JP2007043628A - Camera module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a camera module which is accomplished in miniaturization and is excellent in waterproof property. <P>SOLUTION: In a camera module 1 according to the present invention, a sensor chip 5 for conversion into an electric signal in accordance with light made incident through a lens part 2a is fixed on a step provided on an inner lateral side of a lens barrel 2b for supporting the lens part 2a. Furthermore, a seal 4 for sealing the relevant sensor chip 5 is fixed on a step, outside the sensor chip 5, provided on the inner lateral side of the lens barrel 2b. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a camera module used for, for example, a camera-equipped mobile phone or a vehicle-mounted camera.

  In recent years, there has been an increasing demand for miniaturization of cameras centering on camera-equipped mobile phones. Of course, there is a demand for downsizing even in a digital still camera, but there are two flows for size, namely, upsizing and downsizing depending on the level of performance and function. Among the cameras that follow the trend toward larger sizes, there is a digital still camera that has the same performance as a film single-lens reflex camera. In this digital still camera, in addition to the pursuit of the imaging performance of the lens, it is necessary to pursue the high S / N and high dynamic range performance of the sensor. Therefore, it is necessary to mount a large lens and a large-size imaging sensor. Therefore, this digital still camera has a size close to that of a film single-lens reflex camera.

  There is a digital still camera for snapping that uses the portability as an appealing point as a camera along the trend of miniaturization. In the digital still camera for snapping, a small camera aiming at thinning, miniaturization, and weight reduction has become the mainstream. However, even though it is a small camera, there is a demand for improved handling and higher pixels, so the demand for ultra-small size is not high.

  On the other hand, since a camera mounted on a mobile phone is housed in a housing of the mobile phone, ultra-miniaturization is strongly desired from the viewpoint of thickness and volume. Furthermore, ultra-miniaturization is essential from the viewpoint of low power consumption.

  Further, in addition to ultra-miniaturization, a camera mounted on a mobile phone is desired to be reduced in cost. In particular, a reduction in cost is strongly desired for a camera module that constitutes a sub camera used for photographing itself.

  As camera modules have become smaller and lower in cost, applications other than mobile phones have been created. Another application is in-vehicle use. Conventionally, a rear confirmation camera is known as an in-vehicle camera. Recently, however, there are other uses such as a side confirmation camera, a lane detection camera, an in-vehicle rear monitoring camera, and a driver monitoring camera. In these applications, since it is necessary to mount many cameras, it is expected that the demand for low-cost camera modules will increase.

  Such mobile phone cameras and in-vehicle cameras are required to be completely waterproof, vibration resistant and robust. In addition, cameras for outdoor surveillance, leisure use, and the like are also required to be completely waterproof, vibration resistant, and robust.

  On the other hand, since miniaturization and cost reduction are major goals of camera module development, various proposals have been made. For example, Patent Document 1 discloses a technology for reducing the size by integrating a lens and a sensor chip by placing a lens housing in which a lens and a lens barrel are integrated on the front surface of a CCD chip in contact with the sensor chip. Has been. In the camera module described in Patent Document 1, assuming that the dimensional accuracy of the lens housing is lowered by contacting the lens housing with the sensor chip, the side surface of the sensor chip is processed into a step shape, and the lens housing is provided there. The device is made to contact.

Patent Document 2 proposes a lens-integrated substrate in which a thickness corresponding to a lens barrel portion is given to a substrate having an element mounting pattern, and an imaging lens is integrated with the substrate using the thickness. Has been. Furthermore, Patent Document 3 discloses an example in which a component or a sensor chip is mounted on a substrate provided with a signal lead, and the substrate and the sensor chip are connected by bonding. Structurally, an adjustment mechanism is not required by preparing a lens part that integrates the leg part corresponding to the lens barrel and the imaging lens and making it contact the sensor chip in substantially the same manner as in Patent Document 1. I have to.
JP-A-9-312809 JP 2003-125294 A JP 2003-250072 A

  First, the conventional camera modules described in Patent Documents 1 to 3 do not have a structure for improving water resistance. Further, in Patent Documents 1 to 3, the size is reduced by adopting a structure in which the lens is brought into direct contact with the sensor. However, in Patent Documents 1 and 3, a CCD sensor is assumed, and the processing from the sensor to the substrate is performed. Since the signal processing is performed by a processing circuit on a substrate different from the sensor, the circuit module is not sufficiently miniaturized. In Patent Document 2, a CMOS sensor is assumed, but since the lens integrated substrate is formed by integrating the substrate portion on which the processing circuit and components are arranged and the lens portion, miniaturization is achieved as the module structure itself. Not done.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a camera module that achieves miniaturization and is excellent in waterproofness.

  A camera module according to the present invention includes a lens unit, a lens barrel that supports the lens unit, a sensor chip that is fixed to the lens barrel and converts an electric signal according to light incident through the lens unit, A seal is provided outside the sensor chip and seals the sensor chip.

  Here, it is preferable that the lens portion and the lens barrel are integrally formed. The lens barrel is provided with a step portion on the inner side surface thereof, and a wiring is provided from the step portion to the bottom surface of the lens barrel. The sensor chip has a sensor pad directly connected to the wiring of the step portion. Or it is good to fix to the said level | step-difference part so that it may contact indirectly.

  Further, it is preferable that the wiring extends from the stepped portion through the lens barrel to the outside of the lens barrel, and is further formed along the outer surface of the lens barrel to the bottom of the lens barrel.

  Further, the wiring may be socketed on the outer surface of the lens barrel. Moreover, it is preferable that a step portion is provided on the inner side surface of the recording tube, and the seal is fixed to the step portion.

  Furthermore, the sensor chip may be fixed to the bottom surface of the lens barrel, and the seal may have a recess, and the sensor chip may be fixed to the lens barrel at an end in a state where the sensor chip is accommodated in the recess. Here, it is preferable that a wiring for connecting a sensor pad of the sensor chip and a wiring of an external substrate provided outside the seal is formed from the bottom of the lens barrel to the outer surface of the seal. Further, the wiring may be constituted by an internal wiring formed on the bottom surface of the lens barrel and an external wiring formed from the top of the side wall for forming the concave portion in the seal to the outer surface. .

  In the lens barrel, it is desirable that an inner side surface directed downward from the vicinity of the lens portion is a slope inclined with respect to the optical axis of the lens portion. The lens portion and the lens barrel may be formed by different material molding. Furthermore, it is preferable that the sensor chip includes a circuit that converts a parallel signal generated in the sensor chip into a serial signal and outputs the serial signal.

  The wiring for connecting the sensor chip and the external substrate is preferably formed by molding different materials together with the lens portion and the lens barrel. Moreover, it is preferable that the wiring for connecting the sensor chip and the external substrate protrudes outside the lens barrel at the bottom of the lens barrel. Here, it is preferable that the portion of the wiring protruding outside the lens barrel is melted and connected to the wiring of the external substrate.

  Further, it is desirable that a light shielding part is formed in a part of the lens barrel, and the light shielding part is formed by molding at least a different material from the lens part.

  Furthermore, an actuator may be provided between the lens unit and the lens barrel. In this case, it is desirable that wiring for connecting the terminal of the actuator and the wiring of the external substrate is formed in the lens barrel.

  The lens unit includes a first lens and a second lens, and the camera module further includes a first actuator that drives the first lens and a second actuator that drives the second lens. Two actuators may be provided. In this case, the first actuator is connected to the wiring of the external substrate by the wiring formed in the lens barrel, and the second actuator is connected to the wiring of the external substrate through the first actuator. It is preferable.

  In addition, a wiring for electrically connecting a functional component provided in the vicinity of the lens unit and a sensor pad of the sensor chip may be formed in the lens barrel.

  ADVANTAGE OF THE INVENTION According to this invention, while achieving size reduction, the camera module excellent in waterproofness can be provided.

Embodiment 1 of the Invention
FIG. 1 is a structural diagram showing a schematic cross section of a camera module according to Embodiment 1 of the present invention. In the following description, the incident surface side of the lens will be described as the upper side, and the output surface side will be described as the lower side.

  As shown in FIG. 1, the camera module 1 is mounted on a parent substrate 6 and basically includes a lens mold 2, a sensor 5, and a seal 4. The lens mold 2 is configured by integrally forming a lens portion 2a and a lens barrel portion 2b. The lens unit 2 a forms an image of light incident from the outside on the imaging area 5 a of the sensor 5.

  The lens barrel portion 2b has a circular upper surface portion extending radially from the periphery of the lens portion 2a and a side surface portion extending in a cylindrical shape below the upper surface portion. The outer surface of the side surface portion is a uniform curved surface, but as the inner surface goes downward, that is, away from the lens portion 2a, a plurality of step portions are provided on the inner surface, and the inner periphery becomes wider stepwise. Yes. That is, the surface parallel to the upper surface of the lens barrel 2b, that is, the surface perpendicular to the optical axis of the lens 2a, the lower surface (hereinafter referred to as the lens forming surface 2b1) on which the lens 2a is formed, and the sensor 5 are arranged. The lower surface (hereinafter referred to as sensor arrangement surface 2b2) and the lower surface (hereinafter referred to as seal arrangement surface 2b3) on which the seal 4 is arranged are formed. Similarly, as a surface perpendicular to the upper surface of the lens barrel portion 2b, a side surface located in the space where the lens portion 2a is formed, a side surface where the sensor 5 is disposed, and a side surface where the seal 4 is disposed are formed.

  A surface light shielding portion 2c is continuously formed from the outer edge on the upper surface side of the lens portion 2a to the outer surface of the lens barrel portion 2b. The surface light-shielding part 2c is provided in order to prevent external light from entering from a region other than the lens part 2a.

  A back-surface light-shielding portion 2d is continuously formed from the outer edge on the lower surface side of the lens portion 2a to the inner surface of the lens barrel portion 2b. Specifically, the rear surface light-shielding portion 2d is provided on the lens forming surface 2b1 and the side surface between the lens forming surface 2b1 and the sensor arrangement surface 2b2. The back surface light-shielding part 2d is provided to prevent reflection or the like on the inner surface of the lens mold 2.

  An internal wiring 3 is formed on the inner side surface from the sensor arrangement surface 2b2 to the outside of the lens barrel portion 2b. The internal wiring 3 is formed integrally with the lens mold 2. The internal wiring 3 provided on the sensor placement surface 2b2 is connected to the sensor pad 5b through the contact portion 3a. Further, the internal wiring 3 provided at the lower end of the lens barrel 2b is connected to the parent board wiring 6b.

  The sensor 5 is an image sensor chip for imaging, and an imaging area 5a is provided at the center of the upper surface, and a plurality of sensor pads 5b are also provided at the periphery of the upper surface. The sensor 5 is disposed inside the lens barrel portion 2b with the imaging area 5a facing upward, and the sensor pad 5b is fixed to the lens barrel portion 2b by being connected to the internal wiring 3 via the contact portion 3a.

  Inside the lens mold 2, the seal 4 is arranged on the seal arrangement surface 2 b 3 and fixed with an adhesive or the like. The seal 4 is provided outside the sensor 5 in order to seal the sensor 5. The seal 4 has a shape along the shape of the inner surface of the lens barrel portion 2b. The seal 4 according to this example is a circular flat plate. The seal 4 is made of, for example, a synthetic resin.

  The parent substrate 6 is an external substrate on the other side on which the camera module 1 is mounted. The parent substrate 6 and the camera module 1 are electrically connected by a parent substrate contact 6a such as solder or conductive resin. The parent substrate 6 may be a so-called rigid substrate or a flexible substrate, and is illustrated as a connection destination of the camera module 1. The parent substrate wiring 6 b is a circuit wiring that is laid on the parent substrate 6 and uses the camera module 1.

  FIG. 2A is a schematic view seen from the upper surface of the sensor 5. An imaging area 5a is provided at the center of the sensor 5, and a sensor circuit section 5c is provided outside the imaging area 5a. Further, a plurality of (in this example, ten) sensor pads 5b are provided outside the sensor circuit portion 5c.

  The external light incident through the lens unit 2a enters the imaging area 5a. The imaging area 5a is converted into an electric signal according to the intensity of light. The sensor circuit unit 5c processes the converted electrical signal and outputs the processed electrical signal from the sensor pad 5b to the outside of the sensor. The sensor circuit unit 5c includes a circuit that generates and outputs an imaging drive signal for the imaging area 5a, a circuit that performs A / D conversion of the imaging signal, and performs image processing. The sensor 5 is, for example, a CMOS sensor. In this example, the captured image is output from the sensor 5 in the form of a processed video signal, so that the camera module 1 does not require an external circuit such as video signal processing that is conventionally required.

  FIG. 2B is a schematic view of the lens mold 2 viewed from the inside, that is, from the lower side (the exit surface side of the lens portion 2a). As shown in the figure, of the internal wiring 3 provided in the lens mold 2, the sensor connection portion 3c is connected to the sensor pad 5b. Similarly, the internal wiring 3 is connected to the parent substrate wiring 6b at the parent substrate connecting portion 3d.

  Next, a method for assembling the camera module 1 will be described. First, the sensor 5 is arranged inside the lens mold 2 on which the front surface light shielding portion 2c and the rear surface light shielding portion 2d are formed, and the sensor pad 5b and the sensor connection portion 3c of the internal wiring 3 are fixed by the contact portion 3a.

  Here, the connection method of the sensor pad 5b and the sensor connection part 3c is demonstrated in detail using FIG. FIG. 3A is a cross-sectional view showing a first connection method. In this method, the sensor 5 is adsorbed and fixed to the assembly jig 8 by the sensor adsorbing duct 8b. In this example, the sensor pad 5b and the sensor connection portion 3c are connected and fixed by the bump 3a1. Specifically, first, the sensor 5 is sucked onto the assembly jig 8 by suction from the sensor suction duct 8a, and then the sensor pad 5b and the sensor connection portion 3c are crimped and connected via the bump 3a1. When connecting, the height of the bump may be increased in advance, the height may be adjusted by the amount of movement of the assembly jig 8, and the back focus of the lens may be adjusted. Further, the bump 3a1 and the wiring can be made of gold, and ultrasonic connection can be applied at the time of connection to strengthen the connection. Furthermore, an anisotropic positive conductor or an adhesive may be applied around the bump 3a1 to fix it more firmly, or an underfill resin may be filled and fixed in the gap.

  When such a jig is used, if the imaging area 5a of the sensor 5 is observed with an observation device having an infinite system from the outside of the camera module (not shown) through the lens unit, imaging is performed according to the back focus adjustment amount. Although the appearance of the microlenses and the like on the area 5a changes, when the back focus is adjusted to an infinite position, the image of the microlens is also observed almost satisfactorily, and focus adjustment can be performed based on this. It becomes possible. This adjustment method can absorb the molding difference of the lens barrel portion of the lens mold and the focal length error of the lens portion.

  In the second connection method, connection / fixation is performed by the conductive adhesive 3a2. Even in this method, the back focus adjustment can be realized by the method described above.

  After the contact between the sensor 5 and the internal wiring 3 is established, a subject image such as a collimator placed outside the lens unit may be captured, and the back focus adjustment may be performed based on the imaging signal from the internal wiring 3.

  Next, the seal 4 is fixed to the seal arrangement portion 2b3 of the lens mold 2 with an adhesive or the like. In this way, the sensor 5 is sealed by the seal 4. Furthermore, the parent substrate wiring 6b and the parent substrate connecting portion 3d of the internal wiring 3 are connected using a parent substrate contact 6a such as solder. The internal wiring 3 is formed integrally with the lens mold 2. As a forming method, there is a method of generating a wiring by surface modification with supercritical fluid and plating thereby, but other generation methods and sensor This will be described in more detail later, including the contact method.

  Since the camera module 1 according to the embodiment of the present invention is sealed by the seal 4, it is excellent in water resistance. Further, in the camera module 1, the height direction of the camera module is substantially determined by the optical length of the lens design, and the vertical and horizontal directions are substantially determined by the size of the sensor chip, so that the miniaturization can be realized.

  In the embodiment of the present invention, it has been described that the electrical connection between the camera module 1 and the parent substrate 6 is performed by the parent substrate contact 6a by solder or the like. Good. In the camera module 1 according to the embodiment of the present invention, since the sensor 5 is sealed by the seal 4 and has excellent heat resistance, a material such as molding optical glass is selected for the lens mold 2. It is also possible to perform melt bonding by the reflow method.

  Usually, in order to improve imaging sensitivity, the sensor 5 often has a microlens array mounted on the imaging area 5a. The microlens is formed, for example, by heating a microlens member that has been cut into a mymesh shape and processing it into a lens shape using surface tension. Therefore, the heat resistance temperature of the microlens is low, and accordingly, the heat resistance of the sensor 5 is also low. Therefore, the sensor 5 may not be able to withstand the heating due to solder reflow. However, in the camera module 1 according to the embodiment of the present invention, since the sensor 5 is sealed and protected by the seal 4, the temperature rise of the sensor 5 is delayed with respect to the external temperature rise caused by reflow. For this reason, it is possible to finish the reflow bonding before the temperature rises to the heat resistance temperature of the microlens, and as a result, it is possible to configure a camera module that is resistant to heating during reflow.

Embodiment 2 of the Invention
FIG. 4 is a schematic cross-sectional view of a camera module according to the second embodiment of the invention. In the same figure, the component which has the same number as the component shown in FIG. 1 is a component which has the same effect | action.

  As shown in FIG. 4, the camera module 1 according to the second embodiment of the invention is different from the camera module according to the first embodiment of the invention in the structure of the lens barrel 2 b and the seal 4 of the lens mold 2.

  In Embodiment 2 of the invention, the inner surface of the lens barrel portion 2b is formed in a flat shape and has no stepped portion. The sensor 5 is fixed to the bottom surface (lower surface) of the lens barrel portion 2b via a wiring 31 with a contact. The wiring 31 with a contact includes a contact and a wiring connected to the contact. The sensor pad 5b is located closer to the inside of the bottom surface of the lens barrel 2b, and is in contact with the contact of the wiring 31 with contact at this position. The wiring of the wiring 31 with a contact extends from the contact provided closer to the inner side to the outer side to the vicinity of the outer surface of the lens barrel portion 2b.

  In this example, unlike the internal wiring 3 according to the first embodiment of the present invention, the contact-provided wiring 31 is provided on a flat surface without being bent, so that manufacturing is easy. The wiring 31 with contacts is electrically connected to the external wiring 32 attached to the seal 4 by a conductive adhesive or crimping.

  The seal 4 is formed with a side wall extending upward at the periphery, and has a concave shape opening upward. The top part of the side wall of the seal 4 is fixed in contact with the bottom surface of the lens barrel part 2 b of the lens mold 2. The seal 4 is made of, for example, a synthetic resin. By storing the sensor 5 in the recess of the seal 4, the sensor 5 is sealed by the seal 4.

  External wiring 32 is continuously formed from the top of the side wall of the seal 4 to the outer surface. A portion located at the top of the external wiring 32 is brought into contact with the wiring 31 with a contact to establish conduction. The external wiring 32 and the wiring 31 with a contact are located between the bottom surface of the lens barrel 2 b of the lens mold 2 and the top of the side wall of the seal 4. The external wiring 32 extends to the vicinity of the bottom surface (lower surface) of the seal 4 on the outer surface.

  The seal 4 is disposed on the parent substrate 6 so that the end of the external wiring 32 is positioned on the parent substrate wiring 6b. The end of the external wiring 32 is electrically connected to the parent substrate wiring 6b by the parent substrate contact 6a.

  Also in the camera module according to the second embodiment of the invention, the waterproof property can be enhanced by the seal.

Embodiment 3 of the Invention
FIG. 5 is a schematic sectional view of a camera module according to the third embodiment of the invention. 5, components having the same numbers as those shown in FIG. 1 are components having the same action. The camera module 1 according to the third embodiment of the invention is characterized by the structure of the lens mold 201.

  The lens mold 201 includes a lens portion 2a, a lens barrel light shielding portion 2e, and a lens barrel transmission portion 2f. In this example, the lens part 2a and the lens barrel transmission part 2f are integrally formed of the same light-transmitting material. The lens barrel light shielding portion 2e is formed of a material different from those of the lens portion 2a and the lens barrel transmission portion 2f. The lens mold 201 is formed by different material molding (so-called two-color molding) in which two kinds of materials are bonded in a molding process so that different molded material characteristics coexist in one molded product.

  In the embodiment of the present invention, a molding lens material such as ZEONEX (registered trademark: ZEON CORPORATION) is used for the lens portion 2a and the lens barrel transmission portion 2f. Further, a material suitable for light shielding such as GRP (glass reinforced plastic) is used for the lens barrel light shielding portion 2e.

  In this example, since the lens portion 2a and the sensor arrangement surface 2b2 are integrally formed, the relative positional accuracy of the lens portion 2a and the sensor 5 fixed to the sensor arrangement surface 2b2 can be increased. Further, since GRP (glass reinforced plastic) or the like, which is usually used for manufacturing a lens barrel or the like, is used for the lens barrel light shielding portion 2e, the heat resistant temperature of the lens barrel light shielding portion 2e is set higher than that of the lens barrel transmission portion 2f. Therefore, even if the heat resistance of the lens portion 2a is not high, soldering processing by a hot air overheating method or the like can be performed at the connection between the internal wiring 3 and the parent substrate wiring 6b, and the options of the manufacturing method are expanded. be able to.

  Furthermore, the camera module 1 according to the embodiment of the present invention has an antireflection structure 2g. Specifically, the antireflection structure 2g is a structure in which the inner side surface of the lens barrel transmission portion 2f expands downward in a conical shape. By providing such an antireflection structure 2g, it is possible to prevent the obliquely incident light of the lens portion 2a from entering the imaging area 5a through the lens mold 201 other than the lens portion 2a.

Embodiment 4 of the Invention
The camera module according to the fourth embodiment has a feature in the structure of the lens module. FIG. 6 shows a schematic cross-sectional view of a lens module according to Embodiment 4 of the present invention. In the same figure, the component which has the same number as the component shown in FIG. 1 is a component which has the same effect | action.

  FIG. 6A shows a first support structure. Its structure is the same as the example shown in FIG. The problem of the focal plane movement due to the focal length of the lens portion 2a and the temperature change of the lens barrel portion 2b can be solved by the optical design of the lens portion 2a because the lens portion 2a and the lens barrel portion 2b are made of the same material. it can.

  FIG. 6B shows a second support structure. In the second support structure, the lens portion 2a and the lens barrel portion 2b are formed of different materials by two-color molding. In such a structure, the choice of the material and structure of the lens barrel portion 2b increases, so that it is easier to solve the problem related to the movement of the focal plane due to temperature compared to the first support structure.

Embodiment 5 of the Invention
The camera module according to the fifth embodiment of the present invention is characterized by wiring that connects the sensor pad and the parent substrate wiring. FIG. 7 is a schematic cross-sectional view of a camera module according to Embodiment 5 of the present invention. In the same figure, the component which has the same number as the component shown in FIG. 1 is a component which has the same effect | action.

  As shown in FIG. 7, the contact-attached wiring 3f according to the fifth embodiment of the present invention penetrates through the inside of the lens barrel portion 2b of the lens mold 2, extends to the outside, and is further formed to the bottom of the lens barrel portion 2b. ing. The contact-attached wiring 3f is constituted by a so-called lead frame.

  FIG. 8 is an explanatory diagram showing a state of processing of the wiring. As shown in FIG. 8A, the frame 31 has a contact portion 31a formed at the end thereof. After this frame 31 is placed in an injection mold, a resin is injected to perform injection molding. As a result, as shown in FIG. 8 (b), the frame 31 penetrating the lens barrel 2b of the lens mold 2 can be formed. Next, the frame 31 is moved in the direction indicated by the arrow in FIG. 8 (b). By bending, the lens mold 2 having a wiring structure as shown in FIG. 8C can be created.

  In the configuration shown in FIG. 8D, it is assumed that the camera module 1 is connected to a socket. In this case, as shown in FIG. 8D, socket processing is performed by bending the frame 31 in the vicinity of the end so that part of the frame 31 protrudes outward.

Embodiment 6 of the Invention
In the camera module according to Embodiment 6 of the present invention, downsizing and cost reduction are achieved by devising the sensor. In FIG. 9, the light receiving element 51 of the sensor 5 converts the light incident through the lens unit 2a into a video signal and outputs it. The A / D conversion circuit and signal processing circuit 52 digitally converts the video signal output from the light receiving element 51 and performs predetermined signal processing. The parallel-serial conversion circuit 53 inputs the video signal after the signal processing, converts it into a serial signal, and outputs it.

  The serial-parallel conversion circuit 61 inputs a video signal of a serial signal and converts it into a parallel signal. The serial-parallel conversion circuit 61 is provided outside the sensor 5, for example, provided on the parent substrate 6. The host circuit 62 is a circuit that uses a video signal converted into a parallel signal. The host circuit 62 is provided on the parent substrate 6, for example.

  According to the sixth embodiment of the present invention, since information is exchanged between the camera module 1 and the parent substrate 6 by serial signals, the number of interface wires is reduced, thereby reducing the internal wiring laid on the module. In addition, cost reduction, ultra miniaturization, and the like can be achieved.

  Furthermore, the ease of forming and assembling the camera module can be increased by reducing the number of wires for the interface. Specifically, as the sensor chip is miniaturized and the wiring rule is miniaturized from micron to submicron, the contact pad itself or the distance between the pads is narrowed. Accordingly, in the production of the lead frame wiring portion attached to the lens mold described above, further fine patterning is required, which increases the difficulty of mold production. Therefore, by adopting the configuration of the sixth embodiment of the present invention, the number of interface wires can be reduced, the number of necessary pads can be reduced, and the distance between the pads can be prevented from being narrowed. Can be improved.

Embodiment 7 of the Invention
In the camera module according to the third embodiment of the present invention, the example in which the lens barrel light shielding portion and the lens portion are formed by two-color molding has been shown. However, in the camera module according to the seventh embodiment of the present invention, the internal wiring and the lens portion are illustrated. Is formed by two-color molding.

  In FIG. 10, the internal wiring 3g is provided continuously from the stepped inner surface to the bottom surface of the lens barrel 2b. The internal wiring 3 is formed by two-color molding together with the lens mold 201. In this example, the material of the lens part 2a that transmits light and the lens mold 201 is a plastic material that is an electrically insulating material such as ZEONEX, while the material of the internal wiring 3g is a conductive plastic that has electrical conductivity. is there. With this internal wiring 3, the sensor 5 and the parent substrate wiring 6b can be connected from the sensor pad 5b through the contact portion 3a, the internal wiring 3g, and the parent substrate contact 6a.

  Further, as shown in FIG. 11, the lens barrel light-shielding portion 2h may be formed by molding different materials together with the other lens mold 201 and the internal wiring 3g. The lens barrel light-shielding portion 2h is formed of the same material as the internal wiring 3g, and is formed of, for example, a conductive and light-shielding material obtained by adding a material such as carbon to conductive plastic.

  In the example shown in FIG. 11, the shape of the internal wiring 3g on the parent substrate 6 side is further changed from the example shown in FIG. That is, the internal wiring 3g extends outward and protrudes at the bottom of the lens barrel portion 2b, thereby forming a parent substrate contact 6c.

  Fig.12 (a) shows the cross-section 9c part of FIG. The internal wiring 3g is formed on the inner side by two-color molding so as to be flush with the sensor arrangement surface 2b2 of the lens mold 201. Therefore, since the cross-sectional area of the internal wiring 3g can be increased, the wiring resistance can be reduced. Internal wiring 3g is connected to sensor pad 5b through contact portion 3a. In this case, since the contact portion 3a is made of a gold bump or the like and the shape of the contact portion 3a can be deformed by applying pressure, the distance between the lens mold 201 and the sensor 5 can be adjusted. Therefore, the back focus can be adjusted also in this example. After adjustment of the back focus, it may be more firmly fixed with an underfill resin or the like.

  FIG. 12B shows another configuration example of the cross section 9c of FIG. The internal wiring 3g is formed by injection molding inside a hollow structure provided in the lens mold 201 as shown in the figure. The internal wiring 3g is formed so as to form a recess inside the sensor arrangement surface 2b2 of the lens mold 201. The internal wiring 3g in the hollow portion and the sensor pad 5b are connected via the contact portion 3a. From such a state, as shown in FIG. 12C, the contact portion 3a is deformed by applying pressure to narrow the distance between the sensor 5 and the lens mold 201, and the sensor 5 and the lens mold 201 are directly connected. It is brought into contact with and brought into electrical contact with it. At this time, an adhesive or the like may be applied to the contact portion between the two and the lens mold 201 and the sensor 5 may be brought into contact with each other to be bonded. Further, an adhesive resin such as an underfill resin may be filled and fixed around the sensor 5 or the like. When the sensor 5 and the lens mold 201 are in contact with each other as shown in FIG. 12C, the distance between the lens portion 2a of the lens mold 201 and the sensor 5 is such that the lens mold 201 including the lens portion 2a is molded. It is determined by the accuracy of time, and this determines the back focus setting accuracy of the lens unit 2a. Therefore, if accuracy management is performed, a camera module with adjusted back focus can be manufactured without adjusting back focus, and productivity can be improved and module cost can be reduced.

  FIG. 13A shows a configuration example of the cross section 9d in FIG. 11, and FIG. 13B shows a configuration example of the connection portion 9e. As shown in FIG. 13A, in this configuration example, there is no step on the contact surface between the internal wiring 3g and the lens mold 201. Also, as shown in FIG. 13B, the internal wiring 3g protrudes outside the lens mold 201. When the internal wiring 3g is protruded in this way, this protruding portion can be used as a contact portion with the parent substrate wiring 6b.

  FIG.13 (c) shows another structural example of the connection part 9e in FIG. In this example, once the camera module 1 and the parent substrate 6 are brought into contact with each other, the externally exposed portion of the internal wiring 3g is melted and bonded by thermal reflow or the like, thereby establishing a contact. For this reason, the corner of the end of the internal wiring 3g is rounded. At this time, if the material is colored, laser welding can be performed, and since the contact portion protrudes outside the lens mold 201, spot welding can be performed by ultrasonic welder welding or the like. Therefore, the internal wiring 3g does not need to have a lower melting point than the lens mold 201, and a material with a higher melting point can be used.

  Also, as shown in FIG. 13 (d), the internal wiring 3g and the internal wiring 3g can be obtained by pasting or printing a thermal contact member 6d or an adhesive for facilitating adhesion on the parent substrate wiring 6b. Connection of the parent substrate wiring 6b can be facilitated.

  An example in which the internal wiring 3g protrudes outside the lens mold 201 is shown as a configuration for facilitating the connection between the internal wiring 3g and the parent substrate wiring 6b. A molding method for forming such a configuration will be described with reference to FIG. . The camera module 1 shown in FIG. 14 has the same configuration as that shown in FIG. 11, but shows only the shape of the mold body from which the sensor 5 and the like are removed for the purpose of explaining the molding method. FIG. 14A is a cross-sectional view of the camera module, and a ridge line 201b is a ridge line generated by a step in the mounting portion in the mold that has been hidden because the sensor 5 is mounted. FIG. 14B is a diagram showing a cross section 9g of FIG. The arrangement of the lens barrel light shielding portion 2h is filled up to the lower end of the lens mold 201 and covers the periphery of the mold.

  FIG. 14C shows an example of a resin injection port when the lens mold 201 having such a structure is manufactured by injection molding. In the figure, 202a is a resin injection port. After the lens mold 201 including the lens portion 2a is injection-molded by injecting resin from the injection port 202a, the internal wiring 3g and the lens barrel light-shielding portion 2h are simultaneously injection-molded by injecting another resin again. . Thereafter, by cutting along the cutting separation line 202b, the internal wiring 3g having a structure protruding to the outside of the lens mold 201 can be formed while forming the lens barrel light shielding portion 2h.

  In addition, although it has been described that such an internal wiring is formed by two-color molding, in this example, a conductive material is injected into the upper and lower surfaces of the lens mold 201. Normally, in two-color molding, resin is injected and molded at an appropriate time while replacing the mold. Therefore, in the molding method shown in FIG. 14, when the lens barrel light-shielding part 2h is molded, the upper and lower surfaces may be molded in three times as three-color molding. The lens barrel shading part 2h may be formed by adjusting the above. This forming method will be described with reference to FIG.

  In FIG. 15, 2f is a lens barrel transmission part, and 2i is a lens barrel light shielding part. In the lens barrel light-shielding portion 2h shown in FIG. 14, the shape on the lens mold side is tapered to facilitate manufacture by injection molding. A mold that forms the lens barrel light shielding portion 2i and the lens portion 2a is nested, and after the lens portion 2a and the lens barrel transmission portion 2f are molded, the lens barrel light shielding is performed in the mold drawing direction indicated by 9h. While moving the mold of the part 2i, the mold for internal wiring is replaced. Thereafter, the lens barrel light-shielding portion 2i and the internal wiring 3g are injection-molded to form a lens mold. By doing so, it is possible to mold both the light shielding portion and the wiring portion without exchanging the mold of the lens portion 2a, and the lens portion 2a and the lens barrel transmitting portion 2f are integrally molded. Therefore, it is possible to form a lens mold that maintains the lens dimensional accuracy between the sensor and the lens portion.

Embodiment 8 of the Invention
In the embodiments of the invention described above, the camera module in which the lens and the sensor are integrated has been described. However, if the resolution of the sensor is increased, the camera module in which the fixed focus lens and the sensor are combined may not be compatible. come. Therefore, a configuration in which an actuator such as a focus adjustment mechanism or a zoom mechanism is combined with the sensor is required.

  FIG. 16A shows a configuration example in which a sensor and an actuator are combined. In this example, the internal wiring 3h of the actuator 24 for driving the lens or the like is formed on the lens mold 202 by two-color molding in the same manner as the internal wiring 3g for the sensor 5.

  The lens unit 21 in this example is separated from the lens mold 202. The actuator 24 can move the lens unit 21 in the optical axis direction. The lens mold 202 basically functions as a lens barrel. The internal wiring 3h is a wiring that connects the actuator 24 and the parent board wiring 6b. The actuator 24 and the parent substrate wiring 6b may be connected by an external wiring disposed outside the lens mold 202.

  In the example of FIG. 16, the connection between the actuator 24 and the internal wiring 3h can be performed by the method described in the seventh embodiment of the invention. In this example, the internal wiring 3g and the internal wiring 3h are electrically connected to electrical terminals (not shown) of the sensor 5 and the actuator 24 by deforming and pressing the contact portions 3e. At this time, a conductive adhesive may be used as the contact portion 3e.

  In this example, each of the seal 4, the sensor 5, and the actuator 24 is in contact with and fixed to the lens mold 202. Therefore, optical mounting dimensional accuracy can be ensured.

  The internal wiring 3h is formed in a taper shape in the vicinity of the contact portion 3e. Thereby, when the contact portion 3e is formed, so-called escape of the mold can be ensured, and the mold of the lens mold 202 can be pulled out in order to achieve two-color molding.

  FIG. 16B is a view for explaining an example of the structure of the internal wiring in the lens mold 202 of FIG. 16A, and shows a schematic diagram of the mold bottom surface on which the internal wiring 3g and the internal wiring 3h are laid. The internal wiring 3h can energize the actuator 24 in addition to the sensor 5. FIG. 16A shows a cross section 9g viewed from the direction of the arrow.

Embodiment 9 of the Invention
The camera module according to Embodiment 9 of the present invention has two types of lenses and includes an actuator that drives each lens.

  In the cross-sectional view of FIG. 17, the lens unit 21a is a zoom lens, and a zoom operation can be performed by changing the distance between the lens unit 21b and the lens unit 21b. The lens unit 21a is driven by an actuator 24a. The lens unit 21b is an objective lens, and focusing can be performed using this lens. The lens unit 21b is driven by the actuator 24b. The entire lens portion 21a and lens portion 21b constitute a zoom lens.

  The actuators 24a and 24b need to be electrically connected to the parent board wiring 6b, but may be connected to the actuator 24b through a signal transmission wiring (not shown) via the actuator 24a. . With such a configuration, control signals can be transmitted to the actuator 24a and the actuator 24b through the internal wiring of the lens mold. Such wiring eliminates the need for considerations such as connection by external paths from the outside, so that effects such as simplified structure and improved productivity can be obtained.

Embodiment 10 of the Invention
Next, FIG. 18A shows a configuration example in which an additional function is added to the lens mold and external wiring is formed for this purpose. In FIG. 18A, 2j is a lens barrel light shielding portion, 203 is a lens mold, 24 is a functional component such as a light emitting diode, and 3i is an external wiring. The functional component 25 in this example is illumination composed of a light emitting diode or the like for illuminating a subject, and is connected to the parent substrate wiring 6b by an external wiring 3i. With this configuration, it is possible to construct a camera module with illumination without particularly installing external wiring. Of course, the external wiring is connected to the parent board wiring 6b. However, the functional component may be controlled by the output of the sensor 5, and in this case, the wiring may be configured to go from the internal wiring to the external wiring. .

  Further, in this example, the functional parts are configured to be exposed and attached to the outside of the lens mold 203, but may be configured to be embedded. An example in that case is shown in FIG. In the figure, reference numeral 204 denotes a lens mold, 3j denotes an external wiring, and the functional component 25 is arranged so as to be embedded in the lens mold 204. By doing in this way, the camera module integrated with the functional component can be configured, and the camera module according to the concept of the one-chip camera module integrated with all can be configured.

  In addition, although the light emitting diode which illuminates a subject was given as an example as the functional component 25, the present invention is not limited to this, and for example, an infrared LED may be attached as an illuminating LED and used for monitoring under night vision. Good. These are light emitting functions, but on the contrary, a light receiving function such as an infrared sensor for detecting a passerby used in an automatic door or the like is attached, in addition to imaging by the sensor 5, or detection function by the image processing, The camera module with an infrared sensor may be configured to perform solid monitoring by using it for recording confirmation when a passerby passes. Of course, parts such as an actuator may be attached together with these functional parts to increase the functionality of the camera module. Of course, the point of attention for such high functionality is that the functional component 25 is provided with a portion that is insufficient for the function of the light detection element provided in the sensor 5, thereby achieving high functionality and ultra-small size. The camera module can be configured. Therefore, improvement in usability by using the structure of the camera module is expected due to such high functionality. As one of them, for example, paying attention to the position when the camera module is attached, it is possible to provide an optical communication function with an external device and to provide an optical communication function with an external device, thereby improving usability. This means that the lens part of the camera module is open to the outside regardless of how it is used. By using this point, a light path is secured, so that no additional communication opening is provided. The communication function can be realized, and the cost can be reduced while reducing the size. In this case, the optical communication function can be configured by using the light emitting diode described above as the light transmission function and using the sensor 5 as the light reception function. Note that when the sensor 5 is used as a reception function, a normal imaging signal may be used, but this limits the readout frame rate. Therefore, for example, in a CMOS sensor, it is easy to select and read out a signal from a specific light receiving unit. Furthermore, normally in a CMOS sensor, incident light is photoelectrically converted by a light receiving unit, and separated electrons are accumulated in a photodiode and converted into an imaging signal, but one separated carrier is usually a P substrate. Have been exhaled. Since this carrier is photoelectrically converted and transmitted to the P substrate and discharged, if the current by this carrier is detected from the output of the P substrate, the incident light of the image sensor changes without regard to the normal reading of the video signal. It can be detected. Therefore, if such a carrier detection means is added to the sensor 5 to constitute a light receiving function, an optical communication function by high-speed light transmission / reception can be realized only by a combination of the light emitting diode and the sensor 5.

  In this way, since it is possible to provide an optical communication function without particularly installing a light receiving photodiode separately, various devices using this can be configured. For example, when a camera module and recording unit are combined for surveillance purposes, the recorded content can be configured to be read from the outside using the optical communication function, but this also utilizes the structure of this camera module that can easily incorporate a functional element separately. This is one example. It goes without saying that there are various other applications, but details are omitted.

It is a structural diagram explaining an example of the camera module concerning this invention. It is the schematic explaining the structure of an example of the camera module concerning this invention. It is a schematic diagram explaining an example about the assembly wiring method of the camera module concerning this invention. It is a schematic sectional drawing explaining an example of the camera module concerning this invention. It is a schematic sectional drawing explaining an example of the camera module concerning this invention. It is a schematic sectional drawing explaining an example of the camera module concerning this invention. It is a schematic sectional drawing explaining an example of the camera module concerning this invention. It is a schematic diagram explaining the production | generation method of the wiring of the camera module concerning this invention. It is a block diagram explaining the structure of an example of the camera module concerning this invention. It is a schematic sectional drawing explaining an example of the camera module concerning this invention. It is a schematic sectional drawing explaining an example of the camera module concerning this invention. It is the schematic explaining an example of the electrical connection and attachment method of the camera module concerning this invention. It is the schematic explaining an example of the electrical connection and attachment method of the camera module concerning this invention. It is a schematic diagram explaining an example of the injection molding method of the camera module concerning this invention. It is a schematic diagram explaining an example of the injection molding method of the camera module concerning this invention. It is a schematic diagram explaining an example of the camera module concerning this invention. It is a schematic sectional drawing explaining an example of the camera module concerning this invention. It is a schematic sectional drawing explaining an example of the camera module concerning this invention.

Explanation of symbols

1 camera module, 2 lens mold,
2a lens part, 2b lens barrel part,
2c Front light-shielding part, 2d Rear light-shielding part,
2e, 2h, 2i, lens barrel light-shielding section, 2f, lens barrel transmission section,
2g anti-reflection structure, 3 internal wiring, 3a contact part,
3c sensor connection part, 3d parent board connection part, 3e contact part,
3f wiring with contacts, 3g, 3h internal wiring,
3i External wiring, 4 seals, 5 sensors,
5a imaging area, 5b sensor pad, 5c sensor circuit section,
6 parent board, 6a parent board contact, 6b parent board wiring,
6c parent substrate contact, 6d thermal contact member,
24 Actuators, 25 Functional parts

Claims (21)

The lens part,
A lens barrel that supports the lens unit;
A sensor chip that is fixed to the lens barrel and converts it into an electrical signal in accordance with light incident through the lens unit;
A camera module provided with a seal provided outside the sensor chip and sealing the sensor chip.   The camera module according to claim 1, wherein the lens unit and the lens barrel are integrally formed. The lens barrel is provided with a step portion on the inner surface thereof, and a wiring extending from the step portion to the bottom surface of the lens barrel is provided.
2. The camera module according to claim 1, wherein the sensor chip is fixed to the step portion so that the sensor pad is in direct or indirect contact with the wiring of the step portion.   The wiring extends from the stepped portion through the lens barrel to the outside of the lens barrel, and is further formed along the outer surface of the lens barrel to the bottom of the lens barrel. Item 4. The camera module according to Item 3.   The camera module according to claim 4, wherein the wiring is socket-processed on an outer surface of the lens barrel. On the inner surface of the lens barrel, a step is provided,
The camera module according to claim 1, wherein the seal is fixed to the stepped portion. The sensor chip is fixed to the bottom surface of the barrel,
2. The camera module according to claim 1, wherein the seal has a recess and is fixed to the lens barrel at an end in a state where the sensor chip is accommodated in the recess. 3.   The wiring for connecting the sensor pad of the sensor chip and the wiring of the external substrate provided outside the seal is formed from the bottom of the lens barrel to the outer surface of the seal. The camera module.   The wiring is composed of an internal wiring formed on the bottom surface of the lens barrel and an external wiring formed from the top of the side wall for forming the recess in the seal to the outer surface. The camera module according to claim 8.   2. The camera module according to claim 1, wherein an inner side surface of the lens barrel directed downward from the vicinity of the lens portion is a slope inclined with respect to the optical axis of the lens portion.   The camera module according to claim 1, wherein the lens unit and the lens barrel are formed by molding different materials.   The camera module according to claim 1, wherein the sensor chip includes a circuit that converts a parallel signal generated in the sensor chip into a serial signal and outputs the serial signal.   The camera module according to claim 1, wherein the wiring for connecting the sensor chip and the external substrate is formed by molding different materials together with the lens portion and the lens barrel.   The camera module according to claim 1, wherein the wiring for connecting the sensor chip and the external substrate protrudes outside the lens barrel at the bottom of the lens barrel.   15. The camera module according to claim 14, wherein a portion of the wiring that protrudes outside the lens barrel is melted and connected to the wiring of an external substrate.   2. The camera module according to claim 1, wherein a light shielding part is formed on a part of the lens barrel, and the light shielding part is formed by molding at least a different material from the lens part.   The camera module according to claim 1, wherein an actuator is provided between the lens unit and the lens barrel.   18. The camera module according to claim 17, wherein wiring for connecting a terminal of the actuator and wiring of an external substrate is formed in the lens barrel. The lens unit includes a first lens and a second lens,
The camera module according to claim 1, further comprising a first actuator that drives the first lens and a second actuator that drives the second lens.   The first actuator is connected to the wiring of the external board by wiring formed in the lens barrel, and the second actuator is connected to the wiring of the external board via the first actuator. The camera module according to claim 19. 2. The camera module according to claim 1, wherein a wiring for electrically connecting a functional component provided in the vicinity of the lens portion and a sensor pad of the sensor chip is formed in the lens barrel.

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