JPH06326072A - Cleaning apparatus - Google Patents

Cleaning apparatus

Info

Publication number
JPH06326072A
JPH06326072A JP13697593A JP13697593A JPH06326072A JP H06326072 A JPH06326072 A JP H06326072A JP 13697593 A JP13697593 A JP 13697593A JP 13697593 A JP13697593 A JP 13697593A JP H06326072 A JPH06326072 A JP H06326072A
Authority
JP
Japan
Prior art keywords
cleaning
cleaning liquid
tank
inner bottom
ejection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13697593A
Other languages
Japanese (ja)
Inventor
Emi Sugimoto
恵美 杉本
Shinichi Sato
真一 佐藤
Takeshi Aiba
武 相場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP13697593A priority Critical patent/JPH06326072A/en
Publication of JPH06326072A publication Critical patent/JPH06326072A/en
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To obtain the title cleaning apparatus wherein a cleaning effect is enhanced and a cleaning treatment is executed stably. CONSTITUTION:Cleaning-liquid jet parts 7, 7 at a cleaning-liquid jet pipe 6 are arranged at two parts situated on mutually opposite sides of a cleaning bath 2 in such a way that at least a part on their outside faces comes into contact with the inside face 15 and with the inner bottom face 16 of the cleaning bath. A plurality of jet hole 14a, 14b are made in such a way that they are opened in a face 17 faced with the opposite side of a corner part at which the inside face and the inner bottom face of the cleaning bath out of the cleaning liquid jet parts come into contact.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は新規な洗浄装置に関す
る。詳しくは、洗浄効果の向上を図ることが出来、安定
した洗浄処理を行なうことが出来る新規な洗浄装置を提
供しようとするものである。
FIELD OF THE INVENTION The present invention relates to a novel cleaning device. More specifically, it is intended to provide a novel cleaning device capable of improving the cleaning effect and performing stable cleaning processing.

【0002】[0002]

【従来の技術】例えば、半導体装置の製造において、半
導体ウエハを各種処理プロセスに沿って洗浄する洗浄処
理工程がある。
2. Description of the Related Art For example, in manufacturing a semiconductor device, there is a cleaning process step of cleaning a semiconductor wafer along various processing processes.

【0003】半導体ウエハに対する洗浄処理には、有機
物の洗浄、金属汚染の洗浄、自然酸化膜の除去、及びそ
れらの間でのリンス処理(薬液水洗)等がある。
Cleaning processes for semiconductor wafers include cleaning of organic substances, cleaning of metal contamination, removal of natural oxide film, and rinsing process between them (chemical solution cleaning).

【0004】従って、かかる洗浄装置における処理槽
は、所要の処理プロセスに応じて適宜選択して複数配置
される。
Therefore, a plurality of treatment tanks in such a cleaning apparatus are appropriately selected and arranged according to a required treatment process.

【0005】図6に半導体ウエハ洗浄システムの一例a
を示す。
FIG. 6 shows an example of a semiconductor wafer cleaning system a.
Indicates.

【0006】bは有機物の洗浄を行なうための薬液を入
れた薬液処理槽、cは純水を入れたリンス処理槽、dは
自然酸化膜の除去を行なうための薬液を入れた薬液処理
槽、eは純水を入れたリンス処理槽、fは金属汚染の洗
浄を行なうための薬液を入れた薬液処理槽、gは純水を
入れたリンス処理槽、hは純水を入れた最終リンス処理
槽であり、iは乾燥処理を行なう乾燥処理部である。
Reference numeral b is a chemical treatment tank containing a chemical for cleaning organic substances, c is a rinse treatment tank containing pure water, and d is a chemical treatment tank containing a chemical for removing a natural oxide film. e is a rinse treatment tank containing pure water, f is a chemical treatment tank containing a chemical liquid for cleaning metal contamination, g is a rinse treatment tank containing pure water, and h is a final rinse treatment containing pure water. It is a tank, and i is a drying processing unit that performs a drying process.

【0007】しかして、キャリアjに収納された複数の
半導体ウエハkはローダl側に搬送された後、各処理槽
b、c、d、e、f、gに順次浸漬されて、有機洗浄、
自然酸化膜の除去、金属汚染の洗浄等が為され、最終リ
ンス処理槽hを経て乾燥処理部iで乾燥されてアンロー
ダm側に搬送され、次の工程に送られる。
Thus, the plurality of semiconductor wafers k stored in the carrier j are transferred to the loader 1 side, and then sequentially immersed in the processing baths b, c, d, e, f and g to carry out organic cleaning,
The natural oxide film is removed, metal contamination is cleaned, etc., dried in the drying processing section i through the final rinse processing tank h, transported to the unloader m side, and sent to the next step.

【0008】そして、上記洗浄装置aにおける各薬液処
理槽等の洗浄槽は図7及び図8に示すようになってい
る。
The cleaning tanks such as the chemical liquid processing tanks in the cleaning device a are as shown in FIGS. 7 and 8.

【0009】nが洗浄槽であり、該洗浄槽n上部外側部
には樋状の受部oが設けられており、洗浄槽nから溢れ
た薬液等の洗浄液pは一端受部oに流れ、ポンプqによ
ってフィルタrを通して再び洗浄槽nの下部に設置して
ある円筒形の洗浄液噴出管sを通して洗浄槽n内に供給
される、というように洗浄液pが循環されている。
N is a cleaning tank, and a trough-shaped receiving portion o is provided on the outer upper portion of the cleaning tank n. The cleaning liquid p such as a chemical solution overflowing from the cleaning tank n flows into the receiving portion o once. The cleaning liquid p is circulated by the pump q through the filter r to be supplied into the cleaning tank n through the cylindrical cleaning liquid jet pipe s installed in the lower portion of the cleaning tank n again.

【0010】上記洗浄液噴出管sは、図10に示すよう
に、洗浄槽nの内側面t及び内底面uから離した状態で
配置され、噴出孔は洗浄液噴出管sの軸芯を中心として
120度の角度間隔で3ヶ所にそれぞれ同じ孔径のもの
v1、v2、v3が形成されている。
As shown in FIG. 10, the cleaning liquid jetting pipe s is arranged in a state of being separated from the inner side surface t and the inner bottom face u of the washing tank n, and the jetting hole 120 is centered on the axis of the cleaning liquid jetting pipe s. The holes v1, v2, and v3 having the same hole diameter are formed at three locations at angular intervals of degrees.

【0011】しかして、ポンプqによって洗浄液噴出管
s、sに圧送された薬液等の洗浄液pは洗浄液噴出管
s、sの各噴出孔v1、v1、・・・、v2、v2、・
・・、v3、v3、・・・から洗浄槽n内に噴出され
て、半導体ウエハk、k、・・・を洗浄しながら洗浄槽
nの上方に達し、受部oに溢れ出て行く。
However, the cleaning liquid p such as a chemical liquid pressure-fed to the cleaning liquid ejection pipes s, s by the pump q causes the ejection holes v1, v1, ..., V2, v2, ... Of the cleaning liquid ejection pipes s, s.
.., v3, v3, ... Spouts into the cleaning tank n, reaches the upper portion of the cleaning tank n while cleaning the semiconductor wafers k, k, ..., and overflows to the receiving portion o.

【0012】[0012]

【発明が解決しようとする課題】ところで、上記した洗
浄装置にあっては、洗浄液噴出管s、sと洗浄槽nの内
側面t、t及び内底面uとの間に間隙があるため、そこ
で不必要な渦等が発生して、洗浄液pの滞留が生じ、洗
浄効率を下げる原因となっている。
By the way, in the above-mentioned cleaning device, since there is a gap between the cleaning liquid jetting pipes s, s and the inner side surfaces t, t and the inner bottom surface u of the cleaning tank n, there is a problem. Unnecessary vortices and the like are generated, and the cleaning liquid p is accumulated, which causes a decrease in cleaning efficiency.

【0013】また、洗浄液pは洗浄液噴出管s、sから
120度の間隔を開けて360度方向に噴出しているの
で、互いに干渉をしてしまい、洗浄領域へのスムーズな
洗浄液pの流入が阻害されるという問題がある。
Further, since the cleaning liquid p is ejected from the cleaning liquid ejecting pipes s, s in the direction of 360 ° with an interval of 120 °, it interferes with each other and the smooth inflow of the cleaning liquid p into the cleaning area. There is a problem of being hindered.

【0014】[0014]

【課題を解決するための手段】本発明洗浄装置は、上記
した課題を解決するために、洗浄槽の互いに反対側に位
置した2ヶ所において洗浄液噴出管をその外側面の少な
くとも一部が洗浄槽の内側面と内底面とに接するように
配置し、洗浄液噴出管のうち洗浄槽の内側面と内底面と
が接する角部の反対側を向いた面に開口する複数の噴出
孔を形成したものである。
In order to solve the above-mentioned problems, the cleaning apparatus of the present invention has a cleaning solution jetting pipe at two locations located on opposite sides of the cleaning tank, at least a part of the outer surface of which is a cleaning tank. Of the cleaning liquid ejecting pipe, and a plurality of ejection holes are formed on the surface of the cleaning liquid ejection pipe facing the opposite side of the corner where the inner surface of the cleaning tank contacts the inner bottom face. Is.

【0015】[0015]

【作用】従って、本発明洗浄装置にあっては、洗浄液噴
出管をその外側面の少なくとも一部が洗浄槽の内側面と
内底面とに接するように配置したので、洗浄液噴出管と
洗浄槽との間の間隙が殆ど無くなり、また、洗浄液噴出
管のうち洗浄槽の内側面と内底面とが接する角部の反対
側を向いた面にのみ噴出孔を開口させたので、従来の洗
浄装置におけるような渦流や洗浄液の滞留が生じること
なく、また、各噴出孔から噴出する洗浄液間の干渉が少
なくなり、これらによって、洗浄効率が向上する。
Therefore, in the cleaning apparatus of the present invention, the cleaning liquid ejection pipe is arranged so that at least a part of its outer surface is in contact with the inner side surface and the inner bottom surface of the cleaning tank. Since there is almost no gap between the cleaning liquid ejection pipes and the ejection holes are opened only on the surface of the cleaning liquid ejection pipe facing the opposite side of the corner where the inner side surface and the inner bottom surface of the cleaning tank contact, the conventional cleaning device Such swirl and retention of the cleaning liquid do not occur, and the interference between the cleaning liquids ejected from the ejection holes is reduced, which improves the cleaning efficiency.

【0016】[0016]

【実施例】以下に、本発明洗浄装置の詳細を図示した実
施例に従って説明する。
The details of the cleaning apparatus of the present invention will be described below with reference to the illustrated embodiments.

【0017】図1及び図2は本発明洗浄装置1の概要を
示すものである。
1 and 2 show the outline of the cleaning apparatus 1 of the present invention.

【0018】2は洗浄槽であり、この洗浄槽2の上端部
を囲むように樋状の受部3が形成されており、該受部3
は一の方向に稍傾斜されており、最も低い部分の底部に
流出孔4が形成されている。
Reference numeral 2 denotes a cleaning tank, and a gutter-shaped receiving portion 3 is formed so as to surround an upper end portion of the cleaning tank 2, and the receiving portion 3
Is slightly inclined in one direction, and an outflow hole 4 is formed at the bottom of the lowest part.

【0019】5は上記受部3の最も低い部分の下方部を
カバーするように設けられた貯留槽である。
Reference numeral 5 is a storage tank provided so as to cover a lower portion of the lowest portion of the receiving portion 3.

【0020】6は洗浄液噴出管であり、洗浄槽2の内底
部の両側に配置される洗浄液噴出部7、7を備え、これ
ら洗浄液噴出部7、7の一端同士が上方へ立ち上がった
立上部8、8と該立上部8、8の上端間を連結している
連結部9とによって連結されている。
A cleaning liquid jetting pipe 6 is provided with cleaning liquid jetting portions 7, 7 arranged on both sides of the inner bottom portion of the washing tank 2, and a rising portion 8 with one end of the washing liquid jetting parts 7, 7 rising upwards. , 8 and a connecting portion 9 connecting the upper ends of the rising portions 8 and 8 to each other.

【0021】そして、洗浄槽2内に洗浄液10が満たさ
れ、洗浄槽2の上端から溢れ出た洗浄液10は受部3に
よって受けられてからその流出孔4を経て貯留槽5に達
し、ここからポンプ11によってフィルタ12を経て洗
浄液噴出管6の連結部9に圧送され、それが、立上部
8、8を経て洗浄液噴出部7、7から洗浄槽2内に噴出
される。
Then, the cleaning liquid 10 is filled in the cleaning liquid tank 2, and the cleaning liquid 10 overflowing from the upper end of the cleaning liquid tank 2 is received by the receiving portion 3 and reaches the storage tank 5 through the outflow hole 4 thereof. It is pumped by the pump 11 through the filter 12 to the connecting portion 9 of the cleaning liquid ejection pipe 6, and is ejected from the cleaning liquid ejection portions 7 and 7 into the cleaning tank 2 through the rising portions 8 and 8.

【0022】そして、洗浄液噴出部7、7から噴出され
た洗浄液10が図示しないキャリアに保持されて洗浄槽
2内の洗浄液10中に浸漬されている半導体ウエハ1
3、13、・・・を洗浄しながら洗浄槽2の上方に達
し、再び受部3へ溢れ出て行く。
Then, the cleaning liquid 10 ejected from the cleaning liquid ejecting portions 7, 7 is held by a carrier (not shown) and immersed in the cleaning liquid 10 in the cleaning tank 2 to form the semiconductor wafer 1.
While washing 3, 3, ..., It reaches above the washing tank 2 and overflows to the receiving portion 3 again.

【0023】洗浄液噴出管6の洗浄液噴出部7は円筒状
をしており、多数の噴出孔14、14、・・・が穿設さ
れている。
The cleaning liquid ejection portion 7 of the cleaning liquid ejection pipe 6 has a cylindrical shape, and a large number of ejection holes 14, 14, ... Are bored therein.

【0024】そして、係る洗浄液噴出部7はその外側面
が洗浄槽2の内側面15と内底面16とに接するように
配置され、上記噴出孔14、14、・・・はその優弧
部、即ち、洗浄槽2の内側面15と内底面16とが接す
る角部の反対側を向いた部分17に形成されている。
The cleaning liquid ejecting portion 7 is arranged so that its outer surface is in contact with the inner side surface 15 and the inner bottom surface 16 of the cleaning tank 2, and the ejection holes 14, 14, ... That is, it is formed in a portion 17 facing the opposite side of the corner where the inner side surface 15 and the inner bottom surface 16 of the cleaning tank 2 contact.

【0025】そして、噴出孔14、14、・・・のうち
洗浄槽2の内側面15に近接したもの14aと内底面1
6に近接したもの14cとは洗浄液噴出部7の軸芯を挟
んで反対側に位置し、中間のもの14bは14aと14
cとの丁度真ん中に位置している。
Of the ejection holes 14, 14, which are close to the inner side surface 15 of the cleaning tank 2 and the inner bottom surface 1
6 is located on the opposite side of the cleaning liquid jetting part 7 with the shaft center of the cleaning liquid spraying part 7 interposed therebetween.
It is located exactly in the middle of c.

【0026】また、これら噴出孔14a、14b、14
cの孔径は14aのそれが一番小さく、14b、14c
の順に大きくなっている。そして、噴出孔14cの孔径
は噴出孔14aの孔径の2倍以上になっている。
Further, these ejection holes 14a, 14b, 14
The hole diameter of c is 14a, which is the smallest, and 14b and 14c.
Is increasing in order. The diameter of the ejection hole 14c is at least twice the diameter of the ejection hole 14a.

【0027】しかして、噴出孔14cから噴出された洗
浄液10は、洗浄槽2の内底面16と略平行に進んで、
洗浄槽2の中央部において相対向する他の洗浄液噴出部
7の噴出孔14cから噴出された洗浄液10とぶつか
り、半導体ウエハ13の下部に向かう上昇流を形成す
る。
The cleaning liquid 10 ejected from the ejection holes 14c advances substantially parallel to the inner bottom surface 16 of the cleaning tank 2,
In the central portion of the cleaning tank 2, the cleaning liquid 10 jetted from the jetting holes 14c of the other cleaning liquid jetting portions 7 facing each other collide with each other to form an upward flow toward the lower part of the semiconductor wafer 13.

【0028】そして、半導体ウエハ13の下方部におい
て上昇流となった洗浄液10は、半導体ウエハ13と1
3との間にその下部から侵入し、半導体ウエハ13と1
3との間を流れ、半導体ウエハ13の表面を洗浄するこ
とになる。
Then, the cleaning liquid 10 which has become an ascending flow in the lower part of the semiconductor wafer 13 has the semiconductor wafers 1 and 1
Between the semiconductor wafers 13 and 1
3 and the surface of the semiconductor wafer 13 is cleaned.

【0029】また、噴出孔14aから噴出された洗浄液
10は、洗浄槽2の内側面15に沿って上昇流を形成
し、上記半導体ウエハ13と13との間を上昇流として
流れる上記洗浄液10を内側面15側へ引き寄せるよう
な働きをする。
The cleaning liquid 10 ejected from the ejection holes 14a forms an ascending flow along the inner surface 15 of the cleaning tank 2, and the cleaning liquid 10 flowing between the semiconductor wafers 13 and 13 as an ascending flow. It works like pulling toward the inner surface 15.

【0030】これにより、半導体ウエハ13と13との
間における洗浄液10の流れは半導体ウエハ13の下部
から上方へ流れる上昇流を該上昇流から分かれて斜め上
方へ向かう流れとが形成され、半導体ウエハ13の表面
はその略全面において洗浄液10の流れが生じ、略均一
な洗浄が行われる。
As a result, the flow of the cleaning liquid 10 between the semiconductor wafers 13 is divided into an upward flow that flows upward from the lower part of the semiconductor wafer 13 and a flow that flows obliquely upward from the upward flow. A flow of the cleaning liquid 10 is generated on the surface of the surface 13 so that cleaning is performed substantially uniformly.

【0031】更に、噴出孔14bから噴出された洗浄液
10は噴出孔14aと14cとによるそれぞれの洗浄液
10の流れと流れとの間を埋め、両者の流れがスムーズ
になるように働く。
Further, the cleaning liquid 10 ejected from the ejection holes 14b fills the gap between the respective flows of the cleaning liquids 10 formed by the ejection holes 14a and 14c, and works so that both flows become smooth.

【0032】そして、この洗浄装置1にあっては、洗浄
液噴出管6の洗浄液噴出部7が洗浄槽2の内側面15と
内底面16に接して位置しているので、洗浄液噴出部7
と洗浄槽2の内面との間に隙間がなく、洗浄槽2の底部
角部での渦流による所謂死水が発生することが無く、従
って、死水の発生に基づくパーティクルの発生が無くな
り、洗浄効果が向上する。
In the cleaning apparatus 1, the cleaning liquid ejecting portion 7 of the cleaning liquid ejecting pipe 6 is located in contact with the inner side surface 15 and the inner bottom surface 16 of the cleaning tank 2, so that the cleaning liquid ejecting portion 7 is provided.
There is no gap between the inner surface of the cleaning tank 2 and the inner surface of the cleaning tank 2, so that so-called dead water due to the vortex flow at the bottom corner of the cleaning tank 2 is not generated. improves.

【0033】この結果、よりスムーズな洗浄を行なうこ
とが出来る。
As a result, smoother cleaning can be performed.

【0034】尚、洗浄液噴出部7の横断面で見てその軸
芯を中心とした180度の角度範囲内に3ヶ所に噴出孔
14a、14b、14cを形成したが、この数は3ヶ所
に限定されるものではなく、2ヶ所であっても、また、
4ヶ所以上であっても良い。
Incidentally, when viewed in the cross section of the cleaning liquid jetting portion 7, jetting holes 14a, 14b and 14c were formed at three places within an angle range of 180 degrees around the axis thereof, but the number is three. It is not limited, and even if it is two places,
It may be four or more.

【0035】また、3ヶ所に形成する場合、中央に位置
するもの14bは14aと14cの丁度真ん中に位置す
る必要はなく、14aと14cとの間で位置されれば良
い。
Further, in the case of forming at three places, the one 14b located at the center does not have to be located exactly in the middle of 14a and 14c, but may be located between 14a and 14c.

【0036】更に、上記したように噴出孔14a、14
b、14cの孔径が14a<14b<14cとなるよう
にしたが、このようにすることによって、半導体ウエハ
13の下方部への洗浄液10の供給量を増やして従来洗
浄効率がさほど良くなかった半導体ウエハ13の下方部
での洗浄効率の向上を図ることが出来る。
Further, as described above, the ejection holes 14a, 14
Although the hole diameters of b and 14c are set to 14a <14b <14c, by doing so, the supply amount of the cleaning liquid 10 to the lower portion of the semiconductor wafer 13 is increased and the conventional cleaning efficiency is not so good. It is possible to improve the cleaning efficiency in the lower portion of the wafer 13.

【0037】ただ、このような孔径の設定にしなくと
も、少なくとも、上記したような、洗浄液噴出部7を洗
浄槽2の内側面15及び内底面16に接触させたことに
よる効果は奏することが出来る。
However, even if the hole diameter is not set as described above, at least the above-mentioned effect can be obtained by bringing the cleaning liquid jetting portion 7 into contact with the inner side surface 15 and the inner bottom surface 16 of the cleaning tank 2. .

【0038】図5は本発明洗浄装置における洗浄液噴出
部の変形例を示すものである。
FIG. 5 shows a modification of the cleaning liquid jetting portion in the cleaning device of the present invention.

【0039】この変形例による洗浄液噴出部18は横断
面形状が略正方形の角筒状をしており、該洗浄液噴出部
18に多数の噴出孔19、19、・・・が形成されてい
る。
The cleaning liquid ejecting portion 18 according to this modification has a rectangular cross-section having a substantially square cross section, and the cleaning liquid ejecting portion 18 has a large number of ejection holes 19, 19 ,.

【0040】そして、該洗浄液噴出部18は互いに隣接
する2つの外側面が洗浄槽2の内側面15と内底面16
に接触するように配置される。
The cleaning liquid jetting portion 18 has two outer surfaces adjacent to each other, the inner surface 15 and the inner bottom surface 16 of the cleaning tank 2.
Is placed in contact with.

【0041】そして、上面の内側面15寄りの位置と、
洗浄槽2の内面に接していない角部と、洗浄槽2の内側
面15に接している側面の反対側に位置した側面の内底
面16寄りの位置との、3ヶ所に噴出孔19a、19
b、19cが形成されている。
Then, the position near the inner surface 15 of the upper surface,
The ejection holes 19a, 19 are provided at three locations, namely, a corner portion that is not in contact with the inner surface of the cleaning tank 2 and a position near the inner bottom surface 16 of the side surface that is opposite to the side surface that is in contact with the inner surface 15 of the cleaning tank 2.
b and 19c are formed.

【0042】また、噴出孔19aは内側面15と平行
に、噴出孔19cは内底面16と平行に延びるように形
成されている。
The ejection holes 19a are formed so as to extend parallel to the inner side surface 15, and the ejection holes 19c are formed so as to extend parallel to the inner bottom surface 16.

【0043】噴出孔19a及び19cをこのような向き
に形成することによって、これら噴出孔19a、19c
から噴出された洗浄液10は内側面15や内底面16に
ぶつかることなく洗浄槽2内へ出て行くため、噴流のロ
スが少なく、効率的な洗浄を行なうことが出来る。尚、
このような噴出孔19a、19cの形成の仕方は、円筒
形の洗浄液噴出管の場合にも適用することが出来ること
は勿論である。
By forming the ejection holes 19a and 19c in such a direction, the ejection holes 19a and 19c are formed.
Since the cleaning liquid 10 ejected from the liquid flows out into the cleaning tank 2 without hitting the inner side surface 15 and the inner bottom surface 16, the loss of the jet flow is small and efficient cleaning can be performed. still,
It goes without saying that such a method of forming the ejection holes 19a and 19c can be applied to the case of a cylindrical cleaning liquid ejection pipe.

【0044】そして、これら噴出孔19a、19b、1
9cの孔径は19a<19b<19cの関係になるよう
にされている。
Then, these ejection holes 19a, 19b, 1
The hole diameter of 9c is set to have a relationship of 19a <19b <19c.

【0045】[0045]

【発明の効果】以上に記載したところから明らかなよう
に、本発明洗浄装置は、洗浄槽の互いに反対側に位置し
た2ヶ所において洗浄液噴出管をその外側面の少なくと
も一部が洗浄槽の内側面と内底面とに接するように配置
し、洗浄液噴出管のうち洗浄槽の内側面と内底面とが接
する角部の反対側を向いた面に開口する複数の噴出孔を
形成したことを特徴とする。
As is apparent from the above description, in the cleaning apparatus of the present invention, the cleaning liquid jetting pipe is provided at two positions on the opposite sides of the cleaning tank, at least a part of the outer surface of which is inside the cleaning tank. It is arranged so as to be in contact with the side surface and the inner bottom surface, and has a plurality of ejection holes formed on the surface of the cleaning liquid ejection pipe facing the opposite side of the corner where the inner surface of the cleaning tank contacts the inner bottom surface. And

【0046】従って、本発明洗浄装置にあっては、洗浄
液噴出管をその外側面の少なくとも一部が洗浄槽の内側
面と内底面とに接するように配置したので、洗浄液噴出
管と洗浄槽との間の間隙が殆ど無くなり、また、洗浄液
噴出管のうち洗浄槽の内側面と内底面とが接する角部の
反対側を向いた面にのみ噴出孔を開口させたので、従来
の洗浄装置におけるような渦流や洗浄液の滞留が生じる
ことなく、また、各噴出孔から噴出する洗浄液間の干渉
が少なくなり、これらによって、洗浄効率が向上する。
Therefore, in the cleaning apparatus of the present invention, the cleaning liquid jetting pipe is arranged so that at least a part of its outer surface is in contact with the inner side surface and the inner bottom surface of the cleaning tank. Since there is almost no gap between the cleaning liquid ejection pipes and the ejection holes are opened only on the surface of the cleaning liquid ejection pipe facing the opposite side of the corner where the inner side surface and the inner bottom surface of the cleaning tank are in contact, Such swirl and retention of the cleaning liquid do not occur, and the interference between the cleaning liquids ejected from the ejection holes is reduced, which improves the cleaning efficiency.

【0047】尚、上記実施例では、本発明を半導体ウエ
ハの洗浄装置に適用したものを示したが、本発明は半導
体ウエハの洗浄装置以外の洗浄装置に適用することが出
来ることは勿論である。
In the above embodiment, the present invention is applied to the semiconductor wafer cleaning apparatus, but it goes without saying that the present invention can be applied to cleaning apparatuses other than the semiconductor wafer cleaning apparatus. .

【0048】また、上記実施例に示した各部の形状及び
構造は、本発明を実施するに際しての具体化のほんの一
例を示したものにすぎず、これらによって本発明の技術
的範囲が限定的に解釈されてはならない。
Further, the shapes and structures of the respective portions shown in the above-mentioned embodiments are merely examples of the embodiment when the present invention is carried out, and the technical scope of the present invention is limited by these. Should not be interpreted.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明洗浄装置の実施の一例の概略を示す断面
図である。
FIG. 1 is a cross-sectional view showing an outline of an example of implementation of a cleaning apparatus of the present invention.

【図2】図1におけるII−II線に沿う概略断面図で
ある。
FIG. 2 is a schematic sectional view taken along line II-II in FIG.

【図3】要部を示す斜視図である。FIG. 3 is a perspective view showing a main part.

【図4】要部を示す拡大断面図である。FIG. 4 is an enlarged cross-sectional view showing a main part.

【図5】洗浄液噴出管の変形例を示す要部の拡大断面図
である。
FIG. 5 is an enlarged cross-sectional view of a main part showing a modified example of the cleaning liquid jetting pipe.

【図6】半導体ウエハの洗浄システムの概要を示すフロ
ー図である。
FIG. 6 is a flowchart showing an outline of a semiconductor wafer cleaning system.

【図7】従来の洗浄装置の一例の概略を示す断面図であ
る。
FIG. 7 is a cross-sectional view schematically showing an example of a conventional cleaning device.

【図8】図7のVIII−VIII線に沿う概略断面図
である。
8 is a schematic cross-sectional view taken along the line VIII-VIII of FIG.

【図9】従来の洗浄装置の要部を示す斜視図である。FIG. 9 is a perspective view showing a main part of a conventional cleaning device.

【図10】従来の洗浄装置の要部を示す拡大断面図であ
る。
FIG. 10 is an enlarged cross-sectional view showing a main part of a conventional cleaning device.

【符号の説明】[Explanation of symbols]

1 洗浄装置 2 洗浄槽 7 洗浄液噴出管(洗浄液噴出部) 14a、14b、14c 噴出孔 15 洗浄槽の内側面 16 洗浄槽の内底面 18 洗浄液噴出管(洗浄液噴出部) 19a、19b、19c 噴出孔 DESCRIPTION OF SYMBOLS 1 Cleaning device 2 Cleaning tank 7 Cleaning liquid spouting pipe (cleaning liquid spouting part) 14a, 14b, 14c Spouting hole 15 Inner side surface of the cleaning tank 16 Inner bottom surface of the washing tank 18 Cleaning liquid spouting pipe (cleaning liquid spouting part) 19a, 19b, 19c Spouting hole

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 洗浄槽の互いに反対側に位置した2ヶ所
において洗浄液噴出管をその外側面の少なくとも一部が
洗浄槽の内側面と内底面とに接するように配置し、洗浄
液噴出管のうち洗浄槽の内側面と内底面とが接する角部
の反対側を向いた面に開口する複数の噴出孔を形成した
ことを特徴とする洗浄装置。
1. A cleaning solution jetting pipe is arranged at two locations located on opposite sides of a cleaning tank so that at least a part of its outer surface is in contact with the inner side surface and the inner bottom surface of the washing tank. A cleaning device, wherein a plurality of ejection holes are formed on a surface facing the opposite side of a corner where the inner side surface and the inner bottom surface of the cleaning tank contact each other.
【請求項2】 少なくとも洗浄槽の内底面側に位置した
噴出孔の孔径を他の部分に位置した噴出孔の孔径より大
きくしたことを特徴とする請求項1に記載の洗浄装置。
2. The cleaning apparatus according to claim 1, wherein at least the diameter of the ejection hole located on the inner bottom surface side of the cleaning tank is made larger than the diameter of the ejection hole located in another portion.
【請求項3】 洗浄槽の内側面寄りに位置した噴出孔と
内底面寄りに位置した噴出孔とがそれぞれが近接した面
と略平行に延びるように形成されたことを特徴とする請
求項1又は請求項2に記載の洗浄装置。
3. The jet hole located near the inner side surface of the cleaning tank and the jet hole located near the inner bottom surface of the cleaning tank are formed so as to extend substantially parallel to the adjacent surfaces. Alternatively, the cleaning device according to claim 2.
JP13697593A 1993-05-17 1993-05-17 Cleaning apparatus Granted JPH06326072A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13697593A JPH06326072A (en) 1993-05-17 1993-05-17 Cleaning apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13697593A JPH06326072A (en) 1993-05-17 1993-05-17 Cleaning apparatus

Publications (1)

Publication Number Publication Date
JPH06326072A true JPH06326072A (en) 1994-11-25

Family

ID=15187849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13697593A Granted JPH06326072A (en) 1993-05-17 1993-05-17 Cleaning apparatus

Country Status (1)

Country Link
JP (1) JPH06326072A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995028235A1 (en) * 1994-04-14 1995-10-26 Kabushiki Kaisha Toshiba Washing method and washing device
US7305999B2 (en) * 2000-07-07 2007-12-11 Semitool, Inc. Centrifugal spray processor and retrofit kit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995028235A1 (en) * 1994-04-14 1995-10-26 Kabushiki Kaisha Toshiba Washing method and washing device
US7305999B2 (en) * 2000-07-07 2007-12-11 Semitool, Inc. Centrifugal spray processor and retrofit kit

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