of appearance inspection. It is an object of the present invention to provide a semiconductor device capable of easily performing the above.

[0015]

In order to achieve the above object, the present invention provides a package for packaging a semiconductor device, and a package provided outside the package and connected to each of the input / output terminals of the semiconductor device. In a semiconductor device having a plurality of outer leads, wherein the outer leads are electrically connected to the wiring circuit board by being bonded to pads on the wiring circuit board using a solder material, the outer leads are: Each side surface is connected to each other by an auxiliary frame provided in a portion that is not connected to the pad, and is separated from each other by cutting and removing the auxiliary frame when being joined to the pad. And

Further, the auxiliary frame is provided within a range of 0.3 to 2.0 mm from the outer circumference of the package.

The outer leads are plated with a material suitable for joining with the solder material.

Further, the material used for the plating process is gold.

Further, the material used for the plating is silver.

Further, the material used for the plating is tin.

Further, the material used for the plating process is palladium.

Further, the material used for the plating process is a solder material.

Further, the material used for the plating is nickel.

(Operation) In the present invention configured as described above, the plurality of outer leads provided outside the package for connecting the semiconductor element to the printed circuit board,
The respective side surfaces are connected to each other by an auxiliary frame provided in a portion that is not connected to the wiring circuit board, and are separated from each other by cutting and removing the auxiliary frame when being joined to the wiring circuit board.

As described above, since the cut portion of the outer lead is separated from the portion to be joined to the printed circuit board, even if the outer lead is plated in advance, The plating of the part to be joined does not come off, and the solder wetting does not deteriorate during joining.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is an external perspective view showing an embodiment of a semiconductor device of the present invention.

As shown in FIG. 1, this embodiment comprises an insulating sealing resin 1 which is a package for packaging a semiconductor element (not shown), and an external connection outer lead 2 which becomes an input / output terminal. Since the flat portion 4 provided at the tip of the outer lead 2 for external connection is fixed to the pad 6 provided on the printed circuit board 5 with the solder 8, the semiconductor device and the printed circuit board 5 are electrically connected to each other. It is connected to the.

The manufacturing process of the semiconductor device having the above structure will be described below.

2A and 2B are diagrams showing the details of the semiconductor device shown in FIG. 1. FIG. 2A is a plan view of the semiconductor device, and FIG. 2B is a state in which the lead frame plate 9 shown in FIG. FIG. 6C is a cross-sectional view of the semiconductor device shown in FIG.
(D) is a sectional view showing a state in which the semiconductor device shown in (b) is mounted on a substrate.

First, as shown in FIG. 2 (a), a support bar 10a, which is an auxiliary frame, is attached to the lead frame plate 9.
Is 0.3 to 2.0 m from the outer periphery of the sealing resin 1 for insulation.
The support bars 10 and 10a and the outer leads 2 for external connection are patterned so as to be within m, and an opening 11 which becomes an unnecessary portion is formed by an etching process to form a semiconductor element (not shown) for insulation. It is packaged with the stop resin 1, and the entire surface of the lead frame plate 9 is plated. Here, the material for the plating process is a material suitable for joining with a solder material such as gold, silver, tin, palladium, solder, or nickel.

Next, as shown in FIG. 2B, the support bar 1 connected to the lead frame plate 9 by a dedicated mold.
Cut off 0a.

Since the cut surfaces 3 are located on both side surfaces of the outer lead 2 for external connection and within 0.3 to 2.0 mm near the outer circumference of the insulating sealing resin 1, The plated surface of the connecting outer lead tip surface 2a is not damaged.

Next, as shown in FIG. 2C, the outer connection outer lead 2 is bent to form a flat portion 4 so as to be easily connected to the printed circuit board 5.

Thereafter, as shown in FIG. 2D, the semiconductor device having the outer leads 2 for external connection formed thereon is mounted on the surface of the pad 6 on the printed circuit board 5 and joined by the solder 8.

In the semiconductor device manufactured by the above process, as shown in FIG. 2D, since the cutting surface 3 of the outer connecting outer lead 2 is not formed at the solder joint portion, the outer connecting outer lead is formed. The wettability of the solder 8 on the tip surface 2a is improved, and the solder joint strength is improved. Further, the better wetting of the solder 8 makes it possible to form the solder fit shape neatly and easily perform visual inspection or visual inspection with an image.

[0037]

As described above, according to the present invention, the plurality of outer leads provided outside the package for connecting the semiconductor element to the wiring circuit board are not connected to the wiring circuit board on the respective side surfaces. They are connected to each other by an auxiliary frame provided in the part, and are separated by cutting and removing the auxiliary frame when joined to the printed circuit board. It is a portion apart from the portion to be joined to the circuit board, and even if the outer leads are plated in advance, the portion to be joined to the printed circuit board will not be stripped.

As a result, it is possible to prevent problems due to deterioration of solder wetting, and to improve soldering strength and environmental characteristics.

Further, it is possible to easily judge the quality at the appearance inspection.

[Brief description of drawings]

FIG. 1 is an external perspective view showing an embodiment of a semiconductor device of the present invention.

2A and 2B are diagrams showing details of the semiconductor device shown in FIG. 1, wherein FIG. 2A is a plan view of the semiconductor device, and FIG. 2B is a diagram showing a state in which the lead frame plate shown in FIG. (C)
6B is a cross-sectional view of the semiconductor device shown in FIG. 7B, and FIG. 8D is a cross-sectional view showing a state in which the semiconductor device shown in FIG.

FIG. 3 is a diagram showing a configuration example of a conventional semiconductor device,
(A) is a plan view of the semiconductor device, (b) is a view showing a state in which the lead frame plate shown in (a) is cut along the AA ′ plane, and (c) is a substrate of the semiconductor device shown in (b). It is sectional drawing which shows the state mounted in.

[Explanation of symbols]

 1 Sealing resin for extinction 2 Outer lead for external connection 2a Outer lead for external connection Tip surface 3 Cut surface 4 Flat part 5 Wiring circuit board 6 Pad 7 Solder resist 8 Solder 9 Lead frame board 10, 10a Support bar 11 Opening part

Claims (9)

[Claims] 1. A package for packaging a semiconductor element, and a plurality of outer leads provided outside the package and connected to respective input / output terminals of the semiconductor element, wherein the outer lead is a wiring circuit. In a semiconductor device that is electrically connected to the printed circuit board by being bonded to a pad on a board using a solder material, the outer lead is provided on a portion of each side surface that is not connected to the pad. A semiconductor device, wherein the semiconductor devices are connected to each other by an auxiliary frame, and are separated from each other by cutting and removing the auxiliary frame when bonded to the pad. 2. The semiconductor device according to claim 1, wherein the auxiliary frame is 0.3 from an outer periphery of the package.
A semiconductor device provided within a range of up to 2.0 mm. 3. The semiconductor device according to claim 1, wherein the outer lead is plated with a material suitable for joining with the solder material. 4. The semiconductor device according to claim 3, wherein the material used for the plating process is gold. 5. The semiconductor device according to claim 3, wherein the material used for the plating process is silver. 6. The semiconductor device according to claim 3, wherein the material used for the plating process is tin. 7. The semiconductor device according to claim 3, wherein the material used for the plating process is palladium. 8. The semiconductor device according to claim 3, wherein the material used for the plating process is a solder material. 9. The semiconductor device according to claim 3, wherein the material used for the plating process is nickel.