JP2011100903A - Electronic element module and method of manufacturing the same, electronic element wafer module and method of manufacturing the same, and electronic information apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily and speedily arrange a light shield structure, to eliminate the need for an extra substrate and an extra component, and to obtain high production efficiency. <P>SOLUTION: A method of manufacturing electronic element modules includes: a process of fixing respective camera units 11 each having a lens module 6 stacked on an imaging element 2 on a light-shielding and conductive substrate 7 in a state wherein lens regions 6a of lens modules 6 are positioned at a plurality of circular openings 7a; a process of obtaining a sensor wafer module 1 by fixing the plurality of camera units 11, fixed on the light shielding and conductive substrate 7, at predetermined positions of a metal mold 20 and charging a light-shielding and conductive resin material 8a in gaps between adjacent camera units 11 and on the light-shielding and conductive substrate 7; and a dicing process of dividing the sensor wafer module 1, taken out of the metal mold 20, into the individual camera units 11 or pluralities of camera units 11 so that the light-shielding and conductive resin material 8a is left on side faces of the respective camera units 11 by dicing the sensor wafer module 1 on width-directional center lines of the light-shielding and conductive resin material 8a charged in peripheries of the respective camera units 11 of the sensor wafer module 1. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention provides a plurality of lenses that collect incident light, or a plurality of optical functional elements that linearly guide outgoing light or bend the incident light in a predetermined direction, and a lens corresponding to each lens. An image sensor having a plurality of light receiving units that photoelectrically convert image light to image, or a light emitting element for generating outgoing light and a light receiving element for receiving incident light, corresponding to each optical functional element, respectively. Electronic device module formed into a plurality of modules and manufacturing method thereof, electronic device wafer module in which a plurality of electronic device modules are arranged in a wafer shape and manufacturing method thereof, and electronic device module used as an image input device in an imaging unit, for example Digital cameras such as digital video cameras and digital still cameras, image input cameras such as surveillance cameras, and scanner devices A facsimile machine, a television telephone device, an electronic information device, such as a camera-equipped mobile phone device.

  A sensor module as a conventional electronic element module of this type has a lens unit that collects incident light, and a plurality of light receiving units that photoelectrically convert incident light from a subject to image corresponding to the lens unit. The imaging device is modularized. In this conventional sensor module, the current light-shielding process for the image sensor is almost always performed on a sensor module that has been singulated. The current light-shielding process includes processing methods such as putting a light-shielding holder on the sensor module that has been singulated, applying a light-shielding agent to the periphery or top of the sensor module, and stacking light-shielding blocks as the sensor module. It is done. Patent Document 1 proposes a case in which a light shielding agent is applied to the periphery or top of the sensor module.

  FIG. 5A to FIG. 5E are main part longitudinal cross-sectional views for explaining each manufacturing process of the conventional semiconductor imaging device of Patent Document 1. FIG.

  As shown in FIG. 5A, an imaging region 102 in the center part and a peripheral circuit region 103 in the outer peripheral region so as to be adjacent to the imaging region 102 are formed on the upper surface 101 a of the semiconductor substrate 101. A plurality of electrode portions 104 are arranged on the outer peripheral side of the peripheral circuit region 103 on the upper surface 101a. In addition, a plurality of microlenses 105 are provided on the imaging region 102 for condensing incident light on each light receiving unit. Each of the plurality of microlenses 105 is provided corresponding to each pixel.

  At this time, as shown in FIG. 5B, bumps 106 are arranged on the electrode portions 104 on the outer peripheral side of the peripheral circuit region 103. The bump 106 may be formed by a wire bonder using a conductive wire, for example. Further, the connection surface of the bump 106 is pressed by a plate-shaped metal plate or the like after the bump 106 is formed. This plate-shaped metal plate has an opening larger than the size of the optical member 108 constituted by the lens portion. In this way, by pressing the connection surface of the bump 106 with a plate-shaped metal plate or the like, the height is made uniform and the connection surface of the bump 106 is flattened so as to be easily electrically connected to the conductive wire. Also good.

  As shown in FIG. 5C, a light-shielding film 109 formed in advance using a light-shielding metal or resin material is provided in advance in the side surface region of the optical member 108 formed of a lens portion. In addition, an optical member 108 having a shape that covers at least the imaging region 102 is prepared.

  Next, as shown in FIG. 5D, an ultraviolet curable transparent adhesive member 110 is applied so as to cover the microlens 105 of each semiconductor element 107 and the peripheral circuit region 103 around it. The transparent adhesive member 110 can be applied by, for example, a drawing method, a printing method, a stamping method, or the like.

  Further, as shown in FIG. 5E, the optical member 108 formed of a lens portion is aligned with the imaging region 102 to which the transparent adhesive member 110 is applied. Thereafter, pressure is applied from the upper surface of the optical member 108 while maintaining parallelism between the upper surface of the optical member 108 and the upper surface of the imaging region 102. Next, ultraviolet light having a wavelength that cures the transparent adhesive member 110 is irradiated to the upper surface side of the optical member 108 as indicated by an arrow 111. As a result, the imaging region 102 and the optical member 108 are bonded by the transparent adhesive member 110. As a result, a semiconductor imaging element 100A in which the optical member 108 is bonded onto the semiconductor element 107 is obtained.

  Dicing is performed between adjacent semiconductor elements 107 of a plurality of semiconductor imaging elements 100A in the form of a semiconductor wafer manufactured as described above. By this dicing, each semiconductor image sensor 100A as shown in FIG. 5E can be obtained. As a result, the optical member 108 can be directly adhered onto the microlens 105 of the semiconductor element 107 with the transparent adhesive member 110, thereby realizing a reduction in thickness. At this time, even if the transparent adhesive member 110 flows on the peripheral circuit region 103, the bump 106 is connected to the electrode portion 104, so that the bump 106 is formed higher than the surface 101 a of the transparent adhesive member 110 without any problem. ing. For this reason, high reliability can be realized without the possibility of non-bonding of the conductive wires. Moreover, it is only necessary to form the bump 106 on the electrode portion 104 before the bonding step of the optical member 108. For this reason, productivity is also high, without disturbing mass productivity.

  Thereafter, as shown in FIG. 6, a light shielding member 112 including an exposed region 110 a of the transparent adhesive member 110 and a side region 108 a of the optical member 108 is further provided. The light shielding member 112 is formed so as to open the electrode portion 104 and the bump 106 on the surface of the peripheral circuit region 103. In this case, the light shielding member 112 is applied so that the surface 112 a of the light shielding member 112 is lower than the connection surface 106 a at the tip of the bump 106.

  Next, FIGS. 7 and 8 show a processing method for stacking the light shielding blocks as the light shielding processing in the conventional sensor module.

  FIG. 7 is an exploded perspective view showing a state of assembling the conventional compound-eye imaging device of Patent Document 2, and FIG. 8 is a longitudinal section of a holder member holding the optical lens array of the compound-eye imaging device 200 of FIG. FIG.

  7 and 8, the conventional compound-eye imaging apparatus 200 includes an optical lens array 203, a holder member 204, a light receiving element array 205, a light shielding block 206, and a frame member 207. In the optical lens array 203, nine optical lenses 201 in three rows and three columns whose optical axes L are parallel to each other are integrally formed on the lower surface of one transparent substrate 202 as a single convex lens. The holder member 204 holds the optical lens array 203 so as to be sandwiched from above and below. The light receiving element array 205 is arranged below the optical lens array 203 and picks up nine images respectively formed by the optical lenses 201. The light blocking block 206 is disposed between the optical lens array 203 and the light receiving element array 205, and a space between the optical lens array 203 and the light receiving element array 205 is provided so that the light emitted from each optical lens 201 does not interfere with each other. Partition on a plane orthogonal to the optical axis L. The frame member 207 is disposed between the light-blocking block 206 and the light-receiving element array 205. The frame member 207 surrounds the light-receiving element array 205 in a frame shape so that the light-blocking block 206 does not hit the light-receiving element array 205. Spacer.

  The holder member 204 includes an upper plate member 204a and a lower frame member 204b in which a groove into which an edge of the optical lens array 203 is fitted is formed. The upper plate member 204 a is configured as a diaphragm member that blocks unnecessary external light from entering the optical lens 201 by forming diaphragm openings 204 c of a predetermined size at nine positions corresponding to the optical lens 201. Has been.

  The light shielding block 206 is configured by stacking six sheet metal unit plates Pa having a thickness of 120 μm and further stacking two sheet metal unit plates Pb having a thickness of 80 μm thereon. That is, eight types of unit plates Pa and Pb having different thicknesses are stacked. As a result, a light blocking block 206 having a total thickness of 880 μm is formed. The length obtained by adding the thickness portion contributed by the frame member 207 surrounding the light receiving element array 205 and the holder member 204 of the optical lens array 203 to the thickness of the light blocking block 206 is equal to the optical length of the optical lens 201. Has been.

  Next, Patent Document 3 discloses a method for creating an electromagnetic shield in a conventional contact image sensor.

  FIG. 9 is a longitudinal sectional view of an essential part showing an example of a method for forming an electromagnetic shield in a conventional contact image sensor.

  As shown in FIG. 9, the contact image sensor 300 includes an image sensor chip 303, an LED 302 serving as a light source, a substrate 304 for mounting them, a light guide plate 305 that guides light from the light source to the document 310, and a document 310. A lens 306 for condensing the reflected light from the light receiving element on the image sensor chip 303, a casing 301 for housing the above components, a glass cover 307 attached to the casing 301 and supporting the light guide plate 305 and the lens 306, and the glass cover An oxide transparent conductive thin film 308 such as an indium oxide thin film formed on the surface of 307 and a conductive spring that connects the oxide transparent conductive thin film 308 and the GND of the substrate 304 on which the image sensor chip 303 is mounted. And a conductor 309.

  The image sensor chip 303 is connected to the substrate 304. The substrate 304 is connected to the conductive film 308 on the surface side by a conductor 309 such as a conductive spring, whereby an electric shield is formed. In such a conventional method, it is necessary to assemble the conductor 309 such as the substrate 304, the casing 301, and the conductive spring, which results in an increase in volume, an increase in parts, and an increase in manufacturing processes, thereby realizing a low cost and small size module. Has become a major obstacle.

JP 2008-92417 A JP 2007-180653 A JP 2000-270155 A

As described above, in Patent Document 1, an optical member 108 such as a lens or a lid glass as an optical element having a light shielding material coated as a light shielding film 109 on its side surface is disposed on the imaging region 102 of the sensor chip. Thereafter, the light shielding member 112 is also applied around the optical member 108. Further, as described above, in Patent Document 2, a light shielding block 206 for shielding light around the optical lens array 203 and the light receiving element array 205 is stacked to shield the light. Furthermore, as described above, in Patent Document 3, many components such as a substrate 304, a conductor 309, a glass cover 307 with a conductive film, and a casing 301 are prepared for forming an electromagnetic shield. Assembly is carried out.

  In the conventional light shielding configuration, the light shielding is performed only on the surface of the semiconductor substrate 101 as in Patent Document 1, and the light shielding cannot be formed on the side surface of the semiconductor substrate 101. Further, as in Patent Document 2, a light shielding block 206 is separately required to realize a light shielding structure. In addition, a space is required to cover the light shielding block 206 around the periphery, and there is a problem that the module size increases. Moreover, these processes are individual piece processes, and the production efficiency is very poor. Further, as in Patent Document 3, mounting on the board 304, addition of parts, and assembly of individual pieces are necessary, which increases the cost and has a problem of very poor production efficiency.

  The present invention solves the above-mentioned conventional problems, without performing the light shielding processing step separately as in the prior art, and without separately requiring a light shielding block to realize a light shielding structure, By arranging the light shielding material in a lump, and cutting the necessary parts in a lump into pieces, the light shielding structure can be easily and quickly arranged, and an electromagnetic shield can be formed without the need for a separate board or parts. Electronic device module with high production efficiency and manufacturing method thereof, electronic device wafer module in which a plurality of electronic device modules are arranged in a wafer shape and manufacturing method thereof, and using the electronic device module as an image input device for an imaging unit, for example An object of the present invention is to provide an electronic information device such as a mobile phone device with a camera.

  The method of manufacturing an electronic element wafer module of the present invention includes a step of installing a light shielding substrate having a plurality of openings formed in a matrix at predetermined positions, and each electronic element unit in which an optical element is stacked on the electronic element. The step of fixing on the light shielding substrate with the optical regions of the optical elements aligned with the plurality of openings, respectively, and fixing the plurality of electronic element units fixed on the light shielding substrate in the mold And a step of filling the light-shielding substrate with a light-shielding resin material in a gap between adjacent electronic element units to form an electronic element wafer module, whereby the above object is achieved.

  Preferably, in the electronic element unit in the method for manufacturing an electronic element wafer module of the present invention, an electronic element substrate in which the electronic element is formed in the center of the surface and an external connection terminal is formed on the back surface, and the electronic element A resin adhesive layer formed on the surrounding electronic element substrate, a transparent support substrate covering the resin adhesive layer and the electronic element, and the transparent support substrate provided in correspondence with the electronic element And an optical element.

  Still preferably, in a method for manufacturing an electronic element wafer module according to the present invention, the mold does not contact the external connection terminal, and presses an outer peripheral edge around the external connection terminal on the back surface of the electronic element unit. It has a recess and its periphery.

  Further preferably, a heat-resistant resin film is formed on the surface of the concave portion and its peripheral portion in the method for manufacturing an electronic element wafer module of the present invention.

  Further preferably, the gap between adjacent electronic element units in the method for manufacturing an electronic element wafer module of the present invention is 100 to 300 μm.

Further preferably, both the light-shielding substrate and the light-shielding resin in the method for producing an electronic element wafer module of the present invention have a conductive function.

  Still preferably, in a method for manufacturing an electronic element wafer module according to the present invention, the light shielding substrate is a light shielding resin sheet or a light shielding resin plate.

  Further preferably, in the method of manufacturing an electronic element wafer module according to the present invention, the alignment of each of the plurality of openings and the optical region of the optical element is performed by using a circular center of the opening and a circular center of the optical region. Align to match.

  An electronic element module manufacturing method of the present invention is an electronic element wafer module manufactured by the above-described electronic element wafer module manufacturing method of the present invention, and is an adjacent electronic element unit of the electronic element wafer module taken out from the mold. A dicing step for dicing each one or more of the electronic element units so that the light shielding resin remains on the side surface of the electronic element unit by dicing the width direction center line of the light shielding resin filled in between This achieves the above object.

  Preferably, the thickness of the light-shielding resin left in the separation step in the method for manufacturing an electronic element module of the present invention is 100 μm ± 20 μm.

  Further preferably, the side surface of the light-shielding resin in the method for manufacturing an electronic element module of the present invention has a concavo-convex surface with a diced cut mark remaining.

  The electronic element wafer module of the present invention includes an electronic element substrate in which an electronic element is provided in the center of the front surface and an external connection terminal is provided on the back surface, and a resin adhesive formed on the electronic element substrate around the electronic element. A plurality of electronic element units each including a layer, a transparent support substrate covering the resin adhesive layer and the electronic element, and an optical element provided on the transparent support substrate corresponding to the electronic element The optical elements are fixed on the light-shielding substrate in a state where the optical regions of the optical elements are aligned with the plurality of openings of the light-shielding substrate that shields the surface of the optical element, and the light-shielding substrate is disposed within the gap between adjacent electronic element units. The substrate is filled with a light-shielding resin, thereby achieving the above object.

  The electronic element module of the present invention is an electronic element module manufactured by the above-described method for manufacturing an electronic element module of the present invention, wherein the electronic element is provided in the center of the surface and the external connection terminal is provided on the back surface. A substrate, a resin adhesive layer formed on the electronic element substrate around the electronic element, a transparent support substrate covering the resin adhesive layer and the electronic element, and the electronic element on the transparent support substrate In an electronic element module in which an optical element provided and a light-shielding substrate that shields the surface of an optical element other than an opening in which an optical region of the optical element is opened are laminated, the side surface of the electronic element substrate, the resin adhesive layer In other words, the light shielding resin that covers the side surface of the transparent support substrate and the side surface of the transparent supporting substrate and shields the side surface of the optical element remains, thereby achieving the above object.

  Preferably, the thickness of the light shielding resin in the electronic element module of the present invention is 100 μm ± 20 μm.

  Further preferably, the side surface of the light shielding resin in the electronic element module of the present invention has a cut mark and the surface is uneven.

  Further preferably, the cut side surface of the light shielding resin in the electronic element module of the present invention is a ground potential.

  Further preferably, in the electronic element module of the present invention, both the light shielding substrate and the light shielding resin have a conductive function.

  Further preferably, the electronic element in the electronic element module according to the present invention is an image pickup element having a plurality of light receiving sections that perform image conversion by photoelectrically converting image light from a subject.

  Further preferably, the optical element in the electronic element module of the present invention includes a condenser lens for condensing incident light on the electronic element.

  Further preferably, the electronic element in the electronic element module of the present invention has a light emitting element for generating outgoing light and a light receiving element for receiving incident light.

  Further preferably, the optical element in the electronic element module of the present invention is an optical functional element that causes the emitted light from the light emitting element to go straight and emit, and bends the incident light to enter the light receiving element.

  Further preferably, in the optical element in the electronic element module of the present invention, a lens region is provided as the optical region in the central portion, and a spacer portion having a predetermined thickness is provided as an overlapping portion on the outer peripheral side of the lens region. ing.

  The electronic information device of the present invention uses a solid-state imaging device that obtains a color image signal by performing predetermined signal processing on the imaging signal from the electronic element module of the present invention as an image input device in an imaging unit. This achieves the above object.

  An electronic information device according to the present invention uses the electronic element module according to the present invention as an information recording / reproducing unit, thereby achieving the above object.

  With the above configuration, the operation of the present invention will be described below.

  In the method for manufacturing an electronic element module of the present invention, a step of installing a light shielding substrate having a plurality of openings formed in a matrix at predetermined positions, and each electronic element unit in which an optical element is laminated on the electronic element, A step of fixing the optical regions of the optical elements to the plurality of openings in a state of being aligned with the light shielding substrate, and fixing a plurality of electronic element units fixed on the light shielding substrate to predetermined positions of the mold. A step of filling the light-shielding substrate with a light-shielding resin material in a gap between adjacent electronic element units to obtain an electronic element wafer module; and each electronic element unit of the electronic element wafer module taken out from the mold Each of the electronic element units is diced so that the light shielding resin remains on the side surface of each electronic element unit by dicing the width direction central portion of the light shielding resin filled in the periphery. And a fragmented singulation process.

  An electronic element module manufactured by such an electronic element module manufacturing method is formed on the periphery of the electronic element, the electronic element substrate in which the electronic element is provided in the center of the front surface, and the through electrode is provided around the back surface. A resin adhesive layer, a transparent support substrate covering the resin adhesive layer and the electronic element, an optical element provided in correspondence with the electronic element on the transparent support substrate, and an optical element other than the opening in which the optical area of the optical element is opened An electronic element module in which a light shielding substrate that shields the element surface is laminated, and the light shielding resin that shields light by covering the side surface of the electronic element substrate, the side surface of the resin adhesive layer, the side surface of the transparent support substrate, and the side surface of the optical element is cut. Remaining.

In this way, using a mold, the light-shielding resin material for covering the side surfaces of a plurality of electronic element units is collectively packed between adjacent electronic element units, and is batched into individual pieces. As in the past, without the need for separate light-blocking processing steps, and without the need for a separate light-blocking block to realize a light-blocking structure, the light-blocking material is placed in a lump and is collectively required. By cutting the parts into pieces, the light shielding structure can be easily and quickly arranged, and there is no need for a separate substrate or separate parts, and an electromagnetic shield can be formed, resulting in significantly higher production efficiency.

  As described above, according to the present invention, by using a mold, a light shielding resin material for covering the side surfaces of a plurality of electronic element units is collectively packed between adjacent electronic element units. In order to divide into pieces, it is not necessary to perform the light shielding process for each individual piece as in the prior art, and there is no need for a light shielding block to realize the light shielding structure, and for the electromagnetic shielding function, There is no need for board mounting and parts assembly as in the past, and the electromagnetic shielding function can be obtained simply by providing the light shielding resin material with a conductive function, and the light shielding and electromagnetic shielding structure can be obtained easily and quickly. Production efficiency can be greatly improved.

It is principal part sectional drawing which shows the structural example of the electronic element wafer module in Embodiment 1 of this invention. (A)-(c) is a principal part longitudinal cross-sectional view to each process (the 1) of the manufacturing method of the electronic element module in Embodiment 1 of this invention. (A)-(c) is a principal part longitudinal cross-sectional view to each process (the 2) of the manufacturing method of the electronic element module following FIG.2 (c). As Embodiment 2 of this invention, it is a block diagram which shows the schematic structural example of the electronic information apparatus which used the solid-state imaging device containing the sensor module of Embodiment 1 of this invention for the imaging part. (A)-(e) is a principal part longitudinal cross-sectional view for demonstrating each manufacturing process of the conventional semiconductor image pick-up element of patent document 1. FIG. It is a principal part longitudinal cross-sectional view for demonstrating the light shielding member formation process following FIG.5 (e). It is a disassembled perspective view which shows the state at the time of the assembly of the conventional compound eye imaging device of patent document 2. FIG. It is a longitudinal cross-sectional view of the holder member holding the optical lens array of the compound-eye imaging device of FIG. It is a principal part longitudinal cross-sectional view which shows an example of the formation method of the conventional electromagnetic shield.

  Embodiment 1 of an electronic element module of the present invention obtained by batch cutting from an electronic element wafer module produced by the method of producing an electronic element wafer module of the present invention, and a method for producing the same, and implementation of this electronic element module Embodiment 2 of an electronic information device such as a mobile phone device with a camera using the form 1 as an image input device for an imaging unit will be described in detail with reference to the drawings.

(Embodiment 1)
FIG. 1 is a cross-sectional view of an essential part showing a configuration example of an electronic element wafer module according to Embodiment 1 of the present invention. Here, although two electronic element modules are shown, a large number of electronic element modules are arranged in a matrix in a matrix.

  In FIG. 1, a sensor wafer module 1 as an electronic element wafer module according to the first embodiment includes an imaging element 2 (sensor chip) including a plurality of light receiving units that are photoelectric conversion units (photodiodes) corresponding to a plurality of pixels. Is formed in the center part as an electronic element, and a through-hole 3a is provided between the front surface and the back surface, and is formed on the periphery of the imaging element 2 of the imaging element substrate 3 as a conductive electronic element substrate. The resin adhesive layer 4 formed, a cover glass 5 as a transparent support substrate covering the resin adhesive layer 4 and the image pickup device 2, and a cover glass 5 provided on the cover glass 5 for condensing incident light on the image pickup device 2. A lens module 6 (including the case of a single lens plate) in which one or a plurality of lens plates are stacked as an optical element, and a lens in the center of the lens module 6 in plan view The light-shielding / conductive substrate 7 that shields the surface portion other than the circular opening 7a (light incident hole) in which the region 6a is opened, the side surface 3b of the imaging element substrate 3, the side surface 4b of the resin adhesive layer 4, and the cover glass 5 The side surface 5b of the lens module 6 and the side surface 6b of the lens module 6 are shielded and light-shielding conductive resin 8 is provided.

  As a camera unit 11 as an electronic element unit, a cover glass 5 and a lens module 6 are aligned on each other in this order on the image pickup device substrate 3 and are bonded up and down by a resin adhesive layer 4 or the like. Therefore, in the sensor wafer module 1, a large number of camera units 11 are arranged in a matrix on the light-shielding / conductive substrate 7, and the light-shielding conductive resin 8 is filled in a gap between the camera units 11.

  The image pickup device substrate 3 has an image pickup device 2 having a plurality of light receiving portions that photoelectrically convert image light from a subject on each surface side. ) A plurality of through holes 3a penetrating below are opened. A side wall and a back surface side of the through hole 3a are covered with an insulating film, and a wiring layer having a contact with the through electrode 3d of the electrode pad is formed to the back surface through the through hole 3a. Solder resist is formed as an insulating film on the wiring layer and on the back surface, and the solder resist 3 is opened on the portion where the solder ball 3c, which is an external connection terminal on the back surface, is formed on the wiring layer. 3c is exposed to the outside.

  The lens module 6 is provided with a circular lens region 6a as an optical region at the center, and a spacer portion having a predetermined thickness is provided as an overlapping portion on the outer peripheral side of the lens region 6a. Plates are stacked. Here, it is a condensing lens that condenses incident light on the image sensor 2 as a single lens plate.

  The light shielding / conductive substrate 7 is formed of a resin light shielding / conductive sheet or a light shielding / conductive plate, and a plurality of circular openings 7a are arranged in a matrix. The circular opening 7a is opened to take light into each imaging element 2. The light shielding / conductive substrate 7 has the lens region 6a and the circular opening 7a of the lens module 6 positioned, and a plurality of camera units 11 are arranged in a matrix on the light shielding / conductive substrate 7.

  The light shielding conductive resin 8 is filled in contact with the side surface 3b of the image pickup device substrate 3, the side surface 4b of the resin adhesive layer 4, the side surface 5b of the cover glass 5, and the side surface 6b of the lens module 6. Electrical conduction is provided at the side surface 3b of the image pickup device substrate 3. Therefore, the region in contact with the light-shielding conductive resin 8 can be set to the ground potential. As a result, the camera unit 11 covers the periphery (side surface) with the light-shielding conductive resin 8 and grounds the light-shielding conductive resin 8 to the ground potential. It is possible to realize the function of an electromagnetic shield that blocks electromagnetic noise from the outside with respect to the image sensor 2.

2 (a) to 2 (c) are main part longitudinal sectional views up to each step (No. 1) of the manufacturing method of the sensor module 1A according to the first embodiment of the present invention, and FIG. 3 (a) to FIG. 3 (c) is the same as FIG.
It is a principal part longitudinal cross-sectional view to each process (the 2) of the manufacturing method of the sensor module following c).

  First, as shown in FIG. 2 (a), the light-shielding / conductive substrate 7 is placed at a predetermined position so that the front surfaces of the plurality of circular openings 7a tapered around the hole are on the lower side (the back surface is the upper side). To do. This predetermined position is on the stage of the pickup device on which the camera unit 11 is placed in alignment with the circular opening 7 a of the light shielding / conductive substrate 7.

  Next, as shown in FIG. 2B, the central lens region 6a (convex lens) is aligned with the circular opening 7a of the light-shielding conductive substrate 2, and the camera unit 11 is bonded and fixed. That is, the alignment of each of the plurality of circular openings 7a of the light-shielding / conductive substrate 7 and the circular convex lens region 6a in each camera unit 11 is performed by aligning the center of the circular opening 7a with the circular convex lens region. 6a is aligned so as to coincide with the center.

  Thereafter, as shown in FIG. 2C, the entire substrate on which the plurality of camera units 11 are arranged in a matrix on the back surface of the light-shielding / conductive substrate 7 is placed at a predetermined position inside the mold 20. The mold 20 has a concave structure (recessed portion) in which the solder ball 3c as a connection terminal of the back surface portion 11a of the camera unit 11 is not in contact and only the peripheral portion of the through hole 3a of the camera unit 11 is pressed from above by the mold 20. And its surroundings). Further, a thin heat-resistant resin 21 a is automatically attached to the surface of the concave structure of the upper mold 21 of the mold 20 for each shot of the mold 20. The heat-resistant resin 21a is attached to the upper concave structure by supplying the heat-resistant resin 21a to the lower position of the concave structure of the upper mold 21 with a feeder and a winding device, and then attaching the heat-resistant resin 21a to the upper mold 21 by vacuum suction. Affix to the bottom surface.

  The heat-resistant resin 21a affixed to the inner surface of the upper mold 21 presses the edge portion of the image pickup device substrate 3 from above, so that the light-shielding conductive resin 8 filled later through the mold 20 is soldered. In addition to preventing entry into the recessed space 11b where the balls 3c are located, it also has the effect of preventing the light-shielding conductive resin 8 from remaining on the mold surface. As a result, the surface of the light-shielding conductive resin 8 and the surface of the image pickup device substrate 3 are at the same level, or the surface of the image pickup device substrate 3 is slightly higher than the heat-resistant resin 21a is recessed.

  Subsequently, as shown in FIG. 3A, a light-shielding conductive resin material 8 a is filled on the back surface of the light-shielding / conductive substrate 7 between adjacent camera units 11. At this time, the light-shielding conductive resin material 8a can be filled with the heat-resistant resin 21a to almost the same height as the surface of the image pickup device substrate 3 without going around the solder balls 3c on the back surface portion 11a of the camera unit 11.

  Next, as shown in FIG. 3B, the electronic element wafer module 1 of FIG. 1 is taken out from the mold 20, and between adjacent camera units 11 of the electronic element wafer module 1 as shown in FIG. If the light-shielding conductive resin 8 is diced with a dicing blade or a wire, the sensor module 1A as an individual electronic element module can be manufactured.

  The light-shielding conductive resin 8 can be filled in a lattice shape in plan view between the adjacent camera units 11 by the mold 20, and can be cut at a central portion in the width direction of the light-shielding conductive resin 8. The sensor modules 1A can be separated into individual pieces.

In this case, each camera unit 11 is divided into pieces. However, the present invention is not limited to this, and a plurality of camera units 11, for example, every two camera units 11 may be divided into pieces. It may be separated. The film thickness of the light-shielding conductive resin 8 left in the individualization step is set here to 100 μm ± 20 μm, but if it is 100 μm or more, there is no problem with light shielding (the upper limit is 300 μm). May be). Thus, the gap between the adjacent camera units 11 is set to about 100 to 300 μm when the thickness of the light-shielding conductive resin 8 is 100 μm ± 20 μm. At this time, the side surface of the light-shielding conductive resin 8 is left with a cut mark, and the surface has an uneven shape (it is fine and the unevenness is not visible to the eyes, but this unevenness also contributes to light shielding).

  Therefore, in the manufacturing method of the sensor module 1A as the electronic element module according to the first embodiment, the light-shielding conduction of the resin substrate in which a plurality of holes (circular openings 7a) are formed in a matrix shape at equal intervals in the vertical direction and the horizontal direction. A step of installing the substrate 7, a step of fitting and aligning the convex lens region 6 a in each hole on the light shielding / conductive substrate 7, and adhering the camera unit 11; The process of fixing the adhesively fixed camera unit 11 in the mold 20 and filling the conductive resin material 8a between the adjacent camera units 11, and the center of the light-shielding conductive resin 8 in the width direction between the adjacent camera units 11 And a step of dicing into individual pieces with a dicing blade. The light shielding / conductive substrate 7 covering the upper surface and the light shielding conductive resin 8 covering the side surface shield the light. And electromagnetic shielding structure is formed. In this light shielding electromagnetic shield structure, the light shielding conductive resin 8 is brought into contact with the side surface of the TSV (imaging device substrate 3) to cover the camera unit 11 with a ground ground structure.

  As described above, according to the first embodiment, in the method for manufacturing the sensor module 1A as the electronic element module, each camera unit 11 in which the lens module 6 is stacked on the image pickup device 2 is disposed in each of the plurality of circular openings 7a. A step of fixing the lens region 6a of the lens module 6 on the light shielding / conductive substrate 7 in a state of alignment, and a plurality of camera units 11 fixed on the light shielding / conductive substrate 7 at predetermined positions of the mold 20 The step of fixing and filling the light-shielding / conductive substrate 7 with the light-shielding conductive resin material 8a in the gap between the adjacent camera units 11 to obtain the sensor wafer module 1, and the sensor wafer module 1 taken out from the mold 20 Each camera unit 11 is diced on the center line in the width direction of the light-shielding conductive resin material 8a filled around each camera unit 11. As the first light-shielding conductive resin material 8a on the side surface remains has a singulation step of singulating the one or more each of the camera unit 11.

  The sensor module 1A manufactured by being collectively cut by the manufacturing method of the sensor module 1A includes the side surface 3b of the imaging element substrate 3, the side surface 4b of the resin adhesive layer 4, the side surface 5b of the cover glass 5, and the lens module 6. The light-shielding conductive resin 8 that covers the side surface 6b and shields light remains after the collective cutting.

  In this way, by using the mold 20, the light-shielding conductive resin material 8 a for covering the side surfaces of the plurality of camera units 11 is collectively put on the light-shielding / conductive substrate 7 between the adjacent camera units 11. Fills and separates into individual pieces, so that the light-blocking process is not performed separately as in the past, and a light-blocking block is not separately required to realize a light-blocking structure. 20, the light-blocking conductive resin material 8a is collectively disposed, and necessary portions are collectively cut into individual pieces so that the light-shielding / conductive structure can be easily and quickly disposed, and a separate substrate, There is no need for separate parts, electromagnetic shields can be formed, and production efficiency is greatly increased.

  That is, it can be manufactured in a state where the TSV (image pickup device substrate 3) is combined, and by the sheet mold method, the light-shielding conductive resin material 8a can be formed up to the edge of the image pickup device substrate 3, and grounding is possible. No connection is required. Since the number of parts is small and batch manufacturing is possible, the number of manufacturing steps can be extremely small.

  In the above embodiment, the light shielding / conductive substrate 7 and the light shielding conductive resin 8 are used as the light shielding / electromagnetic shielding structure on the upper surface and the side surface of the camera unit 11. 7 may be a light shielding substrate, and may be a light shielding resin instead of the light shielding conductive resin 8.

  In this case, the manufacturing method of the sensor wafer module 1 includes a step of installing a light shielding substrate having a plurality of circular openings 7a formed in a matrix at a predetermined position, and each camera in which the lens module 6 is laminated on the image sensor 2. A step of fixing the unit 11 on the light shielding substrate in a state where the lens regions 6a of the lens modules 6 are aligned with the plurality of circular openings 7a, and a plurality of camera units 11 fixed on the light shielding substrate 20 are molded. The sensor wafer module 1 is obtained by filling the back surface of the light shielding substrate with the light shielding resin material in the gap between the adjacent camera units 11.

  The sensor module 1 </ b> A is manufactured by the sensor wafer module 1 manufactured by the sensor wafer module 1 manufacturing method, and is filled around each camera unit 11 of the sensor wafer module 1 taken out from the mold 20. A dicing step is performed in which each of the camera units 11 is diced so that the light shielding resin remains on the side surface of each camera unit 11 by dicing on the center line in the width direction of the light shielding resin. . The light shielding substrate and the light shielding resin of the sensor module 1A do not have a conductive function and thus do not have an electromagnetic shield structure, whereas the light shielding / conductive substrate 7 and the light shielding conductive resin 8 have a conductive function. Therefore, it has an electromagnetic shield structure.

(Embodiment 2)
FIG. 4 is a block diagram illustrating a schematic configuration example of an electronic information device using, as an imaging unit, a solid-state imaging device including the sensor module 1A according to the first embodiment of the present invention as the second embodiment of the present invention.

  4, the electronic information device 90 of the second embodiment includes a solid-state imaging device 91 that obtains a color image signal by performing predetermined signal processing on the imaging signal from the sensor module 1A of the first embodiment, and the solid-state imaging device. After a predetermined signal processing for recording the color image signal from 91, a memory unit 92 such as a recording medium capable of recording data, and after a predetermined signal processing for display of the color image signal from the solid-state imaging device 91 Display means 93 such as a liquid crystal display device that can be displayed on a display screen such as a liquid crystal display screen, and transmission / reception that enables communication processing after color signal signals from the solid-state imaging device 91 are subjected to predetermined signal processing for communication A communication unit 94 such as an apparatus, and a printer capable of performing print processing after performing predetermined print signal processing for color image signals from the solid-state imaging device 91 for printing. And an image output unit 95. The electronic information device 90 is not limited to this, but in addition to the solid-state imaging device 91, at least one of a memory unit 92, a display unit 93, a communication unit 94, and an image output unit 95 such as a printer. You may have.

  As described above, the electronic information device 90 includes, for example, a digital camera such as a digital video camera and a digital still camera, an in-vehicle camera such as a surveillance camera, a door phone camera, and an in-vehicle rear surveillance camera, and a video phone camera. An electronic device having an image input device such as an image input camera, a scanner device, a facsimile device, a camera-equipped mobile phone device, and a portable terminal device (PDA) is conceivable.

  Therefore, according to the second embodiment, on the basis of the color image signal from the solid-state imaging device 91, it is displayed on the display screen, or is printed out on the paper by the image output means 95. (Printing), communicating this as communication data in a wired or wireless manner, performing a predetermined data compression process in the memory unit 92 and storing it in a good manner, or performing various data processings satisfactorily Can do.

Note that the electronic information device 90 is not limited to the electronic information device 90 of the second embodiment, and may be an electronic information device such as a pickup device using the electronic element module of the present invention for an information recording / reproducing unit. In this case, the optical element of the pickup device is an optical functional element that emits the emitted light in a straight line and emits the incident light in a predetermined direction. The electronic device of the pickup device has a light emitting element for generating outgoing light and a light receiving element for receiving incident light.

  In short, in the case of the electronic information device 90 in which the solid-state imaging device 91 that obtains a color image signal by performing predetermined signal processing on the imaging signal from the sensor module 1A as the electronic element module of the present invention is used as an image input device in the imaging unit. The present invention is not limited to this, and it may be an electronic information device such as a pickup device using the electronic element module of the present invention for an information recording / reproducing unit.

  As mentioned above, although this invention was illustrated using preferable Embodiment 1, 2 of this invention, this invention should not be limited and limited to this Embodiment 1,2. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range based on the description of the present invention and the common general technical knowledge, from the description of specific preferred embodiments 1 and 2 of the present invention. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention provides a plurality of lenses that collect incident light, or a plurality of optical functional elements that linearly guide outgoing light or bend the incident light in a predetermined direction, and a lens corresponding to each lens. An image sensor having a plurality of light receiving units that photoelectrically convert image light to image, or a light emitting element for generating outgoing light and a light receiving element for receiving incident light, corresponding to each optical functional element, respectively. Electronic device module made into a plurality of modules and manufacturing method thereof, digital camera such as digital video camera and digital still camera, image input camera such as surveillance camera, and scanner using the electronic device module as an image input device in an imaging unit In the field of electronic information equipment such as equipment, facsimile devices, television telephone devices, and mobile phone devices with cameras. In order to divide a plurality of electronic element units with a light-shielding resin material for covering the side surfaces of the electronic element units, and to fill between adjacent electronic element units, and to divide them into individual pieces, As described above, it is not necessary to perform the light shielding process for each piece, and there is no need for a light shielding block to realize a light shielding structure. , No need to assemble parts, it is possible to obtain an electromagnetic shielding function simply by giving the light shielding resin material a conductive function, and a light shielding and electromagnetic shielding structure can be obtained easily and quickly, greatly increasing production efficiency. Can be improved.

1. Sensor wafer module (electronic element wafer module)
1A Sensor module (electronic element module)
2 Imaging element (electronic element)
3 Imaging device substrate (electronic device substrate)
3a Through hole 3b Side surface 3c Solder ball (external connection terminal)
3d Penetration electrode 4 Resin adhesive layer 4b Side surface 5 Cover glass (transparent support substrate)
5b Side face 6 Lens module (optical element)
6a Lens area 6b Side surface 7 Light-shielding / conductive substrate 7a Circular opening 8 Light-shielding conductive resin 8a Light-shielding conductive resin material 11 Camera unit (electronic element unit)
11a Back portion of camera unit 11 11b Recessed space 20 Mold 21 Upper mold 21a Heat resistant resin (heat resistant protective sheet)
DESCRIPTION OF SYMBOLS 90 Electronic information apparatus 91 Solid-state imaging device 92 Memory part 93 Display means 94 Communication means 95 Image output means

Claims (24)

  A step of installing a light-shielding substrate having a plurality of openings formed in a matrix at a predetermined position, and each electronic element unit in which an optical element is stacked on the electronic element are provided in each of the plurality of openings. Fixing the region on the light-shielding substrate in a state where the regions are aligned, fixing a plurality of electronic element units fixed on the light-shielding substrate in a mold, and shielding the light-shielding within a gap between adjacent electronic element units And a step of forming an electronic element wafer module by filling a light-shielding resin material on a substrate. It is a manufacturing method of the electronic element wafer module according to claim 1,
The electronic element unit includes an electronic element substrate in which the electronic element is formed at the center of the front surface and an external connection terminal formed on the back surface, and a resin adhesive layer formed on the electronic element substrate around the electronic element. A method of manufacturing an electronic element wafer module, comprising: a transparent support substrate covering the resin adhesive layer and the electronic element; and the optical element provided on the transparent support substrate corresponding to the electronic element . It is a manufacturing method of the electronic element wafer module according to claim 2,
The mold has a recess that does not contact the external connection terminal and that holds the outer peripheral edge of the periphery of the external connection terminal on the back surface of the electronic element unit, and an electronic element wafer module that includes the periphery. Production method. It is a manufacturing method of the electronic element wafer module according to claim 3,
A method of manufacturing an electronic element wafer module, wherein a heat-resistant resin film is formed on the surface of the concave portion and its peripheral portion. It is a manufacturing method of the electronic element wafer module according to claim 1,
The method of manufacturing an electronic element wafer module, wherein a gap between the adjacent electronic element units is 100 to 300 μm. It is a manufacturing method of the electronic element wafer module according to claim 1,
The method of manufacturing an electronic element wafer module, wherein both the light shielding substrate and the light shielding resin have a conductive function. It is a manufacturing method of the electronic element wafer module according to claim 1,
The method for manufacturing an electronic element wafer module, wherein the light shielding substrate is a light shielding resin sheet or a light shielding resin plate. It is a manufacturing method of the electronic element wafer module according to claim 1,
The method of manufacturing an electronic element wafer module, wherein the alignment of each of the plurality of openings and the optical region of the optical element is performed such that the circular center of the opening coincides with the circular center of the optical region.   It is an electronic element wafer module manufactured by the manufacturing method of the electronic element wafer module in any one of Claims 1-8, Comprising: It fills between adjacent electronic element units of the electronic element wafer module taken out from the said metal mold | die. An electronic element having a singulation step of dicing the electronic element unit into one or a plurality of pieces so that the light shielding resin remains on the side surface of the electronic element unit by dicing on the center line in the width direction of the light shielding resin Module manufacturing method. It is a manufacturing method of the electronic element module according to claim 9,
The method for manufacturing an electronic element module, wherein the thickness of the light-shielding resin left in the individualizing step is 100 μm ± 20 μm. It is a manufacturing method of the electronic element module according to claim 9,
The side surface of the light shielding resin is a method of manufacturing an electronic element module in which a dicing cut mark is left and the surface is uneven.   An electronic element substrate in which an electronic element is provided in the center of the front surface and an external connection terminal is provided on the back surface, a resin adhesive layer formed on the electronic element substrate around the electronic element, the resin adhesive layer, and the A light-shielding substrate in which a plurality of electronic element units each having a transparent support substrate that covers the electronic element and an optical element that is provided on the transparent support substrate in correspondence with the electronic element shields the optical element surface other than the opening. A plurality of openings are fixed on the light shielding substrate in a state where the optical regions of the optical elements are aligned, and light shielding resin is filled on the light shielding substrate in the gaps between adjacent electronic element units. Electronic device wafer module. An electronic element module manufactured by the method for manufacturing an electronic element module according to claim 9,
An electronic element substrate in which an electronic element is provided in the center of the front surface and an external connection terminal is provided on the back surface, a resin adhesive layer formed on the electronic element substrate around the electronic element, the resin adhesive layer, and the A transparent support substrate that covers the electronic element, an optical element that is provided on the transparent support substrate so as to correspond to the electronic element, and a light shield that shields light from the optical element surface other than the opening in which the optical region of the optical element is opened In an electronic element module laminated with a substrate, an electronic element module in which a light shielding resin that covers and covers the side surface of the electronic element substrate, the side surface of the resin adhesive layer, the side surface of the transparent support substrate, and the side surface of the optical element remains. . The electronic element module according to claim 13,
The electronic element module having a thickness of the light shielding resin of 100 μm ± 20 μm. The electronic element module according to claim 13,
An electronic element module in which a side surface of the light-shielding resin has a cut mark and the surface is uneven. The electronic element module according to claim 13,
An electronic element module in which both the light shielding substrate and the light shielding resin have a conductive function. The electronic element module according to claim 16, wherein
An electronic element module in which a cut side surface of the light shielding resin is at a ground potential. The electronic element module according to claim 13,
The electronic device is an electronic device module that is an image pickup device having a plurality of light receiving units that perform image conversion by photoelectrically converting image light from a subject. The electronic element module according to claim 18,
The optical element is an electronic element module including a condenser lens that condenses incident light on the electronic element. The electronic element module according to claim 13,
The electronic element module includes a light emitting element for generating outgoing light and a light receiving element for receiving incident light. The electronic element module according to claim 20, wherein
The optical element is an electronic element wafer module which is an optical functional element that causes the emitted light from the light emitting element to go straight and emit, and also bends incident light to enter the light receiving element. The electronic element module according to claim 13 or 19,
The optical element is an electronic element module in which a lens region is provided as an optical region in the central portion, and a spacer portion having a predetermined thickness is provided as an overlapping portion on the outer peripheral side of the lens region.   An electronic information device using a solid-state imaging device that obtains a color image signal by performing predetermined signal processing on an imaging signal from the electronic element module according to claim 19 as an image input device in an imaging unit.   An electronic information device using the electronic element module according to claim 21 in an information recording / reproducing unit.