KR100696842B1 - Plasma display device - Google Patents

Abstract

The present invention discloses a plasma display device in which, in a circuit board provided behind the chassis base, an installation hole or a groove used to install the circuit board in the chassis is elongated in one direction.

In general, a plurality of mounting holes are formed in the circuit board. In this case, all of the mounting holes are preferably formed long in the same direction, and the lengths of all the mounting holes formed in the same direction are also the same length. desirable.

Description

Plasma display device {Plasma display device}

* Explanation of symbols for the main parts of the drawings

10: panel 11, 13: substrate

20,23,25: heat transfer medium 30: chassis base

33: reinforcement 40: protective plate

50: Tape carrier package (TCP) 51,61: Chip

60: circuit board 165: mounting hole

167: bolt 225: adhesive member

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display device, and more particularly, to a heat radiation and anti-vibration structure of a plasma display device.

Plasma display panels are formed by forming electrodes on two opposing substrates, overlapping them at regular intervals, injecting a discharge gas therein, and sealing the plasma display panel (PDP). Refers to a flat panel display device.

In a plasma display panel, each pixel is represented through discharge in that pixel region. The discharge is performed in the discharge cell space by the voltage applied to the electrode, and generates a plasma or an excited atom in the space. The power required for discharging is partially lost to light, but most of it is converted to heat. Overheating in the panel, in particular partial overheating, can cause thermal expansion deformation of the glass plate, which is the substrate of the panel, and hence stress, which can cause breakage.

On the other hand, the driving circuit connected to the electrodes of the plasma display panel consumes a lot of power to implement the screen. The consumption of power eventually means heat generation, and when the driving circuit is overheated, the life of the circuit element may decrease, and it is easy to cause malfunction in the circuit operation. A circuit malfunction may cause a problem of degrading the screen quality, for example, by causing a discharge to occur even in a pixel portion which should not be discharged. Therefore, an important technical problem is how to effectively dissipate heat generated in an integrated circuit chip portion or other driving circuit of a tape carrier package (TCP) in which heat is concentrated in a plasma display device.

1 and 2 are cross-sectional views illustrating a part of a cross-sectional view of a panel vertically cut out of a panel in a state where a chassis and a panel are combined in a conventional plasma display device. More specifically, Figs. 1 and 2 show the lower part of the section in which the panel is cut vertically.

In order to dissipate the heat of the panel 10 and the driving circuit to the outside, a chassis attached to the back of the panel is usually used. The chassis is typically made by coupling the reinforcement 37 to the plate-shaped chassis base 30. The chassis base 30 may be bent to form a cup or reinforcement 33 by bending the end of the chassis base periphery for reinforcement. The reinforcement 37 or the bent reinforcement 33 at these chassis base peripheral ends are both reinforcement portions of the chassis. On the rear of the chassis, circuits for driving the PDP are distributed on a plurality of substrates and mounted together with a power supply.

Therefore, the chassis supports the panel 10 to reinforce mechanical strength and serves as a base on which the driving circuit is installed, and discharges heat of the panel 10 or the driving circuit into the space. To this end, the chassis base 30 is formed of a metal such as aluminum having excellent thermal conductivity.

A plurality of lead electrodes are formed around the plasma display panel attached to the front of the chassis. The lead-out electrode is formed outside the sealing line, which is a periphery of the panel, to connect a plurality of electrodes such as an address electrode and a sustain electrode formed over the surfaces of the two substrates 11 and 13 constituting the panel with an external driving circuit. Since the driving circuit is usually mounted on the back of the chassis in a state of being installed on a circuit board or the like, in order to transfer the electrical signal of the driving circuit to each of the drawing electrodes, signal transmission means for connecting the drawing electrode and the driving circuit is required.

Examples of the signal transmission means include a tape carrier package (TCP) or a chip on film (COF). They are a kind of package having a signal processing chip 51 on its own, and serve as a medium between the lead electrodes of the panel whose terminal lines are connected to them and the circuit terminals of the circuit board. In the TCP 50 or the like, a group of conductive wires are formed on both sides of the chip 51, so that TCP can be thought of as a signal line composed of a plurality of conductive wire bundles with an emphasis on a flexible and long terminal line.

Signal lines, such as TCP, are flexible and long, and are easy to connect with the electrode terminal of a panel, or the terminal of a circuit board. However, once the connection is made, the flexible signal line, which is convenient at the connection step, is exposed outward around the chassis, which can be a cumbersome obstacle in subsequent processes. For example, the signal line may be damaged by touching other objects during the subsequent process or during movement, or may be broken by dropping the panel itself.

In addition, integrated circuit chips that generate a lot of heat in TCP need to be in surface contact with the metal chassis for heat dissipation. However, since the signal line itself is made of a flexible material, it is difficult to stably heat dissipate by bringing the integrated circuit chip into contact with the chassis without a separate fixing member.

This problem may be solved to some extent by the cover plate 40 installed in a form surrounding the chassis at the chassis reinforcement part 33. The cover plate 40 is coupled to the reinforcement 37 provided at the peripheral end of the chassis or the bent reinforcement 33 by means of bolts or the like, wherein the integrated circuit chip 51 of the TCP 50 is disposed between the cover plate and the chassis. To be fitted. Since the cover plate surrounds the chassis, the signal line such as TCP can be prevented from being exposed to the outside, and the integrated circuit chip of the TCP can be fixed so that the heat radiation and the signal line can be fixed or aligned.

In this structure, as shown, the signal processing driver circuit chip 51 of the TCP 50 is bent at the periphery of the chassis base to form a reinforcement 33 or attach a reinforcement 37, The cover plate 40 is formed to be in thermal contact with each other to release heat. To help the heat dissipation of the chip part, a plate-like thermal conductive medium (23, 25), a gel-like or liquid thermal conductive medium such as a thermal grease is used alone or at the place where the chip part, the chassis reinforcement part, and the chip part and the cover plate touch each other. May be intervened in combination.

However, thermal conductivity between silicon and the like is relatively low between the cover plate and the integrated circuit chip, and a heat transfer medium made of a soft material serving as a buffer material is often used, and heat transfer to the cover plate is not as efficient as heat dissipation to air. In addition, as the cover plate itself is combined, component cost and process cost increase due to the use of the cover plate or the heat transfer medium, and the vibration of the plasma display device such as panel vibration is transmitted to the cover plate to increase the noise. Could cause.

The present invention is to realize a structure that can overcome the problems caused by the heat dissipation of the integrated circuit chip on the signal line, such as TCP, and the vibration, noise caused by the cover plate in the above-described conventional plasma display device, installed around the chassis base It is an object of the present invention to provide a plasma display device having a configuration which can facilitate replacement and reconnection of a circuit board connected to a signal line.

An object of the present invention is to provide a plasma display device having a configuration that enables replacement, repair, and reconnection of a circuit board connected to a signal line even when a part of the signal line such as TCP is fixed around the chassis base.

SUMMARY OF THE INVENTION An object of the present invention is to provide a plasma display device which can facilitate the assembly process by allowing the chassis base circuit board positioning to be flexible.

In order to achieve the above object, the present invention is characterized in that, in a circuit board provided behind the chassis of the plasma display device, an installation hole or a groove used to install the circuit board in the chassis is elongated in one direction.

Usually, a plurality of mounting holes are formed in the circuit board. In this case, all of the mounting holes are preferably formed long in the same direction. In addition, it is preferable that all the formation lengths also become the same length in the installation hole extended in several same direction.

Meanwhile, at least a part of the hole formed to install the circuit board in the chassis base may be formed to be long and open to meet the peripheral boundary to one side to form a deep groove. The circuit board with the mounting holes of the present invention may be the entire circuit board used for the plasma display device, and at least the driving circuit boards connected to the signal lines such as TCP and connected to the signal lines such as TCP, the driving circuit buffer boards, etc. It is preferable to have an installation hole formed long in the installation direction.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

3 is a perspective view seen from the rear side of the plasma display device according to the exemplary embodiment of the present invention.

Referring to FIG. 3, the plasma display device according to the present embodiment includes a plasma display panel including two substrates 11 and 13, a chassis base 30 supporting the panel behind the panel, and a driving circuit mounted on the rear of the chassis base. The circuit board 60 is provided.

On the front substrate 11 of the panel, sustain electrodes having a straight shape parallel to each other are formed horizontally, and address electrodes having a straight shape parallel to each other are formed on the rear substrate 13. The partition wall is positioned in parallel with the address electrode, and a phosphor layer is disposed above the address electrode.

A chassis is installed behind the rear substrate 13. The chassis may be provided with a plate-shaped chassis base 30 and a reinforcing material for preventing warpage or deformation of the chassis. In the present embodiment, the chassis base is once bent backward once around the address electrode and then bent once again to form the stepped reinforcement 33. The TCP 50 integrated circuit chip 51 is in contact with the rear side of the reinforcement part 33 forming the peripheral end of the chassis base.

The chassis base 30 is fixed to the rear surface of the rear substrate 13 with a double-sided tape or the like. The thermal conductive medium 20 is interposed between the chassis base 30 and the rear substrate 13 together with the double-sided tape.

A plurality of circuit boards 60 and a power supply are installed behind the chassis base 30. The circuit board 60 is provided with integrated circuit chips 61 and other electrical and electronic element devices necessary for driving the panel. Circuit boards and other circuit boards are connected with signal lines as necessary.

A plurality of lead electrodes are formed around the plasma display panel attached to the front of the chassis. The lead electrode is formed outside the sealing part along the periphery of the panel to connect a plurality of electrodes such as an address electrode and a sustain electrode formed over the two substrate surfaces of the panel with the driving circuit. On the other hand, a driving circuit connected to the electrodes formed on the panel and driving them is mounted on the rear of the chassis while being installed in a circuit board or the like. In order to transfer an electrical signal of the driving circuit to each of the drawing electrodes, the drawing electrode and the driving circuit are connected by a tape carrier package (TCP) 50 or other signal lines.

Signal lines such as TCP are designed to be flexible, with the middle part extending with a margin of length outside the peripheral ends of the panel and chassis body. That is, the signal lines are connected to predetermined terminals and panel electrode terminals of a circuit board coupled at both ends to the rear of the chassis while bypassing the peripheral edge of the chassis. However, there is no cover plate in the present embodiment that couples the peripheral edge of the chassis with a bolt or the like to hold the integrated circuit chip to fix the signal line and discharge heat generated from the chip. The absence of a cover plate can lead to structural spreading of the panel vibrations, increased noise, and reduced component and operating costs.

However, the flexible signal line can be conveniently used in the connecting step of connecting the electrode terminals of the panel and the circuit board, but once the connection is completed, there is no fixing role of the cover plate, so that the free length portion is not supported. . As a solution to the problem of the cover plate member, a circuit board 60 to which one end of a signal line is connected is provided toward the peripheral end of the chassis, or a TCP integrated circuit chip 51 is provided as a reinforcing part of the peripheral end of the chassis ( 33) is being sought.

Also in this embodiment, the portion of the integrated circuit chip 51 of the TCP is to be adjacent to the end portion in contact with the circuit board 60, and bonded to the reinforcing portion 33 of the chassis base 30 through the adhesive member 225 have. In addition, a circuit board 60 such as an address buffer substrate is disposed adjacent to the upper and lower ends of the chassis base 30. Therefore, both ends of the TCP 50 are connected to and fixed to the panel 10 and the circuit board 60, respectively, and the integrated circuit chip 51 portion is further fixed to the reinforcement portion 33 of the chassis base. Therefore, the probable portion of the TCP 50 protrudes to the outside and is located unsupported while being in contact with an external object, and in some cases, the probability of causing a problem such as being broken is reduced.

In addition, when the adhesive member 225 that stably contacts the integrated circuit chip 51 to the surface of the chassis reinforcement part 33 has excellent thermal conductivity, heat transfer from the integrated circuit chip 51 to the chassis is more smoothly performed. Can be done. For example, as the adhesive member 225, a ceramic material such as alumina (Al ₂ O 3) having excellent thermal conductivity may be mixed with the adhesive.

However, one new problem may arise in the simply mentioned configuration. For example, as shown in FIG. 4, a stepped reinforcement part 33 is formed at a peripheral end of the chassis base 30, and a circuit board 60 such as an address buffer substrate is formed adjacent to the reinforcement part 33. have.

In this configuration, the circuit board 60 is first installed on the chassis base 30 using the boss 35, and then the board side end portion of the TCP 50 is connected to the connection terminal of the circuit board 60. In addition, the integrated circuit chip 51 adjacent to the end of the TCP 50 is firmly fixed to the stepped chassis reinforcement 33 through the adhesive member 225. However, when a part of a circuit element such as a chip 60 on the circuit board 60 is in a bad state or a failure occurs later, it is necessary to remove the existing circuit board 60 and install a new circuit board. To do this, the TCP terminal connected to the existing circuit board must be disconnected, and the existing circuit board must be detached from the boss 35 of the chassis base 30. Subsequently, a new circuit board 60 must be installed in the chassis base 30 via the boss 35 and the end of the TCP 50 must be connected to the connection terminal of the new circuit board 60.

However, in this process, the integrated circuit chip 51 of TCP is fixed to the chassis reinforcement 33 side, and the boundary between the reinforcement 33 of the chassis and the reinforcement 33 side of the circuit board 60 is spaced apart. This very narrow, TCP terminal on the circuit board 60 side connected to the integrated circuit chip 51 protrudes above the circuit board, which prevents the terminal from being detached for replacement of the circuit board 60. The TCP 50 can be bent freely to some extent because the conductive wire is formed on a flexible tape, but it is difficult to bend at a large angle within a narrow range. In addition, since the chassis reinforcement part 33 and the integrated circuit chip 51 and the end portion of the circuit board 60 are adjacent to each other to form a relatively rigid portion, the TCP terminal portion protruding toward the circuit board 60 is connected to the circuit board 60. This can be a more difficult obstacle for replacement.

The above problem is based on the assumption that the integrated circuit chip 51 is bonded to the chassis reinforcement 33 surface after the two ends of the TCP 50 are connected, but the panel side end of the TCP 50 is the electrode of the panel. Connected to the terminal, and the integrated circuit chip 51 is first adhered to the chassis reinforcement 33, and then the other end thereof is already connected to the connection terminal of the circuit board 60 provided behind the chassis base 30 through the boss 35. The same applies to the case where the connection is made.

Therefore, in the present embodiment, the installation hole 165 of the circuit board 60 is provided with the reinforcement part 33 so that the circuit board 60 can be attached and detached in a space far from the reinforcement part 33 around the chassis base 30. Form long enough to get closer to or farther away. First, the installation of the circuit board 60 will be described. The boss 35 associated with the circuit board 60 is formed at a distance from the periphery of the chassis base 30. The circuit board is placed as far as possible from the chassis base reinforcement part 33 and the boss 35 fixing bolt 167 is coupled to the boss 35 through the installation hole 165. Before fully tightening the boss fixing bolt 167, push the circuit board toward the reinforcement part 33 to facilitate connection of the TCP terminal and the circuit terminal (not shown) of the circuit board 60, and tighten the bolt 167 completely. Fix it.

When the circuit board needs to be replaced due to a defective circuit board, the circuit board and the TCP terminal are disconnected. Loosen the boss fixing bolt 167 for a certain period. The circuit board 60 is pulled out as far as possible from the reinforcement 33. Subsequently, necessary repairs are made or the bolts 167 are completely loosened to replace the circuit board. Replacement can be done in accordance with the installation of the circuit board.

As a result, in the present embodiment adopting the installation hole 165 formed long, the circuit board and the reinforcement part 33 are released by releasing the bolt 167 that fixes the circuit board by being fixed to the boss 35 through the installation hole 165. Since the distance between the circuit board and the mounting hole 165 can be adjusted within the length range, the circuit board and the TCP can be easily connected and separated, and the circuit board itself can be easily repaired or replaced.

On the other hand, the mounting hole 165 can be formed in other circuit boards other than the circuit board of the above embodiment so as to be elongated in one direction so as to enable position adjustment. By using such a circuit board, the position between the circuit boards in the rear space of the chassis base 30 can be flexibly adjusted for the convenience of installation or repair work. For example, when the address buffer substrate and the scan buffer substrate partially overlap each other at the ends, one or both of them may be formed to have elongated installation holes in a direction away from each other. Therefore, when installing or replacing, loosening the bolts or screws, moving the substrate away from the substrate, and removing the substrate upward in this state can reduce the problems of breakage and damage between the substrates.

According to the configuration of the present invention, the installation hole of the circuit board can be formed long to flexibly adjust the position of the circuit board during the installation, replacement or repair of the circuit board. Such adjustments can then avoid collisions between the circuit board and the circuit board, the circuit board and the TCP terminal or peripheral fixtures.

According to the present invention, the workability at the time of replacement and repair of the circuit board can be improved, and the breakage and failure of the parts occurring later in the work can be prevented.

Claims (7)

Plasma display panel, A chassis including a chassis base supporting the plasma display panel behind the plasma display panel; A driving circuit unit installed at the rear of the chassis to apply a signal to each electrode terminal of the panel; A plasma display device comprising: a flexible signal line provided to bypass a peripheral end of the chassis to connect the driving circuit unit and each electrode terminal to each other; In the circuit board included in the driving circuit portion, the installation hole or groove is formed so that the hole or groove is penetrated by the bolt and coupled to the boss installed in the chassis, at least a portion of the installation hole or groove is And a plasma display device extending in the direction in which the signal line is installed. The method of claim 1, A portion of the signal line is fixed to the surface of the reinforcement formed around the chassis through an adhesive material, And an end portion of the signal line connected to the circuit board so as to overlap the circuit board in a plane. The method of claim 2, And said adhesive material is a ceramic paste mixed with ceramic powder in an adhesive component. The method of claim 2, The signal line is a tape carrier package (TCP) type having an integrated circuit chip, And the integrated circuit chip portion is fixed to the surface of the reinforcement portion by an adhesive material. The method of claim 1, And the plurality of installation holes or grooves are all formed in the same length in the same direction. The method of claim 2, And the reinforcing part is formed by bending the peripheral end of the chassis base or by attaching a separate member to the peripheral end of the chassis base. The method of claim 2, The signal line is a TCP type having an integrated circuit chip, And one surface of the integrated circuit chip is fixed to the surface of the reinforcement part, and the other surface of the integrated circuit chip is exposed to air.

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