JP2006100516A - Molded substrate and its manufacturing method as well as camera module employing it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a molded substrate capable of surely effecting electric connection between the electrodes of an electronic component, in the molded substrate employed for portable telephone or the like and its manufacturing method as well as a camera module employing it. <P>SOLUTION: The joining places Y1, Y2 of injected thermoplastic resin are molded at fore-and-rear two places pinching an opening 11A at the substantially center of a case 11 molded by injecting the thermoplastic resin in the left-and-right direction, at the substantially center between inside electrode groups constituted of a plurality of conductive electrodes formed so as to be opposed in the left-and-right direction orthogonal to a fore-and-rear direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a molded substrate used for a mobile phone, a manufacturing method thereof, and a camera module using the same.

  In recent years, with the increase in functionality of mobile phones, the number of cameras equipped with camera modules for capturing images has been increasing.

  Such a conventional camera module and a molded substrate used therefor will be described with reference to FIGS.

  FIG. 11 is a perspective view of a conventional molded substrate as viewed from below, and FIG. 12 is a cross-sectional view of the same side view. In FIG. 11, 1 is a case made of a thermoplastic resin having an opening 1A at the center of a substantially square shape. In the vicinity of the opening 1A, there is a protruding portion 1C having a flat bottom surface and a substantially cylindrical upper surface, and a convex portion 1B protruding in a frame shape on the outer periphery of the lower surface.

  Reference numeral 2 denotes a terminal made of a conductive metal plate, which is insert-molded in the case 1. The inner electrode portion 2A is in the vicinity of the opening portion 1A on the lower surface of the projecting portion 1C. An intermediate terminal portion 2B extending to the end, and an outer electrode portion 2C bent from the intermediate terminal portion 2B along the outer periphery of the convex portion 1B and extending to the vicinity of the inner peripheral end of the convex portion 1B are provided.

  Further, the inner electrode portion 2A is continuously provided in the left-right direction before and after the opening 1A, and an inner electrode group is configured to face the front-rear direction from the plurality of inner electrode portions 2A in the left-right direction. Yes.

  The inner electrode portion 2A and the intermediate terminal portion 2B are formed so that the surfaces up to the inner peripheral end of the convex portion 1B are exposed to be flush with the lower surface of the protruding portion 1C, and the remaining portion of the intermediate terminal portion 2B is formed. The molded electrode substrate is configured by being buried and formed so that the outer electrode portion 2C is bent along the convex portion 1B.

  Next, a camera module using this molded substrate will be described with reference to a sectional view of FIG. 13 and a perspective view of FIG.

  In the figure, 3 is a lens, 4 is a lens cover having an opening on the upper surface, 5 is an optical filter for cutting infrared rays out of incident light, and these lens 3, lens cover 4 and optical filter 5 are openings in case 1. It is held and fixed at a predetermined location of the protruding portion 1C protruding in a substantially cylindrical shape on the upper surface in the vicinity of the portion 1A.

  Reference numeral 6 denotes a bare chip of an image pickup device such as a CCD image pickup device or a CMOS image pickup device, and has a light receiving portion 6A on the upper surface, and a plurality of bump electrode portions 6B made of gold, aluminum, or the like on both sides of the light receiving portion 6A. Is formed.

  These bump electrode portions 6B are electrically connected to a plurality of inner electrode portions 2A on the lower surface in the vicinity of the opening 1A of the molded substrate through a conductive paste (not shown), and thermosetting resin (FIG. (Not shown).

  These inner electrode portions 2A are connected to the outer electrode portions 2C via the intermediate terminal portions 2B, and these outer electrode portions 2C are arranged at predetermined locations on the wiring board 7 in which a plurality of wiring patterns 7A are formed on the upper and lower surfaces. The camera module is configured by being electrically connected to and fixed to each other by soldering.

  Further, the camera module configured as described above is connected to an electronic circuit (not shown) of the mobile phone main body via the wiring pattern 7A of the wiring board 7.

  In the above configuration, during imaging, light incident from the opening of the lens cover 4 is refracted by the lens 3, passes through the optical filter 5, and is received by the light receiving portion 6A of the bare chip 6 of the imaging device.

  Then, it is converted into an electric signal by photoelectric conversion in the light receiving portion 6A, and this electric signal is transmitted from the bump electrode portion 6B to the wiring pattern 7A of the wiring substrate 7 through the terminal 2 of the molded substrate, and further through this wiring pattern 7A. Is transmitted to the electronic circuit of the mobile phone body.

  In this molded substrate, the thermoplastic resin melted from an injection molding machine (not shown) flows into a mold (not shown) for molding a molded product as shown in FIG. This molded substrate is manufactured by being injected into the A gate at the left rear end and the B gate at the right rear end.

  At this time, the melted thermoplastic resin flows from the gate A at the left rear end and the gate B at the right rear end merge. X is formed.

  And since this merge location X is intricately intertwined with the filler contained in the thermoplastic resin, the expansion / contraction rate after molding is small as compared with other uniform flow portions.

  Moreover, the expansion / contraction rate of this thermoplastic resin is larger than the expansion / contraction rate of the terminal 2 made of a conductive metal plate.

  For this reason, as shown in FIG. 15, when heat is applied to the case 1 of the molded board when soldering the molded board on which the bare chip 6 is mounted to a predetermined portion of the wiring board 7, the thermoplastic resin from the terminals 2 is used. The resin expanded more greatly, and deformation H in which the left and right direction of the inner electrode group was curved occurred at the junction X where the expansion / contraction rate was small on the lower surface of the protrusion 1C.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 2003-131112 A

  However, in the above-described conventional camera module, the deformation H that occurs at the junction X when the heat is applied to the case 1 of the molded substrate causes non-uniform distortion in the inner electrode group. There has been a problem that there may be a case where the electrode near the center and the bump electrode portion 6B of the bare chip 6 facing the electrode are separated and not electrically connected.

  The present invention solves such a conventional problem, and an object of the present invention is to provide a molded substrate and a camera module using the molded substrate that can reliably perform electrical connection with an electrode of an electronic component. .

  In order to achieve the above object, the present invention has the following configuration.

  The invention according to claim 1 of the present invention is such that the joining portion of the thermoplastic resin to be injected is before and after sandwiching the opening at the substantially center of the case formed by injecting the thermoplastic resin. The molded substrate is configured so as to be formed in a substantially central left-right direction between a group of electrodes composed of a plurality of conductive electrodes formed so as to face each other in the orthogonal left-right direction. When heat is applied to the case, deformation occurs at the central left-right direction between the electrode groups, where the thermoplastic resin joins, but this deformation does not affect the linearity of the electrode groups in the left-right direction. That is, since a non-uniform distortion is not generated in the electrode group, a molded substrate that can be reliably connected to the electrode of the electronic component can be obtained.

  According to a second aspect of the present invention, in the first aspect of the invention, the electrode group connected to the belt-like conductive metal plate at the substantially central portion is continuously processed, and injection molding is performed around the substantially central portion. The thermoplastic resin melted from the machine to the multiple gates of the mold is injected so that the joining point of the injected thermoplastic resin is formed in the left-right direction at the approximate center between the electrode groups. This method is a method of manufacturing a molded substrate that is formed, and has an effect that a molded substrate that can be reliably connected to an electrode of an electronic component can be realized.

  According to a third aspect of the present invention, a camera module is configured by disposing a lens above the opening of the molded substrate according to the first aspect and disposing an image pickup element below the molded substrate. It has the effect that it is possible to obtain a camera module that can reliably perform electrical connection with the electrodes of the image sensor.

  As described above, according to the present invention, it is possible to obtain an advantageous effect that it is possible to obtain a molded substrate and a camera module using the molded substrate that can reliably perform electrical connection with the electrodes of the electronic component.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  In addition, the same code | symbol is attached | subjected to the part of the structure same as the structure demonstrated in the term of background art, and detailed description is simplified.

(Embodiment)
FIG. 1 is a perspective view of a molded substrate according to an embodiment of the present invention as viewed from below, FIG. 2 is a sectional view of the same side view, and 11 is a thermoplastic having an opening 11A at the center of a substantially square shape. In the case made of resin, in the vicinity of the opening 11A, there is a projection 11C that has a flat bottom surface and a substantially cylindrical top surface, and a projection 11B that projects in a frame shape on the outer periphery of the bottom surface. Yes.

  Reference numeral 2 denotes a terminal made of a conductive metal plate, which is insert-molded in the case 11. The inner electrode portion 2A is in the vicinity of the opening portion 11A on the lower surface of the protruding portion 11C. An intermediate terminal portion 2B extending to the end and an outer electrode portion 2C bent from the intermediate terminal portion 2B along the outer periphery of the convex portion 11B and extending to the vicinity of the inner peripheral end of the convex portion 11B are provided.

  In addition, the inner electrode portion 2A is continuously provided in the left-right direction before and after the opening 11A, and an inner electrode group is configured to face the front-rear direction from the plurality of inner electrode portions 2A in the left-right direction. Yes.

  The inner electrode portion 2A and the intermediate terminal portion 2B are formed so that the surfaces up to the inner peripheral end of the convex portion 11B are exposed to be flush with the lower surface of the protruding portion 11C, and the remaining portion of the intermediate terminal portion 2B is formed. The molded electrode substrate is configured by being buried and formed so that the outer electrode portion 2C is bent along the convex portion 11B.

  Next, a camera module using this molded substrate will be described with reference to the cross-sectional view of FIG. 3 and the perspective view of FIG.

  In the figure, 3 is a lens, 4 is a lens cover having an opening on the upper surface, 5 is an optical filter that cuts infrared rays out of incident light, and these lens 3, lens cover 4, and optical filter 5 are openings in the case 11. It is held and fixed at a predetermined location of the protruding portion 11C protruding in a substantially cylindrical shape on the upper surface in the vicinity of the portion 11A.

  Reference numeral 6 denotes a bare chip of an image pickup device such as a CCD image pickup device or a CMOS image pickup device, and has a light receiving portion 6A on the upper surface, and a plurality of bump electrode portions 6B made of gold, aluminum, or the like on both sides of the light receiving portion 6A. Is formed.

  Further, these bump electrode portions 6B are electrically connected to a plurality of inner electrode portions 2A on the lower surface near the opening 11A of the molded substrate through a conductive paste (not shown), and are thermosetting resin (see FIG. (Not shown).

  These inner electrode portions 2A are connected to the outer electrode portions 2C via the intermediate terminal portions 2B, and these outer electrode portions 2C are arranged at predetermined locations on the wiring board 7 in which a plurality of wiring patterns 7A are formed on the upper and lower surfaces. The camera module is configured by being electrically connected to and fixed to each other by soldering.

  Further, the camera module configured as described above is connected to an electronic circuit (not shown) of the mobile phone body via the wiring pattern 7A of the wiring board 7.

  In the above configuration, during imaging, light incident from the opening of the lens cover 4 is refracted by the lens 3, passes through the optical filter 5, and is received by the light receiving portion 6A of the bare chip 6 of the imaging device.

  Then, it is converted into an electric signal by photoelectric conversion in the light receiving portion 6A, and this electric signal is transmitted from the bump electrode portion 6B to the wiring pattern 7A of the wiring substrate 7 through the terminal 2 of the molded substrate, and further through this wiring pattern 7A. Is transmitted to the electronic circuit of the mobile phone body.

  Next, a manufacturing method of the molded substrate configured as described above will be described with reference to a sectional view in side view of FIG. 5 to FIG. 9 and a plan view in downward view of FIG.

  First, as shown in FIG. 5, the central portion 14 of the strip-shaped conductive metal plate 13, the plurality of inner electrode portions 2 </ b> A connected to and extending from the front and rear, and the end portions of the inner electrode portion 2 </ b> A are extended. A plurality of intermediate terminal portions 2B and a plurality of outer electrode portions 2C extending from front to back and left and right from the end portions of the intermediate terminal portions 2B are continuously punched.

  At the same time, the connecting bar 15 extending from the front, rear, left and right outer electrode portions 2C toward the central portion 14 is continuously punched.

  Next, the thermoplastic resin melted from the injection molding machine (not shown) is an inlet to a first mold (not shown) for molding a molded product as shown in FIG. Injection to the gate of A1 at the left rear end and the gate of C1 at the left front end.

  Then, a part of the projecting part 11C1 of the substantially cylindrical projecting part 11C is formed on the upper surface so that the lower surface of the projecting part 11C1 is flat, and the inner electrode part 2A and a part of the surface of the intermediate terminal part 2B are While forming so that it may become the same surface as the lower surface of this protrusion part 11C1, some convex parts 11B1 of the frame-shaped convex part 11B are formed in a lower surface.

  At this time, the melted thermoplastic resin flows from the A1 gate at the left rear end and the C1 gate at the left front end merge. Is formed.

  That is, the joining point Y1 is formed not in the front-rear direction connecting the approximate centers of the front and rear inner electrode groups as described in the background section, but in the left-right direction at the approximate center between the front and rear inner terminal groups.

  Then, as shown in FIG. 7, the connecting portion 12E between the inner electrode portion 2A and the inner central portion 14 is cut by punching to remove the central portion 14 and provide an opening.

  Thereafter, as shown in FIG. 8, the thermoplastic resin is further fed into the left rear end A2 gate and the left front end, which are inlets to a second mold (not shown) for molding a molded product. The remaining projecting portion 11B2 of the frame-shaped projecting portion 11B is formed on the lower surface, and the remaining projecting portion 11C2 of the substantially cylindrical projecting portion 11C is formed on the upper surface.

  At this time, the flow of the molten thermoplastic resin from the gate A2 at the left rear end and the gate C2 at the left front end merges as in the case where the merge point Y1 is formed. It is formed at the approximate center between the front and rear inner terminal groups.

  Then, as shown in FIG. 9, the connecting portion 12D between the outer electrode portion 2C and the outer conductive metal plate 13 is cut by punching, and the outer electrode portion 2C is bent along the convex portion 11B. After that, the connecting rail 15 is removed by cutting or the like to complete the molded substrate.

  Next, a method for manufacturing a camera module using this molded substrate will be described.

  First, the bump electrode portion 6B of the bare chip 6 coated with a conductive paste such as silver is mounted and electrically connected to the inner electrode portion 2A of the molded substrate, and the periphery thereof is bonded and fixed with a thermosetting resin. So-called flip chip mounting is performed.

  Next, a paste-like solder is applied to a predetermined portion of the wiring substrate 7, and the outer electrode portion 2C of the molded substrate is mounted thereon, and is soldered by heating in a high temperature furnace at about 270 ° C. Reflow soldering is performed to electrically connect and fix the outer electrode portion 2 </ b> C of the molded substrate to a predetermined portion of the wiring substrate 7.

  At this time, as shown in FIG. 10, when heat is applied to the case 11 of the molded substrate, the thermoplastic resin expands more than the terminal 2, and the joining portion Y1 has a small expansion / contraction rate on the lower surface of the protruding portion 11C. And the deformation I that curves at the boundary Y2 occurs, but since this deformation I does not affect the linearity of the inner electrode group in the left-right direction, that is, the inner electrode group does not cause non-uniform distortion. The electrical connection between the group and the bump electrode portion 6B of the bare chip 6 facing the group can be reliably performed.

  Thus, according to the present embodiment, before and after the junctions Y1 and Y2 of the injected thermoplastic resin sandwich the substantially central opening 11A of the case 11 formed by injecting the thermoplastic resin, By forming the molded substrate so as to be formed in a substantially central left-right direction between the inner electrode groups composed of a plurality of conductive electrodes formed facing the left-right direction perpendicular to the front-rear direction. When the heat is applied to the case 11 of the molded substrate, a deformation I occurs at the substantially central left-right direction between the inner electrode groups that are the joining points Y1 and Y2 of the thermoplastic resin. In order not to affect the linearity of the right and left direction of the electrode, that is, to prevent non-uniform distortion in the inner electrode group, and a molded substrate that can be securely connected to the electrode of the electronic component and its use Camera module Those which can be obtained Le.

  Further, the inner electrode group connected at the central portion 14 is continuously processed on the strip-shaped conductive metal plate 13 and melted around the central portion 14 from the injection molding machine to a plurality of gates of the mold. By injecting the thermoplastic resin so that the joining points Y1 and Y2 of the injected thermoplastic resin are formed in the substantially horizontal direction between the inner electrode groups, and forming the case 11, the electrode of the electronic component It is possible to easily manufacture a molded substrate that can be reliably connected to the electrical connection.

  In the above description, the gates are provided at the front and rear ends on the left side of the outer periphery of the case 11, and the thermoplastic resin merging points are formed in the substantially horizontal direction between the front and rear inner electrode groups. Instead of the above, the present invention can be implemented even if the gate is provided at substantially the center in the front and rear of the outer periphery of the case 11 and the joining point of the thermoplastic resin is formed in the left and right direction at the substantially center between the front and rear inner electrode groups. It is.

  In addition, although the terminal 2 and the connecting beam 15 are described as being formed by punching, the terminal 2 and the connecting beam 15 may be formed by etching or the like instead.

  The molded substrate according to the present invention, the manufacturing method thereof, and the camera module using the molded substrate can obtain a molded substrate capable of reliably performing electrical connection with an electrode of an electronic component and a camera module using the molded substrate. It has an advantageous effect and is useful for a molded substrate used for a mobile phone or the like, a manufacturing method thereof, a camera module using the same, and the like.

The perspective view of the downward view of the shaping | molding board | substrate by one embodiment of this invention Cross section of side view of the molded substrate Cross section of side view of the camera module Perspective view of the camera module (A) Cross-sectional view in side view showing the method for manufacturing the molded substrate, (b) Plan view in downward view showing the method for manufacturing the molded substrate (A) Cross-sectional view in side view showing the method for manufacturing the molded substrate, (b) Plan view in downward view showing the method for manufacturing the molded substrate (A) Cross-sectional view in side view showing the method for manufacturing the molded substrate, (b) Plan view in downward view showing the method for manufacturing the molded substrate (A) Cross-sectional view in side view showing the method for manufacturing the molded substrate, (b) Plan view in downward view showing the method for manufacturing the molded substrate (A) Cross-sectional view in side view showing the method for manufacturing the molded substrate, (b) Plan view in downward view showing the method for manufacturing the molded substrate Perspective view of the bottom view when heating the molded substrate A perspective view of a conventional molded substrate viewed from below Cross section of side view of the molded substrate Cross section of side view of the camera module Perspective view of the camera module Perspective view of the bottom view when heating the molded substrate

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 11 Case 1A, 11A Opening part 1B, 11B Protrusion part 1C, 11C Projection part 2 Terminal 2A Inner electrode part 2B Intermediate terminal part 2C Outer electrode part 3 Lens 4 Lens cover 5 Optical filter 6 Bare chip 6A Light receiving part 6B Bump electrode part 7 wiring board 7A wiring pattern 11B1 part of convex part 11B2 remaining part of convex part 11C1 part of protruding part 11C2 remaining part of protruding part 12D, 12E connecting part 13 conductive metal plate 14 central part 15 connecting bar

Claims (3)

It is formed by injecting molten thermoplastic resin from an injection molding machine, and has an opening at the approximate center and a flat surface around the opening, and is exposed on the flat surface of the case. In addition, an electrode group composed of a plurality of conductive electrodes formed to face in the left-right direction orthogonal to the front-rear direction before and after sandwiching the opening for electrical connection with the electrode of the electronic component A molded substrate in which the joining portion of the injected thermoplastic resin is formed in a substantially lateral direction between the electrode groups. A group of electrodes connected at a substantially central portion is continuously processed on a strip-shaped conductive metal plate, and a thermoplastic resin melted from an injection molding machine to a plurality of gates of a mold is formed around the substantially central portion. The method for producing a molded substrate according to claim 1, wherein the case is formed by injecting so that a joining portion of the injected thermoplastic resin is formed in a substantially central left-right direction between the electrode groups. A camera module in which a lens is disposed above the opening of the molded substrate according to claim 1 and an imaging element is disposed below.

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