WO2008146812A1 - Imaging device manufacturing method, imaging device and optical element - Google Patents

Imaging device manufacturing method, imaging device and optical element Download PDF

Info

Publication number
WO2008146812A1
WO2008146812A1 PCT/JP2008/059719 JP2008059719W WO2008146812A1 WO 2008146812 A1 WO2008146812 A1 WO 2008146812A1 JP 2008059719 W JP2008059719 W JP 2008059719W WO 2008146812 A1 WO2008146812 A1 WO 2008146812A1
Authority
WO
WIPO (PCT)
Prior art keywords
imaging device
optical element
component
substrate
camera module
Prior art date
Application number
PCT/JP2008/059719
Other languages
French (fr)
Japanese (ja)
Inventor
Daisuke Watanabe
Original Assignee
Konica Minolta Opto, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto, Inc. filed Critical Konica Minolta Opto, Inc.
Publication of WO2008146812A1 publication Critical patent/WO2008146812A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

Provided are an imaging device manufacturing method which is applicable to reflow process and excellent in optical characteristics, an imaging device and an optical element. The imaging device manufacturing method has a step of forming an optical element by curing a curable resin composition. The resin composition contains, as essential components, a component (A), which is an organic compound composed of an organic structure containing at least two carbon-carbon double bonds which react with a SiH group in a molecule; a component (B), which is a silicon compound containing at least two SiH groups in a molecule, and a component (C), which is a hydrosilylation catalyst. The method also has a step of placing a camera module having the optical element on a substrate with an electronic component, and a step of performing reflow process to the camera module, the electronic component and the substrate and mounting the camera module and the electronic component on the substrate.
PCT/JP2008/059719 2007-05-29 2008-05-27 Imaging device manufacturing method, imaging device and optical element WO2008146812A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007141758 2007-05-29
JP2007-141758 2007-05-29

Publications (1)

Publication Number Publication Date
WO2008146812A1 true WO2008146812A1 (en) 2008-12-04

Family

ID=40075052

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059719 WO2008146812A1 (en) 2007-05-29 2008-05-27 Imaging device manufacturing method, imaging device and optical element

Country Status (1)

Country Link
WO (1) WO2008146812A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013175861A (en) * 2012-02-24 2013-09-05 Fujifilm Corp Substrate module and manufacturing method of the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002185826A (en) * 2000-12-15 2002-06-28 Matsushita Electric Ind Co Ltd Camera to be mounted on board, and method of mounting the camera onto board
JP2004294741A (en) * 2003-03-27 2004-10-21 Kanegafuchi Chem Ind Co Ltd Optical lens and method for manufacturing optical lens
JP2005538503A (en) * 2002-09-06 2005-12-15 ノキア コーポレイション connector
JP2006100516A (en) * 2004-09-29 2006-04-13 Matsushita Electric Ind Co Ltd Molded substrate and its manufacturing method as well as camera module employing it
JP2007043628A (en) * 2005-08-05 2007-02-15 Hitachi Maxell Ltd Camera module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002185826A (en) * 2000-12-15 2002-06-28 Matsushita Electric Ind Co Ltd Camera to be mounted on board, and method of mounting the camera onto board
JP2005538503A (en) * 2002-09-06 2005-12-15 ノキア コーポレイション connector
JP2004294741A (en) * 2003-03-27 2004-10-21 Kanegafuchi Chem Ind Co Ltd Optical lens and method for manufacturing optical lens
JP2006100516A (en) * 2004-09-29 2006-04-13 Matsushita Electric Ind Co Ltd Molded substrate and its manufacturing method as well as camera module employing it
JP2007043628A (en) * 2005-08-05 2007-02-15 Hitachi Maxell Ltd Camera module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013175861A (en) * 2012-02-24 2013-09-05 Fujifilm Corp Substrate module and manufacturing method of the same

Similar Documents

Publication Publication Date Title
WO2009117345A3 (en) Adhesive compositions for use in die attach applications
TW200636877A (en) Temporary wafer bonding method for semiconductor processing
TW200720315A (en) Molding resin composition for optical semiconductor elements and optical semiconductor device obtained by using the same
WO2011025307A3 (en) Photosensitive resin composition which is curable at a low temperature, and dry film produced using same
WO2010074520A3 (en) Novel organic semiconductor compound, method for preparing same, and organic semiconductor composition, and organic semiconductor thin film and element containing same
WO2010064185A3 (en) Electronic devices having plastic substrates
TW200618111A (en) Silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device
ATE480130T1 (en) ELECTRONIC MODULE AND METHOD FOR PRODUCING AN ELECTRONIC MODULE
EP2590025A4 (en) Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or the photosensitive resin composition film
JP5425759B2 (en) Fixing material and optical element sealing body comprising silane compound polymer
WO2009041472A1 (en) Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device
WO2008111470A1 (en) Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part
ATE546033T1 (en) ELECTRONIC UNIT AND METHOD FOR THE PRODUCTION THEREOF
WO2007130643A3 (en) Die-on-leadframe (dol) with high voltage isolation
WO2008126717A1 (en) Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them
TW200511454A (en) Adhesive sheet for producing a semiconductor device
WO2007037858A3 (en) Thermosetting coating compositions with multiple cure mechanisms
WO2009072632A1 (en) Curable composition, coating composition for optical device, led sealing material, and method for producing the same
WO2009038960A3 (en) Flexible epoxy-based compositions
WO2015041342A1 (en) Curable composition, curing product, and method for using curable composition
WO2008090971A1 (en) Terminally epoxidized polydimethylsiloxane, method for producing the same, and curable polysiloxane composition
WO2009004929A1 (en) Imaging device manufacturing method, imaging device and optical element
WO2008142931A1 (en) Epoxy resin composition for optical semiconductor device encapsulation, cured body thereof, and optical semiconductor device using the epoxy resin composition
JP2013191687A5 (en)
WO2008146812A1 (en) Imaging device manufacturing method, imaging device and optical element

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08764747

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08764747

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP