JPS6151969B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for removing gate residue after resin sealing in a resin sealing apparatus for resin sealing electronic components such as semiconductor devices.

Conventionally, there has been no apparatus for removing such gate residue after resin sealing, and there has been no good method other than removing it by hand after molding.

The present invention provides a device for performing such work that conventionally had to be done manually.
An embodiment thereof will be described below based on the accompanying drawings.

FIG. 1 is a diagram showing an embodiment of a resin sealing device according to the present invention. In this figure, first, the means for preheating the comb material 5 into which the semiconductor device is incorporated and the means for supplying it to the sealing mold will be explained. Reference numeral 19 denotes a magazine stocker in which the com materials 5 are stacked and stored at a constant pitch; 20 a motor; 21 a comb material transfer loader that can move vertically and horizontally; and 22 a com material attached to the comb material transfer loader 21. A pull-out pin, 23 is a preheat rail incorporating a heater 24, and 25 is a comb material transfer loader 21.
This is a comb material chucking device attached to the com material chuck device.
In the above configuration, as the comb material transfer loader 21 moves vertically and horizontally, the magazine stocker 1
The uppermost comb material 5a of No. 9 is pulled out onto the preheat rail 23 by the pull-out pin 22.
At the same time, the comb material 5b already on the preheat rail 23 and heated by the heater 24 is
The lower mold 17 is formed by the comb material chucking device 25.
supplied to

After the above operations are completed, the magazine stocker 19 is raised by a predetermined pitch by the motor 20, and the com material 5 pulled out onto the preheat rail 23 is raised by the motor 20.
b is immediately heated by the heater 24 and prepared for the next cycle. Therefore, by operating the comb material transfer loader 21, the two operations of drawing out the comb material 5a from the magazine case 19 and supplying the preheated comb material 5b to the lower mold 17 can be performed simultaneously. Further, there is an effect that the comb material 5b can be prepared for heating during sealing molding. In this embodiment, when the comb material 5 is supplied, it is pulled out from the magazine stocker 19 onto the preheat rail 25 using the comb pull-out pin 22, but it may also be directly fed onto the preheat rail 23 using a conveyor or the like.

Next, the molding means will be explained.

6 is the upper mold, 17 is the lower mold and the heating heater 2
It has a built-in 4'. 26 is a lower die plate that fixes the lower die plate 17; 27 is a mold clamping cylinder that provides thrust to the lower die plate 26; 28 is a tie bar shaft, one end of which is fixed to the upper die plate 29; Perform sliding guide. The upper mold 6 has resin injection holes 16 and heating heaters 24'' corresponding to the number of semiconductor elements incorporated in the comb material 5c, and is fixed to the upper die plate 29. It is a molded cylinder that gives

In the above configuration, when the preheated comb material 5c is supplied to the lower mold 17, the lower mold 17 rises while further heating the comb material 5c by the heater 24', and the lower mold 17 and the upper mold 6 is dotted and the mold is tightened. Next, the resin material pellets 18 are charged into the resin material injection hole 16 of the upper mold 6, and the plunger 9 is lowered to release the heating heater 2.
The resin material heated at 4" and melted is injected under pressure into the cavity to perform sealing molding.

Next, a take-out means for taking out the encapsulated comb material 5c (hereinafter referred to as comb molded product) from the mold;
Also, a means for taking out the comb molded product 5d from which the gate residue has been removed will be explained.

31 is a chucking device for taking out the comb molded product 5c from the lower mold 17, 32 is a chucking device for taking out the comb molded product 5d from which the gate residue has been removed, and 33 is the molding taken out from the lower mold 17. A rail 34 for receiving the comb material 5d is a take-out loader that moves the chucking devices 31, 32 vertically and horizontally. In the above configuration, after the sealing molding is completed and the lower mold 17 is lowered, the take-out loader 34 moves into the mold, grips the comb molded product 5c with one chuck device 31, and removes the rail with the other chuck device 32. 33, grip the rubber molded product 5d from which the gate residue has been removed,
Take out each.

Therefore, one operation of the take-out rotor 34 can simultaneously take out the comb molded product 5c and the comb molded product 5d from which the gate residue has been removed.

Next, the means for supplying the resin pellets 18 will be explained. 35 is a hopper for storing a large number of resin pellets 18; 36 is a fixed pipe chute with both ends open; 37 is a disk with a hole capable of intermittent rotation; the hole 38 matches the lower opening of the pipe chute 36. It's becoming like that. 39 is a supply block which is movable by external power and guides the plurality of resin material pellets 18, and 40 is a drive cylinder. In the above configuration, the hopper 35 is moved up and down by the drive cylinder 40, and the hopper 35 is moved vertically by the drive cylinder 40.
The resin pellet 18 in 5 is the pipe chute 36
will be inserted aligned with. The resin pellets 18 are separated one by one by a disk with holes 37 and sent to a supply block 39. When a predetermined number of resin pellets 18 are guided to the supply block 39, the supply block 39 is moved to fill the resin material injection hole 16 of the upper mold 6.
at a given time, positioned to match the
The resin pellets 18 are fed into the resin material injection hole 16 all at once. By performing the individual operations described above continuously and cyclically, this device automatically and continuously performs everything from supplying the comb material 5 and resin pellets 18 to sealing molding and taking out the comb molded product 5c. This makes it possible.

Next, the gate residue removing device of the present invention is applied to the second to fourth gates.
This will be explained in detail based on the diagram. In Figure 2,
41 is a receiving plate arranged so as to bend upward the supply part residue 13 connected to the comb molded product 5d received by the rail 33; 42 is a dropping plate; 43 is a receiving plate 4
1 and drop plate 42 are fixed, and lever 45 is rotatable around the fulcrum shaft 44 by the thrust of the drive cylinder 46. It is configured such that the signal is reliably transmitted to the swing lever 43 via the swing lever 43. On the other hand, the comb molded product 5d has a manifold hole 4 provided in the chucking device 31.
7, 47' and vacuum pressure transmitted through suction nozzles 48, 48', and transfer is possible.

Next, the operation will be explained based on FIGS. 3 and 4. The comb molded product 5d is transferred to a predetermined position on the rail 33 by the chucking device 31, and held and fixed until the gate residue is removed.
At this time, the bottom of the supply portion residue 13 connected to the molded resin outer shell 15 by the gate residue 14 hits the receiving plate 41, and the gate residue 14 is bent upward at an angle α. Thereafter, in FIG. 2, the drop plate 42 fixed to the swing lever 43 rotates via the arm 45 and the fulcrum shaft by the thrust of the drive cylinder 46, and as shown in FIG. At the point when the gate residue 14 is bent downward at an angle β by applying pressure, the connection portion between the molded resin outer shell 15 and the gate residue 14 is broken. At this time, since the receiving plate 41 is fixed to the swing lever 43, it moves relative to the drop plate 42 and escapes downward.

Therefore, the comb molded product 5 taken out from the sealing mold
The gate residue 14 in d is bent slightly upward before it has completely cooled down, causing a crack at its base, and then bent downward in the opposite direction, resulting in a clean broken surface. This has the effect of ensuring separation in different conditions. If the gate residue 14 is broken only from a single direction as in the conventional method, there are disadvantages such as a part of the gate residue 14 remaining on the molded resin outer shell 15 or not being completely broken.

As described above, the present invention is effective in removing gate residues and enables automation of resin sealing equipment, making a significant contribution to continuous integrated production of semiconductor element assembly processes.

[Brief explanation of the drawing]

FIG. 1 is an overall perspective view showing a resin sealing device according to an embodiment of the present invention, FIG. 2 is a side view of a gate residue removing device according to an embodiment of the present invention, and FIGS. 3 and 4 are gate FIG. 3 is a cross-sectional view of the main part of the device showing a state in which a residue is removed. 13... Supply section residue, 14... Gate residue section,
15...Body part of parts, 31, 32...Chucking device, 33...Guiding part, 41...Receiving part, 4
2...Drop plate, 43...Lever, 46...Driving means.

Claims (1)

[Scope of Claims] 1. A guide portion that grips a main body of a resin-sealed electronic component and holds a plurality of independent resin gate residue portions corresponding to the component so as to protrude to the outside; a first pressurizing means for pressurizing the resin gate residue portion from one side so as to rotate the resin gate residue portion around a connection portion between the main body portion of the component and the resin gate residue portion; It has a second pressurizing means that similarly pressurizes from the opposite direction,
A gate residue removal device that removes gate residue by applying primary pressure from one direction and then applying secondary pressure from the other direction. 2 The first and second pressurizing means include a swinging lever that swings about one point as a center of rotation, a drive unit that drives the swinging lever, and a drive means that is attached to the swinging lever to remove gate residue from electronic components. The gate according to claim 1, characterized in that the gate comprises a receiving part and a dropping part, which are located on both sides of the supply part residue formed continuously with the supply part residue and alternately contact the supply part residue. Residue removal equipment.