JP2013175861A - Substrate module and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the durability of an imaging module.SOLUTION: An image pickup device 20 and multiple circuit components 8 are mounted on a lower surface 1B of a substrate 1. The image pickup device 20 and the multiple circuit components 8 are divided by a dam tape 9, and the divided area is covered by a heat radiation plate 12. A peripheral region of the image pickup device 20 is sealed by resins 11 and 13, and peripheral regions of the multiple circuit components 8 are sealed by a resin 10. When the dam tape 9 is removed, a space 9A communicating with the exterior of a substrate module is formed. This structure prevents contact failure of an electric connection part that is caused by expansion etc. of a cavity due to module external air pressure changes and improves the durability.

Description

  The present invention relates to a substrate module in which a first circuit component and a second circuit component are mounted on the same surface of a substrate, and a manufacturing method thereof.

  For the purpose of downsizing, an imaging module in which an imaging element and an FPC (Flexible printed circuits) substrate are flip-chip connected has been put into practical use. Since the FPC board can be bent, the mounting area can be substantially reduced. In addition, since there are heat generating members such as small electronic components (regulators, resistors, etc.) in the vicinity of the image sensor, heat is transmitted to the image sensor and noise is generated, which may degrade the image quality. For this reason, there are some which dissipate heat by attaching a heat dissipating member to the back surface of the image sensor. Furthermore, there is an increasing demand for waterproofing measures for imaging modules. In particular, when used in an endoscope, there is a need for an imaging module that can withstand a sterilization environment in addition to waterproofing.

  As for the sterilization environment, EOG sterilization is generally carried out in addition to sterilization with a cleaning solution. EOG sterilization is a method of sterilizing an object to be sterilized by exposing it to an atmosphere in which EO gas and CO2 gas are mixed in a certain ratio. Compared to autoclaves (methods of sterilization with high-temperature and high-pressure steam), the sterilization target is less altered and deformed.

  FIG. 13 is a bottom view of the imaging module.

  An image sensor 20 is mounted on the lower surface of the substrate 1. A circuit component 8 is mounted on the right side of the image sensor 20. The periphery of the circuit component 8 is sealed with a resin 10. Further, the periphery of the image sensor 20 is sealed with a resin 14 and has a waterproof structure.

  Since the resin 10 is applied and cured around the circuit component 8 and then the resin 14 is applied and cured around the image sensor 20, the periphery of the circuit component 8 and the image sensor 20 are sealed. The resin 14 flows into the resin 10 and is cured after the resin 10 and the resin 14 come into contact with each other. Since the back surface of the imaging module in which the periphery of the imaging element 20 and the circuit component 8 are sealed with the resin 10 and the resin 14 is covered with the heat sink, the substrate 1 is surrounded by the heat sink, the resin 10 and the resin 14, and the imaging is performed. A cavity 15 that does not vent to the outside of the module is formed.

  There are also a solid-state imaging device module (Patent Document 1) that reduces the manufacturing cost with a simple structure, a manufacturing method of a solid-state imaging module that improves image quality (Patent Document 2), and the like.

JP 2001-16486 JP-A-9-186308

  In EOG sterilization, the object is exposed to a pressurized / reduced (decompressed) environment. When the object is exposed to a pressurized / reduced pressure environment, in the conventional imaging module structure, the heat radiating member is pulled backward due to the deformation and alteration of the resin (the flip chip connecting portion is pulled in the shear direction). As shown in FIG. 13, the volume change due to compression and expansion of the cavity 15 in the vicinity of the resins 10 and 14, and even when the cavity 15 is sealed with a waterproof resin, it becomes a heat radiating member due to resin curing shrinkage and the difference in thermal expansion of the member For example, the flip chip connection may cause poor contact due to the increase in stress, and the video may not be displayed. Such a problem that durability is lowered is not considered at all in either of the cited documents 1 and 2.

  An object of the present invention is to improve the durability of a substrate module such as an imaging module.

  According to the substrate module manufacturing method of the present invention, the first circuit component and the second circuit component are mounted on the same surface, and the first module and the second circuit component are arranged between the first circuit component and the second circuit component. A dividing member is provided so that the peripheral area of the first circuit component and the peripheral area of the second circuit component are not in contact with each other, and a first resin (for example, waterproof resin) is applied to the peripheral area of the first circuit component. The second resin (for example, waterproof resin) is applied to the peripheral area of the second circuit component, and the sorting member is removed. The separating member may be removed after the heat radiating member is attached to the imaging module, or the heat radiating member may be attached to the imaging module after the separating member is removed.

  According to the present invention, the first circuit component is disposed between the first circuit component and the second circuit component on the same surface of the substrate on which the first circuit component and the second circuit component are mounted. A dividing member for separating the surrounding area of the second circuit component and the surrounding area of the second circuit component is provided. The first resin is applied to the peripheral region of the first circuit component, and the second resin is applied to the peripheral region of the second circuit component. Next, if necessary, a heat radiating member is attached, and the sorting member is removed. Since the sorting member separates the surrounding area of the first circuit component from the surrounding area of the second circuit component, the first resin and the second resin may be in contact with each other. To be prevented. In addition, since a cavity surrounded by the first resin and the second resin is not formed, contact failure of the electrical connection portion due to expansion of the cavity due to a change in the external pressure of the imaging module is prevented, and durability is improved.

  The first resin and the second resin are, for example, curable resins, and the first insulating resin is applied to the peripheral area of the first circuit component and the second resin is applied to the peripheral area of the second circuit component. After applying the resin, a heat radiating member may be attached as necessary, the first resin and the second resin are cured, and the sorting member may be removed after the first resin and the second resin are cured.

  The second circuit component is a group of components composed of a plurality of circuit components, and it is preferable to apply the second resin around each circuit component, in particular, to an electrical connection portion by solder or the like so as not to contact each other.

  The hardness of the first resin and the second resin is preferably, for example, from A20 to D80.

  The sorting member is, for example, a dam tape.

  In the first circuit component and the second circuit component, it is preferable to attach a heat radiating member on the surface facing the surface mounted on the substrate.

  The present invention also provides a substrate module. That is, the substrate module includes a substrate on which the first circuit component and the second circuit component are mounted on the same surface, a first resin applied to a peripheral region of the first circuit component, and a first resin. A second resin applied to the peripheral region of the second circuit component is provided with a space between the first resin and the first resin so as to be in non-contact with the first resin.

  According to the present invention, the first circuit component and the second circuit component are mounted on the same surface of the substrate, and the first resin is provided in the peripheral region of the first circuit component. A second resin is sealed in a peripheral region of the circuit component. A space is provided between the first resin and the second resin so that the first resin and the second resin are not in contact with each other. Since the cavity surrounded by the first resin and the second resin is not formed, the durability is improved as described above.

  The space formed between the first resin and the second resin is connected to the outside of the substrate module so that the first resin and the second resin are not in contact with each other.

  The second circuit component is, for example, a group of components composed of a plurality of circuit components, and the second resin may be applied to the periphery of each circuit component, in particular, to the electrical connection portion by solder or the like so as not to contact each other. preferable.

  For example, the first resin and the second resin preferably have a hardness of A20 to D80.

  The first circuit component and the second circuit component further include a heat radiating member attached on a surface facing the surface mounted on the substrate.

2A and 2B are explanatory diagrams of Example 1, in which FIG. 1A is a bottom view of a substrate, and FIG. 1B is a cross-sectional view taken along line IB-IB in FIG. 2A and 2B are explanatory diagrams in Example 1, in which FIG. 2A is a bottom view of the substrate, and FIG. 2B is a cross-sectional view taken along line IIB-IIB in FIG. FIG. 3 is an explanatory diagram of Example 1, (A) is a bottom view of the substrate, and (B) is a cross-sectional view taken along line IIIB-IIIB in FIG. 3 (A). 4A and 4B are explanatory views of Example 1, in which FIG. 4A is a bottom view of the substrate, and FIG. 4B is a cross-sectional view taken along line IVB-IVB in FIG. 2A and 2B are explanatory diagrams in Example 1, in which FIG. 5A is a bottom view of the substrate, and FIG. 5B is a cross-sectional view taken along line VB-VB in FIG. 2A and 2B are explanatory views in Example 1, in which FIG. 6A is a cross-sectional view of a substrate, and FIG. 6B is a cross-sectional view taken along line VIB-VIB in FIG. It is explanatory drawing in Example 1, and is a bottom view of the imaging module from which the heat sink was removed. It is explanatory drawing in Example 2, (A) is a bottom view of a board | substrate, (B) is sectional drawing seen from the VIIIB-VIIIB line | wire of FIG. 8 (A). It is explanatory drawing in Example 2, (A) is a bottom view of a board | substrate, (B) is sectional drawing seen from the IXB-IXB line | wire of FIG. 9 (A). It is explanatory drawing in Example 2, (A) is a bottom view of a board | substrate, (B) is sectional drawing seen from the XB-XB line | wire of FIG. 10 (A). It is explanatory drawing in Example 2, (A) is a bottom view of a board | substrate, (B) is sectional drawing seen from the XIB-XIB line | wire of FIG. 11 (A). It is explanatory drawing in Example 2, and is a bottom view of the imaging module from which the heat sink was removed. FIG. 6 is a bottom view of an imaging module that is a conventional imaging module with a heat sink removed.

  1A is a bottom view of the substrate 1, and FIG. 1B is a cross-sectional view taken along line IB-IB in FIG. 1A.

  Referring mainly to FIG. 1B, an opening 2 is formed in the substrate 1. An image sensor 20 positioned with the light receiving surface at the top is attached by a resin 7 at a position of the lower surface 1B of the substrate 1 corresponding to the opening 2. A wiring pattern (not shown) is formed on the lower surface 1 </ b> B of the substrate 1, and the wiring pattern and the image sensor 20 are electrically connected via the bumps 5.

  A rectangular glass plate 3 is fitted into the opening 2 formed in the substrate 1. The glass plate 3 is fixed to the upper surface 1A of the substrate 1 by a resin 4. A spacer 6 is sandwiched between the lower surface of the glass plate 3 and the upper surface of the image sensor 3. A double-sided tape 21 is attached to the entire lower surface of the image sensor 20.

  Referring mainly to FIG. 1A, a plurality of circuit components 8 are mounted on the right side of the lower surface 1B of the substrate 1. The plurality of circuit components 8 are spaced from each other.

  As described below, first, the dam tape 9 is attached to the substrate 1.

  2A is a bottom view of the substrate 1, and FIG. 2B is a cross-sectional view taken along the line IIB-IIB in FIG. 2A.

  Referring mainly to FIG. 2A, the peripheral region 31 of the image sensor 3 (the image sensor 3 cannot be seen because the double-sided tape 21 is visible in FIG. 2) and the peripheral region 32 of the circuit component 8 are separated. As shown, a dam tape 9 is stuck between the imaging element 3 and the circuit component 8 on the back surface 1 </ b> B of the substrate 1 so as to penetrate through the opposite sides of the substrate 1. The dam tape 9 prevents the surrounding area 31 of the image sensor 3 from contacting the surrounding area 32 of the circuit component 8.

  Subsequently, a resin is applied to the peripheral region 32 and the like of the circuit component 8.

  3A is a bottom view of the substrate 1, and FIG. 3B is a cross-sectional view taken along line IIIB-IIIB in FIG. 3A.

  Referring mainly to FIG. 3A, a curable resin 10 is applied to the peripheral region 32 of the circuit component 8. The resin 10 is also applied between each of the plurality of circuit components 8. Further, a curable resin 11 is also applied to a portion of the surrounding area 31 of the image pickup device 3 that is in contact with the dam tape 9. Since there is a dam tape 9, the resin 10 and the resin 11 are completely separated without contact.

  Subsequently, the heat sink 12 is pasted.

  4A is a bottom view of the substrate 1, and FIG. 4B is a cross-sectional view taken along line IVB-IVB in FIG. 4A.

  Referring mainly to FIG. 4B, a heat radiating plate 12 having substantially the same shape as the substrate 1 is prepared. The prepared heat radiating plate 12 is attached to the image pickup device 20 by a double-sided tape 21 attached to the back surface of the image pickup device 20. The resin 11, the dam tape 9 and the resin 10 are sandwiched between the heat sink 12 and the substrate 1.

  Subsequently, a resin is applied to a portion of the surrounding area of the image sensor 20 where the resin 11 is not applied.

  5A is a bottom view of the substrate 1, and FIG. 5B is a cross-sectional view taken along the line VB-VB in FIG. 5A.

  When the resin 13 is applied to the peripheral region 31 of the image pickup device 20 sandwiched between the substrate 1 and the heat radiating plate 12, the image pickup device 20 is surrounded by the resin 13 and the resin 11. The resins 13, 11 and 10 applied between the substrate 1 and the heat sink 12 are cured. If the resins 13, 11 and 10 are thermosetting resins, they will be cured by heating.

  When the resins 13 and 11 applied to the peripheral region 31 of the image pickup device 20 and the resin 10 applied to the peripheral region 32 of the circuit component 8 are cured, the dam tape 9 is removed.

  6A is a bottom view of the substrate 1, and FIG. 6B is a cross-sectional view taken along line VIB-VIB in FIG. 6A. FIG. 7 is a bottom view of the substrate 1 with the heat sink 12 removed.

  When the dam tape 9 is removed, a space 9A connected to the outside of the substrate module is formed at the removed place. A space 9 </ b> A is formed between the resin 10 filled in the peripheral region 32 of the circuit component 8 and the resin 13 or 11 filled in the peripheral region 31 of the imaging element 20.

  In the case where there is a cavity surrounded by the resin 10 and the resins 11 and 13, when the cavity is compressed or expanded due to a change in the external atmospheric pressure, the connection portion between the substrate 1 and the image sensor 20 or the substrate 1 and the circuit A connection portion with the component 8 may be disconnected, resulting in poor contact. In this embodiment, since there is no cavity surrounded by resin, such contact failure can be prevented.

  Since the present embodiment is substantially the same as the first embodiment, the same components as those in the above-described embodiment are denoted by the same reference numerals, and detailed description of the overlapping portions is omitted.

  8A is a bottom view of the substrate 1, and FIG. 8B is a cross-sectional view taken along the line VIIIB-VIIIB in FIG. 8A.

  Resins 11 and 10A are applied only to the portion of the peripheral region 31 of the image sensor 20 that is in contact with the dam tape 9 and the periphery of the electronic component 8. Compared with the resin 10 in FIG. 3A, the area of the resin 10A applied around the electronic component 8 is significantly reduced.

  9A is a bottom view of the substrate 1, and FIG. 9B is a cross-sectional view taken along line IXB-IXB in FIG. 9A.

  When the resins 10A and 11 are applied, a heat radiating plate 12 having substantially the same shape as the substrate 1 of FIG. 8 is attached from below.

  FIG. 10A is a bottom view of the substrate 1, and FIG. 10B is a cross-sectional view taken along line XB-XB in FIG.

  A resin 13 is applied to a peripheral region 31 of the imaging element 20 sandwiched between the substrate 1 and the heat radiating plate 12. The periphery of the image sensor 20 is surrounded by the resin 13 and the resin 11.

  11A is a bottom view of the substrate 1, and FIG. 11B is a cross-sectional view taken along the line XIB-XIB in FIG. 11A.

  After the resins 13, 11 and 10 applied between the substrate 1 and the heat sink 12 are cured, the dam tape 9 is removed.

  FIG. 12 is a bottom view of the substrate 1 with the heat sink 12 removed. Compared with FIG. 7, the resin application area around the circuit component 8 is remarkably reduced.

  In this embodiment, there is no cavity surrounded by resin, and the resin applied around the circuit component 8 is suppressed to the minimum area. This prevents the above-mentioned poor contact due to the compression and expansion of the cavity due to the atmospheric pressure change outside the module, and the same due to external forces such as tension applied to the electrical joint through the heat dissipation member due to thermal expansion difference or resin deformation. Contact failure can also be prevented.

  As the above-mentioned resins 10, 11 and 13, an epoxy resin or a silicone resin can be used. For example, a resin whose durometer hardness is about A20 to D80 is preferable.

  In the above-described embodiment, the image pickup device 20 and the plurality of circuit components 8 are mounted on the substrate 1, but circuit components other than the image pickup device 20 may be mounted. Further, although the plurality of circuit components 8 are mounted, the number may not be plural. Also, the resins 10 and 11 are applied before the heat sink 12 is attached to the lower surface of the image sensor 20, and the resin 13 is applied after the heat sink 12 is attached to the lower surface of the image sensor 20. The order of application is not limited as long as the resins 11 and 13 filled in the peripheral region 31 of the element 20 and the resin 10 filled in the peripheral region 32 of the circuit component 8 do not contact each other.

1 Substrate 8 Circuit (second circuit component)
9 Dam tape (partitioning material)
10 Waterproof resin (second resin)
11, 13 Waterproof resin (first resin)
12 Heat sink (heat dissipation member)
20 Image sensor (first circuit component)

Claims (11)

In the substrate on which the first circuit component and the second circuit component are mounted on the same surface, the area around the first circuit component and the second region are between the first circuit component and the second circuit component. A dividing member is provided so that it does not touch the surrounding area of the circuit parts.
First resin is applied to the peripheral area of the first circuit component,
Apply the second resin to the area around the second circuit component,
Remove the sorting member,
A method for manufacturing a substrate module. The first resin and the second resin are curable resins,
After the application of the first resin to the peripheral area of the first circuit component and the application of the second resin to the peripheral area of the second circuit component, the first resin and the second resin are cured,
Removing the separating member after the first resin and the second resin are cured;
The manufacturing method of the board | substrate module of Claim 1. The second circuit component is a group of components composed of a plurality of circuit components, and a second resin is applied around each of the plurality of circuit components so that the circuit components do not contact each other.
The manufacturing method of the board | substrate module of Claim 1 or 2. The hardness of the first resin and the second resin is from A20 to D80,
The manufacturing method of the board | substrate module as described in any one of Claims 1-3.   The method of manufacturing a substrate module according to any one of claims 1 to 4, wherein the sorting member is a dam tape. In the first circuit component and the second circuit component, a heat dissipating member is attached on the surface facing the surface mounted on the substrate.
The manufacturing method of the board | substrate module as described in any one of Claims 1-5. A substrate on which the first circuit component and the second circuit component are mounted on the same surface;
The first circuit applied to the peripheral area of the first circuit component, and the second circuit component having a space between the first resin and the first resin so as not to contact the first circuit component. A second resin applied to the surrounding area of
Board module with. The space formed between the first resin and the second resin is connected to the outside of the substrate module so that the first resin and the second resin are not in contact with each other;
The board module according to claim 7. The second circuit component is a group of components composed of a plurality of circuit components, and a second resin is applied around each of the plurality of circuit components so that the circuit components do not contact each other.
The board module according to claim 7 or 8. The first resin and the second resin have a hardness of A20 to D80.
The substrate module according to any one of claims 7 to 9. In the first circuit component and the second circuit component, the heat dissipating member attached on the surface facing the surface mounted on the substrate,
The substrate module according to any one of claims 7 to 10, further comprising:

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