JPH0917605A - Thick film resistor paste composition - Google Patents

Thick film resistor paste composition

Info

Publication number
JPH0917605A
JPH0917605A JP7188119A JP18811995A JPH0917605A JP H0917605 A JPH0917605 A JP H0917605A JP 7188119 A JP7188119 A JP 7188119A JP 18811995 A JP18811995 A JP 18811995A JP H0917605 A JPH0917605 A JP H0917605A
Authority
JP
Japan
Prior art keywords
oxide
powder
thick film
paste composition
ruthenium oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7188119A
Other languages
Japanese (ja)
Inventor
Atsuhiko Yanagisawa
敦彦 柳澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku International KK
Original Assignee
Tanaka Kikinzoku International KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku International KK filed Critical Tanaka Kikinzoku International KK
Priority to JP7188119A priority Critical patent/JPH0917605A/en
Publication of JPH0917605A publication Critical patent/JPH0917605A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To form a thick film resistor of low resistance which is excellent in geometry effect, by using ruthenium oxide to which admixture is added in the form of oxide coating, as conducting component, and printing and forming the conducting component on an Ag rich thick film conductor electrode. CONSTITUTION: In thick film resistor paste composition wherein conducting powder whose main component is ruthenium oxide, glass powder, titnium oxide, and manganese oxide are dispersed in organic vehicle, the surface of the ruthenium oxide powder is previously coated with titanium oxide and manganese oxide. In another thick film resistor paste composition, the following is used as conducting powder; ruthenium oxide powder on which surface titanium oxide coating and manganese oxide coating are formed by heat treatment after ruthenium oxide powder is dispersed in an aqueous solution which is a mixture of the colloidal solution of titanium oxide and the aqueous solution of manganese oxide precursor, and water content is evaporated. Thereby a resistor wherein geometry effect is small can be formed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はハイブリッドICやネッ
トワーク抵抗器・チップ抵抗器等の電子回路部品の印刷
抵抗体の形成に用いる厚膜抵抗ペースト組成物に関する
ものであり、特にAgリッチ導体による電極と組み合わ
せた場合にも良好な特性を発揮する低抵抗値レンジの印
刷抵抗体を形成する事に有用な厚膜抵抗ペースト組成物
に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thick film resistor paste composition used for forming a printed resistor of an electronic circuit component such as a hybrid IC, a network resistor and a chip resistor, and more particularly to an electrode made of an Ag-rich conductor. The present invention relates to a thick film resistance paste composition which is useful for forming a printed resistor having a low resistance value range which exhibits good characteristics when combined with.

【0002】[0002]

【従来の技術】印刷抵抗体の形成に用いられる厚膜抵抗
ペースト組成物は一般的に酸化ルテニウムまたはルテニ
ウム酸鉛を主成分とする導電性粉末、ガラス粉末、有機
ビヒクル及び添加物を秤量し混合後、三本ロールミル等
を用いて混練することにより製造される。こうして製造
された抵抗ペーストは、予め電極を形成した絶縁セラミ
ック基板上に印刷し焼成されることにより抵抗体を形成
する。電極としては、Ag、Au、AgPd、AgPt
のいずれかを主成分とする厚膜導体ペーストを印刷焼成
して形成されるものが通常用いられている。
2. Description of the Related Art A thick film resistance paste composition used for forming a printed resistor is generally prepared by measuring and mixing conductive powder, glass powder, organic vehicle and additives mainly containing ruthenium oxide or lead ruthenate. Then, it is manufactured by kneading using a three-roll mill or the like. The resistor paste thus manufactured forms a resistor by printing on an insulating ceramic substrate on which electrodes are formed in advance and firing it. As electrodes, Ag, Au, AgPd, AgPt
The one formed by printing and firing a thick film conductor paste containing any of the above as a main component is usually used.

【0003】[0003]

【発明が解決しようとする課題】印刷抵抗体はそのパタ
ーン形状及びパターンサイズにより、シート抵抗値、抵
抗値温度係数(TCR)、ESD特性等に差が生じるこ
とがあり、この現象をジオメトリー効果と言い、抵抗体
と組み合わせる電極材によってこのジオメトリー効果の
影響度合いも大きく違ってくることが一般的に知られて
いる。電極材としてPd含有率の高いAgPd導体即ち
Pdリッチ導体もしくはAu導体を使用した場合は顕著
なジオメトリー効果が見られなかったが、昨今盛んに使
用されるようになったAgの含有率が圧倒的に高いいわ
ゆるAgリッチ導体を電極材とした場合には非常にジオ
メトリー効果の影響を受け易く、抵抗値、TCRがパタ
ーンによって大きく変化する。しかも電子回路・部品の
小型化によって抵抗体のパターンサイズが微細化し、電
極間距離が減少する傾向にあるため、ジオメトリー効果
の影響は無視できないレベルとなっている。
The printed resistor may have a difference in sheet resistance, temperature coefficient of resistance (TCR), ESD characteristics, etc. depending on its pattern shape and pattern size. This phenomenon is referred to as a geometric effect. In other words, it is generally known that the degree of influence of this geometry effect greatly varies depending on the electrode material combined with the resistor. When an AgPd conductor with a high Pd content, that is, a Pd-rich conductor or an Au conductor was used as an electrode material, no remarkable geometric effect was observed, but the Ag content, which has become popular recently, is overwhelming. When a very high so-called Ag-rich conductor is used as the electrode material, it is very susceptible to the geometry effect, and the resistance value and TCR change greatly depending on the pattern. In addition, the pattern size of the resistor tends to become finer due to the miniaturization of electronic circuits and parts, and the distance between the electrodes tends to decrease, so that the effect of the geometry effect cannot be ignored.

【0004】本発明の目的は、上記の問題点を解決し、
Agリッチ厚膜導体と組み合わせた場合にもジオメトリ
ー効果の小さい抵抗体の形成が可能な厚膜抵抗ペースト
組成物を提供することにある。
An object of the present invention is to solve the above problems,
It is an object of the present invention to provide a thick film resistor paste composition capable of forming a resistor having a small geometric effect even when combined with an Ag-rich thick film conductor.

【0005】[0005]

【課題を解決するための手段】本発明は、酸化ルテニウ
ムを主成分とする導電性粉末とガラス粉末と酸化チタン
及び酸化マンガンとを有機ビヒクルに分散させてなる厚
膜抵抗ペースト組成物において、酸化チタン及び酸化マ
ンガンがあらかじめ酸化ルテニウム粉末表面に被覆して
ある事を特徴とする。
The present invention provides a thick film resistance paste composition comprising a conductive powder containing ruthenium oxide as a main component, a glass powder, titanium oxide and manganese oxide dispersed in an organic vehicle. It is characterized in that the surface of ruthenium oxide powder is previously coated with titanium and manganese oxide.

【0006】本発明の効果をより良く発揮させる為に
は、酸化チタン及び酸化マンガン水溶液中に酸化ルテニ
ウム粉末を分散させてから水分を蒸発させた後熱処理す
る事により表面に酸化チタン及び酸化マンガン被覆を形
成した酸化ルテニウム粉末を導電性粉末として用いる事
が望ましい。また、熱処理の温度は500℃とすること
が望ましい。
In order to exert the effects of the present invention more effectively, ruthenium oxide powder is dispersed in an aqueous solution of titanium oxide and manganese oxide, water is evaporated, and then heat treatment is performed to coat the surface with titanium oxide and manganese oxide. It is desirable to use the ruthenium oxide powder having the above-mentioned structure as the conductive powder. Further, it is desirable that the temperature of the heat treatment be 500 ° C.

【0007】本発明において、酸化ルテニウム粉末とし
ては、酸化ルテニウムの水和物を用いることができ、特
に比表面積50m2/g以上、より好ましくは100m2
/g以上の極微細な粉末状の酸化ルテニウム水和物が好
ましく用いられる。この様な酸化ルテニウム水和物微粉
末は、例えば塩化ルテニウム水溶液をアルカリもしくは
アルコールで中和還元して得られる。
In the present invention, as the ruthenium oxide powder, a hydrate of ruthenium oxide can be used, and in particular, a specific surface area of 50 m 2 / g or more, more preferably 100 m 2
/ G or more ultrafine powdery ruthenium oxide hydrate is preferably used. Such ruthenium oxide hydrate fine powder can be obtained, for example, by neutralizing and reducing an aqueous ruthenium chloride solution with an alkali or alcohol.

【0008】また、本発明で用いられる酸化チタン水溶
液としては酸化チタンコロイド(TiO2ゾル)が好ま
しく、酸化マンガン前駆体としては、加熱によって酸化
マンガンを生成し、水に可溶な物であれば良く、例えば
KMnO4が適当である。
The titanium oxide aqueous solution used in the present invention is preferably titanium oxide colloid (TiO 2 sol), and the manganese oxide precursor is a water-soluble substance that produces manganese oxide. Well, for example KMnO 4 is suitable.

【0009】こうして得られた酸化物被覆済み酸化ルテ
ニウム粉末とガラス粉末とを分散させる有機ビヒクルと
しては、エチルセルロースをカルビトールアセテート、
ターピネオール等の有機溶剤に溶解したものが好ましく
用いられる。
As an organic vehicle for dispersing the oxide-coated ruthenium oxide powder thus obtained and the glass powder, ethyl cellulose is used as carbitol acetate,
Those dissolved in an organic solvent such as terpineol are preferably used.

【0010】[0010]

【作用】こうして得られる酸化物被覆済み酸化ルテニウ
ム粉末を導電成分とする抵抗ペーストを焼成して得られ
る抵抗膜中には、酸化チタン及び酸化マンガンが導電成
分の酸化ルテニウムを取り囲む形で均一に分散された状
態が出現する為、ジオメトリー効果の抑制によりよく寄
与するものと考えられる。しかも粉末時の熱処理及びペ
ースト化後の焼成においては、酸化ルテニウム粉末の周
囲の酸化物が障壁となって酸化ルテニウムの不均一粒成
長が防止される結果、酸化ルテニウムの粗大化が抑制さ
れる為、抵抗体としての特性向上に寄与する所が大きい
と考えられる。
[Function] Titanium oxide and manganese oxide are uniformly dispersed in the resistance film obtained by firing the resistance paste containing the oxide-coated ruthenium oxide powder as a conductive component so as to surround the conductive component ruthenium oxide. It is thought that this contributes better to the suppression of the geometrical effect because the appearance of the state occurs. Moreover, in the heat treatment during powdering and the firing after forming into a paste, the oxide around the ruthenium oxide powder serves as a barrier to prevent nonuniform grain growth of ruthenium oxide, and as a result, coarsening of ruthenium oxide is suppressed. It is considered that there is a large contribution to improving the characteristics of the resistor.

【0011】[0011]

【実施例】酸化ルテニウム(RuO2)粉末100重量
部を純水に分散させ、その中にKMnO4水溶液(酸化
マンガンMnO2として4.5重量部を含有に相当)と
TiO2ゾル(TiO2として1.7重量部を含有)を加
えよく攪拌分散させた後、120℃で乾燥し、800℃
で熱処理しMnO2とTiO2を被覆したRuO2粉(比
表面積20m2/g)を作成した。SiO2:28.3
%、B238.0%、PbO55.2%、Al234.
7%、CuO3.8%からなる組成のガラス粉末55重
量部とMnO2、TiO2被覆RuO2粉末107.2重
量部とを、エチルセルロース3重量部をターピネオール
25重量部に溶解した有機ビヒクルに加え、よく三本ロ
ールミルで分散させ厚膜抵抗ペーストを作製した。この
厚膜抵抗ペーストを、AgPd比99.5:0.5のA
gPd導体による電極が形成されたアルミナ基板上にス
クリーン印刷し120℃で10分間乾燥後850℃で焼
成して厚膜抵抗体を得た。この際の抵抗体のパターンサ
イズは1.0mm幅1.0mm長のものと0.5mm幅
0.5mm長のもので実施した。評価結果を表1に示
す。
EXAMPLE 100 parts by weight of ruthenium oxide (RuO 2 ) powder was dispersed in pure water, and a KMnO 4 aqueous solution (equivalent to containing 4.5 parts by weight of manganese oxide MnO 2 ) and TiO 2 sol (TiO 2 ) were dispersed therein. Of 1.7 parts by weight) and well stirred and dispersed, and then dried at 120 ° C. to 800 ° C.
Was heat-treated in order to prepare RuO 2 powder (specific surface area 20 m 2 / g) coated with MnO 2 and TiO 2 . SiO 2 : 28.3
%, B 2 O 3 8.0%, PbO 55.2%, Al 2 O 3 4.
55 parts by weight of glass powder having a composition of 7% and 3.8% of CuO and 107.2 parts by weight of RuO 2 powder coated with MnO 2 and TiO 2 were added to an organic vehicle in which 3 parts by weight of ethyl cellulose was dissolved in 25 parts by weight of terpineol. , And was well dispersed by a three-roll mill to prepare a thick film resistance paste. This thick film resistance paste was used as an A with an AgPd ratio of 99.5: 0.5.
A thick film resistor was obtained by screen-printing on an alumina substrate on which an electrode made of a gPd conductor was formed, drying at 120 ° C. for 10 minutes, and baking at 850 ° C. The pattern size of the resistor at this time was 1.0 mm wide and 1.0 mm long and 0.5 mm wide and 0.5 mm long. Table 1 shows the evaluation results.

【0012】[0012]

【表1】 [Table 1]

【0013】従来例として、RuO2粉末を400℃で
熱処理し比表面積を20m2/gに調整して得られたR
uO2粉末100重量部、上記組成のガラス粉末55重
量部、MnO24.5重量部及びTiO21.7重量部を
上記の有機ビヒクル28重量部に加え、三本ロールミル
で分散し厚膜抵抗ペーストを作成した。試料作成方法と
評価は実施例と同様に行った。結果を表1に併記する。
As a conventional example, R obtained by heat treating RuO 2 powder at 400 ° C. and adjusting the specific surface area to 20 m 2 / g
100 parts by weight of uO 2 powder, 55 parts by weight of glass powder having the above composition, 4.5 parts by weight of MnO 2 and 1.7 parts by weight of TiO 2 were added to 28 parts by weight of the above organic vehicle and dispersed by a three-roll mill to form a thick film. A resistance paste was created. The sample preparation method and evaluation were performed in the same manner as in the example. The results are also shown in Table 1.

【0014】[0014]

【発明の効果】以上述べた通り、本発明の厚膜抵抗ペー
ストは、酸化物被覆の形で添加物を加えた酸化ルテニウ
ムを導電成分として用いているため、Agリッチ厚膜導
体電極上に印刷形成する事により、ジオメトリー効果の
非常に優れた低抵抗の厚膜抵抗体を形成することが可能
となる。
As described above, since the thick film resistance paste of the present invention uses ruthenium oxide to which an additive is added in the form of an oxide coating as a conductive component, it is printed on an Ag-rich thick film conductor electrode. By forming it, it becomes possible to form a low resistance thick film resistor having an extremely excellent geometry effect.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 酸化ルテニウムを主成分とする導電性粉
末とガラス粉末と酸化チタン及び酸化マンガンとを有機
ビヒクルに分散させてなる厚膜抵抗ペースト組成物にお
いて、酸化チタン及び酸化マンガンがあらかじめ酸化ル
テニウム粉末表面に被覆してある事を特徴とする厚膜抵
抗ペースト組成物。
1. A thick film resistance paste composition comprising a conductive powder containing ruthenium oxide as a main component, a glass powder, titanium oxide and manganese oxide dispersed in an organic vehicle, wherein the titanium oxide and manganese oxide are preliminarily ruthenium oxide. A thick film resistor paste composition, characterized in that the powder surface is coated.
【請求項2】 酸化チタンのコロイド溶液と酸化マンガ
ン前駆体の水溶液とを混合した水溶液中に酸化ルテニウ
ム粉末を分散させてから水分を蒸発させた後熱処理する
事により表面に酸化チタン及び酸化マンガン被覆を形成
した酸化ルテニウム粉末を導電性粉末として用いた請求
項1に記載の厚膜抵抗ペースト組成物。
2. A ruthenium oxide powder is dispersed in an aqueous solution obtained by mixing a colloidal solution of titanium oxide and an aqueous solution of a manganese oxide precursor, the water content is evaporated, and then heat treatment is performed to coat the surface with titanium oxide and manganese oxide. The thick film resistance paste composition according to claim 1, wherein the ruthenium oxide powder formed with is used as a conductive powder.
JP7188119A 1995-06-30 1995-06-30 Thick film resistor paste composition Pending JPH0917605A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7188119A JPH0917605A (en) 1995-06-30 1995-06-30 Thick film resistor paste composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7188119A JPH0917605A (en) 1995-06-30 1995-06-30 Thick film resistor paste composition

Publications (1)

Publication Number Publication Date
JPH0917605A true JPH0917605A (en) 1997-01-17

Family

ID=16218048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7188119A Pending JPH0917605A (en) 1995-06-30 1995-06-30 Thick film resistor paste composition

Country Status (1)

Country Link
JP (1) JPH0917605A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002127483A (en) * 2000-08-17 2002-05-08 Rohm Co Ltd Thermal printing head, heating resistor used in the same, and method of manufacturing the heating resistor
US6512532B2 (en) * 2000-08-17 2003-01-28 Rohm Co., Ltd. Thermal printhead, heating resistor used for the same, and process of making heating resistor
JP2006248815A (en) * 2005-03-09 2006-09-21 Sumitomo Metal Mining Co Ltd Ru-Mn-O FINE POWDER, ITS MANUFACTURING METHOD AND THICK FILM RESISTOR COMPOSITION USING THE SAME
JP2011523489A (en) * 2008-04-18 2011-08-11 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Surface-modified ruthenium oxide conductive material, lead-free glass, thick film resistor paste, and devices made therefrom
CN114496347A (en) * 2022-01-12 2022-05-13 广东风华高新科技股份有限公司 Internal electrode slurry and preparation method and application thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002127483A (en) * 2000-08-17 2002-05-08 Rohm Co Ltd Thermal printing head, heating resistor used in the same, and method of manufacturing the heating resistor
US6512532B2 (en) * 2000-08-17 2003-01-28 Rohm Co., Ltd. Thermal printhead, heating resistor used for the same, and process of making heating resistor
JP4707892B2 (en) * 2000-08-17 2011-06-22 ローム株式会社 Thermal print head, heating resistor used in the same, and method for manufacturing the heating resistor
JP2006248815A (en) * 2005-03-09 2006-09-21 Sumitomo Metal Mining Co Ltd Ru-Mn-O FINE POWDER, ITS MANUFACTURING METHOD AND THICK FILM RESISTOR COMPOSITION USING THE SAME
JP4692028B2 (en) * 2005-03-09 2011-06-01 住友金属鉱山株式会社 Ru-Mn-O fine powder, method for producing the same, and thick film resistor composition using the same
JP2011523489A (en) * 2008-04-18 2011-08-11 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Surface-modified ruthenium oxide conductive material, lead-free glass, thick film resistor paste, and devices made therefrom
CN114496347A (en) * 2022-01-12 2022-05-13 广东风华高新科技股份有限公司 Internal electrode slurry and preparation method and application thereof

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