JPH09181415A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH09181415A JPH09181415A JP26281096A JP26281096A JPH09181415A JP H09181415 A JPH09181415 A JP H09181415A JP 26281096 A JP26281096 A JP 26281096A JP 26281096 A JP26281096 A JP 26281096A JP H09181415 A JPH09181415 A JP H09181415A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- layer
- filler
- plating
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明はプリント配線板に
関し、特に、スルーホール内を充填材によって密封状態
に閉塞処理してなるプリント配線板についての提案であ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, and more particularly to a printed wiring board in which the inside of a through hole is hermetically closed by a filling material.
【０００２】[0002]
【従来の技術】従来、基板の表裏両面に導体回路を形成
したプリント配線板において、基板表裏の導体回路どう
しは、その基板を貫通するスルーホールを介して電気的
に接続されていた。そのため、このような構成のプリン
ト配線板は、表層にスルーホールが露出して存在するた
めに、導体回路形成の有効面積が小さくなり、プリント
配線板の小型化や実装の高密度化を難しくするという欠
点があった。2. Description of the Related Art Conventionally, in a printed wiring board in which conductor circuits are formed on both front and back surfaces of a board, the conductor circuits on the front and back surfaces of the boards are electrically connected to each other through through holes penetrating the board. Therefore, in the printed wiring board having such a structure, since the through holes are exposed in the surface layer, the effective area for forming the conductor circuit is reduced, which makes it difficult to downsize the printed wiring board and increase the packaging density. There was a drawback.
【０００３】かかる欠点を解消して回路設計の自由度を
増大するために、最近では、コア材には表裏を電気的に
接続するためのスルーホールを形成し、表層材には、ブ
ラインドバイアホール（表面層と他の層を接続する基板
を貫通していない穴）やベリードバイアホール（内層間
を接続する基板を貫通していない穴）を形成することに
より、基板に貫通孔を設けないＩＶＨ（インタースティ
シャルバイアホール）構造のプリント配線板が提案され
ている。In order to eliminate such drawbacks and increase the degree of freedom in circuit design, recently, through holes for electrically connecting the front and back sides are formed in the core material, and blind via holes are formed in the surface layer material. By forming (holes that do not penetrate the substrate that connects the surface layer and other layers) and belly via holes (holes that do not penetrate the substrate that connects the inner layers), no through holes are provided in the substrate A printed wiring board having an IVH (interstitial via hole) structure has been proposed.
【０００４】しかしながら、コア材のスルーホール内を
未充填のままにすると、表層を形成するに当たって絶縁
樹脂等の流入があり、多層化が困難であった。また、め
っき液やめっき前処理液等の流入により、導体の腐食等
を招くなど多くの問題点があった。However, if the inside of the through hole of the core material is left unfilled, an insulating resin or the like will flow into it when forming the surface layer, making it difficult to form a multilayer structure. Further, there are many problems such as corrosion of the conductor caused by the inflow of the plating solution or the pretreatment solution for plating.
【０００５】これに対し、特公平５−32919 号公報や特
開平２−121386号公報、特開平５−226814号公報、特開
平６−125164号公報、実公平６−51010 号公報等には、
スルーホール内に樹脂等を充填または被覆したプリント
配線板が開示されている。On the other hand, Japanese Patent Publication No. 5-32919, Japanese Unexamined Patent Publication No. 2-121386, Japanese Unexamined Patent Publication No. 5-226814, Japanese Unexamined Patent Publication No. 6-125164, Japanese Utility Model Publication No. 6-51010, etc.
A printed wiring board in which resin or the like is filled or covered in the through holes is disclosed.
【０００６】しかしながら、スルーホール内を樹脂等で
充填または被覆する上記従来技術においても、熱衝撃試
験（低温高温サイクル試験）等の信頼性試験で、充填樹
脂や導体、層間絶縁樹脂にクラックが発生したり、樹脂
の硬化収縮による隙間からめっき処理液や他の処理液が
スルーホール内にしみ込むといった問題点を残してい
た。However, even in the above-mentioned prior art in which the through hole is filled or covered with resin or the like, cracks occur in the filled resin, conductor, or interlayer insulating resin in reliability tests such as thermal shock test (low temperature high temperature cycle test). However, there remains a problem that the plating treatment liquid or other treatment liquid permeates into the through hole through the gap due to the curing shrinkage of the resin.
【０００７】[0007]
【発明が解決しようとする課題】この発明は、スルーホ
ール内に充填材を充填するときに不可避に起こる本発明
分野において特有の上記問題点を解決するための構成を
提案するものであり、その主たる目的は、スルーホール
内壁と充填材との密着性に優れたプリント配線板の構成
を提案することにある。また、この発明の他の目的は、
クラックの発生やめっき処理液等のしみ込みを抑止でき
る信頼性に優れたプリント配線板を提供することにあ
る。SUMMARY OF THE INVENTION The present invention proposes a structure for solving the above-mentioned problems peculiar to the field of the present invention, which inevitably occur when the filling material is filled in the through holes. The main purpose is to propose a structure of a printed wiring board having excellent adhesion between the inner wall of the through hole and the filling material. Another object of the present invention is to
It is an object of the present invention to provide a highly reliable printed wiring board that can suppress the occurrence of cracks and the penetration of plating solution and the like.
【０００８】[0008]
【課題を解決するための手段】発明者らは、上記の目的
実現に向け鋭意研究を行った結果、以下に示す内容を要
旨構成とする発明を完成するに至った。すなわち、この
発明は、スルーホールを有し、該スルーホール内を充填
材によって密封状態に閉塞処理してなるプリント配線板
において、該スルーホール内壁の導体表面に凹凸層が形
成されていることを特徴とするプリント配線板である。
なお、この発明において、前記凹凸層は、銅−ニッケル
−リンからなる針状合金層であること、あるいは酸化銅
層（黒化層）であることが望ましく、前記充填材は、エ
ポキシ樹脂と有機フィラーの混合物、エポキシ樹脂と無
機フィラーの混合物、およびエポキシ樹脂と無機ファイ
バーの混合物のなかから選ばれるいずれか１つであるこ
とが望ましい。As a result of intensive research aimed at achieving the above-mentioned object, the inventors have completed an invention having the following contents as the gist configuration. That is, according to the present invention, in a printed wiring board having a through hole, and the inside of the through hole is hermetically closed by a filler, an uneven layer is formed on the conductor surface of the inner wall of the through hole. It is a characteristic printed wiring board.
In the present invention, the uneven layer is preferably a needle-shaped alloy layer made of copper-nickel-phosphorus or a copper oxide layer (blackening layer), and the filler is an epoxy resin and an organic resin. It is desirable to be any one selected from a mixture of fillers, a mixture of epoxy resins and inorganic fillers, and a mixture of epoxy resins and inorganic fibers.
【０００９】[0009]
【発明の実施の形態】この発明にかかるプリント配線板
の特徴は、スルーホール内壁の導体表面に凹凸層が形成
されている点にある。これにより、スルーホール内壁の
導体と充填材との密着性が向上する。その結果、 ．冷熱サイクル（−65℃⇔125 ℃）やはんだ耐熱試験
（230 ℃での浸漬試験）等の信頼性試験での膨張，収縮
によるクラックの発生を抑止することができる。 ．樹脂の硬化収縮時には、スルーホール内壁の導体と
充填材との界面に隙間が発生しないので、めっき処理液
等のしみ込みを抑止することができる。The printed wiring board according to the present invention is characterized in that an uneven layer is formed on the conductor surface of the inner wall of the through hole. This improves the adhesion between the conductor on the inner wall of the through hole and the filling material. as a result, . It is possible to prevent the occurrence of cracks due to expansion and contraction in reliability tests such as cooling / heating cycles (-65 ° C ⇔ 125 ° C) and solder heat resistance tests (immersion test at 230 ° C). . When the resin cures and shrinks, no gap is generated at the interface between the conductor on the inner wall of the through hole and the filling material, so that penetration of the plating solution or the like can be suppressed.
【００１０】なお、上記凹凸層は、スルーホール内壁以
外の導体表面にも形成されるので、絶縁層を設けて多層
化する場合や、ソルダーレジストを形成してはんだを供
給する場合には、下層の導体と絶縁層やソルダーレジス
トとの密着性も向上する。Since the uneven layer is formed on the surface of the conductor other than the inner wall of the through hole, when the insulating layer is provided to form a multilayer structure or when the solder resist is formed and the solder is supplied, the lower layer is formed. The adhesion between the conductor and the insulating layer or the solder resist is also improved.
【００１１】このような発明にかかるプリント配線板に
おいて、スルーホール内壁の導体表面に形成した凹凸層
としては、無電解銅−ニッケル−リンめっき等によって
得られる針状合金層や、銅の酸化処理によって得られる
黒化層、銅の酸化処理および還元処理によって得られる
黒化還元層、ブラウン還元層、サンドブラストやショッ
トブラスト、バフ研磨、ラッピング等の物理的手法によ
って得られる物理的粗化層などがある。なかでも、無電
解銅−ニッケル−リンめっき等によって得られる針状合
金層が望ましい。なぜなら、このような合金層は、針状
であるために充填材との密着性に優れ、しかも、強靱性
があり硬くて割れにくく、ヒートサイクル特性にも優れ
るからである。ここで、銅−ニッケル−リン合金層を構
成する銅、ニッケルおよびリンの含有量は、それぞれ、
90〜96％、１〜５％、 0.5〜２wt％程度であることが望
ましい。この理由は、上記範囲内において、析出被膜が
針状構造になり、アンカー効果に優れるからである。In the printed wiring board according to the present invention, the concavo-convex layer formed on the conductor surface of the inner wall of the through hole is a needle-like alloy layer obtained by electroless copper-nickel-phosphorus plating or the like, or a copper oxidation treatment. Blackening layer obtained by, a blackening reduction layer obtained by oxidation and reduction treatment of copper, a brown reduction layer, a physical roughening layer obtained by a physical method such as sandblasting, shot blasting, buffing, lapping, etc. is there. Of these, a needle-shaped alloy layer obtained by electroless copper-nickel-phosphorus plating or the like is preferable. This is because such an alloy layer has a needle-like shape and thus has excellent adhesion to the filler, and is tough, hard and hard to crack, and has excellent heat cycle characteristics. Here, the copper-nickel-phosphorus alloy layer constituting the content of copper, nickel and phosphorus, respectively,
90 to 96%, 1 to 5%, and 0.5 to 2 wt% are desirable. This is because within the above range, the deposited film has a needle-like structure and is excellent in the anchor effect.
【００１２】このような針状合金層を形成するための無
電解めっき浴の組成は、硫酸銅：１〜40ｇ／リットル、
硫酸ニッケル： 0.1〜6.0 ｇ／リットル、クエン酸：10
〜20ｇ／リットル、次亜リン酸塩：10〜100 ｇ／リット
ル、ほう酸：10〜20ｇ／リットル、界面活性剤：0.01〜
10ｇ／リットルとすることが望ましい。特に合金層を針
状とするためには、界面活性剤の存在が必要であり、か
つ上記範囲を満たさなければならない。上記範囲を逸脱
すると、析出する凹凸層を構成するめっき被膜が緻密に
ならず、ヒートサイクル特性が著しく低下してしまうか
らである。また、無電解めっきの条件は、めっき浴の温
度を60〜80℃、ｐＨを 8.5〜10程度の強塩基、浴比を0.
01〜1.0 ｄｍ2 ／ｌとし、析出速度を１〜３μｍ／10
分、めっき時間を５〜20分とすることが望ましい。The composition of the electroless plating bath for forming such an acicular alloy layer is copper sulfate: 1 to 40 g / liter,
Nickel sulfate: 0.1 to 6.0 g / liter, citric acid: 10
~ 20 g / l, hypophosphite: 10 to 100 g / l, boric acid: 10 to 20 g / l, surfactant: 0.01 to
It is desirable to set it to 10 g / liter. In particular, in order to make the alloy layer needle-like, the presence of a surfactant is required and the above range must be satisfied. If it deviates from the above range, the plating film constituting the deposited uneven layer will not be dense and the heat cycle characteristics will be significantly deteriorated. The conditions for electroless plating are as follows: the temperature of the plating bath is 60 to 80 ° C, the pH is a strong base of about 8.5 to 10, and the bath ratio is 0.
01 to 1.0 dm 2 / l, deposition rate 1 to 3 μm / 10
Min, and the plating time is preferably 5 to 20 minutes.
【００１３】このようにして形成される針状合金層は、
凹凸層の厚さを 0.5〜7.0 μｍ、好ましくは 1.0〜5.0
μｍ、より好ましくは 1.5〜3.0 μｍの銅−ニッケル−
リン合金層とすることが望ましい。この理由は、凹凸層
の厚みが7.0 μｍよりも厚くなると、めっき時間の長期
化に起因して製造コストや材料コストが嵩むおそれがあ
るばかりでなく、針状皮膜自体が脆くなって充填材との
間に隙間が生じやすくなる。一方 0.5μｍよりも薄くな
ると、アンカー効果が不充分となって充填材との間に隙
間が生じやすくなるからである。なお、ここでいう凹凸
層（銅−ニッケル−リン合金層）の厚さとは、スルーホ
ール内壁の平滑な導体表面から針状合金の頂部までの距
離をいう。The needle-shaped alloy layer thus formed is
The thickness of the uneven layer is 0.5 to 7.0 μm, preferably 1.0 to 5.0
μm, more preferably 1.5-3.0 μm copper-nickel-
A phosphorus alloy layer is desirable. The reason for this is that if the thickness of the concavo-convex layer is greater than 7.0 μm, not only the manufacturing cost and material cost may increase due to the prolonged plating time, but also the needle-shaped film itself becomes brittle and becomes a filler. A gap is likely to occur between the two. On the other hand, when the thickness is less than 0.5 μm, the anchor effect becomes insufficient and a gap is likely to be formed between the anchor and the filler. The thickness of the concavo-convex layer (copper-nickel-phosphorus alloy layer) here means the distance from the smooth conductor surface of the inner wall of the through hole to the top of the acicular alloy.
【００１４】この発明では、スルーホール内壁に形成し
た凹凸層が無電解銅−ニッケル−リン等の針状合金層で
ある場合には、その凹凸層は、スズ層によって保護され
ていることが望ましい。その理由は、前記合金めっきが
酸や酸化剤に溶解しやすく、その溶解を防止して凹凸層
を維持するためである。しかも、スズ層は、凹凸層の酸
化を防止して凹凸層と充填樹脂との濡れ性を改善でき、
凹凸層と充填樹脂との間に空隙が発生するのを防止して
密着性を向上させることができ、ひいては、ヒートサイ
クルなどに供してもクラック等の発生を抑止することが
可能となる。なお、スズは、工業的に安価で毒性が少な
い金属で、酸や酸化剤での変色がなく、光沢を維持し続
けうるものであり、しかも、銅との置換反応によって析
出する金属であり、銅−ニッケル−リン層の針状合金を
破壊することなく被覆できるという点で好適である。ま
た、スズは、銅との置換反応によって析出するために、
表層の銅と一旦置換されると、そこでの置換反応は終了
し、非常に薄い被膜で上記凹凸層の針状合金を覆うよう
な層を形成する。それ故に、上記凹凸層の針状合金はそ
の尖った形状がそのまま維持され、上記凹凸層とスズめ
っき膜とは密着性にも優れる。In the present invention, when the uneven layer formed on the inner wall of the through hole is a needle-shaped alloy layer such as electroless copper-nickel-phosphorus, it is desirable that the uneven layer is protected by the tin layer. . The reason is that the alloy plating is easily dissolved in an acid or an oxidizing agent, and the dissolution is prevented to maintain the uneven layer. Moreover, the tin layer can prevent the uneven layer from being oxidized and improve the wettability between the uneven layer and the filling resin.
It is possible to prevent the occurrence of voids between the uneven layer and the filling resin and improve the adhesion, and it is possible to suppress the occurrence of cracks and the like even when subjected to a heat cycle or the like. Incidentally, tin is an industrially inexpensive and less toxic metal, does not discolor with an acid or an oxidant, and can maintain its luster, and moreover, it is a metal deposited by a substitution reaction with copper, It is preferable in that the needle-shaped alloy of the copper-nickel-phosphorus layer can be coated without breaking. Further, tin is deposited by the substitution reaction with copper,
Once replaced with the surface copper, the replacement reaction ends and a layer is formed which covers the needle-shaped alloy of the uneven layer with a very thin film. Therefore, the needle-shaped alloy of the concavo-convex layer maintains its sharp shape as it is, and the concavo-convex layer and the tin-plated film also have excellent adhesion.
【００１５】この発明において、充填材を構成するマト
リックス樹脂としては、エポキシ樹脂やポリイミド樹
脂、ポリエーテルサルホン等が挙げられ、なかでもエポ
キシ樹脂を用いることが望ましい。また上記充填材は、
ヒートサイクル特性の改善のために、上記マトリックス
樹脂中に分散材を混合させることが望ましく、かかる分
散材としては、エポキシ樹脂やポリイミド樹脂等の有機
フィラー、シリカやアルミナ等の無機フィラー、ガラス
ファイバーやジルコニア等の無機ファイバーを用いるこ
とができる。In the present invention, examples of the matrix resin constituting the filler include epoxy resin, polyimide resin, polyether sulfone, etc. Among them, it is preferable to use the epoxy resin. Further, the filler is
In order to improve the heat cycle characteristics, it is desirable to mix a dispersant in the matrix resin, as the dispersant, an organic filler such as an epoxy resin or a polyimide resin, an inorganic filler such as silica or alumina, a glass fiber or Inorganic fibers such as zirconia can be used.
【００１６】ここで、上記分散材は、その平均粒径を
0.1〜10μｍとすることが望ましい。この理由は、上記
平均粒径が 0.1μｍよりも小さいと、硬化時における膨
張，収縮の分散材による緩和効果が得られにくく、一
方、平均粒径が10μｍよりも大きいと、分散材が前記針
状合金層の針状形状よりも大きくなり充填材の針状合金
層への追従を阻害するおそれがあるからである。特に、
充填材を、スルーホール内の充填材料として用いる一方
でさらに基板表裏に形成する絶縁層として用い、この絶
縁層上に導体を形成する場合、あるいはスルーホール内
の充填材料としてのみ用い、その充填材の上に導体を形
成する場合などにおいて、上記分散材の粒径範囲は有効
である。即ち、前記充填材と導体との密着性を改善する
ために、その充填材表面には、充填材表面の分散材を酸
化剤等を用いて溶解除去することにより凹凸面（粗化
面）が形成される。この粗化面は、凹凸の形状や粗度が
分散材の大きさに依存し、十分なアンカー効果を得るた
めには１〜20μｍの粗度が必要である。ところが、分散
材の粒径が 0.1μｍよりも小さいと粗度が１μｍよりも
小さくなり、分散材の粒径が10μｍよりも大きいと粗度
が20μｍよりも大きくなる。それ故に、分散材の粒径を
0.1〜10μｍとすることは、特に上記充填材の構成に有
効である。Here, the dispersant has an average particle size of
It is desirable that the thickness is 0.1 to 10 μm. The reason for this is that if the average particle size is less than 0.1 μm, it is difficult to obtain the relaxation effect of the expansion and contraction during curing by the dispersant, while if the average particle size is greater than 10 μm, the dispersant is the needle. This is because it is larger than the needle-like shape of the alloy layer and may hinder the filler from following the needle-shaped alloy layer. Especially,
The filler is used as a filling material in the through-hole, and is also used as an insulating layer formed on the front and back of the substrate, and a conductor is formed on this insulating layer, or is used only as a filling material in the through-hole. The particle size range of the dispersion material is effective, for example, when a conductor is formed on. That is, in order to improve the adhesion between the filler and the conductor, an uneven surface (roughened surface) is formed on the surface of the filler by dissolving and removing the dispersant on the surface of the filler using an oxidizing agent or the like. It is formed. On this roughened surface, the shape and roughness of the unevenness depend on the size of the dispersant, and a roughness of 1 to 20 μm is required to obtain a sufficient anchor effect. However, if the particle size of the dispersion material is smaller than 0.1 μm, the roughness becomes smaller than 1 μm, and if the particle size of the dispersion material is larger than 10 μm, the roughness becomes larger than 20 μm. Therefore, the particle size of the dispersant
The thickness of 0.1 to 10 μm is particularly effective for the composition of the filler.
【００１７】なお、有機フィラーまたは無機フィラーで
いうフィラーとは、最長長／最短長のアスペクト比が１
〜1.2 である分散材をいう。また、無機ファイバーでい
うファイバーとは、最長長／最短長のアスペクト比が1.
2 よりも大きい分散材をいう。A filler referred to as an organic filler or an inorganic filler has an aspect ratio of maximum length / shortest length of 1
A dispersant that is ~ 1.2. In addition, the fiber referred to as an inorganic fiber has an aspect ratio of the longest length / shortest length of 1.
A dispersant greater than 2.
【００１８】[0018]
（実施例１） (1)ガラスエポキシ銅張積層板（FR−４）に、ドリル孔
明け加工によりスルーホール形成用の貫通孔を形成し
た。次いで、その基板１を活性化し、無電解銅めっきと
電解銅めっきを施し、スルーホール３を形成した。 (2)次に、前記(1) でスルーホール３を形成した基板１
を酸性脱脂し、ソフトエッチングし、塩化パラジウムと
有機酸からなる触媒溶液で処理して、Pd触媒を付与し、
活性化を行った後、下記表に示す組成の無電解めっき浴
にてめっきを施し、銅パターンとスルーホール３内壁に
Cu−Ni−Ｐ合金の厚さ 2.5μｍの凹凸層（粗化層）４を
形成した。(Example 1) (1) A through hole for forming a through hole was formed in a glass epoxy copper clad laminate (FR-4) by drilling. Then, the substrate 1 was activated and electroless copper plating and electrolytic copper plating were performed to form the through holes 3. (2) Next, the substrate 1 having the through holes 3 formed in (1) above.
Acid degreasing, soft etching, treating with a catalyst solution consisting of palladium chloride and an organic acid to impart a Pd catalyst,
After activation, plating is performed in an electroless plating bath having the composition shown in the table below, and the copper pattern and the inner wall of the through hole 3 are plated.
A concavo-convex layer (roughening layer) 4 having a thickness of 2.5 μm of Cu—Ni—P alloy was formed.
【００１９】 [0019]
【００２０】特に、本実施例では、Cu−Ni−Ｐ合金の前
記粗化層４を形成するためのめっき浴は、荏原ユージラ
イト株式会社製、商品名「インタープレートプロセス」
を使用した。その処理条件は、70℃、10分とした。 (3)次に、前記 (2)の処理をし終えた基板を水洗（およ
び必要に応じて乾燥）した後、さらにホウふっ化スズ−
チオ尿素液（あるいは塩化スズ−チオ尿素液）からなる
無電解スズめっき浴に50℃で１分間浸漬して、Cu−Ni−
Ｐ合金の粗化層４表面に厚さ 0.3μｍのスズめっき層を
置換形成した。なお、この無電解スズめっきは置換反応
であるため、Cu−Ni−Ｐの表面がスズめっきで一旦置換
されると、めっき反応がそれ以上進行せず、非常に薄い
スズめっき層を形成することができる。しかも、置換反
応であるため、Cu−Ni−Ｐ層とスズめっき層との密着性
にも優れる。Particularly, in this embodiment, the plating bath for forming the roughened layer 4 of Cu-Ni-P alloy is manufactured by Ebara-Udylite Co., Ltd. under the trade name "Interplate Process".
It was used. The treatment conditions were 70 ° C. and 10 minutes. (3) Next, after washing the substrate that has been subjected to the treatment of (2) above (and drying if necessary), tin borofluoride-
Immerse in an electroless tin plating bath consisting of a thiourea solution (or tin chloride-thiourea solution) at 50 ° C for 1 minute to form Cu-Ni-
On the surface of the roughening layer 4 of P alloy, a tin plating layer having a thickness of 0.3 μm was formed by substitution. Since this electroless tin plating is a substitution reaction, once the surface of Cu-Ni-P is replaced with tin plating, the plating reaction does not proceed any further and a very thin tin plating layer is formed. You can Moreover, since it is a substitution reaction, the adhesion between the Cu-Ni-P layer and the tin plating layer is also excellent.
【００２１】 (4)そして、上述したような処理を施したスルーホール
３内に充填材５を充填した。なお、充填材５の組成は以
下に示すとおりであり、充填はスキージ印刷方法に従っ
て行った。 ・Ｅ807 （油化シェル製） ： 60 重量部 ・HN−2200（日立化成製） ： 40 重量部 ・2E4MZ-CN（四国化成製、硬化剤）： 0.5wt％ ・SiO2粉末（龍森製） ： 150wt％ (5)充填材５を充填した後、80℃で１時間、 100℃で１
時間、 120℃で１時間、150℃で３時間の条件で硬化処
理した（図１参照）。[0021] (4) Then, the filling material 5 is filled in the through hole 3 which has been subjected to the above-mentioned treatment. The composition of the filler 5 is as shown below, and the filling was performed according to the squeegee printing method.・ E807 (made by Yuka Shell): 60 parts by weight ・ HN-2200 (made by Hitachi Chemical): 40 parts by weight ・ 2E4MZ-CN (hardening agent made by Shikoku Kasei): 0.5 wt% ・ SiO 2 powder (made by Tatsumori) : 150wt% (5) After filling with filling material 5, 1 hour at 80 ℃, 1 hour at 100 ℃
Curing treatment was performed under the conditions of 120 ° C. for 1 hour and 150 ° C. for 3 hours (see FIG. 1).
【００２２】（実施例２） (1) 実施例１と同様にして、スルーホール３を形成し
た基板１を脱脂し、水洗し、酸処理をしてから黒化浴に
６分間浸漬し、黒化処理を施した。なお、黒化浴は、Na
OH(10g/l) 、NaClO2(40g/l) 、Na3PO4(6g/l)の混合液を
用いた。 (2)次に、前記 (1)の処理を施した基板１を水洗し、還
元浴に１分間浸漬し、還元処理を施した。なお、還元浴
は、NaOH(10g/l) 、NaBH4 の混合液を用いた。 (3)さらに、前記(1)(2)の処理をし終えた基板１の水洗
を繰り返すことにより、粗度が 1.5μｍ〜３μｍの範囲
にある粗面（凹凸層）４をスルーホール３内壁に形成し
た。 (4)そして、上述したような処理を施したスルーホール
３内に充填材５を充填した。なお、充填材５の組成は以
下に示すとおりであり、充填はロールコーターを用いて
行った。 ・Ａ-BPE-4（新中村化学製） ：80重量部 ・Ｅ807 （油化シェル製） ：20重量部 ・2P4MHZ（四国化成製、硬化剤） ：５重量部 ・DETX（日本化薬製、硬化剤） ：５重量部 ・Ｉ-907（チバガイギー製、硬化剤）：５重量部 ・SiO2粉末（不二見研磨剤工業製） ： 100wt％ ・Ｓ-65 （サンノプコ製、消泡剤） ： 0.5wt％ (5)充填材５を充填した後、紫外線1000mj/cm2で露光
し、基板表面から突出している部分をバフ研磨で研削
し、さらに、100 ℃で１時間、150 ℃で５時間の熱硬化
を行った。(Example 2) (1) In the same manner as in Example 1, the substrate 1 having the through holes 3 formed thereon was degreased, washed with water, treated with an acid, and then immersed in a blackening bath for 6 minutes to obtain black. Chemical treatment was performed. The blackening bath is Na
A mixed solution of OH (10 g / l), NaClO 2 (40 g / l) and Na 3 PO 4 (6 g / l) was used. (2) Next, the substrate 1 that had been subjected to the treatment of (1) above was washed with water, immersed in a reducing bath for 1 minute, and subjected to a reducing treatment. The reducing bath used was a mixed solution of NaOH (10 g / l) and NaBH 4 . (3) Furthermore, by repeating the washing of the substrate 1 that has been subjected to the treatments of (1) and (2) above with water, a rough surface (uneven layer) 4 having a roughness of 1.5 μm to 3 μm is formed on the inner wall of the through hole 3. Formed. (4) Then, the filling material 5 is filled in the through hole 3 which has been subjected to the above-mentioned treatment. The composition of the filler 5 is as shown below, and the filling was performed using a roll coater.・ A-BPE-4 (manufactured by Shin-Nakamura Chemical): 80 parts by weight ・ E807 (manufactured by Yuka Shell): 20 parts by weight ・ 2P4MHZ (manufactured by Shikoku Kasei, curing agent): 5 parts by weight ・ DETX (manufactured by Nippon Kayaku, Curing agent): 5 parts by weight I-907 (Ciba Geigy, curing agent): 5 parts by weight SiO 2 powder (manufactured by Fujimi Abrasives Industry): 100 wt% S-65 (San Nopco defoamer): 0.5wt% (5) After filling the filling material 5, it is exposed to 1000mj / cm 2 of ultraviolet rays, the part protruding from the substrate surface is ground by buffing, and further 100 ° C for 1 hour and 150 ° C for 5 hours. Was heat-cured.
【００２３】（実施例３） (1)実施例１と同様にして、スルーホール３の形成と凹
凸層（粗化面）４の形成を行った。この時の凹凸層４の
厚さは 1.0μｍであった。 (2)次に、スルーホール３内に充填材５を充填した。な
お、充填材５の組成は以下に示すとおりである。 ・ 828Ａ（油化シェル製） ： 100重量部 ・ベンゾフェノン（関東化学製、開始剤）： ５重量部 ・ミヒラーケトン（関東化学製、開始剤）： 0.5重量部 ・ガラスファイバー ： 100wt％ ・Ｆ-45 （サンノプコ製；脱泡剤） ： １重量部 (3)充填材５を充填した後、紫外線1000mj/cm2で仮露光
し、基板表面から突出している部分をバフ研磨で研削
し、さらに、紫外線6000mj/cm2で露光して本硬化した。Example 3 (1) In the same manner as in Example 1, a through hole 3 and an uneven layer (roughened surface) 4 were formed. At this time, the thickness of the uneven layer 4 was 1.0 μm. (2) Next, the filling material 5 is filled in the through holes 3. The composition of the filler 5 is as shown below.・ 828A (made by Yuka Shell): 100 parts by weight ・ Benzophenone (made by Kanto Kagaku, initiator): 5 parts by weight ・ Michler Ketone (made by Kanto Kagaku, initiator): 0.5 parts by weight ・ Glass fiber: 100wt% ・ F-45 (Made by San Nopco; Defoamer): 1 part by weight (3) After filling the filler 5, it is temporarily exposed to 1000 mj / cm 2 of ultraviolet light, and the part protruding from the substrate surface is ground by buffing, and further ultraviolet light It was exposed to 6000 mj / cm 2 and was fully cured.
【００２４】（比較例１）実施例１と同様にしてスルー
ホール３を形成し、凹凸層（粗化面）４を形成すること
なく、このスルーホール３内に、実施例１と同組成の充
填材５を充填した（図２参照）。(Comparative Example 1) A through hole 3 was formed in the same manner as in Example 1, and the same composition as in Example 1 was formed in the through hole 3 without forming the uneven layer (roughened surface) 4. Filling material 5 was filled (see FIG. 2).
【００２５】（比較例２）実施例１と同様にして、スル
ーホール３の形成と凹凸層（粗化面）４の形成を行っ
た。この時の、凹凸層４の厚さは 0.2μｍであった。そ
して、実施例１と同組成の充填材５をスルーホール３内
に充填した。Comparative Example 2 In the same manner as in Example 1, the through hole 3 and the uneven layer (roughened surface) 4 were formed. At this time, the thickness of the uneven layer 4 was 0.2 μm. Then, the filling material 5 having the same composition as in Example 1 was filled in the through holes 3.
【００２６】（比較例３）実施例１と同様にして、スル
ーホール３の形成と凹凸層（粗化面）４の形成を行っ
た。この時の、凹凸層４の厚さは10μｍであった。そし
て、実施例１と同組成の充填材５をスルーホール３内に
充填した。Comparative Example 3 In the same manner as in Example 1, the through hole 3 and the uneven layer (roughened surface) 4 were formed. At this time, the thickness of the uneven layer 4 was 10 μm. Then, the filling material 5 having the same composition as in Example 1 was filled in the through holes 3.
【００２７】このようにして得られたスルーホール内に
充填材を充填した基板に関し、冷熱サイクル特性（−65
℃⇔125 ℃の冷熱衝撃試験でのクラック発生サイクル数
で示す）およびスルーホール内の断面観察による液しみ
込みの有無（めっき腐食または導体めっき／充填材界面
の隙間発生）を調べた。With respect to the substrate in which the through hole thus obtained is filled with the filler, the thermal cycle characteristics (-65
The number of crack generation cycles in the thermal shock test between ℃ ⇔ 125 ℃) and the presence or absence of liquid penetration (plating corrosion or gaps at the conductor plating / filler interface) were examined by observing the cross section in the through hole.
【００２８】その結果を表１に示す。この表に示す結果
から明らかなように、この発明にかかるスルーホールの
構成によれば、スルーホール内壁の導体と充填材との密
着性が向上する。それ故に、冷熱サイクル特性に優れ、
硬化時の膨張，収縮によるクラックの発生を抑止するこ
とができる。しかも、硬化収縮時に、スルーホール内壁
の導体と充填材との界面に隙間が発生しないので、めっ
き処理液等のしみ込みを抑止することができることを確
認した。The results are shown in Table 1. As is clear from the results shown in this table, the configuration of the through hole according to the present invention improves the adhesion between the conductor on the inner wall of the through hole and the filler. Therefore, it has excellent thermal cycle characteristics,
It is possible to prevent the occurrence of cracks due to expansion and contraction during curing. In addition, it was confirmed that since a gap does not occur at the interface between the conductor on the inner wall of the through hole and the filler during curing shrinkage, it is possible to suppress the penetration of the plating solution or the like.
【００２９】[0029]
【表１】 ＊１；粗度を示す。 ＊２；−65℃⇔125 ℃の冷熱衝撃試験でのクラック発生サイクル数 ＊３；スルーホール内の断面観察による液しみ込みの有無 （めっき腐食または導体めっき／充填材界面の隙間発生）[Table 1] * 1: Shows roughness. * 2: Number of crack generation cycles in the thermal shock test between -65 ° C and 125 ° C * 3: Presence or absence of liquid soaking by observing the cross section in the through-hole (plating corrosion or gaps at the conductor plating / filler interface)
【００３０】[0030]
【発明の効果】以上説明したようにこの発明によれば、
スルーホール内壁と充填材との密着性に優れ、クラック
の発生やめっき処理液等のしみ込みを抑止できる信頼性
に優れたプリント配線板を提供することができる。As described above, according to the present invention,
It is possible to provide a printed wiring board that has excellent adhesion between the inner wall of the through hole and the filling material and that can suppress the occurrence of cracks and the penetration of the plating solution or the like and that has excellent reliability.
【図１】この発明のプリント配線板におけるスルーホー
ルの構成を示す部分断面図である。FIG. 1 is a partial cross-sectional view showing the structure of through holes in a printed wiring board according to the present invention.
【図２】従来のプリント配線板におけるスルーホールの
構成を示す部分断面図である。FIG. 2 is a partial cross-sectional view showing the structure of through holes in a conventional printed wiring board.
１ 基板 ２ 導体 ３ スルーホール ４ 凹凸層（粗化層） ５ 充填材 1 Substrate 2 Conductor 3 Through Hole 4 Concavo-convex Layer (Roughening Layer) 5 Filling Material
Claims (4)
を充填材によって密封状態に閉塞処理してなるプリント
配線板において、該スルーホール内壁の導体表面に凹凸
層が形成されていることを特徴とするプリント配線板。1. A printed wiring board having a through hole, wherein the inside of the through hole is hermetically closed by a filling material, wherein a concavo-convex layer is formed on the conductor surface of the inner wall of the through hole. And a printed wiring board.
る針状合金層である、請求項１に記載のプリント配線
板。2. The printed wiring board according to claim 1, wherein the uneven layer is a needle-shaped alloy layer made of copper-nickel-phosphorus.
に記載のプリント配線板。3. The uneven layer is a copper oxide layer.
The printed wiring board described in.
ラーの混合物、エポキシ樹脂と無機フィラーの混合物、
およびエポキシ樹脂と無機ファイバーの混合物のなかか
ら選ばれるいずれか１つである、請求項１に記載のプリ
ント配線板。4. The filler is a mixture of epoxy resin and organic filler, a mixture of epoxy resin and inorganic filler,
The printed wiring board according to claim 1, which is any one selected from the group consisting of an epoxy resin and an inorganic fiber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26281096A JP3172456B2 (en) | 1995-10-23 | 1996-10-03 | Printed wiring board |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27392895 | 1995-10-23 | ||
| JP7-273928 | 1995-10-23 | ||
| JP26281096A JP3172456B2 (en) | 1995-10-23 | 1996-10-03 | Printed wiring board |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000065747A Division JP2000269620A (en) | 1995-10-23 | 2000-03-06 | Printed wiring board |
| JP2000160100A Division JP2000357850A (en) | 1995-10-23 | 2000-05-30 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09181415A true JPH09181415A (en) | 1997-07-11 |
| JP3172456B2 JP3172456B2 (en) | 2001-06-04 |
Family
ID=26545724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26281096A Expired - Lifetime JP3172456B2 (en) | 1995-10-23 | 1996-10-03 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3172456B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999020090A1 (en) * | 1997-10-14 | 1999-04-22 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| JP2002134921A (en) * | 2000-10-30 | 2002-05-10 | Ibiden Co Ltd | Multilayer printed wiring board and method for manufacturing the same |
| WO2004110116A1 (en) * | 2003-06-03 | 2004-12-16 | Hitachi Metals, Ltd. | Production method for feedthrough electrode-carrying substrate |
| JP2005317934A (en) * | 2004-03-31 | 2005-11-10 | Ngk Spark Plug Co Ltd | Component support substrate and its manufacturing method, and optical device |
| JP2006324500A (en) * | 2005-05-19 | 2006-11-30 | Olympus Corp | Junction structure and joining method |
| US7178234B2 (en) | 1999-10-26 | 2007-02-20 | Ibiden Co., Ltd. | Method of manufacturing multi-layer printed circuit board |
| US7183497B2 (en) | 2003-12-16 | 2007-02-27 | Ngk Spark Plug Co., Ltd. | Multilayer wiring board |
| US7415761B2 (en) | 1998-09-03 | 2008-08-26 | Ibiden Co., Ltd. | Method of manufacturing multilayered circuit board |
| JP2008263222A (en) * | 2008-06-23 | 2008-10-30 | Ibiden Co Ltd | Multilayer printed wiring board |
-
1996
- 1996-10-03 JP JP26281096A patent/JP3172456B2/en not_active Expired - Lifetime
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999020090A1 (en) * | 1997-10-14 | 1999-04-22 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| US6376049B1 (en) | 1997-10-14 | 2002-04-23 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| US6376052B1 (en) | 1997-10-14 | 2002-04-23 | Ibiden Co., Ltd. | Multilayer printed wiring board and its production process, resin composition for filling through-hole |
| USRE40947E1 (en) | 1997-10-14 | 2009-10-27 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| US7415761B2 (en) | 1998-09-03 | 2008-08-26 | Ibiden Co., Ltd. | Method of manufacturing multilayered circuit board |
| US8148643B2 (en) | 1998-09-03 | 2012-04-03 | Ibiden Co., Ltd. | Multilayered printed circuit board and manufacturing method thereof |
| US7832098B2 (en) | 1998-09-03 | 2010-11-16 | Ibiden Co., Ltd. | Method of manufacturing a multilayered printed circuit board |
| US8822839B2 (en) | 1999-10-26 | 2014-09-02 | Ibiden Co., Ltd. | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| US7178234B2 (en) | 1999-10-26 | 2007-02-20 | Ibiden Co., Ltd. | Method of manufacturing multi-layer printed circuit board |
| US7999194B2 (en) | 1999-10-26 | 2011-08-16 | Ibiden Co., Ltd. | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| US8106310B2 (en) | 1999-10-26 | 2012-01-31 | Ibiden Co., Ltd. | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| US7795542B2 (en) | 1999-10-26 | 2010-09-14 | Ibiden Co., Ltd. | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| JP4605888B2 (en) * | 2000-10-30 | 2011-01-05 | イビデン株式会社 | Multilayer printed wiring board and method for producing multilayer printed wiring board |
| JP2002134921A (en) * | 2000-10-30 | 2002-05-10 | Ibiden Co Ltd | Multilayer printed wiring board and method for manufacturing the same |
| WO2004110116A1 (en) * | 2003-06-03 | 2004-12-16 | Hitachi Metals, Ltd. | Production method for feedthrough electrode-carrying substrate |
| US7183497B2 (en) | 2003-12-16 | 2007-02-27 | Ngk Spark Plug Co., Ltd. | Multilayer wiring board |
| JP4639101B2 (en) * | 2004-03-31 | 2011-02-23 | 日本特殊陶業株式会社 | Component supporting substrate, manufacturing method thereof, and optical device |
| JP2005317934A (en) * | 2004-03-31 | 2005-11-10 | Ngk Spark Plug Co Ltd | Component support substrate and its manufacturing method, and optical device |
| JP2006324500A (en) * | 2005-05-19 | 2006-11-30 | Olympus Corp | Junction structure and joining method |
| JP2008263222A (en) * | 2008-06-23 | 2008-10-30 | Ibiden Co Ltd | Multilayer printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3172456B2 (en) | 2001-06-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000353874A (en) | Multilayer printed wiring board and production thereof | |
| EP1893005B1 (en) | Printed wiring board and method of producing a printed wiring board | |
| EP1705973B1 (en) | Build-up mulitlayer printed circuit board | |
| JP3101197B2 (en) | Multilayer printed wiring board and method of manufacturing the same | |
| JP5216078B2 (en) | Multilayer printed wiring board and method for producing multilayer printed wiring board | |
| KR100492465B1 (en) | Printed-circuit board and method for manufacturing thereof | |
| JPH09181415A (en) | Printed wiring board | |
| JP4582892B2 (en) | Multilayer printed wiring board and manufacturing method thereof | |
| JP3229923B2 (en) | Multilayer printed wiring board and method of manufacturing the same | |
| JP2000357850A (en) | Printed wiring board | |
| JP3152633B2 (en) | Multilayer printed wiring board and method of manufacturing the same | |
| JP2003332737A (en) | Printed wiring board | |
| JP4209006B2 (en) | Manufacturing method of multilayer printed wiring board | |
| JP3098729B2 (en) | Manufacturing method of multilayer printed wiring board | |
| JP2000196227A (en) | Manufacture of printed wiring board | |
| JP2000183495A (en) | Forming method for conductor circuit and manufacture of printed-wiring board | |
| JP2000022309A (en) | Printed wiring board | |
| JP2000332408A (en) | Printed wiring board | |
| JPH1117336A (en) | Multilayer printed wiring board and its manufacture | |
| JP2000156551A (en) | Printed wiring board, body to be treated, and manufacture of printed wiring board | |
| JPH11251720A (en) | Manufacture of printed wiring board | |
| JP2000114717A (en) | Multilayer printed wiring board and manufacture thereof | |
| JP2000183521A (en) | Printed wiring board and body to be processed and manufacture of the printed wiring board | |
| JP2001102750A (en) | Multilayer printed wiring board and manufacturing method thereof | |
| JP2000124607A (en) | Multilayer printed wiring board and its manufacture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080323 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090323 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100323 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100323 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 10 Free format text: PAYMENT UNTIL: 20110323 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110323 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130323 Year of fee payment: 12 |