JPH09160006A - Liquid injector for substrate for liquid crystal - Google Patents

Liquid injector for substrate for liquid crystal

Info

Publication number
JPH09160006A
JPH09160006A JP32288395A JP32288395A JPH09160006A JP H09160006 A JPH09160006 A JP H09160006A JP 32288395 A JP32288395 A JP 32288395A JP 32288395 A JP32288395 A JP 32288395A JP H09160006 A JPH09160006 A JP H09160006A
Authority
JP
Japan
Prior art keywords
substrate
liquid
nozzle
nozzles
liquid crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP32288395A
Other languages
Japanese (ja)
Other versions
JP3113192B2 (en
Inventor
Tetsuya Yamauchi
哲也 山内
Makoto Kimura
誠 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP07322883A priority Critical patent/JP3113192B2/en
Publication of JPH09160006A publication Critical patent/JPH09160006A/en
Application granted granted Critical
Publication of JP3113192B2 publication Critical patent/JP3113192B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

PROBLEM TO BE SOLVED: To suppress the variation in the processing states on the surfaces of substrates for liquid crystals by processing liquids, such as washing liquids, developers and etching liquids, to the utmost. SOLUTION: This device has plural nozzles 5 for injecting the processing liquids toward the substrates 3 and plural nozzle pipes 1 extending in a direction approximately orthogonal with the transporting direction 4 of the substrates 3. The nozzles 5 are holes formed at 45 deg. downward of the nozzle pipes 1 with respect to a horizontal direction in a lateral view and these holes are so formed that the injection direction of the nozzles 5 inclines 45 deg. with the radial direction of the nozzle pipes 1 in a plane view. The injection direction 2 of the nozzles 5 is in a direction reverse from the injection direction 2 of the nozzles 5 opposite to the nozzles 5 and the processing liquids injected from the nozzles 5 intersect with each other without colliding against the processing liquids injected from the opposite nozzles 5.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、液晶用基板の製造
工程のうち液晶用基板の洗浄、パターン形成のための現
像、ウェットエッチング等の湿式工程において用いられ
る液体噴射装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid ejecting apparatus used in a wet process such as cleaning of a liquid crystal substrate, development for pattern formation, and wet etching in a process of manufacturing a liquid crystal substrate.

【0002】[0002]

【従来の技術】一般に、液晶表示装置を構成する液晶用
基板の製造工程においては、洗浄、パターン形成のため
の現像、ウェットエッチング等の湿式工程が多く含まれ
る。通常、基板やウェハ等を湿式工程で連続的に処理す
る場合、(1)基板の搬送経路上にノズルを配置し、こ
のノズルから基板に向かって液体を扇状または円錐状に
スプレーもしくはシャワーする、(2)基板の搬送経路
上に処理液槽を配置し、基板がこの処理液槽内の処理液
に浸漬するように基板を搬送する、等の方法が採られる
が、液晶表示装置を構成する液晶用基板はサイズが大き
いために、ハンドリングの容易な上記(1)の方法が採
られる。
2. Description of the Related Art Generally, a manufacturing process of a liquid crystal substrate constituting a liquid crystal display device includes many wet processes such as cleaning, development for pattern formation, and wet etching. Usually, in the case of continuously processing a substrate, a wafer or the like in a wet process, (1) a nozzle is arranged on a transfer path of the substrate, and a liquid is sprayed or showered in a fan shape or a conical shape from the nozzle toward the substrate. (2) A method of arranging a processing liquid tank on the transfer path of the substrate and transferring the substrate so that the substrate is immersed in the processing liquid in the processing liquid tank is adopted, but the liquid crystal display device is configured. Since the liquid crystal substrate has a large size, the method (1) described above can be easily handled.

【0003】図4は上記(1)の方法に相当する従来の
液晶用基板の液体噴射装置を示す側面図である。図4に
示すように、搬送方向14に向かって液晶用基板13を
水平を維持しながら搬送させる。それと同時に、搬送経
路上であって、基板13に対して平行となるように配設
されたスプレーノズル11から基板13に向かって処理
液12を扇状または円錐状にスプレーもしくはシャワー
している。
FIG. 4 is a side view showing a conventional liquid ejecting apparatus for a liquid crystal substrate corresponding to the method (1). As shown in FIG. 4, the liquid crystal substrate 13 is transported in the transport direction 14 while maintaining the horizontal direction. At the same time, the processing liquid 12 is sprayed or showered in a fan shape or a conical shape toward the substrate 13 from the spray nozzle 11 arranged on the transfer path so as to be parallel to the substrate 13.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、上述し
た従来の方法では、基板サイズの大型化に伴い以下のよ
うな問題が発生する。すわなち、基板上に処理液を単純
にスプレー、シャワーする方法では、基板中央付近に処
理液が滞留し、スプレー等の効果が減殺されるという問
題がある。また、処理液が滞留する領域と、処理液の流
れがある領域とでは、基板表面での液交換の速さが異な
り、これによっても処理の進行状態が異なってくるとい
う問題がある。
However, in the above-mentioned conventional method, the following problems occur as the substrate size increases. That is, the method of simply spraying and showering the treatment liquid on the substrate has a problem that the treatment liquid stays in the vicinity of the center of the substrate and the effect of spraying or the like is diminished. Further, there is a problem in that the region where the processing liquid is retained and the region where the processing liquid flows have different liquid exchange speeds on the substrate surface, which also causes the progress of the processing to be different.

【0005】そこで、上記問題を回避する手法として、
基板上の処理液の滞留を防止するためにスプレーやシャ
ワーに方向性を持たせ、基板上で処理液全体に流れを生
じさせる方法が採られているが、この方法では、特に大
型の基板において処理液の流れの上流と下流とで流量、
流速に大きな差が生じ、処理状態に差が発生するという
問題がある。いずれにしても基板表面での処理状態のば
らつきが起こることで、液晶表示装置を構成した際の微
妙な表示のむらの原因となり、表示品位の低下を起こす
こととなる。
Therefore, as a method for avoiding the above problems,
In order to prevent stagnation of the processing liquid on the substrate, a method has been adopted in which the spray or shower has directionality so that the entire processing liquid flows on the substrate. Flow rate upstream and downstream of the flow of processing liquid,
There is a problem that a large difference occurs in the flow rate and a difference occurs in the processing state. In any case, variations in the processing state on the surface of the substrate may cause subtle unevenness in display when the liquid crystal display device is configured, resulting in deterioration of display quality.

【0006】本発明は、上記従来の問題点を解決するた
めになされたものであり、洗浄液、現像液、エッチング
液等の処理液による液晶用基板表面での処理状態のばら
つきを極力抑制する液晶用基板の液体噴射装置を提供す
ることを目的とする。
The present invention has been made in order to solve the above-mentioned conventional problems, and is a liquid crystal that suppresses variations in the processing state on the surface of a liquid crystal substrate due to a processing liquid such as a cleaning liquid, a developing liquid, an etching liquid, etc. as much as possible. An object of the present invention is to provide a liquid ejecting apparatus for a substrate.

【0007】[0007]

【課題を解決するための手段】請求項1の発明は、液晶
表示装置を製造する工程のうち湿式工程において用いら
れる液晶用基板の液体噴射装置において、処理液を基板
に向かって噴射する複数のノズルからなると共に基板の
搬送方向に対して概略直交する方向に並ぶノズル列を複
数備え、各ノズルの噴射方向は、当該ノズルから噴射さ
れた処理液と、当該ノズルと対向するノズルから噴射さ
れた処理液とが基板上で合流して基板の搬送方向に対し
て概略直交する方向に流れるように、平面視で基板の搬
送方向に対して左右一側に傾斜していることを特徴とす
る液晶用基板の液体噴射装置である。
According to a first aspect of the invention, in a liquid ejecting apparatus for a liquid crystal substrate used in a wet process in a process of manufacturing a liquid crystal display device, a plurality of treatment liquids are ejected toward the substrate. A plurality of nozzle rows that are composed of nozzles and are arranged in a direction substantially orthogonal to the transport direction of the substrate are provided, and the ejection direction of each nozzle is ejected from the processing liquid ejected from the nozzle and a nozzle facing the nozzle. A liquid crystal characterized by being inclined to the left and right with respect to the substrate transport direction in plan view so that the processing liquid merges on the substrate and flows in a direction substantially orthogonal to the substrate transport direction. It is a liquid ejecting apparatus for a substrate.

【0008】請求項2の発明は、請求項1において、さ
らに、前記ノズル列の各ノズルと対向し、かつ、当該ノ
ズルの噴射方向と逆方向に処理液を噴射するように平面
視で基板の搬送方向に対して他側に傾斜した複数のノズ
ルからなると共に基板の搬送方向に対して概略直交する
方向に並ぶノズル列を複数備え、前記ノズルから噴射さ
れた処理液は、当該ノズルと対向するノズルから噴射さ
れた処理液と衝突することなく交差することを特徴とす
る液晶用基板の液体噴射装置である。
According to a second aspect of the present invention, in addition to the first aspect, the substrate of the substrate is seen in a plan view so as to face each nozzle of the nozzle array and jet the processing liquid in a direction opposite to the jet direction of the nozzle. A plurality of nozzle rows, each of which is composed of a plurality of nozzles inclined to the other side with respect to the transfer direction and arranged in a direction substantially orthogonal to the transfer direction of the substrate, are provided, and the processing liquid ejected from the nozzles faces the nozzles. The liquid ejecting apparatus for a liquid crystal substrate is characterized by intersecting with a processing liquid ejected from a nozzle without colliding.

【0009】請求項3の発明は、請求項1又は2におい
て、前記処理液は、洗浄液、現像液又はエッチング液か
らなることを特徴とする液晶用基板の液体噴射装置であ
る。
A third aspect of the present invention is the liquid-jet apparatus for a liquid crystal substrate according to the first or second aspect, wherein the treatment liquid is a cleaning liquid, a developing liquid, or an etching liquid.

【0010】[0010]

【発明の実施の形態】本発明にかかる液晶用基板の液体
噴射装置の実施形態を図面を参照しながら詳細に説明す
る。図1は本発明にかかる液晶用基板の液体噴射装置の
一実施形態を示す概略側面図であり、図2はその平面図
である。なお、上述した如く、本発明の液体噴射装置は
液晶用基板の製造工程のうち液晶用基板の洗浄、パター
ン形成のための現像、ウェットエッチング等の湿式工程
において用いられるものである。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a liquid ejecting apparatus for a liquid crystal substrate according to the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic side view showing an embodiment of a liquid ejecting apparatus for liquid crystal substrates according to the present invention, and FIG. 2 is a plan view thereof. As described above, the liquid ejecting apparatus of the present invention is used in the wet process such as cleaning of the liquid crystal substrate, development for pattern formation, and wet etching in the manufacturing process of the liquid crystal substrate.

【0011】図1及び2に示すように、本発明にかかる
液晶用基板の液体噴射装置は、処理液を基板3に向かっ
て噴射する複数のノズル5を有し、かつ、基板3の搬送
方向4に対して概略直交する方向に延びるノズルパイプ
1を複数備えている。ノズルパイプ1は搬送される基板
3に対向しており、その内部には処理液が流通してい
る。
As shown in FIGS. 1 and 2, the liquid ejecting apparatus for a liquid crystal substrate according to the present invention has a plurality of nozzles 5 for ejecting a processing liquid toward the substrate 3, and the substrate 3 carrying direction. A plurality of nozzle pipes 1 extending in a direction substantially orthogonal to 4 are provided. The nozzle pipe 1 faces the substrate 3 to be conveyed, and the processing liquid flows inside thereof.

【0012】ノズルパイプ1は外径22mmの硬質塩化ビ
ニルパイプからなり、基板3との離間距離は25mmであ
る。また、ノズルパイプ1は多数水平に、かつ、平行に
40mmピッチで配置されている。ノズル5は側方視で水
平方向に対してノズルパイプ1の下方45°に形成され
た直径0.8mmの穴であり、10mm間隔でノズルパイプ1の
軸方向に多数設けられている。さらに、その穴は、ノズ
ル5の噴射方向が平面視でノズルパイプ1の半径方向に
対して45°傾斜するように形成されている。
The nozzle pipe 1 is made of a hard vinyl chloride pipe having an outer diameter of 22 mm, and the distance from the substrate 3 is 25 mm. A large number of nozzle pipes 1 are arranged horizontally and in parallel at a pitch of 40 mm. The nozzles 5 are holes having a diameter of 0.8 mm formed 45 ° below the nozzle pipe 1 with respect to the horizontal direction when viewed from the side, and a large number of nozzles are provided at intervals of 10 mm in the axial direction of the nozzle pipe 1. Further, the hole is formed so that the jet direction of the nozzle 5 is inclined by 45 ° with respect to the radial direction of the nozzle pipe 1 in a plan view.

【0013】図1及び2からも明らかなように、あるノ
ズルパイプ1に設けられた各ノズル5は、隣接する一方
のノズルパイプ1に設けられた各ノズル5と対向してい
るが、隣接する他方のノズルパイプ1に設けられた各ノ
ズル5とは対向していない。すなわち、各ノズルパイプ
1は一方向に向いた複数のノズル5が一列に並んだノズ
ル列を具備している。
As is apparent from FIGS. 1 and 2, the nozzles 5 provided on a certain nozzle pipe 1 are opposed to the nozzles 5 provided on one of the adjacent nozzle pipes 1, but are adjacent to each other. It does not face each nozzle 5 provided in the other nozzle pipe 1. That is, each nozzle pipe 1 has a nozzle row in which a plurality of nozzles 5 oriented in one direction are arranged in a row.

【0014】また、ノズル5の噴射方向2は、そのノズ
ル5と対向するノズル5の噴射方向2に対して逆方向で
あり、さらにそのノズル5から噴射された処理液は、対
向するノズル5から噴射された処理液と衝突することな
く交差するように、各ノズル5はノズルパイプ1上に配
列されている。なお、ノズル5から噴射された処理液が
基板3と衝突する位置と、そのノズル5と対向するノズ
ル5から噴射された処理液が基板3と衝突する位置との
間は、図1に示す如く側方視で約10mmである。
The jetting direction 2 of the nozzle 5 is opposite to the jetting direction 2 of the nozzle 5 facing the nozzle 5, and the treatment liquid jetted from the nozzle 5 is discharged from the facing nozzle 5. The nozzles 5 are arranged on the nozzle pipe 1 so as to intersect with the jetted processing liquid without colliding. As shown in FIG. 1, between the position where the processing liquid ejected from the nozzle 5 collides with the substrate 3 and the position where the processing liquid ejected from the nozzle 5 facing the nozzle 5 collides with the substrate 3. It is about 10 mm when viewed from the side.

【0015】以上説明した構成を具備した液晶基板用の
液体噴射装置を用いて、基板表面のレジストの剥離処理
を行った。すなわち、レジストを剥離するための剥離用
溶液をノズル5から搬送されてくる基板3に向かって噴
射し、処理状態を観察した。各ノズル5から噴射された
剥離用溶液は、側方視で水平方向に対してノズルパイプ
1の下方約45°に、平面視でノズルパイプ1の半径方
向に対して約45°傾斜する方向に進み、対向する他の
ノズル5から噴射された逆方向に進む剥離用溶液と交差
した。
Using the liquid ejecting apparatus for a liquid crystal substrate having the above-described structure, the resist on the substrate surface was stripped. That is, a stripping solution for stripping the resist was sprayed toward the substrate 3 conveyed from the nozzle 5, and the processing state was observed. The stripping solution sprayed from each nozzle 5 is inclined at about 45 ° below the nozzle pipe 1 with respect to the horizontal direction in a side view and in a direction inclined by about 45 ° with respect to the radial direction of the nozzle pipe 1 in a plan view. Then, it intersected with the stripping solution which was sprayed from the other nozzle 5 and which traveled in the opposite direction.

【0016】そして、それぞれのノズル5から噴射され
た剥離用溶液は基板3に衝突した後、図3に示す如く矢
印6に沿って剥離用溶液は流れた。相互に対向し、か
つ、基板3の搬送方向に対して同一側に傾斜したノズル
5から噴射された剥離用溶液は、基板3上で合流し、基
板3の搬送方向に対して概略直交する方向に、すなわち
矢印7に沿って一筋の流れが発生した。基板3全体で見
れば、約70mmの間隔で交互に向きが変化する剥離用溶液
の流れが発生した。その結果、本装置による処理速度を
従来の扇形ノズルを配列して剥離用溶液をスプレーした
場合の処理速度と比較すると、約2割の向上が見られ
た。
After the stripping solution sprayed from each nozzle 5 collides with the substrate 3, the stripping solution flows along the arrow 6 as shown in FIG. The stripping solutions sprayed from the nozzles 5 facing each other and inclined to the same side with respect to the transport direction of the substrate 3 merge on the substrate 3 and are substantially orthogonal to the transport direction of the substrate 3. That is, a unidirectional flow occurred in the direction of arrow 7. When viewed from the whole of the substrate 3, a flow of the stripping solution whose direction changes alternately at intervals of about 70 mm occurred. As a result, when the processing speed of this apparatus was compared with the processing speed when spraying the stripping solution by arranging conventional fan-shaped nozzles, an improvement of about 20% was seen.

【0017】従って、本装置によれば、基板上において
基板の搬送方向に対して概略直交する方向に処理液の流
れが発生すると共に流れの向きが交互に変化するため、
基板の連続搬送により基板各部について表面を処理する
処理液の流れが交互に変わり、従来、一方向のみの処理
液の流れにより上流と下流とで発生していた処理の進行
度の違いが緩和される。特に、基板が大型化しても面内
での処理状態のばらつきを少なくすることができる。
Therefore, according to the present apparatus, since the flow of the processing liquid is generated on the substrate in a direction substantially orthogonal to the transport direction of the substrate and the direction of the flow is alternately changed,
The flow of the processing liquid for treating the surface of each part of the substrate is alternately changed by the continuous transfer of the substrate, and the difference in the progress of the processing, which was conventionally generated between the upstream and the downstream by the flow of the processing liquid in only one direction, is alleviated. It In particular, even if the size of the substrate is increased, it is possible to reduce variations in the in-plane processing state.

【0018】[0018]

【発明の効果】本発明にかかる液晶用基板の液体噴射装
置によれば、各ノズルの噴射方向は、当該ノズルから噴
射された処理液と、当該ノズルと対向するノズルから噴
射された処理液とが基板上で合流して基板の搬送方向に
対して概略直交する方向に流れるように、平面視で基板
の搬送方向に対して左右一側に傾斜しているので、基板
上のほぼ全面で基板の搬送方向に対して概略直交する方
向に処理液の流れが発生し、基板上において部分的に処
理液が滞留することはなく、その結果、従来技術で見ら
れたように滞留した処理液がスプレー、シャワーの表面
への当たりを妨害することにより生じるムラを防止する
ことができ、洗浄液、現像液、エッチング液等の処理液
による基板表面での処理状態のばらつきを極力抑制する
ことができる。
According to the liquid ejecting apparatus for a liquid crystal substrate of the present invention, the ejection directions of the nozzles are the treatment liquid ejected from the nozzle and the treatment liquid ejected from the nozzle facing the nozzle. Since they are merged on the substrate and flow in a direction substantially orthogonal to the substrate transport direction, they are inclined to the left and right with respect to the substrate transport direction in a plan view, so that the substrate is almost entirely covered on the substrate. The processing liquid does not flow partially in the direction substantially orthogonal to the transport direction of the substrate, and the processing liquid does not partially stay on the substrate. It is possible to prevent unevenness caused by hindering the spray or shower from hitting the surface, and it is possible to suppress variations in the processing state on the substrate surface due to a processing liquid such as a cleaning liquid, a developing liquid, or an etching liquid as much as possible.

【0019】また、本発明にかかる液晶用基板の液体噴
射装置は、さらに、各ノズルと対向し、かつ、当該ノズ
ルの噴射方向と逆方向に処理液を噴射するように平面視
で基板の搬送方向に対して他側に傾斜した複数のノズル
からなると共に基板の搬送方向に対して概略直交する方
向に並ぶノズル列を複数備え、上記ノズルから噴射され
た処理液は、当該ノズルと対向するノズルから噴射され
た処理液と衝突することなく交差するので、基板上にお
いて処理液の流れの向きが交互に変化し、その結果、基
板の連続搬送により基板全面は順次流れの向きが交互に
変化する処理液によって処理され、さらに基板表面での
処理状態のばらつきを極力抑制することができると共
に、基板表面での処理液の流量が増加するので、洗浄、
エッチング等の処理時間を短縮することができる。
The liquid crystal substrate liquid ejecting apparatus according to the present invention further conveys the substrate in plan view so as to oppose each nozzle and eject the treatment liquid in a direction opposite to the ejection direction of the nozzle. A plurality of nozzle rows that are inclined to the other side with respect to the direction and are arranged in a direction substantially orthogonal to the substrate transport direction, and the processing liquid ejected from the nozzles is a nozzle that faces the nozzles. Since they intersect without colliding with the processing liquid ejected from the substrate, the flow direction of the processing liquid changes alternately on the substrate, and as a result, the continuous flow of the substrate causes the flow direction of the entire surface of the substrate to change alternately. Since the treatment is performed by the treatment liquid and the variation of the treatment state on the substrate surface can be suppressed as much as possible, and the flow rate of the treatment liquid on the substrate surface increases, cleaning,
Processing time such as etching can be shortened.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明にかかる液晶用基板の液体噴射装置の一
実施形態を示す概略側面図である。
FIG. 1 is a schematic side view showing an embodiment of a liquid ejecting apparatus for a liquid crystal substrate according to the present invention.

【図2】図1に示す液体噴射装置の平面図である。FIG. 2 is a plan view of the liquid ejecting apparatus shown in FIG.

【図3】基板上における処理液の流れを示す説明図であ
る。
FIG. 3 is an explanatory diagram showing a flow of a processing liquid on a substrate.

【図4】従来の液晶用基板の液体噴射装置を示す概略側
面図である。
FIG. 4 is a schematic side view showing a conventional liquid ejecting apparatus for liquid crystal substrates.

【符号の説明】[Explanation of symbols]

1 ノズルパイプ 2 噴射方向 3 基板 4 搬送方向 5 ノズル 1 Nozzle pipe 2 Jet direction 3 Substrate 4 Transfer direction 5 Nozzle

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 液晶表示装置を製造する工程のうち湿式
工程において用いられる液晶用基板の液体噴射装置にお
いて、処理液を基板に向かって噴射する複数のノズルか
らなると共に基板の搬送方向に対して概略直交する方向
に並ぶノズル列を複数備え、各ノズルの噴射方向は、当
該ノズルから噴射された処理液と、当該ノズルと対向す
るノズルから噴射された処理液とが基板上で合流して基
板の搬送方向に対して概略直交する方向に流れるよう
に、平面視で基板の搬送方向に対して左右一側に傾斜し
ていることを特徴とする液晶用基板の液体噴射装置。
1. A liquid ejecting apparatus for a liquid crystal substrate, which is used in a wet process in a process of manufacturing a liquid crystal display device, comprising a plurality of nozzles for ejecting a treatment liquid toward the substrate and with respect to a transport direction of the substrate. A plurality of nozzle rows arranged in a direction substantially orthogonal to each other is provided, and the ejection direction of each nozzle is such that the treatment liquid ejected from the nozzle and the treatment liquid ejected from the nozzle facing the nozzle merge on the substrate. The liquid ejecting apparatus for a liquid crystal substrate, which is inclined to the left and right with respect to the substrate transport direction in plan view so that the liquid flows in a direction substantially orthogonal to the substrate transport direction.
【請求項2】 さらに、前記ノズル列の各ノズルと対向
し、かつ、当該ノズルの噴射方向と逆方向に処理液を噴
射するように平面視で基板の搬送方向に対して他側に傾
斜した複数のノズルからなると共に基板の搬送方向に対
して概略直交する方向に並ぶノズル列を複数備え、前記
ノズルから噴射された処理液は、当該ノズルと対向する
ノズルから噴射された処理液と衝突することなく交差す
ることを特徴とする請求項1記載の液晶用基板の液体噴
射装置。
2. Further, the nozzle array is inclined to the other side with respect to the transport direction of the substrate in plan view so as to face each nozzle of the nozzle row and jet the processing liquid in a direction opposite to the jet direction of the nozzle. A plurality of nozzle rows that are composed of a plurality of nozzles and are arranged in a direction substantially orthogonal to the substrate transport direction are provided, and the treatment liquid ejected from the nozzles collides with the treatment liquid ejected from a nozzle facing the nozzle. 2. The liquid ejecting apparatus for a liquid crystal substrate according to claim 1, wherein the liquid ejecting apparatuses intersect each other.
【請求項3】 前記処理液は、洗浄液、現像液又はエッ
チング液からなることを特徴とする請求項1又は2記載
の液晶用基板の液体噴射装置。
3. The liquid ejecting apparatus for a liquid crystal substrate according to claim 1, wherein the processing liquid is a cleaning liquid, a developing liquid, or an etching liquid.
JP07322883A 1995-12-12 1995-12-12 Liquid jet device for liquid crystal substrate Expired - Fee Related JP3113192B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP07322883A JP3113192B2 (en) 1995-12-12 1995-12-12 Liquid jet device for liquid crystal substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07322883A JP3113192B2 (en) 1995-12-12 1995-12-12 Liquid jet device for liquid crystal substrate

Publications (2)

Publication Number Publication Date
JPH09160006A true JPH09160006A (en) 1997-06-20
JP3113192B2 JP3113192B2 (en) 2000-11-27

Family

ID=18148687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP07322883A Expired - Fee Related JP3113192B2 (en) 1995-12-12 1995-12-12 Liquid jet device for liquid crystal substrate

Country Status (1)

Country Link
JP (1) JP3113192B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006205086A (en) * 2005-01-28 2006-08-10 Sumitomo Precision Prod Co Ltd Washing device of substrate
WO2017164126A1 (en) * 2016-03-25 2017-09-28 東レ株式会社 Developing device and circuit board manufacturing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0454690A (en) * 1990-06-22 1992-02-21 Futaba Keiki Kk Electronic taxi meter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006205086A (en) * 2005-01-28 2006-08-10 Sumitomo Precision Prod Co Ltd Washing device of substrate
WO2017164126A1 (en) * 2016-03-25 2017-09-28 東レ株式会社 Developing device and circuit board manufacturing method

Also Published As

Publication number Publication date
JP3113192B2 (en) 2000-11-27

Similar Documents

Publication Publication Date Title
KR100713235B1 (en) Apparatus for treating surface of thin plate
KR101217371B1 (en) Substrate processing apparatus
JPH09323060A (en) Substrate processing device
JP5701551B2 (en) Substrate processing equipment
JP4352194B2 (en) Substrate drying apparatus and substrate drying method
JP3113192B2 (en) Liquid jet device for liquid crystal substrate
KR100758220B1 (en) Apparatus having numbers of slit nozzles for rinsing substarte and method for rinsing substrate using the saem
JP3916424B2 (en) Substrate processing equipment
JP3881169B2 (en) Substrate processing equipment
JP2000323813A (en) Substrate treatment unit
JP2006255556A (en) Liquid treatment apparatus and liquid crystal display device
JP2003068702A (en) Substrate processing apparatus
JP2003200090A (en) Spray nozzle for printed circuit board and wet line facility using the nozzle
JP4046697B2 (en) Double-sided etching system
JPH09276773A (en) Substrate treating device
JPH0448085A (en) Etching and developing method
JP3981874B2 (en) Chemical treatment method and chemical treatment apparatus
JPH09213668A (en) Substrate processing device
KR100834194B1 (en) Ramjet nozzle for circuit board process and equipment for circuit board process with it
JP2002184749A (en) Substrate-treating device
JP3659526B2 (en) Substrate drainer
JPH11300300A (en) Method and device for treatment of substrate
TWI841216B (en) High pressure cleaning device
JP2003092284A (en) Substrate processing apparatus
JP5633170B2 (en) Development method and development apparatus

Legal Events

Date Code Title Description
FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080922

Year of fee payment: 8

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080922

Year of fee payment: 8

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090922

Year of fee payment: 9

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090922

Year of fee payment: 9

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100922

Year of fee payment: 10

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110922

Year of fee payment: 11

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 12

Free format text: PAYMENT UNTIL: 20120922

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 13

Free format text: PAYMENT UNTIL: 20130922

LAPS Cancellation because of no payment of annual fees