JPH09148278A - Separate carrier of wafer and separate carrying method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device capable of carrying each wafer to a carry direction by being accurately separated instead of a simple structure. SOLUTION: A plurality of wafers 27 are supported in a stacked condition in liquid 12 by a supporting member 26. The plurality of wafers 27 are ascended by specific quantity by ascending of the supporting member 26, and a sheet of wafer 27 located at the uppermost part is arranged at a location near a wafer face 121. Separate push-out means 29 provided with a contact maker which comes into contact with the uppermost wafer to start is provided. Towards an upper face of the wafer 27 at a water face location, water is sprayed to a location biased from a center thereof by a spray nozzle 60, to thereby turn the wafer 27 to one direction, so that the uppermost wafer 27 is separated from the other wafers 27. Further, water is sprayed from aslant upwardly on the opposite side to the carry direction by a spray nozzle 59, and the uppermost wafer 2 is prevented from floating. The separated wafer 27 is carried to a carry direction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer separating / conveying apparatus and a separating / conveying method for separating and conveying a large number of stacked wafers such as semiconductors one by one.

[0002]

2. Description of the Related Art Generally, a wafer such as a semiconductor is formed by cutting an ingot made of a brittle material such as silicon into a predetermined thickness by a wire saw device. As described above, since a large number of wafers cut and processed by the wire saw device are still stacked, it is necessary to separate these wafers one by one in consideration of workability in the post process. However, since wafers are easily damaged, it is difficult to separate them one by one.

Therefore, as disclosed in, for example, Japanese Patent Laid-Open No. 4-3744, an apparatus in which a large number of wafers are arranged in a liquid state in a liquid state and the wafers are separated one by one in the liquid is conventionally known. Has been proposed by.

That is, in this conventional apparatus, the liquid is stored in the storage container, and a large number of wafers are arranged in the liquid in a stacked state. A movable body is arranged above the wafer in the container so as to be capable of reciprocating in the vertical direction,
A liquid suction port is formed in the center of the lower surface, and a plurality of first liquid ejection ports are formed on the outer edge of the lower surface. A notch for discharging the wafer is formed at the upper end of the container, and a plurality of second liquid ejection ports and a third liquid ejection port facing the notch are formed on the peripheral wall of the container.

When separating the wafers, the moving body is placed close to the upper surface of the stacked wafers. In this state, the liquid is sucked from the liquid suction port and the liquid is jetted from the first liquid jet port, and several wafers are floated from above. After that, the moving body is lifted and several wafers are lifted while being sucked by the moving body.

Then, when several wafers are lifted to a position corresponding to the second liquid ejection port, liquid is ejected from the second liquid ejection port, and several wafers are separated one by one. After that, the uppermost wafer is lifted to the position corresponding to the third liquid ejection port by the rising of the moving body. In this state, the suction of the liquid from the liquid suction port is stopped, the liquid is jetted from the third liquid jet port, and the uppermost wafer is transferred to the outside through the cutout portion of the storage container.

A wafer separating / conveying device as disclosed in JP-A-5-63058 is also known. That is,
This separating / conveying device includes a nozzle system that separates and conveys the wafer located at the top of the stacked wafers from other wafers. This nozzle system has an individualizing nozzle that separates the uppermost wafer from other wafers, and a transfer nozzle that is provided on the individualizing nozzle and that transfers the separated wafer.

Then, water is caused to flow from the individualizing nozzle toward the uppermost two wafers, the uppermost wafer is lifted, and the wafer is conveyed by the water flow from the conveying nozzle.

[0009]

However, in the former wafer separating / conveying apparatus, the vertical movement of the moving body, the suction of the liquid from the liquid suction port, and the suction of the liquid from the first, second, and third liquid jet ports. By jetting the liquid, the wafer is floated, separated, and transported. Therefore, there is a problem that the structure of the device is complicated and the switching control of suction and ejection of the liquid is complicated.

Further, in this conventional wafer separating / conveying apparatus, the liquid is sucked from the liquid suction port and the liquid is jetted from the first, second and third liquid component jet ports in order. ing. Therefore, unless the liquid amount, direction, and timing of suction or injection are set accurately, a large number of liquid flows are generated in different directions in the storage container, and each operation of floating, separating, and carrying the wafer is performed accurately. There was a problem that I could not.

On the other hand, in the latter separating and conveying apparatus, water is caused to flow out from the individualizing nozzle toward the space between the uppermost two wafers, and the uppermost wafer is separated in the traveling direction. There is a problem that it requires force and cannot be separated smoothly. In addition, there is a problem that the remaining wafers may adhere to the separated wafers during the transportation process of the separated wafers and thus cannot be reliably separated.

Further, since the wafers are in close contact with each other in a laminated state, the initial resistance for separating the uppermost stationary wafer from the lower wafer is a static frictional resistance larger than the dynamic frictional resistance. There is a problem that it is difficult to perform a reliable separating operation.

The present invention has been made by paying attention to the problems existing in such conventional techniques. It is an object of the present invention to provide a wafer separating / conveying apparatus and a separating / conveying method which have a simple structure and can surely separate the wafers one by one and convey them in the carry-out direction.

[0014]

In order to achieve the above-mentioned object, in the invention of the wafer separating / conveying device according to claim 1, the separating means separates the wafer by moving it in direct contact with the wafer. And a rotating means for ejecting a fluid obliquely from above to a position deviated from the center of the upper surface of the wafer after starting the wafer to rotate the wafer in one direction and separate it from other wafers. Is.

According to the first aspect of the present invention, the supporting means supports a large number of wafers in a liquid state in a stacked state.
In this state, a large number of wafers are lifted by the lifting of the supporting means, and when one uppermost wafer is arranged near the liquid surface, the wafers are moved by the separating / extruding means. Then, the jetting liquid flow is obliquely applied to the upper surface of the wafer so that the uppermost wafer is rotated in one direction and separated from the other wafers. The separated wafer is transported in one direction by the liquid flow.

According to a second aspect of the present invention, a pressing means for preventing the wafer from being lifted is further provided. According to the second aspect of the present invention, the pressing means can prevent the wafer from rising and reliably separate the wafer.

According to a third aspect of the present invention, in the second aspect of the present invention, the pressing means jets the liquid onto the upper surface of the wafer from an obliquely upper position on the downstream side in the wafer transfer direction.

According to the third aspect of the invention, the floating of the wafer can be prevented without damaging the wafer by injecting the fluid onto the upper surface of the wafer from obliquely above and on the downstream side in the transfer direction of the wafer. .

According to the invention described in claim 4,
In any one of the inventions described above, the supporting means has a supporting surface inclined at a predetermined angle with respect to the horizontal plane so as to be gradually lowered in the carrying direction.

According to the fourth aspect of the invention, the wafer on the supporting means is arranged in a state of being inclined downward in the carrying direction so as to be suitable for carrying. In the invention according to claim 5,
In the invention according to claim 1 or 2, a shooter for guiding a wafer carried by the carrying means is disposed downstream of the supporting means in the carrying direction, and the shooter is provided downstream in the carrying direction. A cassette having a plurality of storage shelves for separately storing the transferred wafers one by one is arranged.

In the fifth aspect of the present invention, one wafer to be transferred is guided and transferred along the shooter, and then individually stored on each storage rack in the cassette. In the invention according to claim 6, in the invention according to claim 5, the shooter is inclined downward toward the downstream side in the transport direction.

In the sixth aspect of the present invention, the wafer is transferred according to the descending inclination of the shooter. According to the invention of claim 7, in the invention of claim 1 or 2, liquid level adjusting means capable of adjusting the liquid surface position is provided.

According to the seventh aspect of the invention, the liquid level adjusting means can change the liquid surface position with respect to the upper surface of the wafer to an appropriate liquid level, and the wafer can be smoothly separated. Claim 8
In the invention described in claim 1, in the invention described in claim 1 or 2, an ultrasonic wave oscillating device for promoting separation of wafers is provided in the liquid.

According to the eighth aspect of the invention, the separation of the wafer is promoted by the ultrasonic oscillator. According to a ninth aspect of the present invention, in the first aspect of the present invention, a pressing means for preventing the wafer from rising is provided.

According to the ninth aspect of the invention, the wafer can be reliably separated while rotating the wafer in one direction and preventing the wafer from rising. According to a tenth aspect of the present invention, in the aspect of the ninth aspect, the pressing means acts in a direction of promoting the rotation of the wafer.

In the tenth aspect of the present invention, the pressing means can prevent the wafer from being lifted up, and can accelerate the rotation of the wafer by the separating means to further ensure the separation. According to the invention of claim 11, in the invention of claim 1 or 2, the separating / extruding means includes a contactor for moving the wafer by contacting the wafer, and the contactor moves from the wafer when retracted by an elevating mechanism. It is held at a separated position.

In the eleventh aspect of the present invention, since the contact of the separating / extruding means is brought into contact with the upper surface of the uppermost one wafer to mechanically move the wafer, the wafer is surely moved. be able to.

According to a twelfth aspect of the present invention, in the invention according to the first or second aspect, the separating / extruding means is provided with a rotor for rollingly contacting the upper surface of the wafer to move the wafer. It is held at a position separated from the upper surface of the wafer by the lifting mechanism.

According to the twelfth aspect of the invention, since the rotor of the separating / extruding means is brought into contact with the upper surface of the uppermost one wafer to move the wafer, the wafer can be reliably moved. .

In the thirteenth aspect of the present invention, a large number of wafers supported in a laminated state in a liquid are raised by a predetermined amount,
When one wafer located at the top reaches the vicinity of the liquid surface, a contactor or a rotor is brought into contact with the topmost wafer to move the wafer, and the wafer is further displaced from the center of the wafer. Liquid is jetted obliquely from above to a position, the wafer is rotated in one direction, the uppermost wafer is separated from other wafers, and the separated wafer is carried in a liquid flow and conveyed in the carry-out direction. is there.

[0031]

BEST MODE FOR CARRYING OUT THE INVENTION

(First Embodiment) Hereinafter, a first embodiment of the present invention will be described in detail with reference to FIGS.

As shown in FIGS. 1 and 2, the water tank 11 is formed in a box shape having an open upper surface, and clean water 12 is contained therein.
Is stored. A partition plate 13 as a liquid level adjusting means is arranged near one side in the water tank 11, and the partition plate 13 defines an overflow chamber 14 on one side in the water tank 11. The water 12 in the water tank 11 overflows into the overflow chamber 14 through the upper end of the partition plate 13, and the water level 121 in the water tank 11 is kept constant.

A plurality of water supply ports 16 are formed at the bottom of the water tank 11, and clean water 12 is supplied from the water supply ports 16 into the water tank 11. The water outlet 17 is formed at the bottom of the overflow chamber 14, and the water 12 in the overflow chamber 14 is discharged to the outside through the water outlet 17. In addition,
A drain port 151 and a drain valve 152 are provided at the bottom of the water tank 11.

Each pair (four in total) of guide rods 18,
19 are erected in the water tank 11 at predetermined intervals. The pair of guide rods 19 located on the wafer unloading direction (overflow chamber 14) side, which will be described later, are
It is formed shorter than the other pair of guide rods 18 located on the opposite side to the carry-out direction so that the upper end thereof is located slightly below the water level 121.

The first lifting device 20 is the guide rod 1
Corresponding to Nos. 8 and 19, they are provided outside the water tank 11, and are provided with a lift plate 21, a screw 22, and a servo motor (not shown) for rotating the screw 22. The mounting plate 23 is the water tank 11
It is suspended from the lower surface of the elevating plate 21 via a pair of suspension rods 24 so as to be placed in water therein, and slidably fitted into the guide rod 18 via a guide boss 25.
The support base 26 is disposed on the upper surface of the mounting plate 23, and has a support surface on the upper surface that is inclined at a predetermined angle (about 2 degrees in the first embodiment) with respect to the horizontal plane so as to gradually lower in the carrying-out direction. 261 is formed.

A large number of disk-shaped wafers 27 made of a brittle material such as silicon are placed on the support surface 261 of the support table 26 so as to be located between the guide rods 18 and 19 in the water in the water tank 11. Are supported in a laminated state. Then, the servo motor of the first elevating device 20 is rotated, so that the support base 26 is moved up and down by the action of the screw 22 via the elevating plate 21 and the hanging rod 24. Then, as the support base 26 is raised, a large number of wafers 27 are moved to the guide rod 1.
The wafer 27 is lifted by a predetermined amount along the lines 8 and 19 and the uppermost one wafer 27 is arranged near the water level 121.

In the first embodiment, the guide rods 18, 19, the first elevating device 20, the suspension rod 24, the mounting plate 23, and the supporting base 26 constitute a supporting means. The first sensor 28 is arranged in the water tank 11 so as to correspond to the wafer 27 at the water surface 121 position, and when the uppermost wafer 27 is raised to the water surface position, a detection signal is output from the first sensor 28. Then, the lifting operation of the first lifting device 20 is stopped.

Next, regarding the separating / extruding means 29 for mechanically temporarily moving the uppermost wafer among the stacked wafers 27 according to FIGS. 3 to 5 in the carrying direction in the initial stage of the operation. explain.

As shown in FIGS. 3 and 4, a bracket 30 is fixed to one of the guide rods 18 by bolts 31, and the horizontal support portion 3 of the bracket 30 is fixed as shown in FIG.
The lower end portion of the support pin 32 is engaged with the engagement hole 302 formed in 01, and the large diameter portion 321 is supported by the support portion 301. A cylindrical rotating cam 34 is supported on the support pin 32 via a one-way clutch 33. First to third cam surfaces 341 to 343 (FIG. 6) described later are formed on the upper surface of the rotary cam 34. A base end portion of a support lever 35 is supported on the upper portion of the support pin 32 so as to be rotatable in a horizontal direction, and an operation protrusion 351 that is vertically moved by the cam surfaces 341 to 343 is provided on a lower surface of the base end of the lever 35. It is formed in two places. The support pin 3
A nut 36 is screwed into the male screw portion 322 formed on the upper end of the lever 2, and a coil-shaped compression spring 37 is interposed between the nut 36 and the upper surface of the support lever 35.
Is always urged downward. A support arm 38 is fastened and fixed to the support lever 35 by bolts 39, and a contact 40 made of a thin leaf spring is fastened and fixed to the tip end of the support arm 38 by bolts.

As shown in FIG. 6, on the upper end surface of the rotary cam 34, a horizontal first cam surface 341, a horizontal second cam surface 342 lower than the cam surface 341, and an inclination continuing from the cam surface 342. Six third cam surfaces 343 are repeatedly formed on the entire circumference. The contact 40 is held above the uppermost wafer 27 in a state where the actuating protrusion 351 of the support lever 35 corresponds to the first cam surface 341.
Further, when the support lever 35 is rotated counterclockwise by about 10 degrees, the operation protrusion 351 falls on the second cam surface 342, and the contact 40 is held at a position lower than the uppermost wafer 27. . Further, the actuating protrusion 351 has the third cam surface 3
When lifted by 43, the contact 40 is separated to a position higher than the uppermost wafer 27.

The support lever 35 is always reciprocally rotated within a range of a predetermined angle (approximately 60 degrees in the first embodiment) in FIG. That is, when the support lever 35 is mounted on the wafer 2
Rotating cam 3 during the rotational movement to mechanically move 7 initially
In a state in which 4 is stopped at a predetermined position by the one-way clutch 33, the operating protrusion 351 sequentially moves on the first to third cam surfaces by the pressing force of the spring 37 or against it,
The wafer 40 is mechanically started by the contactor 40. When the support lever 35 is returned to the original position after the completion of the start-up, the operating protrusion 351 of the lever 35 causes the first cam surface 34 to move.
1 and the third cam surface 342 formed on the boundary of the locking surface 34
The lever 35 is reversely rotated to the retracted position in the state of being locked to the position 4. Therefore, the rotation cam 34 is rotated by a predetermined angle (approximately 60 degrees) by the non-connection state of the one-way clutch 33, and the wafer 27 is prepared for a rotation operation for mechanically starting it.

Since the contactor 40 is composed of a thin leaf spring, when mechanically starting the wafer 27, it is curved in an arc shape as shown by a chain double-dashed line in FIG.
Therefore, if the adhesion of the uppermost wafer 27 to the lower wafer 27 is abnormally large due to some reason such as poor cleaning, the arcuate portion of the contactor 40 passes directly through the upper surface of the wafer 27, and It does not damage the wafer. Further, the contactor 40 is curved in an arc shape, and the horizontal plane below the contactor 40 is in flat contact with the upper surface of the wafer 27, so that the wafer 27 is not damaged when the wafer is started. The contactor 40 may be a flexible or elastic plate such as soft resin or rubber, or a brush-like member other than a leaf spring.

Next, a mechanism for reciprocally rotating the support lever 35 will be described. As shown in FIG. 3, a bracket 41 is fixed to the other side of the guide rod 18 by a bolt 42, and a support shaft 43 is supported by the bracket 41 so as to be rotatable in a vertical plane by a support pin 44. The support pin 44 is clamped and fixed to the support shaft 43 by a set bolt 45. A cylinder 46 is attached to the support shaft 43.
The base end portion of is supported by a connecting pin 47 so as to be rotatable in a horizontal plane. A spherical bearing 49 is attached to the tip of the reciprocating rod 48 of the cylinder 46 as shown in FIG. A support pin 50 is supported downward at the tip of the support lever 35, and a sphere 51 fitted to the pin 50 is supported by the spherical bearing 49.

Therefore, the support arm 38 is arranged at the position shown by the solid line in FIG. 3, and the cylinder 46 is operated while the contact 40 is separated from the wafer 27, and the support lever 35 is centered on the support pin 32 by the rod 48. Is rotated counterclockwise. Then, the support arm 38 is rotated in the same direction, the contact 40 is moved toward the wafer 27, and the wafer 27 is mechanically started. The cylinder 46 is rotatable in the vertical plane, and the tip of the rod 48 and the support lever 35 have a spherical bearing structure.
This is to allow the lifting operation of No. 5 above. In this embodiment, the rotary cam 34, the support lever 35 and the cylinder 4 are
An elevating mechanism for the contactor 40 is constituted by 6 and the like.

The first water jet nozzle 59, which serves as a pressing means for preventing the wafer 27 from being lifted up, is provided with the guide rod 19.
The first water jet nozzle 59 is disposed above the space, and water is jetted obliquely from the upper side of the uppermost wafer 27 on the downstream side in the carrying-out direction to prevent the wafers 27 from floating. To be done. The jet outlet of the first water jet nozzle 59 has a wide shape and extends in the horizontal direction.
It extends in a direction orthogonal to the carrying direction described later, and the jetting angle is about 60 degrees with respect to the upper surface of the wafer 27.

The second water jet nozzle 60, which serves as a rotation means and a transfer means for the wafer 27, is disposed above the guide rods 18, and the jetting of the pressing water from the first water jet nozzle 59 is interrupted. , This second water injection nozzle 6
With 0, water is jetted onto the upper surface of the wafer 27 at the water surface position from obliquely above the upstream side in the carry-out direction. At this time, FIG.
2, the water from the second water jet nozzle 60 is jetted toward the upper surface of the wafer 27 toward a position laterally offset from the center thereof, and the water flow causes the water to flow to the wafer 27 at the uppermost position. A clockwise rotating force and a propelling force in the carry-out direction are applied, and the wafer 27 is reliably separated from the second and subsequent lower wafers 27.

Therefore, this separated wafer 27 is used.
Is reliably transported in the carry-out direction (right side in FIGS. 1 and 2) by the propulsive force of the water flow generated by the water jet from the second water jet nozzle 60. At this time, as shown by the chain line in FIG. 2, with the wafer 27 slightly moved in the carry-out direction,
Between the first wafer 27 and the second wafer 27, a second
Water jetted from the water jet nozzle 60 enters. For this reason,
Buoyancy is generated on the first wafer 27, and the wafer 2
The separating action and the conveying action of 7 are promoted.

The second water jet nozzle 60 has a wide shape and is arranged so as to be inclined with respect to the horizontal plane and the carrying direction, and jets water at an angle of about 30 degrees with respect to the upper surface of the wafer 27. Further, in this embodiment, the separating and pushing means 29 and the second water jet nozzle 60 as the rotating means constitute the separating means 75 for separating the uppermost wafer.

The ultrasonic oscillator 61 is disposed in the water tank 11 at the end opposite to the overflow chamber 14, and the ultrasonic wave is applied to the water 12 in the water tank 11 by the ultrasonic oscillator 61. As a result, longitudinal waves are generated on the water surface 121, the separation action of the wafer 27 is promoted, and the cleaning action for the slurry and the like adhering to the wafer 27 is induced.

The partition wall 74 partitions the water tank 11 in the center thereof. The shooter 62 is fixed to the upper end of the partition wall 74 so as to be located near the water surface 121 in the water, and descends at a predetermined angle (about 2 degrees with respect to the horizontal surface in the first embodiment) toward the downstream side in the carry-out direction. It is inclined. Then, one wafer 27 transferred from the transfer position is guided and guided along the shooter 62 in the carry-out direction. Therefore, this shooter 62 also constitutes a conveying means. Then, the water 12 supplied into the water tank 11 from the water supply port 16 on the first elevating device 20 side flows on the shooter 62 in the transport direction. This water flow becomes a transfer flow, and the transfer action of the wafer 27 is promoted.

The second sensor 63 is disposed at the center of the edge of the shooter 62, and the starting end of the wafer 27 is at the shooter 62.
A detection signal is output from the second sensor 63 when the sheet is conveyed to the top. Then, in response to the detection signal from the second sensor 63, the first elevating device 20 is moved down, and a large number of the wafers 27 on the support table 26 are moved down by a predetermined amount.
The detection signal from the sensor 28 is cleared.

The second elevating device 64 is arranged on the downstream side of the shooter 62 in an inclined state toward the outer side of the water tank 11, and the elevating plate 65, the screw 66 and the screw 66 for rotating the screw 66 are not shown. Equipped with a servo motor. The support plate 67 is suspended from the lower surface of the elevating plate 65 via a pair of suspension rods 68 and a mounting plate 69 so as to be placed in water. The support plate 67 is inclined at a predetermined angle with respect to the horizontal plane so that the upper surface of the support plate 67 gradually lowers in the carry-out direction.

A box-shaped cassette 70 having an open front surface is detachably supported on the support plate 67, and a through hole 71 is formed in the rear surface thereof. The plurality of storage shelves 72 are cassettes 7.
0 are arranged at predetermined intervals in the vertical direction, and the shooter 6
The wafers 27 transferred from above 2 are separately stored on the storage rack 72 one by one. And
Each time the wafers 27 are stored one by one on the storage shelf 72 of the cassette 70, a screw 66 based on the rotation of the servo motor
By the action of the above, by the descending operation of the second elevating device 64, the cassette 70 is lowered by a predetermined amount, and the empty storage rack 72 is arranged at the height position corresponding to the shooter 62. The storage shelf 72 may be horizontal, but is inclined so that the entrance side is high and the inside depth is low so that the stored wafers 27 are prevented from accidentally exiting to the outside due to buoyancy or dynamic pressure of water. Is also good.

The pair of third sensors 73 are arranged on the partition plate 13 in the water tank 11 at predetermined intervals, and are opposed to the storage shelves 72 at the height position for storing the wafers 27. Then, when the wafer 27 transferred from the shooter 62 is stored at a predetermined position on the storage shelf 72, detection signals are output from these third sensors 73 and the water is jetted from the second water jet nozzle 60. While being stopped, the second lifting device 64 is moved down.

Next, the operation of the wafer separating / conveying device having the above-mentioned structure will be described. Since a wire saw device (not shown) simultaneously cuts a brittle material such as silicon into a large number of wafers, a large number of wafers are stacked in the cutting completed state.

In the wafer separating / conveying apparatus of the first embodiment, a large number of wafers 27 cut and processed by a wire saw device or the like are supported on the support base 26 in a laminated state prior to the operation of the apparatus. Then, it is submerged in the liquid 12 in the water tank 11. In addition, the empty cassette 70 is supported on the support plate 67 in the raised position, and the storage shelves 7 at the bottom stage are
2 faces the shooter 62.

When the operation of the device is started in this state,
By the raising operation of the first elevating device 20, a large number of wafers 27 on the support base 26 are raised, and the uppermost one wafer 27 is arranged at the water surface 121 position. At this time,
Water is jetted from the pressing water jet nozzle 59 of the wafer 27 onto the upper surface of the uppermost wafer 27, and the floating of each wafer 27 is prevented.

As described above, when the uppermost wafer 27 is raised to the water surface position, the first sensor 28 outputs a detection signal. Then, based on this detection signal, the raising operation of the first lifting device 20 is stopped, the injection of water from the first water injection nozzle 59 is interrupted, and the cylinder 46 of the separating and extruding means 29 in FIG. When the support lever 35 and the support arm 38 are operated, the support lever 35 and the support arm 38 are rotated counterclockwise around the support pin 32, and a mechanical starting force is applied to the uppermost wafer 27 by the contact 40, so that the transfer direction ( 3) to the right).

Water is jetted from the second water jet nozzle 60 to the wafer 27 at the water surface position to which the starting force is applied. At this time, the water from the jet nozzle 60 is jetted toward the position deviated from the center of the upper surface of the wafer 27 from an obliquely upper side opposite to the carry-out direction. Therefore, the water flow of the jet water imparts a rotational force and a propulsive force to one wafer 27 at the transfer position, and the wafer 27 is reliably separated from the second and subsequent wafers 27. Separation is promoted by the action of the longitudinal wave generated by the ultrasonic oscillator 61.

In addition, when the uppermost wafer 27 is separated and starts to be moved in the carrying direction, the water for separation enters between the uppermost wafer 27 and the lower wafer 27. Therefore, the separating operation is further promoted.

Further, the separated wafer 27 is generated by the propulsive force of the water flow generated by the water jet from the jet nozzle 60 and the water flow from the water supply port 16 flowing on the shooter 62, as shown in FIG. And, it is conveyed through the shooter 62 in the carry-out direction indicated by the arrow in FIG. When the starting end of the wafer 27 reaches the second sensor 63, the second sensor 6
A detection signal is output from 3. Based on this detection signal,
The first elevating device 20 is moved down, a large number of wafers 27 on the support table 26 are moved down by a predetermined amount, and the detection signal from the first sensor 28 is cleared.

Further, the wafer 27 is carried in the carry-out direction from the shooter 62 by the propelling force of the water flow, and is housed in one storage shelf 72 in the cassette 70. When the wafer 27 is transferred, since the support surface 261 of the wafer 27 and the shooter 62 are inclined downward toward the downstream side in the transfer direction, the transfer can be performed smoothly. At this time, when the cassette 70 is tilted in the same direction as the shooter 62 or more, the transferred wafer 27 is smoothly accommodated in the cassette 70.

In this way, when the wafer 27 is stored and arranged at the predetermined position on the storage shelf 72, the detection signal is output from the third sensor 73. Then, based on this detection signal, the injection of water from the second water injection nozzle 60 is stopped and the injection of water from the first water injection nozzle 59 for holding is restarted. At the same time, the second elevating device 64 is lowered, the cassette 70 is lowered by a predetermined amount, and the next empty storage rack 72 is placed at a height position corresponding to the shooter 62. Subsequently, the first lifting device 20 shifts to the lifting operation, and the uppermost wafer 27 is placed at the water surface position detected by the first sensor 28.

After that, the above-mentioned operation of separating and carrying the wafers 27 is repeated, and a large number of wafers 27 are separated one by one from the topmost one in order and carried in the carry-out direction. The storage shelves 72 are separately stored. When all the wafers 27 are stored on the respective storage shelves 72 of the cassette 70,
By the lifting operation of the second lifting device 64, the cassette 70 is lifted from the water in the water tank 11 to the water level 121. Therefore, the cassette 70 can be removed from the support plate 67 and the plurality of wafers 27 can be easily transferred together with the cassette 70 to the next step or the like.

The wafers 27 may be stored in the cassettes 70 individually while the cassettes 70 are being raised. In this case, as compared with the method of storing the wafer while lowering the cassette 70, the cassette 7
It is possible to reduce the ascending / descending stroke of 0, and the wafer unloading operation can be performed quickly. In this case, water may be sprayed onto the wafer raised above the water level 121 from a sprayer (not shown).

As described above, in this separation / conveyance apparatus, since the wafer 27 is first mechanically given a starting force by the separation / extrusion means 29, the separation / conveyance of the wafer 27 is performed in water, so that the friction force is applied. By the surface tension and the surface tension, the wafer 27 having a large separation resistance can be surely started at the time of starting, and the wafer 27 can be surely prevented from being damaged. Also, due to the transfer movement of the wafer 27, the jet flow, etc.
The wafer 27 is washed, and the slurry or the like adhering to the wafer 27 during the cutting process is washed off. Since the wafer 27 is separated by the jet water flow directed in one direction, the structure is simple unlike the conventional device having the complicated structure described above.

In addition, in this separation / conveyance apparatus, the wafer 27 is moved by the jet water flow except when the wafer 27 is separated.
Since it is configured to hold down, it is possible to prevent delusion of the wafers 27 under the surface of the water and reliably separate the wafers one by one.

The cassette 70 descends every time one wafer 27 is accommodated, and the accommodated wafer 27 is submerged in water. Therefore, it is possible to prevent foreign matter from sticking to the surface of the wafer 27 due to drying. (Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIG.

In the water tank 11, a movable mounting plate 81 has a support shaft 82.
Is supported so as to be reciprocally rotatable in a vertical plane. This mounting plate 81 is a U clevis 85 connected to the lower end of a ball screw 84 supported by a mounting case 83 fixed to the water tank 11.
Are connected to each other by a connecting pin 86. Then, when the ball screw 84 is moved up and down by the lifting servo motor 87, the mounting plate 81 is moved up and down. In this embodiment, the movable mounting plate 81, the ball screw 84, the servo motor 87, and the like constitute a lifting mechanism for the rotor 90.

A rotary shaft 88 is provided with a bearing 89 on the mounting plate 81.
Is rotatably supported by the rotor shaft 88.
0 is fitted. Further, a servomotor 91 for a rotor is attached to the mounting plate 81, a drive pulley 92 is fixed to its rotation shaft, and a driven pulley 93 fixed to the rotation shaft 88 and a belt 94 to the drive pulley 92. Is wound.

Therefore, in the second embodiment, the operation of applying the mechanical starting force to the uppermost wafer 27 is as follows.
When the elevation servomotor 87 is activated and the ball screw 84 is lowered, the mounting plate 81 is rotated downward about the support shaft 82, and the rotor 90 is brought into contact with the upper surface of the wafer 27. Next, when the servo motor 91 is activated, the drive pulley 9
2, the rotor 90 is rotated via the belt 94, the driven pulley 93 and the rotary shaft 88, and the wafer 27 is moved in the carrying direction. Next, water is jetted toward the wafer 27 by the above-mentioned second jet nozzle 60, and the wafer 27 is transported in the same manner as in the first embodiment.

In the second embodiment, since the starting force is applied to the wafer 27 by the rotor 90, the wafer can be started reliably, but the other operational effects are the same as those of the first embodiment.

The present invention can be modified and embodied as follows, for example. (1) The wafer 27 is mechanically pressed by the pressing member without spraying water from the first water spray nozzle 59,
It should be constructed so as to prevent the floating of those wafers 27. (2) Omit the ultrasonic oscillator 61. (3) The water discharged from the water discharge port 17 is filtered and supplied again into the water tank 11 via the water supply port 16. (4) Providing a plurality of first water jet nozzles 59 to promote rotation of the wafer 27, and to perform separation and transfer more effectively. (5) A pair of water jet nozzles are configured to jet water in the same direction as the transport direction on both upper sides of the wafer 27. Then, separation is performed without rotating the wafer 27,
To transport. (6) As shown in FIG. 8, the first water jet nozzle 59 is configured to jet water obliquely, and the rotation of the wafer 27 by the second water jet nozzle 60 is promoted. (7) As shown in FIG. 9, while directing the second water jet nozzle 60 straight forward, the pair of first water jet nozzles 5
9 in the opposite direction and so as not to face the nozzle 60. Then, without rotating the wafer 27, the separated water 27 is moved forward as it is, while the floating of the wafer 27 is prevented by the first water jet nozzle 59. The positions of the nozzles 59 and 60 may be arranged above the wafer 27 so that they are close to each other in the left-right direction in FIG. (8) As shown in FIG. 10, the lifting plate 96 and the horizontal moving cylinder 97 support the pushing plate 95 having the locking portion 951 locked to the outer peripheral edge of the uppermost wafer 27. Then, the pushing plate 95 is lowered by the raising and lowering cylinder 96 to bring the lower surface of the leading end thereof into contact with the upper surface of the wafer 27,
The pushing plate 95 is moved forward by the cylinder 97, and the locking portion 9
Locking 51 on the outer peripheral edge of the wafer 27 to apply a starting force to the wafer 27.

In this embodiment as well, a mechanical starting force is applied to the wafer 27, so that the wafer can be reliably started, but the other operational effects are the same as in the first embodiment. (9) As the liquid level adjusting means for adjusting the relative position between the water surface position and the upper surface of the wafer 27, the partition plate 13 can be vertically moved and the guide rods 18 and 19 can be vertically moved. . Then, the upper and lower positions of the partition plate 13 and the guide rods 18 and 19 are changed according to the thickness of the wafer 27, and the wafer 27 is separated in water. In addition,
The uppermost wafer 27 may be completely submerged in water, only the upper surface is exposed from the water surface, or the height of the lower surface of the wafer may be the same as the water level. (10) The first water jet nozzle 59 for preventing floating,
In addition to the intermittent operation as in the first embodiment, the wafer 27
It should be configured to operate appropriately when necessary for separation and transportation of.

Incidentally, the technical idea grasped from each of the embodiments will be described below. 6. The wafer separating / conveying apparatus according to claim 5, further comprising: (a) a sensor on the shooter 62 for detecting that the starting end portion of the wafer has been transferred onto the shooter.

According to this structure, the supporting means for raising the wafer group in the stacked state is lowered by a predetermined amount, and a physical gap can be provided between the uppermost wafer and the wafer immediately below it. Thus, the wafers can be smoothly separated and transferred one by one onto the shooter. (B) The wafer separating / conveying apparatus according to claim 1 or 2, wherein the pressing means sprays water in a wide width onto the upper surface of the wafer from obliquely above the downstream side in the wafer conveying direction.

According to this structure, the floating of the wafer can be effectively prevented, and the jet pressure to the wafer can be averaged to prevent the wafer from being damaged. (C) The wafer separating / conveying apparatus according to claim 1 or 2, further comprising a pressing means for preventing the wafer from being lifted at a time other than the time of separating the wafer. According to this structure, the lifting of the wafer can be prevented by the same means even when the wafer is not separated.

[0078]

Since the present invention is constructed as described above, it has the following effects. According to the first and thirteenth aspects of the present invention, the structure is simple, and while the uppermost wafer is being rotated, the wafers can be reliably separated one by one from the other wafers and transferred in the carry-out direction. it can.

According to the second aspect of the present invention, it is possible to prevent the wafer from being lifted up at the time of separating the wafers and to reliably separate the wafers one by one. According to the third aspect of the present invention, it is possible to prevent the floating of the wafer while preventing damage to the wafer.

According to the fourth aspect of the invention, the wafer can be separated and transported more reliably according to the descending inclination. According to the fifth aspect of the present invention, the wafer can be smoothly guided and transported along the shooter, and the wafer can be easily stored separately on each storage rack in the cassette. it can.

According to the sixth aspect of the invention, the wafer on the shooter can be transported smoothly. According to the invention of claim 7, the liquid level adjusting means can change the liquid surface position with respect to the upper surface of the wafer to an appropriate liquid level, and the wafer can be smoothly separated.

According to the eighth aspect of the invention, the separation of the wafer can be promoted by the ultrasonic oscillator. According to the invention as set forth in claim 9, the wafer can be rotated and prevented from being lifted up, so that the wafer can be reliably separated.

According to the tenth aspect of the present invention, it is possible to prevent the floating of the wafer and accelerate the rotation of the wafer so that the separation can be performed more reliably. Claim 11
According to the inventions described in (12) and (12), since the wafer is mechanically started, the wafer can be surely started.

[Brief description of the drawings]

FIG. 1 is a vertical cross-sectional view showing a first embodiment of a wafer separation and transfer apparatus.

FIG. 2 is a plan sectional view of the wafer separation and transfer device.

FIG. 3 is a partially cutaway plan view of a wafer separating / extruding unit.

FIG. 4 is a partially omitted front view of a wafer separating / extruding unit.

5 is a cross-sectional view taken along line 1-1 of FIG.

FIG. 6 is an exploded perspective view of a rotating cam and a support lever.

FIG. 7 is a perspective view showing a second embodiment of a wafer separation / transfer device.

FIG. 8 is a partial plan view showing another embodiment of a wafer separation / conveyance apparatus.

FIG. 9 is a partial plan view showing another embodiment of a wafer separation and transfer apparatus.

FIG. 10 is a partial side view showing another embodiment of the wafer separation and transfer apparatus.

[Explanation of symbols]

11 ... Water tank, 12 ... Water, 121 ... Water surface, 13 ... Partition plate as liquid level adjusting means, 20 ... First elevating device, 26 ... Support base as supporting means, 261 ... Support surface, 27 ... Wafer,
29 ... Separation / extrusion means, 59 ... First jet nozzle as pressing means, 60 ... Second water jet nozzle as rotating means and conveying means, 62 ... Shooter, 64 ... Second lifting device, 67
... Support plate, 70 ... Cassette, 72 ... Storage rack, 75 ... Separation means constituted by the separation push-out means 29 and the second water jet nozzle 60.

Claims (13)

[Claims] 1. A support means for supporting a large number of wafers in a liquid state in a stacked state and raising a group of these wafers in a stacked state, and to the upper surface of the uppermost wafer which is elevated at the liquid level position. In a wafer transfer device comprising a separating means for injecting a fluid to separate the uppermost wafer from other wafers, and a transfer means for transferring the separated wafer in a carry-out direction using a liquid flow, The separating means ejects a fluid from an obliquely upper position to a position deviated from the center of the upper surface of the wafer after starting the separation / extruding means for moving the wafer in direct contact with the separating / extruding means to move the wafer. A wafer separating / conveying device comprising a rotating means for rotating the wafer in a predetermined direction to separate the wafer from other wafers. 2. A support means for supporting a large number of wafers in a liquid state in a stacked state and raising the wafer group in the stacked state, and to the upper surface of the uppermost wafer that is elevated to the liquid surface position. In a wafer transfer device comprising a separating means for injecting a fluid to separate the uppermost wafer from other wafers, and a transfer means for transferring the separated wafer in a carry-out direction using a liquid flow, The separation means is a wafer separation / conveyance apparatus including a separation / extrusion means for moving the wafer in direct contact with the wafer, and a pressing means for preventing the wafer from floating. 3. The wafer separating / conveying apparatus according to claim 2, wherein the pressing unit ejects the liquid onto the upper surface of the wafer from obliquely above the downstream side in the wafer conveying direction. 4. The wafer separating / conveying apparatus according to claim 1, wherein the supporting means has a supporting surface inclined at a predetermined angle with respect to a horizontal plane so as to be gradually lowered in the conveying direction. . 5. A shooter for guiding a wafer carried by the carrying means is disposed downstream of the carrying means in the carrying direction, and one wafer is carried downstream of the shooter in the carrying direction. 3. The wafer separating / conveying apparatus according to claim 1, wherein a cassette having a plurality of storage shelves for separately storing the plurality of wafers is arranged. 6. The wafer separating / conveying apparatus according to claim 5, wherein the shooter is inclined downward toward the downstream side in the conveying direction. 7. The wafer separating / conveying apparatus according to claim 1, further comprising liquid level adjusting means capable of adjusting the liquid surface position. 8. The wafer separating / conveying apparatus according to claim 1, further comprising an ultrasonic wave oscillating device for promoting separation of the wafer in the liquid. 9. The wafer separating / conveying apparatus according to claim 1, further comprising a pressing means for preventing the floating of the wafer. 10. The wafer separating / conveying apparatus according to claim 9, wherein the pressing means acts in a direction to promote rotation of the wafer. 11. The separating / extruding means is provided with a contactor for moving the wafer in contact with the wafer, and the contactor is held at a position separated from the wafer by the elevating mechanism when retracted. Item 3. The wafer separation / conveyance apparatus according to Item 2. 12. The separating / extruding means includes a rotor for rollingly contacting the upper surface of the wafer to move the wafer, and the rotor is held at a position separated from the upper surface of the wafer by an elevating mechanism. The wafer separating / conveying device according to claim 1 or 2. 13. A plurality of wafers supported in a stacked state in a liquid are raised by a predetermined amount, and when one wafer located at the top reaches the vicinity of the liquid surface, it contacts the top wafer. A wafer or a rotor is brought into contact with the wafer, the wafer is moved, and liquid is jetted obliquely from above to a position deviated from the center of the wafer to rotate the wafer in one direction and move the uppermost wafer to another. Separating and separating the wafer from the wafer, and separating and transferring the separated wafer on the liquid flow in the carry-out direction.