JPH09171354A - Electromagnetic wave leakage prevention device - Google Patents
Electromagnetic wave leakage prevention deviceInfo
- Publication number
- JPH09171354A JPH09171354A JP33152695A JP33152695A JPH09171354A JP H09171354 A JPH09171354 A JP H09171354A JP 33152695 A JP33152695 A JP 33152695A JP 33152695 A JP33152695 A JP 33152695A JP H09171354 A JPH09171354 A JP H09171354A
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic wave
- pdp
- shielding plate
- circuit board
- prevention device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はプラズマディスプレイパ
ネル(PDP)の電磁波漏洩防止装置に係り、PDPと
回路基板とを接続するフレキシブル基板から放射される
電磁波を遮断するために設ける電磁波遮蔽板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic wave leakage prevention device for a plasma display panel (PDP), and more particularly to an electromagnetic wave shielding plate provided for shielding electromagnetic waves emitted from a flexible substrate connecting a PDP and a circuit board.
【0002】[0002]
【従来の技術】PDPは、同一画面サイズの陰極線管に
比べて奥行きが薄いので、PDPの制御回路等を搭載し
た回路基板をPDPの背面に取付けることにより装置の
奥行きを大幅に短縮できる。しかし、回路基板には発熱
量の大きい回路部品が搭載されており、また、PDP自
体もプラズマ放電で発熱する。PDPは規定以上に温度
が上昇した場合に表示画像の色が変色するという問題が
あり、また、回路基板の温度上昇は回路部品の信頼性を
低下させる原因となる。このため、ファン(送風扇等)
を設けてPDPと回路基板との間を強制的に通風させ、
PDPおよび回路基板の温度が上昇しないようにしてい
る。ところで、PDPは、上述のように背面の回路基板
より供給される信号で画像を表示するもので、この信号
を供給するためPDPの外周部に導出された電極に回路
基板からの信号線(フレキシブル基板で構成)を配設し
なければならず、このフレキシブル基板がまた通風の妨
げになる。また、この信号線にはPDPを発光させるた
めの高レベルの高周波電流が流れ、この高周波電流によ
り電磁波が放射され、特に情報処理装置等に使用する場
合に電磁波の漏洩レベルの規制値を越える場合がある。
このため、フレキシブル基板の外側に電磁波遮断板(コ
ンタクトストリップ)を取付けており、この電磁波遮蔽
板によってもさらに通風が妨げられ、PDPの温度上昇
の要因になる。2. Description of the Related Art Since a PDP has a smaller depth than a cathode ray tube having the same screen size, the depth of the device can be greatly reduced by mounting a circuit board on which a PDP control circuit and the like are mounted on the back surface of the PDP. However, circuit components that generate a large amount of heat are mounted on the circuit board, and the PDP itself also generates heat due to plasma discharge. The PDP has a problem that the color of a display image is discolored when the temperature rises above a prescribed level, and the rise in the temperature of the circuit board causes a decrease in reliability of circuit components. Therefore, a fan (such as a fan)
Is provided to force ventilation between the PDP and the circuit board,
The temperature of the PDP and the circuit board are prevented from rising. By the way, the PDP displays an image by the signal supplied from the circuit board on the back side as described above, and the signal line (flexible from the circuit board to the electrode led to the outer peripheral portion of the PDP for supplying this signal (flexible). It is necessary to arrange a substrate), and this flexible substrate also obstructs ventilation. Further, a high-level high-frequency current for causing the PDP to emit light flows through this signal line, and the high-frequency current radiates an electromagnetic wave, and when the leakage level of the electromagnetic wave exceeds a regulated value particularly when used in an information processing device or the like. There is.
Therefore, an electromagnetic wave blocking plate (contact strip) is attached to the outside of the flexible substrate, and the electromagnetic wave blocking plate further hinders ventilation, which causes a rise in the temperature of the PDP.
【0003】[0003]
【発明が解決しようとする課題】本発明はこのような点
に鑑み、PDPと回路基板とを接続するフレキシブル基
板の外周に設ける電磁波遮蔽板により、PDPと回路基
板との間の通風を妨げずに電磁波の漏洩を防止できるよ
うにすることにある。SUMMARY OF THE INVENTION In view of the above, the present invention has an electromagnetic wave shielding plate provided on the outer periphery of a flexible substrate that connects a PDP and a circuit board, and does not prevent ventilation between the PDP and the circuit board. It is to prevent the leakage of electromagnetic waves.
【0004】[0004]
【課題を解決するための手段】本発明は上述の課題を解
決するため、PDPの背面にPDPの駆動回路を搭載し
た回路基板を所要の間隔を設けて配設し、PDPの外周
部に導出された電極と回路基板の外周部に導出された導
体とを複数のフレキシブル基板で接続したものにおい
て、前記フレキシブル基板の外側に、コ字型をなし、背
部に通風穴を設け、両腕部で前記PDPおよび回路基板
の外面を挟持するようにした電磁遮蔽板を設け、電磁遮
蔽板を前記回路基板等のアースに接続するようにした電
磁波漏洩防止装置を提供するものである。In order to solve the above-mentioned problems, the present invention arranges a circuit board on which a PDP drive circuit is mounted on the back surface of a PDP at a predetermined interval and leads to the outer peripheral portion of the PDP. In the one in which the electrode and the conductor led to the outer peripheral portion of the circuit board are connected by a plurality of flexible boards, a U-shape is formed on the outside of the flexible board, a ventilation hole is provided on the back, and both arms are provided. An electromagnetic wave leakage prevention device is provided in which an electromagnetic shield plate is provided so as to sandwich the outer surfaces of the PDP and the circuit board, and the electromagnetic shield plate is connected to the ground of the circuit board or the like.
【0005】[0005]
【作用】以上のように構成したので、本発明による電磁
波漏洩防止装置においては、フレキシブル基板を流れる
高周波電流によって発生する電磁波は、フレキシブル基
板の外側に配設した電磁波遮蔽板で遮蔽され、電磁波の
漏洩量が低減する。この電磁波遮蔽板に通風穴を形成
し、この通風穴によりPDPと回路基板との間に空気が
流れるようにし、PDPおよび回路基板の温度上昇を抑
止する。With the above construction, in the electromagnetic wave leakage prevention device according to the present invention, the electromagnetic wave generated by the high-frequency current flowing through the flexible substrate is shielded by the electromagnetic wave shielding plate disposed outside the flexible substrate, The amount of leakage is reduced. Ventilation holes are formed in the electromagnetic wave shielding plate, and air is allowed to flow between the PDP and the circuit board by the ventilation holes to suppress the temperature rise of the PDP and the circuit board.
【0006】[0006]
【実施例】以下、図面に基づいて本発明による電磁波漏
洩防止装置の実施例を詳細に説明する。図1は本発明に
よる電磁波漏洩防止装置の一実施例の概要図、図2は要
部断面図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of an electromagnetic wave leakage prevention device according to the present invention. FIG. 1 is a schematic view of an embodiment of an electromagnetic wave leakage prevention device according to the present invention, and FIG. 2 is a sectional view of a main part.
【0007】図1の1は回路基板、2はバネクリップ、
3は電磁波遮蔽板(コンタクトストリップ)、4はボス
金具、5は電磁遮蔽板3のアース接続用のタブであり、
図2の11はPDP、12はPDP11の背面に両面粘着テー
プ等で接着されたアルミニュウム板、13はPDP11およ
びアルミ板12と回路基板1とを固定するためのボス金
具、14はは回路基板1とPDP11とを接続するフレキシ
ブル基板、15はフレキシブル基板14の接続部を回路基板
1あるいはPDP11の導体部に密着させるための押さえ
具、16はバネクリップ3の先端の折り返し部である。In FIG. 1, 1 is a circuit board, 2 is a spring clip,
3 is an electromagnetic wave shielding plate (contact strip), 4 is a boss metal fitting, 5 is a tab for grounding the electromagnetic shielding plate 3,
In FIG. 2, 11 is a PDP, 12 is an aluminum plate adhered to the back surface of the PDP 11 by a double-sided adhesive tape, 13 is a boss metal fitting for fixing the PDP 11 and the aluminum plate 12 and the circuit board 1, and 14 is the circuit board 1. A flexible substrate for connecting the PDP 11 to the PDP 11, a pressing member 15 for closely contacting the connection portion of the flexible substrate 14 with the circuit board 1 or the conductor portion of the PDP 11, and 16 a folded portion at the tip of the spring clip 3.
【0008】図2に示すように、PDP11は背面を両面
粘着テープ等でアルミニウム板12に固定し、このアルミ
ニウム板12をボス金具13により回路基板1に取付け、さ
らにボス金具4により筺体に背面等に取付ける。ボス金
具13およびボス金具4はPDP11および回路基板の固定
用であると同時に放熱の役をなすもので、熱伝導性の良
好な金属、例えば、銅あるいは黄銅等で形成し、PDP
11からアルミニウム板12に伝導した熱、あるいは回路基
板1で発生した熱を金属で形成された筺体に伝導し、筺
体の表面から放熱するようにする。As shown in FIG. 2, the back surface of the PDP 11 is fixed to the aluminum plate 12 with a double-sided adhesive tape or the like, the aluminum plate 12 is attached to the circuit board 1 by the boss metal fittings 13, and the back surface or the like is attached to the housing by the boss metal fittings 4. Install on. The boss metal fitting 13 and the boss metal fitting 4 are used not only for fixing the PDP 11 and the circuit board but also for radiating heat. The boss metal fitting 13 and the boss metal fitting 4 are made of a metal having good thermal conductivity, such as copper or brass.
The heat conducted from 11 to the aluminum plate 12 or the heat generated in the circuit board 1 is conducted to the housing made of metal and radiated from the surface of the housing.
【0009】PDP11は、外周部に導出した電極をフレ
キシブル基板14を介して回路基板1に接続し、回路基板
1より供給される信号により画像を表示する。フレキシ
ブル基板14は、PDPと回路基板とを接続するための導
体をストライプ状に配設したもので、これらの導体にパ
ルス状の高周波電流が流れ、高周波電流による電磁波が
発生する。この電磁波の漏洩レベルを低減するため、フ
レキシブル基板14をカバーするように電磁波遮蔽板(コ
ンタクトストリップ)3を取付ける。The PDP 11 connects the electrodes led to the outer periphery to the circuit board 1 via the flexible board 14 and displays an image by a signal supplied from the circuit board 1. The flexible substrate 14 is formed by arranging conductors for connecting the PDP and the circuit board in a stripe shape. A pulsed high frequency current flows through these conductors, and electromagnetic waves are generated by the high frequency current. In order to reduce the leakage level of this electromagnetic wave, an electromagnetic wave shielding plate (contact strip) 3 is attached so as to cover the flexible substrate 14.
【0010】フレキシブル基板14および電磁波遮蔽板3
等の取付け状態は図2に示す如くである。すなわち、フ
レキシブル基板14の両端の接続部をPDP11の電極およ
び回路基板1の端子部にそれぞれ当接し、その上に押さ
え具15を載置し、バネクリップ2で挟持してPDP11あ
るいは回路基板1に固定する。図1では図示されていな
いが、バネクリップ2の下にこれらフレキシブル基板14
および押さえ具15がある。Flexible substrate 14 and electromagnetic wave shielding plate 3
The mounting state of the same is as shown in FIG. That is, the connection portions at both ends of the flexible substrate 14 are brought into contact with the electrodes of the PDP 11 and the terminal portions of the circuit board 1, respectively, and the pressing member 15 is placed on the contact portions, and the spring clips 2 are sandwiched between the PDP 11 and the circuit board 1. Fix it. Although not shown in FIG. 1, these flexible boards 14 are provided under the spring clip 2.
And there is a retainer 15.
【0011】図2に示すように、バネクリップ2の先端
16をカールさせ、電磁波遮蔽板の先端も同様に折り返し
て厚みを持たせ、この部分をバネクリップ2のカール部
分に差し込んで電磁波遮蔽板3が脱落しないようにす
る。なお、図2は、バネクリップ2および電磁波遮蔽板
3のPDP11の前面側(図の下方)にもカールを形成し
た例を示しているが、PDP11の前面側に突出部を形成
することは筺体前面部との間に間隙を要するので好まし
くない場合があり、そのような場合はPDP11の前面側
にはカールを形成せず、粘着テープ等を用いて固定する
ようにする。As shown in FIG. 2, the tip of the spring clip 2
16 is curled and the tip of the electromagnetic wave shielding plate is likewise folded back to have a thickness, and this portion is inserted into the curled portion of the spring clip 2 so that the electromagnetic wave shielding plate 3 does not fall off. Although FIG. 2 shows an example in which the curl is formed on the front side (downward in the figure) of the PDP 11 of the spring clip 2 and the electromagnetic wave shielding plate 3, it is not possible to form a protrusion on the front side of the PDP 11. There is a case where it is not preferable because a space is required between the front surface portion and the front surface portion. In such a case, curl is not formed on the front surface side of the PDP 11, and the PDP 11 is fixed by using an adhesive tape or the like.
【0012】電磁波遮蔽板3の背面(図2の左方)に、
図3に示すように通風穴を形成する。すなわち、図3
(イ)は背面を網目状に形成した例、(ロ)は多数の小
穴を穿設した例である。あるいは、(ハ)に示すよう
に、フレキシブル基板2間の隙間(図1のバネクリップ
2の間の隙間に相応する)部分に小穴を設ける、若しく
はこの部分に網目を形成するようにする。なお網目のピ
ッチあるいは小穴の径は遮蔽すべき電磁波の波長を勘案
して設定するようにする。そして、タブ5を回路基板1
等のアースに接続し、電磁波遮蔽板3に発生した電圧を
アースするようにする。On the back surface of the electromagnetic wave shielding plate 3 (on the left side of FIG. 2),
Ventilation holes are formed as shown in FIG. That is, FIG.
(A) is an example in which the back surface is formed in a mesh shape, and (B) is an example in which a large number of small holes are formed. Alternatively, as shown in (c), small holes are provided in the gaps between the flexible substrates 2 (corresponding to the gaps between the spring clips 2 in FIG. 1), or a mesh is formed in this portion. The mesh pitch or the diameter of the small holes is set in consideration of the wavelength of the electromagnetic wave to be shielded. Then, the tab 5 is attached to the circuit board 1.
And the like, so that the voltage generated in the electromagnetic wave shielding plate 3 is grounded.
【0013】これにより、ファン(送風扇、図示せず)
の回転で回路基板1とPDP11との間の空気は電磁波遮
蔽板3の通風穴を通って吸引され、回路基板1およびP
DP11の温度上昇を抑止する。Thus, a fan (blower fan, not shown)
The air between the circuit board 1 and the PDP 11 is sucked through the ventilation holes of the electromagnetic wave shielding plate 3 by the rotation of the circuit board 1 and the PDP 11.
Prevents the temperature rise of DP11.
【0014】[0014]
【発明の効果】以上に説明したように、本発明による電
磁波漏洩防止装置によれば、電磁波遮蔽板に電磁波の遮
蔽に支障を生じないように通風穴を設けたので、フレキ
シブル基板で発生する電磁波は従来同様に遮断でき、か
つ、PDPと回路基板との間の換気の風路が確保される
のでPDPおよび回路基板の温度上昇を抑止することが
できる。As described above, according to the electromagnetic wave leakage prevention device of the present invention, since the ventilation hole is provided in the electromagnetic wave shielding plate so as not to interfere with the shielding of the electromagnetic wave, the electromagnetic wave generated in the flexible substrate is generated. Can be shut off in the same manner as in the related art, and the ventilation air passage between the PDP and the circuit board is secured, so that the temperature rise of the PDP and the circuit board can be suppressed.
【図1】本発明による電磁波漏洩防止装置の一実施例の
概要図である。FIG. 1 is a schematic view of an embodiment of an electromagnetic wave leakage prevention device according to the present invention.
【図2】本発明による電磁波漏洩防止装置の一実施例の
要部断面図である。FIG. 2 is a sectional view of an essential part of an embodiment of an electromagnetic wave leakage prevention device according to the present invention.
【図3】電磁波遮蔽板の背部の部分図である。FIG. 3 is a partial view of a back portion of the electromagnetic wave shielding plate.
1 回路基板 2 バネクリップ 3 電磁波遮蔽板 4 取付ボス 11 PDP 12 アルミニウム板 14 フレキシブル基板 15 押さえ具 1 circuit board 2 spring clip 3 electromagnetic wave shielding plate 4 mounting boss 11 PDP 12 aluminum plate 14 flexible substrate 15 retainer
Claims (6)
ラズマディスプレイパネルの駆動回路を搭載した回路基
板を所要の間隔を設けて配設し、プラズマディスプレイ
パネルの外周部に導出された電極と回路基板の外周部に
導出された導体とを複数のフレキシブル基板で接続した
ものにおいて、前記フレキシブル基板の外側に、コ字型
をなし、背部に通風穴を設け、両腕部で前記プラズマデ
ィスプレイパネルおよび回路基板の外面を挟持するよう
にした電磁遮蔽板を設け、電磁遮蔽板を前記回路基板等
のアースに接続してなる電磁波漏洩防止装置。1. A circuit board on which a driving circuit for the plasma display panel is mounted is arranged on the back surface of the plasma display panel with a required space, and the electrodes led to the outer circumference of the plasma display panel and the outer circumference of the circuit board. A plurality of flexible boards connected to the conductor led out to, the outside of the flexible board is U-shaped, ventilation holes are provided on the back, and the outer surface of the plasma display panel and the circuit board is provided on both arms. An electromagnetic wave leakage prevention device provided with an electromagnetic shielding plate for sandwiching the electromagnetic shielding plate and connecting the electromagnetic shielding plate to the ground of the circuit board or the like.
成したものでなる請求項1記載の電磁波漏洩防止装置。2. The electromagnetic wave leakage prevention device according to claim 1, wherein the electromagnetic wave shielding plate has a back portion formed in a mesh shape.
穿設したものでなる請求項1記載の電磁波漏洩防止装
置。3. The electromagnetic wave leakage prevention device according to claim 1, wherein the electromagnetic wave shielding plate has a large number of holes formed in its back.
基板間の隙間に対向する部分を網目状に形成する、若し
くは多数の穴を穿設したものでなる請求項1記載の電磁
波漏洩防止装置。4. The electromagnetic wave leakage prevention device according to claim 1, wherein the electromagnetic wave shielding plate is formed by forming a mesh-like portion at a portion facing the gap between the flexible substrates or by forming a large number of holes.
プレイパネルあるいは回路基板との接続部をそれぞれバ
ネクリップで固定し、各バネクリップを前記電磁波遮蔽
板の両腕部で挟持するようにした請求項1、請求項2、
請求項3または請求項4記載の電磁波漏洩防止装置。5. A flexible printed circuit board, a plasma display panel or a circuit board, wherein each connection portion of the flexible printed circuit board is fixed by a spring clip, and each spring clip is held by both arms of the electromagnetic wave shielding plate. Item 2,
The electromagnetic wave leakage prevention device according to claim 3 or 4.
し状に折曲し、前記電磁波遮蔽板の先端部をバネクリッ
プの折り返し部に差し込んで挟持するようにした請求項
5記載の電磁波漏洩防止装置。6. The electromagnetic wave leakage prevention device according to claim 5, wherein the tip of the spring clip is bent outward so as to be folded back, and the tip of the electromagnetic wave shielding plate is inserted into the folded portion of the spring clip and held. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33152695A JP3493859B2 (en) | 1995-12-20 | 1995-12-20 | Electromagnetic wave leakage prevention device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33152695A JP3493859B2 (en) | 1995-12-20 | 1995-12-20 | Electromagnetic wave leakage prevention device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09171354A true JPH09171354A (en) | 1997-06-30 |
JP3493859B2 JP3493859B2 (en) | 2004-02-03 |
Family
ID=18244647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33152695A Expired - Fee Related JP3493859B2 (en) | 1995-12-20 | 1995-12-20 | Electromagnetic wave leakage prevention device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3493859B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001265242A (en) * | 2000-03-17 | 2001-09-28 | Fujitsu General Ltd | Plasma display panel unit |
WO2004093036A1 (en) | 2003-04-17 | 2004-10-28 | Matsushita Electric Industrial Co. Ltd. | Thin display device and plasma display |
KR100563052B1 (en) * | 2003-10-10 | 2006-03-24 | 삼성에스디아이 주식회사 | Plasma display device |
KR100615175B1 (en) * | 2003-10-15 | 2006-08-25 | 삼성에스디아이 주식회사 | Plasma display apparatus |
KR100696842B1 (en) * | 2005-04-25 | 2007-03-19 | 삼성에스디아이 주식회사 | Plasma display device |
KR100822207B1 (en) * | 2006-11-02 | 2008-04-17 | 삼성에스디아이 주식회사 | Plasma dispaly module, method of adhering plasma display panel to chassis and method of seperating plasma display panel to chassis |
-
1995
- 1995-12-20 JP JP33152695A patent/JP3493859B2/en not_active Expired - Fee Related
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001265242A (en) * | 2000-03-17 | 2001-09-28 | Fujitsu General Ltd | Plasma display panel unit |
JP4500403B2 (en) * | 2000-03-17 | 2010-07-14 | キヤノン株式会社 | Plasma display panel unit |
WO2004093036A1 (en) | 2003-04-17 | 2004-10-28 | Matsushita Electric Industrial Co. Ltd. | Thin display device and plasma display |
EP1615193A1 (en) * | 2003-04-17 | 2006-01-11 | Matsushita Electric Industrial Co., Ltd. | Thin display device and plasma display |
JPWO2004093036A1 (en) * | 2003-04-17 | 2006-07-06 | 松下電器産業株式会社 | Thin display device and plasma display |
EP1615193A4 (en) * | 2003-04-17 | 2008-08-20 | Matsushita Electric Ind Co Ltd | Thin display device and plasma display |
US7684174B2 (en) | 2003-04-17 | 2010-03-23 | Panasonic Corporation | Thin display device and plasma display |
KR100563052B1 (en) * | 2003-10-10 | 2006-03-24 | 삼성에스디아이 주식회사 | Plasma display device |
KR100615175B1 (en) * | 2003-10-15 | 2006-08-25 | 삼성에스디아이 주식회사 | Plasma display apparatus |
KR100696842B1 (en) * | 2005-04-25 | 2007-03-19 | 삼성에스디아이 주식회사 | Plasma display device |
KR100822207B1 (en) * | 2006-11-02 | 2008-04-17 | 삼성에스디아이 주식회사 | Plasma dispaly module, method of adhering plasma display panel to chassis and method of seperating plasma display panel to chassis |
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