JPH09186308A - Manufacture of solid-state image pickup module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a functional and highly reliable solid-state image pickup module with which the quality of picture can be improved. SOLUTION: A solid-state image pickup element 8 is mounted and arranged on the glass substrate 7 where a wiring circuit 7a, containing an input/output connection terminal and an active circuit element, is provided on one main surface excluding a specific region in such a manner that light-receiving surfaces are opposed, and the terminal 8a of the solid-state image pickup element 8 and one of the connection terminals of the glass substrate 7 surface are electrically connected. Pertaining to the solid-state image pickup element 8, at least the circumferential part excluding the light-receiving surface is covered by high viscosity ultraviolet ray hardening resin 12b, and the region where the active circuit element 11 is mounted is covered by low viscosity ultraviolet ray hardening resin 12a. Ultraviolet rays are made to irradiate on the above- mentioned ultraviolet ray hardening resin layers 12a and 12b and they are sealed by hardening.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a CCD (Carge Copul
The present invention relates to a method for manufacturing a solid-state imaging module suitable for an endoscope having a solid-state imaging device (CCD chip) called an ed device) as a main body.

[0002]

2. Description of the Related Art For example, a monitoring device or an endoscopic device for examining the inside of the stomach generally has an image pickup head portion formed by sealing at least a solid-state image pickup module in a liquid-tight manner, and an input / output signal of the image pickup head portion. It employs a configuration including a signal introducing / extracting section for introducing / extracting and an input / output signal control section for controlling an input / output signal in the signal introducing / extracting section. In addition, in this type of endoscope apparatus and the like, generally, a solid-state imaging module configured to have a cross-sectional view of a main part structure is used in FIG.

In FIG. 4, reference numeral 1 denotes, for example, a thin film process, in which a wiring conductor 1a having a required conductor pad (including a wiring conductor) is provided on one main surface. The thickness is about 0.5 mm, the width is about 6 mm, and the length is about 6 mm. A 9 mm glass substrate 2 is a solid-state image sensor mounted and arranged on one main surface of the glass substrate 1, for example, a CCD chip having 100,000 pixels. Further, 3 is the solid-state image sensor 2
Is a bump (connecting portion) made of, for example, Au for electrically connecting the terminal 2a and the conductor pad of the glass substrate 1, and is connected by a micro socket method by using the In solder 4 together. Here, in order to improve the light-receiving ability, the solid-state imaging device 2 has a configuration in which a condensing microlens 2b is provided for each active region forming a light-receiving surface (imaging active surface), and the condensing microlens 2b is formed. Mounted with the surface facing the glass substrate 1 surface,
It has a configuration to arrange.

Further, 5 is an active type circuit component inserted in the wiring conductor portion in the wiring conductor 1a including the conductor pad on the surface of the glass substrate 1, and 6 is the solid-state image sensor 2 and the active type circuit component 5. In the mounting / arrangement area of, the transparent encapsulating resin layer (for example, a thermosetting resin such as a silicone resin) that mold-seals the peripheral portion of the solid-state image pickup element 2 and the active type circuit component 5 and the gap with the surface of the glass substrate 1 is molded. Resin).

[0005]

However, the following disadvantages are recognized in the solid-state image pickup module having the above structure. That is, in the case of the above configuration, the solid-state image sensor (C
The CD chip 2 has a condensing microlens for each active area forming a light-receiving surface (imaging active surface) in order to enhance the light-receiving ability.
It is configured with 2b. Then, the condensing microlens forming surface is mounted so as to face the glass substrate 1 surface,
It has a configuration to arrange.

In such a structure, the gap between the light receiving surface of the solid-state image pickup device 2 and the surface of the glass substrate 1 is mold-sealed by the transparent sealing resin layer, so that the action of the condensing microlens 2b is achieved. -The effect is likely to be impaired, and the expected high-quality imaging may not be obtained. In particular, in applications such as medical equipment and industrial monitoring devices, in the current situation where miniaturization, high performance, and high reliability of solid-state imaging modules are required, it is difficult to obtain high-quality imaging. It's a great thing.

The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a method of manufacturing a solid-state image pickup module in which image quality is improved and functional reliability is improved.

[0008]

According to a first aspect of the present invention, there is provided a glass substrate on one main surface of which a wiring circuit including required input / output connection terminals and active type circuit elements is provided except a certain region. A step of mounting and arranging a solid-state image sensor with a light-receiving surface facing the fixed region, a step of electrically connecting a terminal of the solid-state image sensor and one connection terminal of a glass substrate surface, For the image pickup device, a step of coating at least the peripheral portion other than the light-receiving surface with a high-viscosity ultraviolet curable resin, and a step of coating a region portion on which the active circuit element is mounted with a low-viscosity ultraviolet curable resin, A step of irradiating the coated ultraviolet curable resin layer with ultraviolet rays to cure and seal the layer, and a method for manufacturing a solid-state imaging module.

According to a second aspect of the present invention, a glass substrate is provided on one main surface thereof with a wiring circuit including a required input / output connection terminal and an active type circuit element excluding a certain area. Mounting and disposing the solid-state image sensor with the light-receiving surfaces facing each other; electrically connecting the terminals of the solid-state image sensor and one of the connection terminals on the glass substrate surface; and the light-receiving surface for the solid-state image sensor. Other than the step of coating at least the peripheral portion with a UV curable resin having a viscosity at room temperature of 50,000 cp or more, and covering the area where the active circuit element is mounted with a UV curable resin having a viscosity at room temperature of 1500 cp or less And a step of irradiating the coated ultraviolet-curable resin layer with ultraviolet rays to cure and seal the layer, and a method of manufacturing a solid-state imaging module.

According to a third aspect of the present invention, in the method of manufacturing a solid-state image pickup module according to the first or second aspect, at least one of a solid-state image pickup element portion coated with an ultraviolet curable resin and an active type circuit element portion. It is characterized in that the outer frame is fixedly arranged on the. That is, the present invention adopts a configuration in which a solid-state image sensor (CCD chip) and an active type circuit component are mounted in the form of a so-called flip chip on a glass substrate surface that also functions as a filter for protecting an active image capturing surface and a filter. And the influence on the imaging area is reduced as much as possible.
This is a method for manufacturing a solid-state image pickup module that is molded while being eliminated to enable compactness and high-quality image pickup.

Further, in the structure of the solid-state image pickup module described above, a so-called condensing microlens is arranged on the light-receiving surface of the solid-state image pickup element to improve the light-receiving performance. We are working to protect and improve environmental resistance. That is, the solid-state image sensor is configured to protect and improve environmental resistance while reliably forming a gap between the light-receiving surface of the solid-state image sensor and the surface of the glass substrate facing the solid-state image sensor so as to properly secure required light reception. There is.

In the present invention, the ultraviolet ray-curable resin is selected as the mold sealing resin. However, in the manufacturing process of the solid-state image pickup module, the solid-state image pickup element and the active type circuit component are easily subjected to thermal This is to reduce or avoid such adverse effects. Further, if necessary, the outer frame body fixedly arranged in the resin coating / filling region of the solid-state image pickup device or the active type circuit component is preferably a thermosetting adhesive film such as epoxy resin.

According to the invention of claim 1, at least the peripheral portion other than the light-receiving surface of the solid-state image pickup device is covered with a high-viscosity UV-curable resin, and the region portion where the active type circuit element is mounted is cured with a low-viscosity UV-ray. Coating with a polar resin. In other words, flow
A resin having a low filling property and a resin having a high filling property are used properly, and the high-viscosity resin having a low filling property is made to function as a weir, so that the required light reception of the solid-state imaging device is properly secured.

On the other hand, while preventing the light-receiving surface region from being filled and sealed with resin, the region portion where the active type circuit element required to protect the environment is mounted is precisely sealed with resin. Moreover, as the resin, an ultraviolet curable resin that is cured by irradiation of ultraviolet rays is used, so that the solid-state image pickup element is also prevented from being adversely affected by heat in the manufacturing process, and a solid-state image pickup module having excellent performance is produced. Well manufactured.

According to the second aspect of the present invention, the high-viscosity UV-curable resin has a viscosity of 50,000 cp or more at room temperature, and the low-viscosity UV-curable resin has a viscosity of 1500 cp or less at room temperature. By selecting each of the ultraviolet curable resins, the action in the case of claim 1 can be achieved more efficiently.

According to the third aspect of the present invention, the outer frame is fixedly arranged on at least one of the solid-state image pickup device section and the active type circuit element section, which are filled and covered with the ultraviolet curable resin, and the ultraviolet cure is carried out and filled and covered. In order to prevent the functional resin from flowing out, the action in the case of claim 1 or claim 2 is more effectively performed.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment will be described below with reference to FIGS. 1, 2 and 3.

FIG. 1 is a sectional view showing the structure of the main part of the solid-state image pickup module manufactured in the first embodiment.

First, for example, in a thin film process, a wiring substrate 7a including required terminals is provided on one main surface to have a thickness of about 0.5 mm, a width of about 6 mm, and a length of about 9 mm, and the glass substrate 7 described above.
A solid-state image sensor 8 mounted and arranged on one main surface is prepared, for example, a CCD chip having 100,000 pixels. It should be noted that, for example, Au bumps (connecting portions) 9 are laminated on the terminals 8a of the solid-state imaging device 8, and the In solder 10 is provided between the terminals 8a and the terminals included in the wiring conductor 7a of the glass substrate 7. It is configured to be electrically connected by a microsocket method when used together. Further, since the solid-state image sensor 8 enhances the light receiving ability,
Each active area forming a light receiving surface (imaging active surface) is provided with a condensing microlens 8b.

Next, at the predetermined position (light receiving area) of the glass substrate 7, the solid-state image pickup device 8 is mounted and arranged with the condensing microlens 8b forming surface facing the glass substrate 7 surface. The terminals 8a are electrically connected to and mounted on the terminal portions of the wiring conductor 7a via the bumps (connection portions) 9 made of metal. Further, the active type circuit component 11 is mounted and connected at a predetermined position of the wiring conductor 7a to form a required electronic circuit to form a solid-state imaging module body.

Then, in the solid-state image pickup module body,
The area where the active circuit component 11 is mounted and mounted is covered with, for example, an ultraviolet curable resin 12a having a room temperature viscosity of about 1000 cp.
Fill. In addition, except for the light-receiving surface area of the mounted / mounted solid-state imaging device 8, the peripheral portion has, for example, a room temperature viscosity of 600.
Cover and fill with 00cp UV curable resin 12b. In this way, the light-receiving surface area of the solid-state image sensor 8 is partitioned by the ultraviolet curable resin 12b which has high viscosity and is hard to flow. That is,
The peripheral area of the solid-state image sensor 8 is temporarily sealed so that the imaging area of the solid-state image sensor 8 is voided.

Next, an ultraviolet-curing resin coated and filled with the solid-state image pickup device 8 and the active circuit component 11, respectively.
By irradiating 12a and 12b with ultraviolet rays to cure them,
A solid-state image pickup module having a structure as shown in FIG. 1 is manufactured.

2 (a) and 2 (b) are schematic views showing an embodiment of the second embodiment, and FIG. 2 (a) is an ultraviolet curable resin 12a, 1
2B is a plan view of the state before curing 2b, and FIG. 2B is a sectional view of the state after curing the ultraviolet curable resins 12a and 12b.

In the case of the second embodiment, a rectangular annular frame body (for example, an adhesive) having a thickness which is about the distance between the lower surface of the solid-state image sensor 8 and the upper surface of the glass substrate 7 and which is larger than the outer dimension of the solid-state image sensor 8. A solid-state image pickup module capable of picking up a high-quality image by the same means as in the first embodiment except that the resin film 13 is fixedly arranged so as to surround the solid-state image pickup element 8 in a plane. Can be manufactured.

Further, FIGS. 3 (a) and 3 (b) are schematic views showing an embodiment of the third embodiment, and FIG. 3 (a) is an ultraviolet curable resin.
FIG. 3B is a cross-sectional view of the state before curing the ultraviolet curable resins 12a and 12b, and FIG. 3B is a plan view of the state before curing 12a and 12b.

In the case of the third embodiment, a window is opened so as to expose the solid-state image pickup element 8 and the active type circuit component 11 and the ultraviolet curable resins 12a and 12b for covering and filling them. Insulating film (open) 14
Except for being attached to the mounting / mounting surface, the sealing resin 12a, 12b is also cured by ultraviolet irradiation for a relatively short time by the same means as in the case of the first embodiment, and a high quality image is obtained. It is possible to manufacture a solid-state image pickup module capable of picking up images.

The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the invention. For example, the size and shape of the solid-state imaging device or the glass substrate may be appropriately selected and set according to the application, standard, etc. of the solid-state imaging module.

[0028]

According to the invention of claim 1, a resin having a low fluidity / filling property and a resin having a high fluidity / filling property are selectively used, and a high viscosity resin having a low fluidity / filling property is made to function as a weir, and a light receiving surface is obtained. While preventing the resin from being filled and sealed in the area, it is possible to densely seal the area in which the active circuit element required to protect the environment is mounted. Moreover,
Since the encapsulating resin is cured by irradiation with ultraviolet rays, the solid-state imaging device can be prevented from being adversely affected by heat, and a solid-state imaging module with excellent performance can be provided with high yield.

According to the second aspect of the invention, the high-viscosity UV-curable resin has a viscosity at room temperature of not less than 50,000 cp, and the low-viscosity UV-curable resin has a viscosity at room temperature.
By selecting each to 1500cp or less, it is possible to easily provide a solid-state imaging module having excellent performance with high yield.

According to the third aspect of the present invention, the outer frame body is fixedly arranged in at least one of the regions where the sealing resin is filled and coated so that the resin that is filled and coated flows out. Since this can be prevented, it is possible to easily provide a solid-state imaging module having excellent performance with high yield.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a configuration of a main part of a solid-state image pickup module manufactured in a first embodiment.

2A and 2B show a configuration state of a solid-state imaging module according to an embodiment of a second embodiment, FIG. 2A is a plan view before the sealing resin is cured, and FIG. Later sectional view.

3A and 3B show a constitutional state of a solid-state imaging module according to an embodiment of a third embodiment, FIG. 3A is a plan view before the sealing resin is cured, and FIG. 3B is a curing state of the sealing resin. Later sectional view.

FIG. 4 is a cross-sectional view showing a configuration of a main part of a conventional solid-state imaging module.

[Explanation of symbols]

 1, 7 ...... Glass substrate 1a, 7a ...... Wire conductors 2,8 ...... Solid-state image sensor (CCD chip) 2a, 8a ...... Solid-state image sensor terminals 2b, 8b ...... Solid-state image sensor focusing microlens 3,9 ...... Au bump 4,10 ...... In solder 5,11 ...... Active type circuit component 6 ...... Mold sealing resin layer 12a ...... Low viscosity UV curable resin 12b ...... High viscosity UV curable resin 13 …… Adhesive resin frame 14 …… Insulating film

Claims (3)

[Claims] 1. A light receiving surface is opposed to a predetermined area on a glass substrate on a main surface of which a wiring circuit including required input / output connection terminals and active type circuit elements is provided excluding a predetermined area. Mounting and arranging the solid-state image sensor by means of the above, electrically connecting the terminals of the solid-state image sensor and one of the connection terminals on the glass substrate surface, and at least the peripheral portion other than the light-receiving surface for the solid-state image sensor. A step of coating with a high-viscosity UV-curable resin, a step of coating the area portion where the active circuit element is mounted with a low-viscosity UV-curable resin, and an ultraviolet ray to the coated UV-curable resin layer. A step of irradiating and curing and encapsulating the solid-state imaging module. 2. A light receiving surface is opposed to a glass substrate on one main surface of which a wiring circuit including required input / output connection terminals and active type circuit elements is provided except for a certain area. Mounting and arranging the solid-state image sensor by means of the above, electrically connecting the terminals of the solid-state image sensor and one of the connection terminals on the glass substrate surface, and at least the peripheral portion other than the light-receiving surface for the solid-state image sensor. A step of coating with a UV curable resin having a viscosity at room temperature of 50000 cp or more, and a step of coating the area portion where the active circuit element is mounted with a UV curable resin having a viscosity of 1500 cp or less at room temperature, And a step of irradiating the coated ultraviolet curable resin layer with ultraviolet rays to cure and seal the layer. 3. The outer frame body is fixedly arranged on at least one of a solid-state image pickup element portion and an active type circuit element portion which are coated with an ultraviolet curable resin. Manufacturing method of solid-state imaging module.