JPH09162539A - Packaging method for semiconductor chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor chip packaging method capable of raising a heating speed for the joined part between a semiconductor chip and a circuit substrate. SOLUTION: When the rear side 202 of a circuit board 20A is heated by a heater block 30, the heat is transmitted to a surface wiring pattern 26 through the medium of an inner-layer wiring pattern 23 etc., too. In the circuit substrate 20A cross section through holes 281A, 282A are formed, and pinlike heating parts 331, 332 to be inserted into them are formed in the heater block 30. Since the metal layer 291 in the cross section through hole 281A and the wiring electrodes 221 on the surface of the circuit substrate 20A connect a surface wiring pattern 21 as a heat transmitting metal layer pattern, heat in the pinlike heating part 331 is transmitted to the joined part between the wiring electrode 221 and a chip electrode 11 through the wiring pattern 21.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a semiconductor chip such as a flip chip on a circuit board. More specifically, the present invention relates to a technique for heating a bonding portion between a circuit board and a semiconductor chip by a heating body that is in contact with the back surface side of the circuit board, in the step of mounting the semiconductor chip on the circuit board.

[0002]

2. Description of the Related Art A process for mounting a flip-chip type semiconductor chip or the like on a circuit board is shown in FIG. 4 in which a part of a wiring pattern 21D is used as a wiring electrode 22D on a front surface side 201D of a circuit board 20D. A resist layer 251D (solder resist) is formed so as to be exposed, and a joint portion between the wiring electrode 22D and the chip electrode 11D of the semiconductor chip 10D is formed on the back surface side 202 of the circuit board 20D.
The heating is performed by the heater block 30D (heating body) brought into contact with D to melt the solder 50D. Here, the substrate guide portion 3 of the heater block 30D
Since the concave portion 321D is formed on the surface of 2D,
The board guide portion 32D is one of the back surface parts of the circuit board 20D.
The chip electrode 1 is contacted with the resist layer 252D while avoiding the region where the electronic component 40D is mounted, and the heat from the heater portion 31D causes the rear surface side 202D of the circuit board 20D to contact the chip electrode 1
It is possible to heat the joint portion between 1D and the wiring electrode 22D.

Although an inner layer wiring pattern 23D is formed over a plurality of layers inside the circuit board 20D, these inner layer wiring patterns 23D are formed on the wiring electrodes 22.
Since it is not connected to D, the heat of the heater block 30D is transmitted from the back surface side of the circuit board 20D through the insulating layer 203D of the circuit board 20D in the thickness direction to the joint portion between the chip electrode 11D and the wiring electrode 22D.

[0004]

However, in the prior art, first, the heater block 30D is only in contact with the rear surface side 202D of the circuit board 20D so as to avoid the mounting area of the electronic component 40D. Since the contact area between the heater block 30D and the circuit board 20D is narrow, there is a problem that the heating rate for the joint portion between the chip electrode 11D and the wiring electrode 22D is slow. Further, since the heat transferred from the heater block 30D is transferred only in the thickness direction of the insulating layer 203D of the circuit board 20D, the heating rate for the joint portion between the chip electrode 11D and the wiring electrode 22D is slow also from this point. There is a problem. Therefore, conventionally, a device for preheating such a portion before joining the chip electrode 11D and the wiring electrode 22D is required.

[0005] In view of the above problems, an object of the present invention is to provide:
In addition to expanding the contact area between the heating element and the circuit board, a new heat transfer path has been added to the joint between the circuit board and the semiconductor chip, which is different from the heat transfer path extending in the thickness direction of the insulating layer of the circuit board. It is to provide a semiconductor chip mounting method capable of increasing the heating rate for the joint portion between the semiconductor chip and the circuit board.

[0006]

In order to solve the above problems, in the method of mounting a semiconductor chip according to the present invention, a metal layer in a through hole formed in a circuit board and a semiconductor chip mounting area on the surface of the circuit board are provided. The front surface side metal layer pattern formed in the above is connected via a heat transfer metal layer pattern, and the front surface contacts the back surface side of the circuit board to form a joint portion between the circuit board and the semiconductor chip. In the heating body to be heated, a pin-shaped heating portion that protrudes from the surface of the heating body and fits into the through hole is configured, and in the step of mounting the semiconductor chip on the circuit board,
In the heating step of heating the junction between the circuit board and the semiconductor chip using the heating element, the metal layer by the pin-shaped heating portion fitted in the through hole, the heat transfer metal layer pattern, And a joint portion between the circuit board and the semiconductor chip is heated via the front surface side metal layer pattern.

In the present invention, it does not matter whether each metal layer pattern (each wiring pattern) is used for wiring connection.

In the present invention, the front surface side metal layer pattern is, for example, a wiring electrode on the side of the circuit board which is joined to a chip electrode of the semiconductor chip.

The front surface side metal layer pattern may be a surface layer wiring pattern formed in a region inside a position where a wiring electrode on the side of the circuit board to be joined to a chip electrode of the semiconductor chip is formed. .

In this case, the back surface side metal layer pattern formed in the area of the back surface side of the circuit board which is in contact with the surface of the heating body is the inner layer wiring pattern passing through the inside of the circuit board, It is preferably connected to the front side metal layer pattern.

In the present invention, the heat transfer metal layer pattern is, for example, a surface wiring pattern extending from the front surface side metal layer pattern to the metal layer in the through hole through the front surface side of the circuit board. Is.

The heat transfer metal layer pattern may be an inner layer wiring pattern that extends from the front side metal layer pattern through the inner layer of the circuit board to the metal layer in the through hole. is there.

In the present invention, it is preferable that a back surface side metal layer pattern formed in a region of the back surface side of the circuit board which is in contact with the surface of the heating body is also connected to the metal layer in the through hole. .

In the present invention, the through-hole may be a normal through-hole, but a cross-section through-hole formed in the thickness direction of the circuit board at the edge of the circuit board may be used.

Further, the through hole may be a hole for positioning the circuit board and the heating body by fitting the pin-shaped heating portion into the through hole.

Further, the through hole is a part of a plurality of tie bar cutting holes for cutting the portion of the circuit board on which the semiconductor chip is mounted from the peripheral region. Good.

In the present invention, when an electronic component is also mounted on the back surface side of the circuit board, the surface of the heating element is placed on the back surface side of the circuit board so as to avoid the mounting area of the electronic component. Will come into contact with.

[0018]

Embodiments of the present invention will be described with reference to the drawings.

[First Embodiment] A semiconductor chip mounting method according to a first embodiment of the present invention will be described with reference to FIG.

FIG. 1A is a process sectional view for explaining the mounting method of this example, and FIG. 1B is an explanatory view showing the structure of a sectional through hole formed in the circuit board used in this example. Is. As shown in FIG. 1A, a surface layer wiring pattern 21 formed of a metal layer pattern (surface side metal layer pattern) is formed on the front surface side 201 of a glass-epoxy or ceramic circuit board 20A, and the surface thereof. On the side, a resist layer 251 (solder resist) is formed, a part of which is exposed as the wiring electrode 221. Also, the circuit board 2
On the front surface side 201 of 0A, a wiring electrode 222 connected to the inner layer wiring pattern 23 formed inside the circuit board 20A.
Is also configured. Here, the semiconductor chip 10 (flip chip) has a chip electrode 11 and a circuit board 20A.
The wiring electrodes 221 and 222 are joined by solder 50.

On the front surface side 201 of the circuit board 20A, not only the surface layer wiring pattern 21 but also the surface layer wiring pattern 26 (in the mounting area of the semiconductor chip 10 inside the position where the wiring electrodes 221 and 222 are formed). A front side metal layer pattern) is formed. In addition, the circuit board 20A is
Since it is a multi-layer substrate, an inner layer wiring pattern 23 and an interlayer wiring pattern 230 (inner layer wiring pattern) that connects these wiring patterns to each other are formed over a plurality of layers inside.

Further, since the circuit board 20A is a double-sided board, not only the surface layer wiring patterns 21 and 26 are formed on the front surface side 201, but also the back surface side wiring pattern 24 (the back surface side metal). Layer pattern) is formed. Of the rear surface side wiring pattern 24, the wiring pattern 241 is covered with a resist layer 252, and the surface mounting type electronic component 40 is soldered to the wiring pattern 242.

To mount the semiconductor chip 10 on the circuit board 20A thus constructed, the semiconductor chip 1
Chip electrode 11 of 0 and wiring electrode 22 of circuit board 20A
It is necessary to heat the joint portion with 1, 222 to melt the solder 50. Therefore, in the step of mounting the semiconductor chip 10 on the circuit board 20A, for the purpose of melting the solder 50, the region on the back surface 202 of the circuit board 20A where the electronic component 40 is mounted is avoided,
A step (heating step) of heating the area in which the wiring pattern 241 covered with the resist layer 252 is formed by the heater block 30 is performed.

In this heating step, as can be seen from FIG. 1A, the heater block 30 (heating body) is brought into contact with the back side 202 of the circuit board 20A to heat the circuit board 20A from the back side 202. Here, since the concave portion 321 is formed on the surface of the board guiding portion 32 of the heater block 30, the board guiding portion 32 covers the area where the electronic component 40 is mounted on the back surface portion of the circuit board 20A. Avoiding contact with the resist layer 252, the heat from the heater section 31 causes
The back side wiring pattern 241 is heated, and the heat is transmitted to the joint portion between the chip electrode 11 and the wiring electrodes 221 and 222. However, the contact area between the heater block 30 and the circuit board 20A is small, and the heat transferred from the heater block 30 is transferred only in the thickness direction of the insulating layer 203 of the circuit board 20A. 222
The heating rate for the joint with is slow.

Therefore, in this example, first, the circuit board 20A
The surface layer wiring pattern 26 formed in a region inside the formation positions of the wiring electrodes 221 and 222 on the front surface side 201 of the inner layer wiring pattern 23 formed inside the circuit board 20A, and these wiring patterns are connected to each other. Are connected through the inter-layer wiring pattern 230. Therefore, when the wiring pattern 241 is heated by the heater block 30, the heat is not only transmitted to the insulating layer 203 of the circuit board 20A in the thickness direction, but also via the inner layer wiring pattern 23 and the interlayer wiring pattern 230. Is also efficiently transmitted to the surface wiring pattern 26, so that the chip electrode 1
The heating rate for the joint portion between 1 and the wiring electrodes 221 and 222 is high.

Further, in this example, as shown in FIG. 1 (b), the circuit board 20A is formed with cross-section through holes 281A, 282A extending in the thickness direction at its edges, while FIG. As can be seen from a), on the heater block 30 side, on the surface (block surface) of the substrate guide portion 32, the cross-section through hole 2 is projected from this surface.
Pin-shaped heating portions 331 and 332 that fit inside 81A and 282A, respectively, are formed. Therefore, the heater block 33 is also connected to the pin-shaped heating portions 331 and 332,
Since the circuit board 20A is in contact with the circuit board 20A, the contact area between the circuit board 20A and the heater block 30 is correspondingly enlarged. Moreover, the metal layer 291 in the cross-section through hole 281A and the wiring electrode 221 on the surface of the circuit board 20A.
Connects the surface wiring pattern 21 as a heat transfer metal layer pattern. Therefore, the cross-section through hole 281
The heat from the pin-shaped heating portion 331 fitted in A is generated by the metal layer 2
91, wiring pattern 2 as metal layer pattern for heat transfer
Through 1 and the wiring electrode 221, the joint portion between the wiring electrode 221 and the chip electrode 11 is efficiently heated. Further, the metal layer 292 in the cross-section through hole 282A and the wiring electrode 222 on the surface of the circuit board 20A connect the inner layer wiring pattern 23 and the interlayer wiring pattern 230 as a heat transfer metal layer pattern. For this reason, the heat from the pin-shaped heating portion 332 fitted in the through-hole 282A in the cross section receives the metal layer 292 and the inner layer wiring pattern 23 and the interlayer wiring pattern 230 as the heat transfer metal layer pattern.
And the bonding portion between the wiring electrode 222 and the chip electrode 11 is efficiently heated via the wiring electrode 222. Therefore,
In this example, there is no need to perform preheating because the heating rate for the joint portion between the chip electrode 11 and the wiring electrodes 221, 222 is high.

Further, in this example, the surface layer wiring pattern 26 formed on the front surface side 201 of the circuit board 20A also includes the metal layers 291 and 292 in the cross-section through holes 281A and 282A.
To the inner layer wiring pattern 23 and the interlayer wiring pattern 230. Furthermore, the circuit board 2
Back side wiring pattern 24 formed on the back side 201 of 0A
No. 1 is also connected to the metal layers 291 and 292 in the through holes 281A and 282A in cross section through the inner layer wiring pattern 23 and the interlayer wiring pattern 230. For this reason, the circuit board 20A is uniformly heated as a whole, so that the joint portion between the chip electrode 11 and the wiring electrodes 221 and 222 has a high heating rate and is not locally heated. Also, there is an advantage that distortion is less likely to occur.

The metal layer pattern (wiring pattern)
Is the wiring electrodes 221, 222 and the wiring pattern 2 on the back surface side.
It does not matter whether or not it is used for wiring connection except for 42.

[Second Embodiment] A semiconductor chip mounting method according to a second embodiment of the present invention will be described with reference to FIG. In the mounting method of the semiconductor chip of this example, the basic structure of the circuit board and the heater block is almost the same as that of the first embodiment, and therefore, the portions having the common functions are designated by the same reference numerals. The detailed description of is omitted.

2A to 2C are process sectional views for explaining the mounting method of this example.

As shown in FIG. 2, the circuit board 2 is also used in this example.
A surface wiring pattern 21 formed of a metal layer pattern (surface side metal layer pattern) is formed on the front surface side 201 of 0B, and a resist layer 251 (solder resist) that exposes a part thereof as a wiring electrode 221 is formed on the front surface side. ) Has been formed. Further, a wiring electrode 222 connected to the inner layer wiring pattern 23 formed inside the circuit board 20B is also formed on the front surface side 201 of the circuit board 20B. Here, the semiconductor chip 10 (flip chip) includes the chip electrode 11 and the wiring electrodes 221 and 2 of the circuit board 20B.
22 and 22 are respectively joined by solder 50.

On the front surface side 201 of the circuit board 20B, wiring electrodes 221 and 22 in the mounting area of the semiconductor chip 10 are provided.
In the area inside the formation position of 2, the surface wiring pattern 2
6 (surface side metal layer pattern) is formed. Also,
Since the circuit board 20B is a multi-layer board, the inner-layer wiring pattern 23 and the inter-layer wiring pattern 23 that connects these wiring patterns to each other are provided inside the circuit board 20B.
0 (inner layer wiring pattern) is formed.

Further, since the circuit board 20B is a double-sided board, the rear surface side wiring pattern 24 is provided on the rear surface side 202.
(Back side metal layer pattern) is formed. Of the rear surface side wiring pattern 24, the wiring pattern 241 is covered with a resist layer 252, and the surface mounting type electronic component 40 is soldered to the wiring pattern 242.

To mount the semiconductor chip 10 on the circuit board 20B thus constructed, the semiconductor chip 1
Chip electrode 11 of 0 and wiring electrode 22 of circuit board 20B
It is necessary to heat the joint portion with 1, 222 to melt the solder 50.

In the heating process therefor, as can be seen from FIG. 2, the back surface side of the circuit board 20B is placed on the heater block 30.
Heating. Here, since the concave portion 321 is formed on the surface of the board guiding portion 32 of the heater block 30, the board guiding portion 32 is located in the area of the back surface of the circuit board 20B where the electronic component 40 is mounted. Avoiding contact with the resist layer 252, the heat from the heater section 31 causes
The back side wiring pattern 241 is heated, and the heat is transmitted to the joint portion between the chip electrode 11 and the wiring electrodes 221 and 222.

For the purpose of efficiently performing such a heating step, the surface wiring pattern 26 formed in the area inside the formation positions of the wiring electrodes 221 and 222 on the front surface side 201 of the circuit board 20B is also used in this example. Circuit board 20
Inner layer wiring pattern 23 formed inside B and interlayer wiring pattern 23 connecting these wiring patterns to each other
It is connected through 0. Therefore, the wiring pattern 24
When 1 is heated by the heater block 30, not only the heat is transmitted through the insulating layer 203 of the circuit board 20B in the thickness direction, but also the surface layer wiring pattern 26 through the inner layer wiring pattern 23 and the interlayer wiring pattern 230. Efficiently transmitted to the tip electrode 11 and the wiring electrodes 221, 2
The heating rate for the joint portion with 22 is high.

Further, in this example, while the through holes 281B and 282B are formed in the circuit board 20B,
On the heater block 30 side, pin-shaped heating portions 331 and 332 are formed on the surface (block surface) of the substrate guiding portion 32 so as to project from the surface and fit into the through holes 281B and 282B, respectively. Therefore, the heater block 33 contacts the circuit board 20B even through the pin-shaped heating units 331 and 332, and accordingly,
The contact area between the circuit board 20B and the heater block 30 is in an enlarged state. Moreover, the metal layer 291 in the through hole 281B and the wiring electrode 22 on the surface of the circuit board 20B are
In No. 1, the surface wiring pattern 21 is connected as a heat transfer metal layer pattern. Therefore, the through hole 281B
The heat from the pin-shaped heating portion 331 fitted inside is the metal layer 29.
1. Wiring pattern 2 as a heat transfer metal layer pattern
Through 1 and the wiring electrode 221, the joint portion between the wiring electrode 221 and the chip electrode 11 is efficiently heated. Further, the metal layer 292 in the through hole 282B and the wiring electrode 222 on the surface of the circuit board 20B are the inner layer wiring pattern 2
3 and the interlayer wiring pattern 230 are connected as a heat transfer metal layer pattern. Therefore, the through hole 28
The heat from the pin-shaped heating portion 332 fitted in 2B passes through the metal layer 292, the inner layer wiring pattern 23 and the interlayer wiring pattern 230 as the heat transfer metal layer pattern, and the wiring electrode 222 through the wiring electrode 222. The joint between the chip electrode 11 and the chip electrode 11 is efficiently heated. Therefore, in this example, the same effect as that of the first example is achieved, such as a high heating rate for the joint portion between the chip electrode 11 and the wiring electrodes 221 and 222.

Further, in this example, the through hole 281 is used.
B and 282B are formed as complete holes, and the pin-shaped heating portions 331 and 332 of the heater block 30 are fitted therein. Therefore, by fitting the pin-shaped heating portions 331 and 332 into the through holes 281B and 282B, the heater block 30 and the circuit board 20B can be positioned. That is, when forming the positioning holes, if only the metal layers 291 and 292 are formed on the inner peripheral surface of the positioning holes, they can be used as the through holes 281B and 282B as they are, so that it is not necessary to open unnecessary holes.

The metal layer pattern (wiring pattern)
Is the wiring electrodes 221, 222 and the wiring pattern 2 on the back surface side.
It does not matter whether or not it is used for wiring connection except for 42.

[Third Embodiment] A semiconductor chip mounting method according to a third embodiment of the present invention will be described with reference to FIG. In the mounting method of the semiconductor chip of this example, the basic structure of the circuit board and the heater block is almost the same as that of the first embodiment, and therefore, the portions having the common functions are designated by the same reference numerals. The detailed description of is omitted.

FIG. 3A is a process cross-sectional view for explaining the mounting method of this example, and FIG. 3B is a process cross-sectional view showing how the tie bar portion of the circuit board is cut after the semiconductor chip is mounted. Is.

As shown in FIG. 3A, also in this example, a surface wiring pattern 21 formed of a metal layer pattern (surface side metal layer pattern) is formed on the surface side 201 of the circuit board 20C, and the surface side thereof is formed. The resist layer 251 (solder resist) that exposes a part thereof as the wiring electrode 221.
Are formed. In addition, the front side 20 of the circuit board 20C
1 also includes a wiring electrode 222 connected to the inner layer wiring pattern 23 formed inside the circuit board 20C. Here, the semiconductor chip 10 (flip chip) is
The chip electrode 11 and the wiring electrode 22 of the circuit board 20C
1 and 222 are respectively joined by solder 50.

On the front surface side 201 of the circuit board 20C, wiring electrodes 221 and 22 in the mounting area of the semiconductor chip 10 are provided.
In the area inside the formation position of 2, the surface wiring pattern 2
6 (surface side metal layer pattern) is formed. Also,
Since the circuit board 20C is a multi-layer board, the inner-layer wiring patterns 23 and the inter-layer wiring patterns 23 that connect these wiring patterns to each other are provided in the inside thereof.
0 (inner layer wiring pattern) is formed.

Furthermore, since the circuit board 20C is a double-sided board, the rear surface side wiring pattern 24 is provided on the rear surface side 202.
(Back side metal layer pattern) is formed. Of the rear surface side wiring pattern 24, the wiring pattern 241 is covered with the resist layer 252, and the wiring pattern 242 has
The surface mount type electronic component 40 is soldered.

To mount the semiconductor chip 10 on the circuit board 20C thus constructed, the semiconductor chip 1
Chip electrode 11 of 0 and wiring electrode 22 of circuit board 20C
It is necessary to heat the joint portion with 1, 222 to melt the solder 50.

In the heating step therefor, as can be seen from FIG. 3A, the back surface side of the circuit board 20C is heated by the heater block 30. Here, the heater block 30
Since the concave portion 321 is formed on the surface of the board guiding portion 32, the board guiding portion 32 is formed on the resist layer 252 while avoiding the area where the electronic component 40 is mounted on the back surface of the circuit board 20C. The back surface side wiring pattern 241 is heated by the heat coming from the heater portion 31 and the heat is transmitted to the joint portion between the chip electrode 11 and the wiring electrodes 221 and 222.

In order to efficiently perform the heating process, the surface wiring pattern 26 formed in the area inside the position where the wiring electrodes 221 and 222 are formed on the front surface side 201 of the circuit board 20C is also used in this example. Circuit board 20
Inner layer wiring pattern 23 formed inside C, and interlayer wiring pattern 23 connecting these wiring patterns to each other
It is connected through 0. Therefore, the wiring pattern 24
When 1 is heated by the heater block 30, not only the heat is transmitted through the insulating layer 203 of the circuit board 20C in the thickness direction, but also the surface layer wiring pattern 26 through the inner layer wiring pattern 23 and the interlayer wiring pattern 230. Efficiently transmitted to the tip electrode 11 and the wiring electrodes 221, 2
The heating rate for the joint portion with 22 is high.

Further, in this example, through holes 281C, 282C ... Are formed in the circuit board 20C so as to surround the region where the semiconductor chip 10 is mounted, and these through holes 281C, 282C. Of the peripheral area 27 for connecting the portion of the circuit board 20 on which the semiconductor chip 10 is mounted to another portion.
1, 272 (tie bar portion). Here, of the through holes 281C, 282C ...
Corresponding to the formation positions of 81C and 282C, through holes 281C and 282C project from the surface (block surface) of the substrate guide portion 32 on the heater block 30 side.
The pin-shaped heating portions 331 and 332 are formed so as to fit inside thereof. Therefore, since the heater block 33 contacts the circuit board 20C even through the pin-shaped heating portions 331 and 332, the contact area between the circuit board 20C and the heater block 30 is expanded by that amount. In addition, the metal layer 291 in the through hole 281C and the wiring electrode 221 on the surface of the circuit board 20C are formed on the surface wiring pattern 2
1 is connected as a heat transfer metal layer pattern. Therefore, the pin-shaped heating portion 3 fitted in the through hole 281C
The heat from 31 efficiently heats the joint portion between the wiring electrode 221 and the chip electrode 11 via the metal layer 291, the wiring pattern 21 as the heat transfer metal layer pattern, and the wiring electrode 221. In addition, the metal layer 292 in the through hole 282C and the wiring electrode 222 on the surface of the circuit board 20C.
Is the inner layer wiring pattern 23 and the interlayer wiring pattern 23.
0 is connected as a heat transfer metal layer pattern. Therefore, the pin-shaped heating portion 3 fitted in the through hole 282C
The heat from 32 passes through the metal layer 292, the inner layer wiring pattern 23 and the interlayer wiring pattern 230 as the heat transfer metal layer pattern, and the wiring electrode 222, and then the wiring electrode 2
The joint portion between 22 and the chip electrode 11 is efficiently heated. Therefore, in this example, the chip electrode 11 and the wiring electrode 22 are
For example, the heating rate for the joint with 1, 222 is high,
The same effect as the first embodiment is obtained.

Further, in this example, the through hole 281 is used.
If the circuit board 20C is cut along C, 282C, ..., As shown in FIG. 3B, only the portion of the circuit board 20 on which the semiconductor chip 10 is mounted is surrounded by the peripheral region 271, It can be separated from 272 (tie bar portion). That is, when forming the holes for cutting the tie bar, if the metal layers 291 and 292 are only formed on the inner peripheral surface of the holes, they can be used as they are as the through holes 281C and 282C, so that it is not necessary to make unnecessary holes.

The metal layer pattern (wiring pattern)
Is the wiring electrodes 221, 222 and the wiring pattern 2 on the back surface side.
It does not matter whether or not it is used for wiring connection except for 42.

(Other Embodiments) In the first to third embodiments, the surface layer wiring pattern 26 formed in the region inside the wiring electrodes 221 and 222 includes the inner layer extension pattern 23 and the heat transfer metal layer pattern. Is connected to the metal layers 291 and 292 in the through hole as the wiring electrode 2
The surface layer wiring pattern extending through the gap between the formation positions of 21, 222 may be used as a heat transfer metal layer pattern so that the surface layer wiring pattern 26 is connected to the metal layers 291 and 292 in the through holes.

[0052]

As described above, in the method of mounting a semiconductor chip according to the present invention, a through hole is formed in the circuit board, and the metal layer in the through hole and the surface side metal layer pattern on the surface of the circuit board are formed. Is connected via a metal layer pattern for heat transfer, and the front surface contacts the back surface side of the circuit board to heat the joint portion between the circuit board and the semiconductor chip. It is characterized in that a pin-shaped heating portion is formed so as to project and fit into the through hole. Therefore, according to the present invention, since the heating element also contacts the circuit board by the pin-shaped heating portion, the contact area between the heating element and the circuit board can be increased accordingly. Moreover, since the wiring electrodes on the surface of the circuit board and the surface wiring pattern are connected to the metal layer in the through holes, the heat from the pin-shaped heating part fitted in the through holes is not applied to the wiring electrodes on the surface of the circuit board or Efficiently transmitted to the surface wiring pattern. Therefore, the heating rate for the joint portion between the semiconductor chip and the circuit board is high.

In the case where the back surface side metal layer pattern formed in the area in contact with the heating body surface on the back surface side of the circuit board is connected to the front surface side metal layer pattern through the inner layer wiring pattern, the circuit board The heat received by the back side is transmitted in the thickness direction of the circuit board even through the inner layer pattern. Therefore, the heating rate for the joint portion between the semiconductor chip and the circuit board is high.

On the back surface side of the circuit board, if the back surface side metal layer pattern formed in the area in contact with the heater block surface is also connected to the metal layer in the through hole, the entire circuit board is Since it is heated, the heating rate for the joint between the semiconductor chip and the circuit board is increased.
Moreover, since it is not locally heated, the circuit board is less likely to be distorted.

Further, when a hole for positioning the circuit board and the heater block or a hole for cutting the tie bar is used as the through hole, it is not necessary to make an unnecessary hole.

[Brief description of the drawings]

1A is a process cross-sectional view showing a semiconductor chip mounting method according to a first embodiment of the present invention, and FIG. 1B is an explanatory view showing a structure of a cross-sectional through hole formed in a circuit board used therein. Is.

FIG. 2 is a process sectional view showing a method of mounting a semiconductor chip according to a second embodiment of the invention.

3A is a process cross-sectional view showing a method for mounting a semiconductor chip according to a third embodiment of the present invention, and FIG. 3B shows a state in which a tie bar portion of a circuit board is cut after mounting the semiconductor chip. FIG.

FIG. 4 is a process sectional view showing a conventional semiconductor chip mounting method.

[Explanation of symbols]

10 ... Semiconductor chip (flip chip) 20A ... Circuit board 21 ... Surface layer wiring pattern (heat transfer metal layer pattern) 23 ... Inner layer wiring pattern (heat transfer metal layer pattern) 24 ... Back surface side wiring pattern (back surface side metal layer pattern) 26 ... Surface layer wiring pattern formed inside the wiring electrode 30 ... Heater block (heating body) 40 ... Electronic component 50 ... Solder 203 ... .. Circuit board insulating layers 221, 222 ... Wiring electrodes 230 ... Interlayer wiring pattern (heat transfer metal layer pattern) 241 ... Backside wiring pattern 242 ... Backside wiring pattern 251, 252 ... Resist layer 271, 272 ... Peripheral region (tie bar portion) 281A, 282A ... Cross-section through hole 281B, 282B ... Ruhoru (positioning holes) 281C, 282C ... through hole (tie bar cutting holes) 291, 292 ... metal layers of the through holes 331 and 332 ... pin-shaped heating unit

Claims (11)

[Claims] 1. A metal layer in a through hole formed in a circuit board and a surface side metal layer pattern formed in a semiconductor chip mounting area on the surface of the circuit board are connected via a heat transfer metal layer pattern. At the same time, the heating member heating the joint between the circuit board and the semiconductor chip by contacting the front surface with the back surface side of the circuit board has a pin shape protruding from the heating body surface and fitted into the through hole. A heating unit is configured, and in the step of mounting the semiconductor chip on the circuit board, in the heating step of heating the joint portion between the circuit board and the semiconductor chip using the heating body, the through Also by the pin-shaped heating portion fitted in the hole, the circuit board and the semiconductor chip are brought into contact with each other via the metal layer, the heat transfer metal layer pattern, and the front surface side metal layer pattern. A semiconductor chip mounting method, which comprises heating the part. 2. The method of mounting a semiconductor chip according to claim 1, wherein the front surface side metal layer pattern is a wiring electrode on the side of the circuit board that is bonded to a chip electrode of the semiconductor chip. 3. The surface wiring pattern according to claim 1, wherein the front surface side metal layer pattern is formed in a region inside a formation position of a wiring electrode on the circuit board side which is joined to a chip electrode of the semiconductor chip. A method of mounting a semiconductor chip, wherein: 4. The back surface side metal layer pattern formed in a region in contact with the heating body surface on the back surface side of the circuit board according to claim 3, wherein an inner layer wiring pattern passing through the inside of the circuit board is interposed. A semiconductor chip mounting method, characterized in that the semiconductor chip is connected to the front side metal layer pattern. 5. The heat transfer metal layer pattern according to claim 1, wherein the heat transfer metal layer pattern is formed on the metal layer in the through hole from the front surface side metal layer pattern through a front surface side of the circuit board. A method for mounting a semiconductor chip, which is a surface layer wiring pattern extended up to. 6. The heat transfer metal layer pattern according to claim 1, wherein the heat transfer metal layer pattern extends from the front surface side metal layer pattern to the metal layer in the through hole through the inside of the circuit board. A method for mounting a semiconductor chip, which is an extended inner layer wiring pattern. 7. The back surface side metal layer pattern formed in a region of the back surface side of the circuit board, which is in contact with the heating body surface, according to any one of claims 1 to 6, wherein: A method of mounting a semiconductor chip, characterized in that the semiconductor chip is connected to a metal layer. 8. The semiconductor according to claim 1, wherein the through hole is a cross-section through hole formed in an edge of the circuit board in a thickness direction of the board. Chip mounting method. 9. The through hole according to claim 1, wherein the pin-shaped heating portion is fitted in the through hole to position the circuit board and the heating body. A method for mounting a semiconductor chip, which is a hole. 10. The tie bar cutting plurality according to claim 1, wherein the through hole is for cutting a portion of the circuit board on which the semiconductor chip is mounted from a peripheral region. A method for mounting a semiconductor chip, wherein the holes are a part of the holes. 11. The electronic component according to any one of claims 1 to 10, wherein an electronic component is mounted on a back surface side of the circuit board, and a surface of the heating body is formed so as to avoid a mounting area of the electronic component. A method for mounting a semiconductor chip, which is in contact with the back surface side of a circuit board.