JPH09201842A - Mold circulating transfer molding method, production of semiconductor device, mold circulating transfer molding apparatus and resin seal molding apparatus of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mold circulating transfer molding method capable of enhancing the productivity by matrializing the full automation of a seal molding process of a semiconductor element fitted with a lead wire. SOLUTION: A semiconductor element arranging and supplying device 10, a device transfer robot 20 taking out an arranged and inspected semiconductor element group to charge the same in the cavity of an opened lower mold 4a in a positioned state, a mold circulating type resin seal molding device of semiconductor elements performing a series of transfer molding processes at a high speed while intermittently circulating a plurality of molds having the same shape, a device transfer robot 40 taking out the molded product released from the lower mold 4a opened after transfer molding to an inspection table 51 and a semiconductor inspection and separation device 50 inspecting the appearance of the molded product to separate the device and the unnecessary part thereof are provided. The resin seal molding device 30 has stages S1-S6 and the mold stop stage of a mold preheating and pooling stage on a mold intermittent feed conveyor 36.

Description

Detailed Description of the Invention

[0001]

The present invention can be suitably used in a method of manufacturing a semiconductor device including, for example, a sealing molding (encap molding) step for sealing a lead wire type semiconductor element body with a resin package. The present invention relates to a mold circulating transfer molding method and a mold circulating transfer molding apparatus that can be preferably used in a resin sealing molding apparatus for a semiconductor device.

[0002]

2. Description of the Related Art Conventionally, in a so-called lead wire type semiconductor device in which lead wires are connected to a semiconductor element body (pellet) such as a high voltage silicon diode, the semiconductor element body is packaged with a resin package (envelope). A single mold type transfer molding method is adopted in the resin sealing molding (encap molding) process for sealing. In this transfer molding method, a cavity of a mold (sealing mold) that is kept at a constant temperature is positionally loaded as an insert with a semiconductor element body to which a large number of lead wires are connected as an insert, and a preheated solid-phase resin material ( Thermosetting resin material) is filled in the material chamber of the mold, and then pressure (material injection) is applied by a plunger (auxiliary ram) to cure the resin for molding. It is difficult to perform molding without misalignment, and a resin package with high sealing property and high reliability can be obtained.

FIG. 20 is a plan view showing a work site of a resin encapsulation molding process of a lead wire type semiconductor element body. Reference numeral 1 in the figure is a stand-alone type auxiliary ram type transfer molding machine as shown in FIG. 21, and various related devices are arranged around the transfer molding machine 1 as a center. A large number of semiconductor element bodies with lead wires (insert parts) p prepared in the automatic aligning device 2 near the transfer molding machine 1 are arranged in the jig holder (tray) 3
The plurality of upper alignment jigs 3b are aligned. Each alignment jig 3b
The inspection of the alignment state of the plurality of element bodies p juxtaposed on each other is left to the visual inspection of the operator who works on the transfer molding machine 1, and the arrangement state of only one element body p is arranged on one alignment jig 3b. Even when there is an abnormality (for example, crossing of lead wires between adjacent element bodies p or missing one end of lead wires), all of the alignment jigs 3b on the jig holder 3 are returned and excluded. Only when there is no misalignment of the element bodies p in all the alignment jigs 3b on the jig holder 3, the worker lifts the jig holder 3 while holding the grip handles 3a, 3a, and the transfer molding machine 1 performs the die molding. It is set between the opened molds (upper mold and lower mold) 4, and each element body p is positioned and loaded as an insert (embedded product) in each cavity. Then, the mold 4 is clamped, after which the solid phase resin material 5 of the preheated tablet is dropped into the material chamber, and the resin material is pressed by the pressure plunger to be molded. The resin material 5 is blocked by a predetermined volume, and is heated to 40 to 50 ° C. in a preheating device (high frequency preheater) 6. Also,
The upper mold and the lower mold of the transfer molding machine 1 each have an electric heater built therein. For example, the mold temperature is 160 to 2
The temperature is controlled to 00 ° C. Here, as shown in FIG. 21, the transfer molding machine 1 includes a fixed platen (top plate) 1
a, a mold clamping cylinder 1b for clamping or opening the mold (lower mold 4a and upper mold 4b), a main ram 1c of the mold clamping cylinder 1b, a movable plate 1d, an auxiliary cylinder 1e, a pressure plunger (auxiliary ram) 1f. have.

The molten resin material in the material chamber is guided from the sprue through the runner to the cavity by the pressure applied by the pressure plunger 1f, and the semiconductor element body of the insert is embedded and cured (cured) for a certain period of time. After that, the lower mold 4a and the upper mold 4b are opened, and a knockout bar (ejector) is released to take out a molded product in which the element body is sealed. The molded product thus taken out is separated into a resin molding portion and an alignment jig 3b in a separating device 7, and the resin molding portion includes a resin-sealed semiconductor device (finished product) and unnecessary resin portions such as runners, sprues and culls. Is separated into The separated alignment jig is collected in the jig container 8, but the separated resin-sealed semiconductor device is visually inspected by a worker for the quality of the resin-sealed portion. Be stored. In many cases, a defective product is generated due to a defective mold, and therefore the corresponding cavity of the mold 4 in which the defective product is generated is inspected. If the mold is defective, the molding process is stopped, the mold 4 is detached from the transfer molding machine 1 and repaired. Further, each time the molding is completed, the mold cleaning device 10 performs brushing and air injection on the cavity of the mold 4.

[0005]

However, the transfer molding method using the transfer molding machine 1 has the following problems.

The worker must perform various works in front of the high temperature mold of the stationary transfer molding machine 1, and improvement of the working environment is strongly demanded. That is, full automation of the resin encapsulation molding process is required. by the way,
Full automation has already been achieved because the injection molding method is used in the resin encapsulation molding process of low-voltage semiconductor devices such as IC (semiconductor integrated circuit), which is a so-called frame type. In the resin encapsulation molding process, since a single mold type transfer molding method using a thermosetting resin material is used, continuous automation of all molding processes has not yet been achieved.

If a defective product is generated by visual inspection of the resin encapsulation molding portion, the mold 4 is immediately opened and inspected. If the mold is defective, wait until the mold temperature falls sufficiently. After that, the large and heavy mold must be removed from the transfer molding machine 1 and repaired.
This mold removing operation is considerably troublesome. Further, since it takes a lot of time to mount the repaired mold 4 on the transfer molding machine 1, the work efficiency of the mold repair is very poor, and the sealing molding process is performed during the repair / adjustment period. It has to be completely canceled, and die repair is a cause of reduced operating efficiency. In order to improve productivity, it is possible to increase the size of the mold and increase the number of molds taken.However, the number of defective mold sites increases, and repair workability deteriorates due to the increased weight of the mold. It is not a drastic measure to improve productivity.

In the single mold type transfer molding machine 1, not only the pressure molding process but also insert loading, mold clamping,
Since the solid phase resin material filling and mold cleaning steps are also performed sequentially in a time-divided manner, idle is long and production efficiency is low.

In view of the above problems, an object of the present invention is to focus on the fact that it is more convenient to use a carry-out mold of a small size in order to improve the workability of repairing the mold, so that the entire sealing molding process is performed. It is an object of the present invention to provide a mold recycle transfer molding method capable of realizing automation and improving productivity, and a mold recirculation transfer molding apparatus for carrying out the method.

[0010]

Means for Solving the Problems In order to solve the above problems, the means taken by the present invention is to intermittently and automatically move a plurality of take-out molds of the same shape in a circulating manner to disperse the circulating paths to dispersive stop positions. The constant temperature and various related operations are simultaneously processed in parallel. That is, in the mold circulation transfer molding method according to the present invention, a component loading step of loading insert components such as electronic components into a cavity of the mold in a mold open state at a component loading position and then performing mold matching, and the mold A first mold feeding step of moving from the component loading position to a resin material filling position, a resin material filling step of filling the resin material while heating the mold stopped at the resin material filling position, The second mold feeding step of moving the mold from the resin material filling position to the resin pressing position, and pressing the filling resin material while heating the mold stopped at the resin pressing position. Resin molding step for molding, a third mold feeding step for moving the mold from the resin pressing position to the molded product unloading position, and the mold opening for the mold stopped at the molded product unloading position. And take out the molded product, A fourth mold feeding stage for moving the mold from the molded product take-out position to the mold cleaning position, and a mold cleaning for cleaning the cavity of the mold in the mold open state stopped at the mold cleaning position. And a fifth mold feeding step of moving the mold from the mold cleaning position to the component loading position and returning the mold.

In such a mold circulation transfer molding method, one or more mold stop positions are provided between the resin pressurizing step and the molded product take-out step, and the mold is stopped at this mold stop position. A curing step of heating may be added. Further, one or more mold stop positions are provided between the mold cleaning position and the component loading position,
A preheating pool stage for heating the mold at the mold stop position may be added.

Such a mold circulation type transfer molding method can be applied to a manufacturing method including a resin encapsulation molding step of a semiconductor device, if the above-mentioned component is a semiconductor element body with a lead wire.

Further, the present invention is, in a mold circulation transfer molding apparatus for carrying out the mold circulation transfer molding method, having a power feeding electrode for a built-in electric heater in which the mold is exposed on a side surface, It is characterized in that a power supply device having a power supply terminal elastically conductively connected to the power supply electrode of the mold stopped in the mold matching state is provided.

Further, in a mold circulation transfer molding apparatus for carrying out the mold circulation transfer molding method, a shaft for aligning a pressure plunger to be pushed into the mold at the resin pressure position with respect to the plunger hole. It is characterized by comprising a centering mechanism. The shaft center aligning mechanism may be a shaft shift universal joint that eccentrically connects the pressure plunger to the driving node plunger.

Such a mold circulation type transfer molding apparatus can be applied to a resin sealing apparatus for a semiconductor device, if the above-mentioned component is a semiconductor element body with a lead wire.

[Operation] In the mold circulating transfer molding method according to the present invention, the component loading position, the resin material filling position, the resin pressing position, the molded product unloading position, and the mold cleaning position are the same stop position. Instead, they are distributed in a take-out automatic circulation path.

Molds of the same shape are simultaneously placed at the respective stop positions, and at the moving stage, the molds are moved to the next adjacent stop positions in synchronization. That is, in the component loading stage, an electronic component such as a semiconductor element body with a lead wire is set as an insert in the cavity of the mold in the mold open state stopped at the component loading position, and the molds are matched.
After that, it is moved to the resin material filling position through the first mold feeding step. In the resin material filling step, the resin material is filled into the material chamber for the stopped die, and then the resin material is moved to the resin pressing position through the second die feeding step. In the resin pressing step, the resin material in the mold is pressed to seal and mold the insert, and thereafter, the insert is moved to the molded product takeout position through the third mold feeding step. At the molded product take-out position, the mold is opened to take out the molded product, and after the molds are aligned, the mold is moved to the mold cleaning position through the fourth mold feeding step.

In the mold cleaning step, the mold is opened, the cavity is cleaned, the molds are aligned, and then the mold is returned to the component loading position through the fifth mold feeding step.

As described above, one mold is automatically circulated as a take-out mold in the order of component loading position → resin material filling position → resin pressing position → molded product unloading position → mold cleaning position → component loading position. However, at least at the resin material filling position to the resin pressing position, the mold is heated during the stop period. Therefore, even if the mold is intermittently circulated and moved, a constant resin temperature (hot water temperature) can always be ensured at the time of stopping at the molding stage, and therefore, transfer molding automation can be achieved. In addition, since the circulation method of the take-out die is adopted, it is possible to perform the 5 steps of component loading, resin material filling, resin pressurization, molded product take-out and die cleaning in parallel at the same time. The productivity can be improved even with the die. Furthermore, when a mold defect occurs, the defective mold is immediately removed from the circulation path and replaced with a non-defective mold, whereby the line recovery can be promptly dealt with without significantly lowering the operating rate of the circulation line. Since a relatively small mold is used, replacement work of a defective mold becomes very easy.

Here, one or more mold stop positions are provided between the molding stage and the molded product take-out stage, and a curing stage is added to heat the mold at the mold stop positions. If it is, it is not necessary to wait until the curing (curing) time is over after the resin is injected in the molding stage, and the resin can be reliably cured in the next additional curing stage, and the idle Since it can be eliminated, the production efficiency can be improved.

Further, one or more mold stop positions are provided between the mold cleaning position and the component loading position,
When a preheating pool stage for heating the mold at the mold stop position is added, even if the intermittent stop period is short in the mold circulation, constant temperature control of the mold temperature becomes easy.

In the mold circulation type transfer molding apparatus according to the present invention, the power feeding electrode for the built-in electric heater is exposed on the side surface of the mold and is elastic with respect to the power feeding electrode of the mold stopped in the mold matching state. Since it is equipped with a power supply terminal that is electrically conductively connected to the mold, when the mold stops at the stop position, power is supplied to the built-in electric heater of the mold through the power supply terminal during the stop period. The mold can be heated to a constant temperature without any trouble.

Further, since the dies stopped at the resin pressurizing position are cyclically different, there is a possibility that a slight misalignment occurs between the plunger hole and the pressurizing plunger depending on the dies positioned at the resin pressurizing position. . However, in the present invention, since the axial centering mechanism for aligning the pressure plunger to be pushed into the mold at the resin pressure position with respect to the plunger hole is provided, there are variations in the dimensional accuracy of the mold. Even if there is no axis deviation, the pressure plunger can be inserted into the plunger hole of the mold without hindrance, problems such as resin leakage can be suppressed, and therefore mold defects etc. due to circulating different molds can be prevented beforehand. it can.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION

[0025]

Next, an embodiment of the present invention will be described with reference to the accompanying drawings.

[Overall Configuration] FIG. 1 is a plan view showing a schematic line of an automatic resin encapsulation molding system for a semiconductor device according to an embodiment of the present invention.

The automatic resin encapsulation molding system for a semiconductor device according to this embodiment is a semiconductor device alignment supply device 10 for inspecting and supplying a plurality of alignment states of semiconductor devices (insert parts) with lead wires for multi-cavity production. And a device transfer robot 20 for taking out the semiconductor device group that has undergone the alignment inspection and positioning and loading it in the cavity of the lower mold 4a in the mold open state,
From a die-sealing type resin encapsulation molding apparatus 30 for semiconductor elements, which performs a series of transfer molding steps at high speed while intermittently circulating a plurality of molds 4 of the same shape, and a lower mold 4a opened after transfer molding. Device transfer robot 40 that takes out the released molded product and transfers it to the inspection table 51
And a semiconductor inspection / separation device 50 for inspecting the appearance of the molded product to separate the device and its unnecessary resin portion.

[Semiconductor Element Aligning and Supplying Device 10] FIG. 2 is a perspective view showing a jig accommodating magazine in which the alignment jigs for the semiconductor element main body with lead wires which are carried in from the outside of the semiconductor element aligning and supplying device are stacked. 4 is a plan view of the semiconductor element alignment and supply apparatus, FIG. 4 is a front view of the semiconductor element alignment and supply apparatus as seen in the direction of arrow A in FIG. 1, and FIG. 5 is a left side view of the semiconductor element alignment and supply apparatus.

In the semiconductor device alignment supply device 10,
As indicated by an arrow IN, the jig storage magazine M shown in FIG. 2 is sequentially loaded from the outside of the machine. This jig storage magazine M is for accumulating and storing a plurality of alignment jigs W for bridging and aligning a plurality of semiconductor element main bodies P with lead wires into parallel girders Wa, Wa having sawtooth-shaped lead receiving notches. Two adjacent bottomless jig stacking chambers Ma, Ma are provided.

The semiconductor element aligning and supplying apparatus 10 has a traveling conveyor 11 that conveys the jig-housed magazine M in the arrow IN direction (line advancing direction), and a jig-housed magazine M that has reached the end side of the traveling conveyor 11. On the other hand, an intermittent lift device 12 that intermittently raises the alignment jigs W stacked via the bottomless bottom, and a plurality of the tops of the stacked alignment jigs W that are hung and held to be mounted thereon. A component aligning / transferring device 13 for transferring and aligning the lead ends of the element body P of the book on the inspection table 15a while aligning the lead ends, and a retreating conveyor 14 for returning and carrying the empty jig storage magazine M ′ in the arrow OUT direction. Inspection table 15 on which the alignment jig W is placed
a is an image processing unit 15 having CCD cameras 15b and 15b
The shuttle 16 that moves directly below the device 16 and a jig holding device that temporarily holds down the alignment jig W from above in order to fix it on the inspection table 15a when the alignment condition of the device body is poor. The device 17 and the jig transfer device 1 for transferring to another empty jig storage magazine 5M for storing the alignment jig W for batch rework when the alignment state is bad.
8 is provided.

As shown in FIGS. 6 and 7, the parts aligning / transferring device 13 has a base 13a which is reciprocally movable, and a bearing 13.
A pair of left and right shafts 13c, 1 suspended and supported via b
3c and an intermittent lift device 12 provided at the ends of these shafts.
Jig holding devices 13d, 13 for suspending and holding the uppermost alignment jigs 4, 4 raised from the magazine M by
d, the shaft 13e suspended and supported by the base 13a via the bearing 13b, and the lead ends of the two rows of the element bodies P on the aligned jigs W and W suspended and held.
It has a component aligning device 13f for aligning and aligning in a straight line at f3.

Each jig gripping device 13d has a vertical arm d1.
An air cylinder d2 that reciprocates in the horizontal direction, an air cylinder d4 that swings a hanging claw d3 at the tip of the vertical arm d1, and a stopper arm d5 that holds the ends of the uppermost alignment jigs W, W. Have The component aligning device 13f includes a fixed aligning plate f1 that partitions the aligning jigs W, a movable aligning plate (width aligning plate) f2 that aligns the outer lead ends of one aligning jig 4, and the other. Movable aligning plate (width aligning plate) for aligning the outer lead ends of the aligning jig W of FIG.
3 and air cylinders f4 and f5 for slidingly moving the movable aligning plates f2 and f3.

The jig transfer device 18 is constructed by removing the part alignment device 13f from the part alignment transfer device 13.

[Device Transfer Robot 20] FIG. 8A
Is a side view showing a manipulator of the device transfer robot in this example, and FIG. 8B is a front view thereof.

When the device transfer robot 20 is judged to be good by the inspection result by the image processing unit 15, only the element main body p is completely taken out from the alignment jigs W, W on the inspection table 15a, and the device transfer robot 20 is opened under the mold open state. The cavity of the mold 4a is positioned and loaded, and the robot arm has a manipulator 21 shown in FIG.

The manipulator 21 is fixed to a block 21a attached to a robot arm, and a parallel arm 21b having a saw-toothed lead receiving notch for each jig for picking up the element bodies from the alignment jigs W, W in an aligned state. , 2
1b and a mounting block 21 supported by a block 21a
c, a vertical shaft 21e supported by a bearing 21d at the tip of the mounting block 21c, an air cylinder 21f that reciprocates the vertical shaft 21e in the axial direction, and a vertical shaft 21e.
A pressing base 21g fixed to the lower end of the shaft, a retractable shaft 21i in which a coil spring is wound around the pressing base 21g via a bearing 21h, and a lead wire pressing plate 21j spanning the lower end of the retractable shaft 21i, 21j
And an inner position regulation plate 21k for preventing the positional deviation of the inner lead ends of the two rows of the element bodies for two jigs, and an outer side for preventing the positional deviation of the outer lead ends of the two rows of the element main body for two jigs It has a position regulation plate 21m.

Contrary to the movement of the robot arm, the manipulator of the device transfer robot 40 for taking out a molded product from the mold circulation type resin encapsulation molding apparatus 30 has the same structure as the manipulator 21. .

[Mold Circulation Type Resin Sealing Molding Apparatus 30] As shown in FIG. 1, the mold circulation type resin sealing molding apparatus 30 is provided with mold stop stages (positions) S1 to S8 and circulates the mold. The inter-die intermittent transfer conveyor 36 that forms a line, and the lower die 4a is left on the conveyor 36 in the component loading stage S1 and the upper die 4b is opened and temporarily retracted to the outside of the conveyor 36. Lower mold 4a
The mold separating device 31 for aligning the upper mold 4b with the lower mold 4a after the two rows of element bodies are positioned and loaded in the cavity of
And a resin material supply device 32 for automatically dropping the preheated thermosetting resin material (disc-shaped tablet) into the material chamber of the mold 4 at the next resin material filling stage S2, and a metal material at the next resin pressure stage S3. An auxiliary ram type transfer molding machine 33 for positioning the mold and molding it by applying a resin pressure with a pressure plunger, and a lower mold 4a on the conveyor 3 at the molded product take-out stage S5 next to the curing stage S4.
6, the upper die 4b is opened to temporarily retreat to the outside of the conveyor 36, and the upper die 4b is removed from the lower die 4a by the device transfer robot 40, and then the upper die 4b is moved to the lower die. A mold separating device 34 that molds to 4a,
In the mold cleaning stage S6, there is a mold cleaning device 35 that opens the mold and brushes the cavity to clean and then match the mold.

The mold intermittent feeding conveyor 36 includes a component loading stage S1, a resin material filling stage S2, a resin pressure stage S3, a curing stage S4, a molded product unloading stage S5, a mold cleaning stage S6 and a mold preheating pool. Between the stages S7 and S8, the component loading stage S1
To a stage S5, a chain-type advance conveyor that conveys the mold in the forward direction, a ball conveyor that pushes the mold in the lateral direction from the stage S5 to roll it, and mounts it on the reverse path, and a chain-type retreat including stages 6 to 8 A conveyor,
At the end of the chain-type retreating conveyor, the die is composed of a ball conveyor that pushes the die laterally to roll it and return it to the stage S1, and the die can be circulated.

FIG. 9 (a) is a partial front view showing the mold opening / releasing mechanism of the mold separating / engaging apparatus of this embodiment, and FIG. 9 (b) is a sectional view showing the mold opening state.

The above-mentioned mold separating and releasing devices 31 and 34 have the same structure, and the mold opening and separating mechanism 131 forming the core thereof.
Is a vertical shaft 31c, 31c that can move forward and backward in the thrust direction through bearings 31b, 31b to the base 31a, an air cylinder 31e fixed to a connecting plate 31d at the tip of the vertical shafts 31c, 31c, and a mold at one end. An L-shaped swiveling lever 31 having a hook portion 31f to be engaged and pivotally supported by the base 31a and the piston of the air cylinder 31e hits the other end.
g, 31g and the release pin 31 planted in the connecting plate 31d
have i and. As shown in FIG. 9 (b), each mold releasing device 31 (34) includes a mold opening and releasing mechanism for the lower mold to prevent the lower mold 4 a from floating on the mold interim transfer conveyor 36 when the mold is opened. 31A and a mold opening and releasing mechanism 31B for the upper mold for lifting the upper mold 4b are provided.

When the air cylinder 31e is activated, the L-shaped turning levers 31g and 31g are closed at the initial stage, so that the hook portions 31f and 31f come close to the stepped portions of the molds 4a and 4b, and are connected by a reaction in the latter period. The plate 31d approaches the molds 4a, 4b side. Base 31 in this latter half
When a is driven by an air cylinder (not shown) in a direction of separating from the molds 4a and 4b, the molds 4a and 4b are separated and the molds are opened, and the release pins 31i are ejector pins E.
Since P is projected into the cavity against the pulling force of the coil spring C, the molded product Q is released. Mold opening and mold release are achieved at the same time.

FIG. 10 is a partial perspective view showing the mold thermostatting apparatus of this example.

Mold stop stages S2 to S4, S7, S8
In the above, in the mold temperature controlling device for controlling the temperature by heating the mold 4 in the mold matched state, a plurality of molds which are inserted into the mold from the side faces of the matched lower mold 4a and upper mold 4b in the same direction are used. The rod-shaped built-in electric heater H and the resistance temperature detector R, and the outer insulating plate Z2 fixed by sandwiching the insulating plate Z1 on the side surface thereof.
, The built-in heater H and the temperature-measuring resistance element R for controlling the temperature, the electrode plates P _{H and} P _R which are electrically connected to each other via the lead wire L, and the mold 4 which is arranged beside the mold intermittent feeding conveyor 36 and stopped. Power feeding device (power feeding robot) 100 having a probe T for elastically conductively connecting by accessing the electrode plates P _H, P _R. The power feeding device 100 has an air cylinder 102 installed on the machine base 101, a probe mounting plate 103 fixed to the tip of the piston of the air cylinder 102, and a coil spring C that elastically biases the probe T. A feed line or a signal line 104 is connected to each probe T. In this way, by heating the mold and controlling the temperature during the intermittent suspension period, it is possible to make the hot water temperature at the time of pressurizing the resin constant.

Mold stop stages S2 to S4, S7, S8
When the mold 4 stops at, the power supply device 100 is activated and the probe T is elastically pressed against the electrode plates P _{H and} P _R. When the temperature of the mold is detected by the resistance temperature detector R and the temperature is lower than the predetermined temperature, electric power is supplied to the built-in heater H so that the temperature is increased by heating, but when the temperature is higher than the predetermined temperature, the heating is not performed. Since the die has a large heat capacity, lowering the temperature requires more time than raising the temperature. Therefore, if the temperature is higher than the appropriate temperature in the stage prior to the resin pressurizing stage S3, it takes time until the heat is released, and the cycle time is delayed. So, for example,
In the resin material filling stage S2, it is desirable to set the temperature to a temperature slightly lower than the predetermined temperature.

FIG. 11 is a schematic perspective view showing the outer appearance of the die 4 together with the backing plate (bolster) 33a of the auxiliary ram type transfer molding machine 33 of this embodiment.

Two plunger holes 4ba are formed on the outer insulating plate Z2 side of the upper die 4b of the mold 4, and a triangle is formed at two points on the outer side of the plunger hole 4ba and one point on the opposite side of the insulating plate Z2. There is provided a positioning bush 4bb.

Although not shown in detail, the resin material supplying device 32 installed in the resin material filling stage S2 stores a plurality of high-frequency preheaters for preheating disc-shaped tablets and disc-shaped tablets of preheated resin material in a stacked manner. ,
The material storage tube arranged substantially vertically above the plunger hole 4ba of the upper mold 4b and the mold 4 are the resin material filling stage S.
2. A detection device that is carried into 2 and detects that the plunger hole 4ba is aligned with the position directly below the material storage tube, and a disc-shaped tablet in the material storage tube is ejected by the generation of the detection signal and the material discharge is dropped into the plunger hole 4ba. And a mechanism.

FIG. 12 is a vertical cross-sectional view of the auxiliary ram type transfer molding machine 33 of this example as seen from the upstream side in the die advancing direction,
13 is a partial front view of the auxiliary ram type transfer molding machine 33 as seen in the direction of arrow B in FIG. 1, and FIG. 14 is a partially enlarged view showing the axial centering mechanism of the plunger in the auxiliary ram type transfer molding machine 33.

Auxiliary ram type transfer molding machine 3 of this example
3 is the guide shafts 33c, 33c standing on the machine base 33b.
A fixed plate (top) 33d fixed on the guide shafts 33c, 33c, a mold clamping cylinder 33e fixed to the machine base 33b, and a movable plate reciprocating by a main ram 33f of the mold clamping cylinder 33e. 33g and a contact plate 33h fixed on the movable plate 33g and pressing the lower surface of the lower mold 4a on the mold inter-conveying conveyor (chain type conveyor) 36.
And a backing plate 33a fixed to the lower surface of the fixed plate 33d to press the upper surface of the upper mold 4b, and an auxiliary cylinder 33j fixed to the fixed plate 33d to drive the pressure plunger (auxiliary ram) 33k. ing. In this example, since the mold 4 carried in from the resin filling stage S2 to the resin pressure stage S3 is positioned at the proper position of the transfer molding machine 33, as shown in FIG. Positioning taper pins 33ab that fit into the three positioning bushes 4bb of 4b are provided in a protruding manner.

As shown in FIG. 14, the transfer molding machine 33 has an axial centering mechanism for aligning a pressure plunger 33k to be pushed into the tapered plunger hole (material chamber) 4ba of the mold 4 in the resin pressure stage S3. It has 133. This axis centering mechanism 133 includes a fixed plate 33.
A driving node plunger 133c penetrating directly below with a hole 133b in a cylinder mounting frame 133a fixed on d.
And the plunger holes 33 of the fixed plate 33d and the contact plate 33a.
A shaft shift universal joint 133d that eccentrically connects a pressure plunger 33k that fits aa with play within a certain amount of eccentricity.
And

The joint 133d is a driving node plunger 133.
A pressure plunger 33k having a shaft 133e having an end spherical flange F1 screwed to the tip of c and an end flat flange F2 slidably contacting the end spherical surface of the shaft 133e.
And the connection cup 133 that is prevented from coming off from the end flat flange F2.
f and a cap 133h which is secured to the end spherical flange F1 and is fitted on the connecting cup 133f with a screw 133g.

Since the dies 4 stopped at the resin pressure stage S3 are cyclically different, there is a possibility that the plunger holes 33a, 4ba and the pressure plunger 33k may be slightly misaligned. Even if the plunger hole 4ba is slightly displaced, the action of the shaft misalignment universal joint 133d causes the pressure plunger 33k to move.
Since the shaft can be displaced to some extent freely with respect to the driving node plunger 133c, the pressure plunger 33k can be pushed into the plunger hole 4ba in a state where the shaft is displaced. Therefore, problems such as resin leakage can be suppressed, and therefore, mold defects caused by circulating different molds can be prevented in advance.

FIG. 15 is a vertical sectional view showing the mold cleaning device 35 of this embodiment as seen from the downstream side in the mold advancing direction.

The mold cleaning device 35 has a mold separating device 135 equivalent to the mold separating device 31 described above, a plunger hole cleaning device 136, and a cavity cleaning device 137. The mold separating device 135 has a swiveling lever 31g for holding the lower mold 4a on the conveyer 36 and lifting the upper mold 4b on the mold intermittent feed conveyor 36 in the mold cleaning stage S6, and an air cylinder 135a for moving the mold vertically. ing.
The plunger hole cleaning device 136 includes the lifted upper mold 4
It has a motor mounting plate 136b which moves forward and backward with respect to b by an air cylinder 136a, and a downward rotary brush 136d which is rotated by a motor 136c of the motor mounting plate 136b and fits into a plunger hole. In addition, 136e is a bearing and 136f is a guide.

Further, the cavity cleaning device 137 is provided with a base 137a installed beside the inter-die intermittent transfer conveyor 36.
And a side plate 137c approaching and separating from the mold 4 by an air cylinder 137b fixed thereon, and a side plate 137c.
The frame 137d fixed above, the upward rotary brush 137e standing upright above the frame 137d for brushing the cavity of the upper mold 4b, and the vertical rotating brush 137d vertically below the frame 137d for brushing the cavity of the lower mold 4a. Downward rotating brush 137f and rotating brush 137
e, 137f and a motor 137h for rotating the transmission belt 13g via the transmission belt 13g.

In this example, the component loading stage S1,
The resin material filling stage S2, the resin pressure stage S3, the molded product unloading stage S5, and the mold cleaning stage S6 are arranged in a distributed manner in a take-out type automatic circulation path, unlike a single-type transfer molding machine. Since the processing can be performed in parallel at the same time, the productivity can be improved even with a relatively small mold. In addition, the mold 4 includes at least the resin material filling stage S2 and the resin pressure molding stage S.
3, Heating is performed during the suspension period in the curing stage S4, the preheating pool stages S7, S8. Therefore, even if the mold 4 is intermittently circulated and moved, the resin pressing stage S3
A constant resin temperature (hot water temperature) can be secured at all times during stoppage, so that transfer molding automation can be achieved. The working environment can be improved. When a mold defect occurs, the molded product is inspected on the inspection table 51, and the molded product is taken out of the line before being sent to the mold cleaning stage S6 at the molded product take-out stage S5. By changing to a mold, it is possible to quickly deal with line restoration without significantly reducing the operating rate of the circulation line.
Since a relatively small mold is used, replacement work of a defective mold becomes very easy.

In this example, in particular, since the curing stage S4 is added, it is not necessary to wait until the curing (curing) time is completed after the resin injection at the resin pressure stage S3, and the next addition is made. In addition, since the resin can be surely cured at the curing stage S4 and the idle of the transfer molding machine 33 can be eliminated, the production efficiency can be improved.

In this example, the preheating pool stage S7,
Since No. 8 is added, even if the intermittent suspension period is short in the mold circulation, it is easy to control the mold temperature to be constant.

[Semiconductor Inspection Separation Device 50] FIG. 16 is a plan view showing the semiconductor inspection separation device of this embodiment, and FIG. 17 is a side view seen from the direction C in FIG.

In the semiconductor inspection / separation apparatus 50 of this example, the two rows of the sealed molded products Q transferred from the molded product take-out stage S5 onto the inspection table 51 by the device transfer robot 40 are good or bad for the resin sealing. Is inspected by an image processing device (not shown) using a CCD camera, and then separated into a semiconductor element and an unnecessary resin portion of the product. The sealed molded product Q that has been inspected is moved to the end on the machine body side by the shuttle 52, then transferred to the device transfer device 53, and a large number of sealed semiconductors of the molded product Q are transferred to the unnecessary resin removing device 56. The element and unnecessary resin parts (cull, runner, etc.) are separated.

FIG. 18 is a side view showing the device carrying device 53. The device transfer device 53 includes parallel arms 53a and 53a having saw-toothed lead receiving notches for receiving a plurality of sealed semiconductor elements in an aligned state, and an air cylinder 53 for moving the arm 53a up and down along a guide base 53b.
c and an air cylinder 53d for horizontally reciprocating the guide base 53b. Unnecessary resin removing device 5
6 is an unnecessary resin pushing-down device 5 that covers the molded product Q on the arms 53a, 53a and pushes down the unnecessary resin portion.
4 and an unnecessary resin receiving device 55 that receives the falling of the unnecessary resin portion just below the molded product Q. Therefore, only two rows of resin-sealed semiconductor elements remain on the two pairs of parallel arms 53a, 53a of the device transfer device 53. Then, the two rows of resin-sealed semiconductor elements are aligned by the component alignment transfer device 153 similar to the component alignment transfer device 13 shown in FIG. 6 to the alignment jig 44 (alignment jig W shown in FIG. 2).
(Similarly to) and mounted in line. The alignment jigs 44 on which the semiconductor elements are mounted are carried out one by one by the upper conveyor 55a. Further, the parts alignment transfer device 1 shown in FIG.
A jig transfer device 15 having a configuration similar to that of FIG. 3 and lifting and transferring two empty alignment jigs 44, which are loaded one by one from the lower conveyor 55b into the semiconductor inspection / separation device 50, in parallel.
4 and the two jigs 44 that have been transferred are the component alignment transfer device 1
A jig transfer device 155 for moving to a transfer position of 53 is provided.

In this example, the resin encapsulation molding process of the semiconductor element body with lead wires is described, but the insert is not limited to the semiconductor element body with lead wires, and other electronic parts may be used.

[0064]

As described above, according to the present invention, a plurality of take-out molds of the same shape are intermittently automatically circulated, and constant temperature and various related operations are simultaneously performed in parallel at dispersive stop positions of the circulation path. It is characterized by the fact that it is processed automatically, and has the following effects.

At least at the resin material filling position and the resin pressing position, the mold is heated during the stop period. Therefore, even if the mold is intermittently circulated and moved, a constant resin temperature (hot water temperature) can always be ensured at the time of stopping at the resin pressurizing stage, and therefore, transfer molding automation can be achieved. The working environment can be improved.

Further, since the take-out die circulation system is adopted, the five steps of component loading, resin material filling, resin pressurization, molded product take-out and die cleaning can be simultaneously processed in parallel. Productivity can be improved even with a relatively small mold.

Further, when a mold defect occurs, the defective mold is immediately removed from the circulation path and replaced with a non-defective mold, so that the line recovery can be promptly dealt with without significantly lowering the operating rate of the circulation line. . Since a relatively small mold is used, replacement work of a defective mold becomes very easy.

Between the resin pressurizing step and the molded product take-out step, one or more mold stopping positions are provided, and a curing step for heating the mold at the mold stopping position is added. If there is, it is not necessary to wait until the curing time is over after injecting the resin in the molding stage, and it is possible to reliably cure the resin in the next additional curing stage,
Since the idle of the transfer molding machine at the resin pressure position can be eliminated, the production efficiency can be improved.

One or more mold stop positions are provided between the mold cleaning position and the component loading position, and a preheating pool stage for heating the mold at the mold stop position is added. In such a case, even if the intermittent suspension period is short in the mold circulation, it is easy to control the temperature of the mold to be constant.

In the mold circulation type transfer molding apparatus, the power supply electrode for the built-in electric heater is exposed on the side surface of the mold and elastically conductively connected to the power supply electrode of the mold stopped in the mold matching state. Since the mold is provided with the power supply terminal, when the mold is stopped at the stop position, power is supplied to the built-in electric heater of the mold through the power supply terminal during the stop period. For this reason, it is possible to perform constant temperature heating of the mold at the stop position without any trouble.

Since the axial centering mechanism that aligns the pressure plunger to be pushed into the mold at the resin pressure position with respect to the plunger hole is provided, even if the dimensional accuracy of the mold varies, The pressurizing plunger can be inserted into the plunger hole without any trouble, and problems such as resin leakage can be suppressed, and therefore, mold defects caused by circulating different molds can be prevented in advance.

[Brief description of drawings]

FIG. 1 is a plan view showing a schematic line of an automatic resin encapsulation molding system for a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a jig accommodating magazine in which alignment jigs for a semiconductor element body with lead wires, which are carried in from the outside of the machine, are stacked in the semiconductor element alignment / feeding apparatus of the embodiment.

FIG. 3 is a plan view of the same semiconductor device alignment supply device.

FIG. 4 is a front view of the same semiconductor device alignment supply device as seen in the direction of arrow A in FIG.

FIG. 5 is a left side view of the same semiconductor device alignment supply device.

FIG. 6 is a partial front view showing the component alignment transfer device in the embodiment.

FIG. 7 is a side view showing a part of the component alignment device in the component alignment transfer device.

8A is a side view showing a manipulator of the device transfer robot according to the embodiment, and FIG. 8B is a front view thereof.

FIG. 9 (a) is a partial front view showing a mold opening / releasing mechanism of the mold separating / engaging apparatus in the embodiment, and FIG. 9 (b) is a sectional view showing a mold opening state.

FIG. 10 is a partial perspective view showing the mold constant temperature device in the example.

FIG. 11 is a schematic perspective view showing an external appearance of a die together with a pad of the auxiliary ram type transfer molding machine in the example.

FIG. 12 is a vertical cross-sectional view of the auxiliary ram type transfer molding machine in the embodiment as seen from the upstream side in the mold advancing direction.

FIG. 13 is a partial front view of the auxiliary ram type transfer molding machine in the embodiment as seen in the direction of arrow B in FIG.

FIG. 14 is a partially enlarged view showing the axial centering mechanism of the plunger of the auxiliary ram type transfer molding machine in the embodiment.

FIG. 15 is a vertical cross-sectional view showing a state in which the mold cleaning device in the embodiment is viewed from the downstream side in the mold advancing direction.

FIG. 16 is a plan view showing a semiconductor inspection / separation device in the example.

FIG. 17 shows a semiconductor inspection / separation apparatus according to the embodiment.
It is the side view seen from the C direction of FIG.

FIG. 18 is a side view showing a device transfer device in the semiconductor inspection separation device.

FIG. 19 is a perspective view showing an alignment jig used in a component alignment transfer device in the semiconductor inspection separation device.

FIG. 20 is a plan view showing a work site of a resin encapsulation molding process for a conventional lead wire type semiconductor element body.

FIG. 21 is a front view showing an auxiliary ram type transfer molding apparatus used for resin encapsulation molding of a conventional lead wire type semiconductor element.

[Explanation of symbols]

4 ... Mold (sealing mold) 4a ... Lower mold 4b ... Upper mold 4ba ... Plunger hole 4bb ... Positioning bush P ... Lead element semiconductor element body W, 44 ... Alignment jig Wa ... Parallel girders M, M ', 5M ... Jig storage magazine Ma ... Jig stacking room 10 ... Semiconductor element alignment supply device 11 ... Progressive conveyor 12 ... Intermittent lift device 13 ... Component alignment transfer device 13a ... Base 13b ... Bearings 13c, 13e ... Shaft 13d ... Tool gripping device d1 ... Vertical arm d2, d4 ... Air cylinder d3 ... Suspending claw d5 ... Stopper arm 13f ... Component aligning device f1-f3 ... Alignment plate f4, f5 ... Air cylinder 14 ... Regressing conveyor 15 ... Image processing unit 15a ... Inspection table 15b ... CCD camera 16 ... Shuttle 17 ... Jig holding device 18 ... Jig transfer device 20 ... Device transfer robot 21 ... Manipulator 21a ... Block 21b ... Parallel arm 21c ... Mounting block 21d ... Bearing 21e ... Vertical shaft 21f ... Air cylinder 21g ... Holding base 21i ... Emerging / retracting shaft 21j ... Lead wire pressing plate 21k ... Inner position regulating plate 21m ... Outer position regulating Plate 30 ... Mold circulation type resin sealing molding device 31, 34 ... Mold detaching device 131 ... Mold opening / separating mechanism 31a ... Base 31b ... Bearing 31c ... Vertical shaft 31d ... Connecting plate 31e ... Air cylinder 31f ... Hook part 31g ... L-shaped turning lever 31i ... Mold release pin 31A ... Mold opening mold release mechanism for lower mold 31B ... Mold opening mold release mechanism for upper mold 32 ... Resin material supply device 33 ... Auxiliary ram type transfer molding machine 33a, 33h ... Bolster) 33ab ... Positioning taper pin 33b ... Machine base 33c ... Guide shaft 3 d ... Fixed plate (top plate) 33e ... Mold clamping cylinder 33f ... Main ram 33g ... Movable plate 33j ... Auxiliary cylinder 33k ... Pressurizing plunger (auxiliary ram) 133 ... Axial centering mechanism 133a ... Cylinder mounting frame 133b ... Hole 133c ... Motor joint plunger 133d ... Shaft misalignment universal joint 133e ... Shaft 133f ... Connection cup 133h ... Cap F1 ... End spherical flange F2 ... End flat flange 35 ... Mold cleaning device 135 ... Mold detaching device 135a ... Air cylinder 136 ... Plunger hole Cleaning device 136a ... Air cylinder 136b ... Motor mounting plate 136c ... Motor 136d ... Downward rotating brush 136e ... Bearing 136f ... Guide 137 ... Cavity cleaning device 137a ... Base 137b ... Air cylinder 137c ... Side plate 137d ... Frame 137e ... Upward rotating brush 1 37f ... downward rotating brush 137g ... transmission belt 137h ... motor 36 ... mold intermittent feeding conveyor S1 ... component loading stage S2 ... resin material filling stage S3 ... pressing stage S4 ... curing stage S5 ... molded product take-out stage S6 ... gold type cleaning stage S7, S8 ... mold preheated pool stage H ... rod internal electrical heater R ... RTD L ... leads Z1, Z2 ... insulating plate P _H, P _R ... electrode plate T ... probe C ... coil spring 100 ... Power supply device 101 ... Machine base 102 ... Air cylinder 103 ... Probe mounting plate 104 ... Power supply line or signal line 40 ... Device transfer robot 50 ... Semiconductor inspection / separation device Q ... Molded product 51 ... Inspection table 52 ... Shuttle 53 ... Device Transport device 53a ... Parallel arm 53b ... Guide bases 53c, 53d ... Air seal Sunda 54 ... unnecessary resin depressed device 55 ... unnecessary resin receiving device 55a ... upper conveyer 55b ... lower conveyer 56 ... unnecessary resin removal device 153 ... component alignment transfer device 154 ... jig transfer device 155 ... jig conveying device.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location B29C 45/40 7639-4F B29C 45/40 45/57 9350-4F 45/57 45/73 7639- 4F 45/73 H01L 21/56 H01L 21/56 T

Claims (8)

[Claims] 1. A component loading step of loading a component into a cavity of a mold in a mold open state at a component loading position and then matching the molds, and moving the mold from the component loading position to a resin material filling position. A die feeding step, a resin material filling step of filling a resin material while heating the die stopped at the resin material filling position, and moving the die from the resin material filling position to a resin pressure position. A second mold feed stage to move,
A resin pressurizing step of pressurizing and filling a filled resin material while heating the die stopped at the resin pressurizing position, and moving the die from the resin pressurizing position to a molded product taking-out position. A third mold feeding step, a molded product unloading stage in which the mold stopped at the molded product unloading position is opened and a molded product is taken out, and the mold is moved from the molded product unloading position to a mold cleaning position. A fourth mold feeding step of moving the mold to a mold, a mold cleaning step of cleaning the cavity of the mold in the mold open state stopped at the mold cleaning position, and a step of moving the mold from the mold cleaning position to the mold cleaning step. And a fifth mold feeding step of moving and returning to a component loading position, the mold circulating transfer molding method. 2. The mold according to claim 1, wherein one or more mold stop positions are provided between the resin pressurizing step and the molded product take-out step, and the mold is stopped at the mold stop position. A mold circulation transfer molding method, characterized in that it comprises a curing step of heating the same. 3. The mold according to claim 1 or 2, wherein one or more mold stop positions are provided between the mold cleaning position and the component loading position, and at the mold stop position, A mold circulating transfer molding method comprising a preheating pool stage for heating a mold. 4. A semiconductor device manufacturing method, characterized in that the component is a semiconductor element body with a lead wire, using the mold circulation transfer molding method defined in any one of claims 1 to 3. Method. 5. A mold circulation transfer molding apparatus for carrying out the mold circulation transfer molding method according to claim 1, wherein the mold is
A power supply device having a power supply electrode for the built-in electric heater exposed on the side surface of the mold and having a power supply terminal elastically conductively connected to the power supply electrode of the mold stopped in the mold matching state is provided. A mold circulation type transfer molding device characterized by being formed. 6. A mold circulation transfer molding apparatus for carrying out the mold circulation transfer molding method according to claim 1, wherein the mold is attached to the mold at the resin pressing position. A die circulating transfer molding apparatus comprising an axial centering mechanism for aligning a pressure plunger to be pushed into a plunger hole. 7. The mold circulation transfer molding apparatus according to claim 6, wherein the shaft center alignment mechanism is a shaft shiftable joint that eccentrically connects the pressure plunger to the driving node plunger. A unique mold circulation type transfer molding device. 8. A mold circulation type transfer molding apparatus as defined in any one of claims 5 to 7,
A resin encapsulation molding apparatus for a semiconductor device, wherein the component is a semiconductor element body with a lead wire.