JPH09171987A - Substrate treatment system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable easy obtaining of symmetrical fluid movement within a bath even when a work error exists in a nozzle. SOLUTION: Reflection boards 40 are provided between nozzles 20 on both sides and the bottom surface of a water-washing bath WB1. On a grooved portion 40b of the reflection board 40, a plurality of grooves 41 are provided at positions corresponding to the spacing between a plurality of substrates 1. Pure water ejected toward the bottom surface of water bath WB1 from the nozzles 20 hits the reflection boards 40 and is thus split, with a part thereof flowing along the grooved portion 40b toward the substrate 1. The flows of water from both sides join at the center portion of the water-washing bath WB1, and wash the substrate 1. If the fluid movement within the bath is not symmetrical, the position and attitude of the reflection boards 40 are adjusted to secure symmetry.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for immersing a thin substrate (hereinafter referred to as "substrate") such as a semiconductor substrate or a liquid crystal glass substrate in a treatment liquid to perform various treatments.

[0002]

2. Description of the Related Art Generally, a substrate processing apparatus as described above is
It is equipped with a chemical treatment tank and a water washing tank (hereinafter, both are collectively referred to as “substrate processing tank”), and by sequentially dipping the substrates in these multiple steps, contaminants on the surface of the substrate can be removed or the substrate surface can be cleaned. The oxide film is etched and the resist film is peeled off.

Conventionally, the processing method in the substrate processing tank is roughly divided into a nozzle method and a rectifying plate method, which are properly used according to the application.

FIG. 10 is a diagram for explaining a processing method in a conventional substrate processing tank. FIG. 10A shows a nozzle type substrate processing bath, in which nozzles 20 are provided on both sides of the bottom of the substrate processing bath 10 filled with the processing liquid 2. The nozzle 20 is a cylindrical member, and as shown in FIG. 10C, the nozzle 20 is provided with a plurality of nozzle holes 21 for ejecting the processing liquid in a row at equal intervals along the longitudinal direction of the nozzle 20. It is provided in. The substrate processing is performed by immersing the substrate 1 supported by means (not shown) in the processing liquid 2 and ejecting the processing liquid from the nozzle 20 toward the substrate 1 (direction of arrow 20a in the figure). ing. In this substrate processing tank 10, a plurality of substrates 1 are arranged in the Y direction in the drawing, and the plurality of substrates 1 are processed at the same time. For example, in the case of pure water cleaning performed after the chemical solution treatment, the above-described nozzle system is used for water cleaning immediately after the chemical solution treatment because the chemical solution and the pure water can be quickly replaced.

FIG. 10 (b) shows a straightening plate type substrate processing bath. The straightening vane system is provided with a straightening vane 30 in addition to the above nozzle type configuration.
A plurality of straightening holes 31 are provided in the. In this straightening plate method, first, the processing liquid 2 is ejected from the nozzle 20 toward the bottom surface of the substrate processing bath 10. Then, the jetted processing liquid 2 has its flow changed at the bottom surface of the substrate processing bath 10, and then flows upward from the flow regulating hole 31 of the flow regulating plate 30. The straightening vane method is used for a chemical solution treatment or the like that requires uniform treatment of the immersed substrate because a uniform upward flow can be obtained.

[0006]

In the above processing method, particularly in the nozzle method, the symmetry of the flow in the tank is important in order to obtain good processing performance (for example, etching uniformity). That is, unless the errors in the hole diameters and ejection directions of the plurality of nozzle holes 21 provided in the nozzles 20 provided on both sides of the bottom of the substrate processing bath 10 are completely eliminated, the in-vessel flow becomes asymmetrical, which is good. It is impossible to obtain a good processing result, and uneven etching occurs.

However, in the nozzle 20, even if the same processing is performed on the design drawing, a processing error of the nozzle hole 21 (a hole diameter error of the nozzle hole 21, a direction error, a residual burr, etc.) due to the processing accuracy at the time of manufacturing. Often occurs. FIG.
FIG. 6 is a diagram for explaining a processing error of the nozzle 20.
If there is a processing error in the nozzle 20, the process shown in FIG.
As shown in (a), there are variations in the ejection direction (arrows 21a to 21f in the figure) in the longitudinal direction of the nozzle 20,
As shown in FIG. 11B, variations occur in the ejection direction (arrows 21 g to 21 i in the figure) in the circumferential direction of the nozzle 20. Further, the flow velocity in each nozzle hole 21 may vary. Even if the processing accuracy is improved, it is extremely difficult to completely eliminate these processing errors.

Further, generally, the substrate processing bath 10 and the nozzle 2
No. 0 is made of quartz, and the nozzle 20
Is fixed to the substrate processing tank 10 by welding after drilling. Therefore, when the nozzle 20 has a processing error, the processing error is fixed as it is,
Symmetry of the flow in the tank cannot be obtained. In such a case, in order to obtain the symmetry of the in-vessel flow, it is necessary to remanufacture the substrate processing bath 10 and the nozzle 20, which causes an increase in cost.

In view of the above problems, it is an object of the present invention to provide a substrate processing apparatus which can easily obtain a symmetrical in-vessel flow even when a nozzle has a processing error.

[0010]

In order to solve the above problems, the invention of claim 1 is a substrate processing apparatus for processing a substrate by immersing the substrate in a predetermined processing liquid, wherein (a) the processing liquid is stored. And a treatment tank to be provided, (b) provided in the treatment tank,
A jetting means for jetting the treatment liquid in a predetermined direction from the jet outlet, and (c) an inner wall surface of the treatment tank facing the jet outlet, which is provided separately from the jetting means, and the treatment jetted by the jetting means is provided. And a rectifying means for rectifying the flow of the liquid.

Further, the invention of claim 2 is characterized in that the rectifying means is movable, and (d) further comprises an adjusting means for adjusting the rectifying condition by changing at least one of the position and the attitude of the rectifying means. ing.

Further, in the invention of claim 3, the substrate is a plurality of substrates arranged at intervals, and the rectifying means corresponds to (c-1) each of the intervals of the plurality of substrates. A plate with a groove in its position is included.

Further, in the invention of claim 4, the rectifying means includes (c-1) a plate provided with a plurality of holes.

Further, in the invention of claim 5, the rectifying means includes (c-1) a block provided on an upper portion of a bottom surface of the processing bath.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a conceptual layout diagram showing an embodiment of a substrate processing apparatus according to the present invention. The substrate processing apparatus 100 includes chemical solution processing tanks CB1 to CB3 containing sulfuric acid, ammonia, hydrochloric acid, hydrofluoric acid, etc., washing tanks WB1 to WB4 containing pure water, and a drying section DR containing a spin dryer. The plurality of substrates 1 are gripped and transported by a transport robot (not shown), and are sequentially subjected to a dipping process and a drying process in accordance with the arrows in the figure to perform a series of substrate processes.

FIG. 2 is an external perspective view of the washing tank WB1. The quartz washing bath WB1 is provided with nozzles (spouting means) 20 on both sides of its bottom along the Y direction in the figure, and is provided with a reflection plate 40 between the nozzle 20 and the bottom of the washing bath WB1. A cleaning process is performed on the substrate 1 after the chemical solution process.

The nozzle 20 has the same shape as that shown in FIG. 10C, and a plurality of nozzle holes 21 are provided in a row along a longitudinal direction of a quartz cylinder at equal intervals.
This nozzle 20 has one end penetrating the tank wall of the washing tank WB1 and connected to a pipe (not shown) of the substrate processing apparatus 100, and the other end is welded to the tank wall of the washing tank WB1. . At this time, the nozzle 20 is installed so that the nozzle hole 21 faces the bottom surface side of the water washing tank WB1. Therefore, the pure water for cleaning is used as the substrate processing apparatus 10.
Nozzle hole 2
1 is jetted toward the bottom surface side of the washing tank WB1.

The reflecting plate 40 is a quartz plate having a V-shaped cross section (a V-shape that is wide open), and is provided with its valley side facing the nozzle 20. Further, both ends of the reflection plate 40 are supported by the tank wall of the washing tank WB1 so as to be movable within the XZ plane in the figure by a movable structure described later.

FIG. 3 is a perspective view showing an end portion of the reflection plate 40. The V-shaped reflector 40 has a smooth portion 40a and a grooved portion 40b, and the grooved portion 40b is provided on the substrate 1 side. Groove 4 is provided on the grooved portion 40b.
1 are provided at equal intervals, and these grooves 41 are provided at positions corresponding to the intervals between the plurality of immersed substrates 1 as described later. A support shaft 42 is fixedly connected to the end portion of the reflection plate 40, and the support shaft 42 penetrates the packing 43 and is connected to the seal cap 44.

FIG. 4 is a diagram for explaining how the reflection plate 40 is supported. 4A is a cross-sectional view of the supporting portion of the reflection plate 40, FIG. 4B is a front view of the packing 43, and FIG.
(C) is a front view of the seal cap 44. As described above, the support shaft 42 fixed to the reflection plate 40 penetrates the shaft hole 43a of the packing 43 and is connected to the seal cap 44, and the packing 43 is fixed to the washing tank WB1. Then, the screw hole 4 of the seal cap 44
A bolt 45 penetrates the gap 43b between the packing 4 and 4a, and the bolt 45 is fastened by a nut 46. The packing 43 and the seal cap 44 are slidable, and the nut 46 and the packing 43 are slidable.
Is also slidable. Therefore, the seal cap 44 is movable in the XZ plane of FIG. 2 according to the size of the shaft hole 43a of the packing 43, and the packing 43 is
The support shaft 42 is rotatable around the support shaft 42 depending on the size of the clearance 43b.

FIG. 5 is a diagram for explaining the cleaning process in the water-washing tank WB1 having the above structure. FIG. 5A is a side view of the water washing tank WB1, in which the substrate 1 is immersed in pure water 3. In addition, a nozzle hole 21 provided in the nozzle 20
The water flow ejected from the bottom of the washing tank WB1
The reflection plate 40 collides with the valley side portion and splits, and proceeds along the smooth portion 40a and the grooved portion 40b. Then, the water streams that have proceeded along the grooved portions 40b of the reflection plate 40 provided on both sides join together at the central portion of the washing bath WB1 and the substrate 1
Wash away. At this time, the groove 41 of the grooved portion 40b is
As shown in FIG. 5B, it is provided at a position corresponding to the interval between the plurality of substrates 1. Therefore, since the water flow is guided by the groove 41 and travels between the substrates 1, the surface of the substrate 1 can be efficiently cleaned.

As described above, the substrate 1 is cleaned, but at this time, if the flow velocity of the water flow traveling from the reflecting plates 40 on both sides is different, the symmetry of the flow in the tank cannot be maintained. Therefore, it is necessary to adjust the position and direction (posture) of the reflection plate 40.

FIG. 6 is a view showing how the water flow is adjusted in the washing tank WB1. Here, as shown in FIG. 6A, a case where the flow velocity of the water flow from the left side reflector 40 is slower than that on the right side will be described. In such a case, first, by sliding the seal cap 44, to which the left side reflector 40 is connected, upward (Z direction in FIG. 6), the reflector 40 moves upward in conjunction with this. Then, as shown in FIG. 6B, the nozzle 20 and the reflection plate 40 approach each other on the left side. Then, when the nozzle 20 and the reflection plate 40 approach each other, the reflection plate 40 on the left side
The flow velocity of the water stream from is high.

When the reflection plate 40 is slid as described above, the positions where the water flow from the left side and the water flow from the right side merge are displaced, so that the reflection plate is next rotated by rotating the seal cap 44 on the left side. The direction of the water flow is adjusted by rotating 40 (adjusting the posture).

As described above, the reflector 40 on the left side
By moving / rotating, the flow velocity / direction of the water flow is adjusted, the horizontal components of the water flow from both sides are made equal, and the merging position is adjusted, whereby a symmetrical in-tank flow can be obtained. Here, the left side reflection plate 40 is moved upward and rotated, but the right side reflection plate 40 is also moved downward and rotated in the same manner as the symmetrical in-tank flow. Can be obtained. However, when there is variation in the jet water flow in the longitudinal direction of the nozzle 20, it is better to shorten the distance between the nozzle 20 and the reflection plate 40, and therefore it is preferable to move the reflection plate 40 upward. Further, when the optimum position and posture of the reflection plate 40 are determined, the reflection plate 40 may be welded to the washing tank WB1 by welding.

With the above arrangement, since the water flow ejected from the nozzle 20 is once applied to the reflection plate 40 and then directed toward the substrate 1, the circle of the nozzle 20 as shown in FIG. Even if there is variation in the ejection direction in the circumferential direction, it can be absorbed. In addition, the variation in the longitudinal direction of the nozzle 20 as shown in FIG.
Since the distance between 0 and the reflection plate 40 is short, the ejection directions can be regarded as substantially the same.

Further, even if there is an error in the flow velocity of the water flow ejected from the nozzle 20, the position and orientation of the reflection plate 40 can be adjusted, so that the horizontal component of the water flow is adjusted,
A symmetrical in-vessel flow can be obtained.

Further, the reflection plate 40 is provided with a groove 41,
Since the water flow is directed between the substrates 1, the substrate 1 can be efficiently used.
The surface of can be washed.

[0031]

[Second Embodiment] FIG. 7 is a diagram showing a second embodiment of the present invention. The reflection plate 40 in the first embodiment is a quartz plate having a V-shaped cross section.
The smooth quartz reflector 80 as shown in FIG.

FIG. 7 (b) is a side view of a washing bath WB1 to which the above-mentioned reflection plate 80 is applied. The position where the reflector 80 is provided is the same as that of the reflector 40 of the first embodiment,
Both ends thereof are also movably supported in the washing bath WB1 with the same configuration as the both ends of the reflection plate 40 in the first embodiment. The configuration other than the reflector 80 is the same as that of the first embodiment.

As shown in FIG. 7B, the installation angle of the reflector 80 is such that the jet of water flowing from the nozzle 20 flows to the center of the bottom surface of the washing tank WB1. This wash tank WB
In 1, the water flow ejected from the nozzles 20 on both sides hits the reflection plate 80 and advances to the central portion of the bottom surface of the water washing tank WB1, where it joins and changes its direction upward to become an ascending water flow to wash the substrate 1. .

When the flow velocities of the water flows from both sides are different or the confluence position is deviated from the center of the bottom surface, the position and posture of the reflector 80 are adjusted to equalize the flow velocities, as in the first embodiment. And make the confluence position the center of the bottom,
Make sure that the flow in the tank is symmetrical.

With the above arrangement, the water flow ejected from the nozzle 20 is once applied to the reflecting plate 80 and directed toward the central portion of the bottom surface of the washing tank WB1, so that the ejection variation in the circumferential direction of the nozzle 20 is absorbed. Also, the variation in the longitudinal direction of the nozzle 20 can be regarded as substantially the same direction because the distance between the nozzle 20 and the reflection plate 80 is short.

Further, even if there is an error in the flow velocity of the water flow ejected from the nozzle 20, the position and orientation of the reflector 80 can be adjusted, so that the horizontal component of the water flow is adjusted to allow the inside of the symmetrical tank. Flow can be obtained.

[0037]

[Third Embodiment] FIG. 8 is a diagram showing a third embodiment of the present invention. Reflector 40 in the first embodiment
Are quartz reflectors 50 and 60 having through holes as shown in FIGS. 8 (a) and 8 (b). That is, FIG.
The reflection plate 50 of (a) is provided with a plurality of small holes 50a,
The reflector 60 of FIG. 8B has a plurality of slits 60a.

FIG. 8 (c) is a side view of the washing tank WB1 to which the above-mentioned reflector 50 is applied. The position where the reflection plate 50 is provided is the same position as the reflection plate 40 of the first embodiment,
Both ends thereof are also movably supported in the washing bath WB1 with the same configuration as the both ends of the reflection plate 40 in the first embodiment.

As shown in FIG. 8C, the installation angle of the reflection plate 50 is inclined so that the plate end near the substrate 1 is located above the other end. Further, in this case, the nozzle 20 is installed so as to rotate so that the water jet direction from the nozzle 20 is perpendicular to the reflection plate 50. In this water washing tank WB1, the water flow ejected from the nozzles 20 on both sides hits the reflection plate 50 and is split. That is, part of the water flow passes through the small holes 50a of the reflection plate 50 and proceeds toward the bottom surface of the washing tank WB1, and part of the water flow proceeds along the reflection plate 50 toward the substrate 1, and the remaining water flow is Along the reflecting plate 50, it advances toward the tank wall of the washing tank WB1. Of these, the water flow that has proceeded toward the bottom surface of the washing tank WB1 advances to the central portion of the bottom surface of the water washing tank WB1, where it joins and changes its direction upwards to become an ascending water flow, and the substrate 1 is washed.

Further, the water streams that have traveled toward the substrate 1 along the reflecting plate 50 join together at the central portion of the washing bath WB1 and wash the substrate 1.

When the flow velocities of the water flows from both sides are different or the merging position is deviated, the position and the posture of the reflecting plate 50 are adjusted to make the flow velocities equal and the merging position is the same as in the first embodiment. Are matched so that the flow in the tank is symmetrical.

The case where the reflector 60 is used is the same as the case where the reflector 50 is used.

By doing so, in addition to the same effects as in the second embodiment, since a water flow for washing in two directions is created, a stagnant area is less likely to occur in the washing tank WB1. The substrate 1 can be cleaned more efficiently. However, in the third embodiment, it is necessary to adjust the water flow in two directions, so it is easier to perform the adjustment work of the reflector as in the second embodiment.

[0044]

[Fourth Embodiment] FIG. 9 is a view showing a fourth embodiment of the present invention. In the first to third embodiments described above, the reflection plate is used to straighten the water flow ejected from the nozzle 20, whereas in the fourth embodiment, the quartz block 70 is used. ing.

As shown in FIG. 9, the block 70 has its upper surface processed to have a V-shaped cross section, and is fixed below the nozzle 20 on the bottom surface of the washing tank WB1. The rest of the configuration is the same as that of the first embodiment.

The water flow ejected from the nozzle 20 toward the bottom side of the washing bath WB1 collides with the valley side portion of the block 70 and splits, part of which proceeds toward the substrate 1, and the remaining portion of the washing bath WB1. Proceed towards the wall. The water streams that have proceeded toward the substrate 1 join together at the central portion of the water washing tank WB1 and wash the substrate 1.

In the fourth embodiment, when the flow velocity and the direction of the water flow on both the left and right sides are inappropriate, the block 70 is once removed and another block subjected to the desired processing is installed.

With the above arrangement, the water flow ejected from the nozzle 20 is applied to the block 70 and then directed toward the substrate 1, so that the ejection variation in the circumferential direction of the nozzle 20 can be absorbed, and the nozzle 20 can be absorbed. Variation in the longitudinal direction of
Since the distance between the nozzle 20 and the block 70 is short, the ejection directions can be regarded as substantially the same.

The block 70 is easier to install and remove than the reflector.

[0050]

[Modification] The embodiment of the present invention has been described above. However, the present invention is not limited to the above example. For example, in the present embodiment, a quartz tank is used. It may be a tank (for example, a resin tank) using another material that is not corroded by the. Further, the reflector and the block may be made of resin instead of quartz.

Further, in the present embodiment, the cleaning treatment in the water washing tank is performed, but the same effect can be obtained by the chemical treatment in the chemical liquid tank as well.

Furthermore, in the first to third embodiments,
Although the flow velocity and direction of the water flow are adjusted by adjusting the position and orientation of the reflector, the water flow may be adjusted by adjusting only the position or orientation of the reflector.

[0053]

According to the invention of claim 1, since the rectifying means for rectifying the flow of the processing liquid is provided in the jetting direction of the nozzle, even if the nozzle has a processing error, the processing error is absorbed. A symmetrical in-vessel flow can be obtained.

According to the invention of claim 2, since the flow of the processing liquid can be changed by adjusting the rectifying means, the symmetry of the in-vessel flow can be easily obtained. Further, even if the flow in the bath is asymmetric, it is not necessary to remanufacture the substrate processing bath, so that the cost can be reduced.

According to the third aspect of the present invention, since the rectifying means is a plate provided with grooves at positions corresponding to the intervals between the plurality of substrates, the flow of the processing liquid can be advanced between the substrates. Therefore, the surface of the substrate can be processed efficiently.

According to the fourth aspect of the present invention, since the rectifying means is a plate provided with a plurality of holes, it is possible to create a processing liquid flow in two directions, and a stagnation area hardly occurs in the tank. The substrate can be processed more efficiently.

According to the fifth aspect of the invention, since the rectifying means is a block, it can be easily installed and removed.

[Brief description of the drawings]

FIG. 1 is a conceptual layout diagram showing an embodiment of a substrate processing apparatus according to the present invention.

2 is an external perspective view of the washing tank of FIG. 1. FIG.

FIG. 3 is a perspective view showing an end portion of the reflection plate of FIG.

FIG. 4 is a diagram for explaining how the reflector is supported.

FIG. 5 is a diagram for explaining a cleaning process in a water washing tank.

FIG. 6 is a diagram showing how the water flow is adjusted in the washing tank.

FIG. 7 is a diagram showing a second embodiment of the present invention.

FIG. 8 is a diagram showing a third embodiment of the present invention.

FIG. 9 is a diagram showing a fourth embodiment of the present invention.

FIG. 10 is a diagram for explaining a processing method in a conventional substrate processing tank.

FIG. 11 is a diagram for explaining a machining error of a nozzle.

[Explanation of symbols]

 1 Substrate 20 Nozzle 40 Reflector 41 Groove WB1 Rinsing Bath 100 Substrate Processing Equipment

Claims (5)

[Claims] 1. A substrate processing apparatus that performs substrate processing by immersing a substrate in a predetermined processing liquid, comprising: (a) a processing tank for storing the processing liquid; and (b) a jet port provided in the processing tank. From a jetting means for jetting the treatment liquid in a predetermined direction from (c) the inner wall surface of the treatment tank facing the jet outlet and provided separately from the jetting means. A substrate processing apparatus comprising: a rectifying unit that rectifies a flow. 2. The apparatus according to claim 1, wherein the rectifying means is movable, and (d) an adjusting means for adjusting the rectifying condition by changing at least one of a position and an attitude of the rectifying means. Further provided is a substrate processing apparatus. 3. The apparatus according to claim 1 or 2, wherein the substrates are a plurality of substrates arranged at intervals from each other, and the rectifying means comprises: (c-1) the gap between the plurality of substrates. A substrate processing apparatus having a plate provided with a groove at a position corresponding to each of the above. 4. The substrate processing apparatus according to claim 1 or 2, wherein the rectifying means has a plate (c-1) having a plurality of holes. 5. The substrate processing apparatus according to claim 1, wherein the rectifying unit has (c-1) a block provided on an upper portion of a bottom surface of the processing bath.