JP3150888B2 - Wafer separation / transport apparatus and separation / transfer method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for separating and transferring a plurality of stacked wafers such as semiconductors one by one.

[0002]

2. Description of the Related Art Generally, a wafer such as a semiconductor is formed by cutting an ingot made of a brittle material such as silicon into a predetermined thickness using, for example, a wire saw device. As described above, since a large number of wafers cut by the wire saw apparatus are still stacked, it is necessary to separate the wafers one by one in consideration of workability in a later process. However, since the wafer is easily broken, it is difficult to separate the wafers one by one.

For this reason, as disclosed in, for example, Japanese Patent Application Laid-Open No. 4-3744, an apparatus in which a large number of wafers are arranged in a liquid in a stacked state and the wafers are separated one by one in this liquid has been known. Has been proposed.

That is, in this conventional apparatus, a liquid is stored in a storage container, and a large number of wafers are arranged in the liquid in a stacked state. A moving body is arranged in the container above the wafer so as to be able to reciprocate up and down,
A liquid suction port is formed at the center of the lower surface, and a plurality of first liquid ejection ports are formed at the outer edge of the lower surface. A cutout portion for discharging the wafer is formed at the upper end of the storage container, and a plurality of second liquid injection openings and a third liquid injection opening facing the cutout portion are formed on the peripheral wall of the storage container.

[0005] When the wafer is separated, the moving body is placed close to the upper surface of the stacked wafers. In this state, the liquid is sucked from the liquid suction port, and the liquid is jetted from the first liquid jet port, so that several wafers from above are floated. Thereafter, the moving body is raised, and several wafers are lifted while being sucked by the moving body.

When several wafers are raised to a position corresponding to the second liquid ejection port, liquid is ejected from the second liquid ejection port, and several wafers are separated one by one. After that, the uppermost wafer is raised to a position corresponding to the third liquid ejection port by raising the moving body. In this state, while the suction of the liquid from the liquid suction port is stopped, the liquid is jetted from the third liquid ejection port, and the uppermost wafer is transported outward through the cutout portion of the storage container.

There is also known a wafer separation and transfer device as disclosed in Japanese Patent Application Laid-Open No. 5-63058. That is,
This separation and transfer device includes a nozzle system for separating and transferring a wafer located at the top of the stacked wafers from other wafers. This nozzle system has an individualizing nozzle for separating the uppermost wafer from other wafers, and a transfer nozzle provided thereon for transferring the separated wafer.

Then, water is caused to flow out from the individualizing nozzle toward the space between the uppermost two wafers, the uppermost wafer is lifted, and the wafer is transported by the water flow from the transport nozzle.

[0009]

However, in the former device for separating and carrying a wafer, the moving body is moved up and down, the liquid is sucked from the liquid suction port, and the liquid is transferred from the first, second and third liquid jet ports. The liquid is ejected so that the wafer floats, separates, and conveys. Therefore, there is a problem that the structure of the apparatus is complicated and switching control of suction and ejection of the liquid is complicated.

In this conventional wafer separation and transfer apparatus, suction of liquid from the liquid suction port and injection of liquid from the first, second, and third liquid injection ports are performed in order. ing. For this reason, unless the liquid amount, direction, and timing of suction or ejection are set accurately, a large number of liquid flows are generated in different directions in the storage container, and each operation of floating, separating, and transporting the wafer is performed accurately. There was a problem that it was not possible.

On the other hand, in the latter separation and transfer device, water is caused to flow out of the individualizing nozzle toward the space between the two uppermost wafers, and the uppermost wafer is separated in the traveling direction. There was a problem that power was required and smooth separation was not possible. In addition, in the process of transporting the separated wafers, there is a problem that the remaining wafers may adhere to the separated wafers and may not be reliably separated.

Further, since the wafers are in close contact with each other in a stacked state, the initial resistance at which the uppermost stationary wafer is separated from the lower wafer is a static friction resistance that is larger than the dynamic friction resistance. There is a problem that it is difficult to perform a reliable separation operation.

The present invention has been made by paying attention to such problems existing in the prior art. It is an object of the present invention to provide a wafer separating and transferring apparatus and a separating and transferring method which have a simple structure and can surely separate wafers one by one and transfer the wafers in an unloading direction.

[0014]

According to a first aspect of the present invention, there is provided a wafer separating / transporting apparatus according to the first aspect, wherein the separating means directly contacts the wafer and moves the wafer. Extruding means and the separating and extruding means
After the wafer has been started, with respect to the upper surface of the 該U Movement consists in a position offset from the center by ejecting fluid from an oblique upward, rotating the wafer in one direction, and rotating means for separating from other wafer Things.

According to the first aspect of the invention, a large number of wafers are supported in a stacked state in the liquid by the support means.
In this state, a number of wafers is raised by the increase of the support means, the one wafer to the uppermost is positioned near the liquid surface, the wafer is startup by separating extrusion means. Thereafter, the jet flow is applied obliquely to the upper surface of the wafer, and the uppermost wafer is separated from other wafers while rotating in one direction. The separated wafer is transferred in one direction by the liquid flow.

According to the second aspect of the present invention, the wafer is
Liquid from the obliquely upper downstream side of the transfer direction
It is provided with holding means for injecting a body to prevent the wafer from floating. In the invention of claim 2, the wafer
The lifting of c is prevented by the obliqueness of the downstream side in the wafer transfer direction.
By injecting fluid from above into the upper surface of the wafer
This can be performed without damaging the wafer .

[0017]

[0018]

According to the third aspect of the present invention, the first aspect or the first aspect
In the invention described in Item 2, the support means has a support surface that is inclined at a predetermined angle with respect to a horizontal plane so as to gradually decrease in a transport direction. Claim 3
In this case, the wafer on the support means is suitable for transport.
Are arranged in a state of being inclined downward in the transport direction.

[0020] 請 in the invention described in Motomeko 4, in the invention described in claim 1 or claim 2, downstream of the conveying direction of the support means, chute for guiding the wafer being transported by the transport means And a cassette having a plurality of storage shelves for storing the transferred wafers one by one in a downstream direction in the transfer direction of the chute. According to the fourth aspect of the present invention, one conveyed wafer
After being guided and transported along the chute,
Are individually stored on each of the storage shelves.

[0021] In the invention described in 請 Motomeko 5, in the invention described in claim 4, wherein the chute are those that are inclined downward toward the downstream side in the transport direction. The invention of claim 5
In, the wafer is transported according to the descending inclination of the shooter
Is done.

[0022] In the invention of 請 Motomeko 6, in the invention described in claim 1 or claim 2, in which the liquid surface position is provided an adjustable liquid level adjusting means. In the invention of claim 6,
The liquid level position with respect to the upper surface of the wafer is adjusted by the liquid level adjusting means.
The liquid level can be changed to an appropriate level, and the wafer can be separated smoothly.
it can.

[0023] In the invention 請 Motomeko 7, in the invention described in claim 1 or claim 2, in the liquid, those having an ultrasonic oscillation device to facilitate separation of the wafer. Claim 7
In the invention, the separation of the wafer by the ultrasonic oscillation device is performed.
Is promoted.

[0024] In the invention 請 Motomeko 8, in the invention described in claim 1, is provided with a pressing means for preventing floating of the wafer. In the invention of claim 8, the wafer
Rotate c in one direction and lift wafer
Wafer separation while preventing
You.

[0025] In the invention 請 Motomeko 9, in the invention described in claim 8, wherein the pressing means is one that acts in a direction to facilitate the rotation of the wafer. According to the ninth aspect of the present invention,
Means to prevent the wafer from lifting and to separate
By means of rotation of the wafer to further ensure separation
Can be

[0026] In the invention 請 Motomeko 10, in the invention of claim 1 or claim 2, wherein the separating extrusion means comprises a contactor to move the wafer in contact with the wafer, the contact by the lift mechanism During retreat, it is held at a position separated from the wafer. In the invention according to claim 10, the uppermost part
The separation and extrusion means contacts the upper surface of one wafer located at
Since the wafer is mechanically moved by the contact of the contactor,
The wafer can be reliably started.

[0027]

According to an eleventh aspect of the present invention, in the first or the second aspect of the present invention, the separating / extruding means includes a rotor for rollingly contacting the upper surface of the wafer to move the wafer, and the rotor is It is held at a position separated from the upper surface of the wafer by a lifting mechanism. In the invention of claim 11,
Separate extrusion hand for upper surface of one wafer located at the top
The rotor of the stage is contacted to ensure that the wafer is started.
Can be.

[0029]

In the twelfth aspect of the present invention, a number of wafers supported in a stacked state in the liquid are raised by a predetermined amount,
When one wafer to the uppermost reaches near the liquid surface, the contacting the contact or rotor relative to the top of the wafer, to startup the wafer, further, offset from the center of the wafer Injecting liquid from obliquely above to the separated position, separating the top wafer from other wafers while rotating the wafer in one direction, and transporting the separated wafer in the liquid flow in the unloading direction It is.

[0031]

BEST MODE FOR CARRYING OUT THE INVENTION

(First Embodiment) Hereinafter, a first embodiment of the present invention will be described in detail with reference to FIGS.

As shown in FIGS. 1 and 2, the water tank 11 is formed in a box shape having an open upper surface, and a clean water 12 is provided therein.
Is stored. A partition plate 13 serving as a liquid level adjusting means is disposed near one side in the water tank 11, and the partition plate 13 defines an overflow chamber 14 on one side in the water tank 11. The water 12 in the water tank 11 overflows into the overflow chamber 14 through the upper end of the partition plate 13, and the water level 121 in the water tank 11 is kept constant.

A plurality of water supply ports 16 are formed at the bottom of the water tank 11, and the clean water 12 is supplied from the water supply ports 16 into the water tank 11. The water outlet 17 is formed at the bottom of the overflow chamber 14, and the water 12 in the overflow chamber 14 is discharged to the outside through the water outlet 17. In addition,
A drain port 151 and a drain valve 152 are provided at the bottom of the water tank 11.

Each pair (four in total) of the guide rods 18,
Reference numeral 19 stands upright in the water tank 11 at predetermined intervals. Then, a pair of guide rods 19 located on the side of the unloading direction (overflow chamber 14) of the wafer 27 described later is
The upper end is formed shorter than the other pair of guide rods 18 located on the opposite side to the unloading direction so that the upper end is located slightly below the water level 121.

The first lifting device 20 is provided with the guide rod 1
A lifting / lowering plate 21, a screw 22, and a servomotor (not shown) for rotating the screw 22 are provided outside the water tank 11 corresponding to the positions 8 and 19. The mounting plate 23 is a water tank 11
It is suspended from the lower surface of the elevating plate 21 via a pair of suspension rods 24 and is slidably fitted to the guide rod 18 via a guide boss 25 so as to be disposed in the water inside.
The support base 26 is disposed on the upper surface of the mounting plate 23 and has a support surface inclined at a predetermined angle (about 2 degrees in the first embodiment) with respect to a horizontal plane so as to gradually lower in the carrying-out direction. 261 are formed.

A large number of disk-shaped wafers 27 made of a brittle material such as silicon are placed on the support surface 261 of the support 26 so as to be located between the guide rods 18 and 19 in the water in the water tank 11. Is supported in a laminated state. Then, when the servo motor of the first lifting device 20 is rotated, the support 26 is raised and lowered via the lifting plate 21 and the suspension rod 24 by the action of the screw 22. Then, a large number of wafers 27 are moved by the support
The wafer 27 is raised by a predetermined amount along the lines 8 and 19, and the uppermost wafer 27 is placed near the water level 121.

In the first embodiment, support means is constituted by the guide rods 18, 19, the first lifting / lowering device 20, the suspension rod 24, the mounting plate 23 and the support 26. The first sensor 28 is disposed in the water tank 11 so as to correspond to the wafer 27 at the water surface 121, and outputs a detection signal from the first sensor 28 when the uppermost wafer 27 is raised to the water surface position. Then, the lifting operation of the first lifting device 20 is stopped.

Next, in the initial stage of the operation of transferring the uppermost wafer among the stacked wafers 27 shown in FIGS. 3 to 5, the separating / extruding means 29 for temporarily moving the wafer mechanically in the transfer direction will be described. explain.

As shown in FIGS. 3 and 4, a bracket 30 is fixed to one guide rod 18 by bolts 31. As shown in FIG.
A lower end portion of the support pin 32 is engaged with the engagement hole 302 formed in the support portion 301, and the large diameter portion 321 is supported by the support portion 301. A cylindrical rotating cam 34 is supported on the support pin 32 via a one-way clutch 33. On the upper surface of the rotary cam 34, first to third cam surfaces 341 to 343 (FIG. 6) to be described later are formed. A base end of a support lever 35 is supported on the upper part of the support pin 32 so as to be rotatable in the horizontal direction. An operation protrusion 351 that is moved up and down by the cam surfaces 341 to 343 is provided on a base lower surface of the lever 35. It is formed in two places. The support pin 3
A nut 36 is screwed into a male screw portion 322 formed at the upper end of the support lever 35, and a coil-shaped compression spring 37 is interposed between the nut 36 and the upper surface of the support lever 35.
Is constantly urged downward. A support arm 38 is fastened and fixed to the support lever 35 by a bolt 39, and a contact 40 made of a thin leaf spring is fastened and fixed to a tip end of the support arm 38 by a bolt.

As shown in FIG. 6, the upper end surface of the rotary cam 34 has a horizontal first cam surface 341, a horizontal second cam surface 342 lower than the cam surface 341, and an inclined surface following the cam surface 342. Six third cam surfaces 343 are formed repeatedly around the entire circumference. When the operation projection 351 of the support lever 35 corresponds to the first cam surface 341, the contact 40 is held above the uppermost wafer 27.
When the support lever 35 is rotated counterclockwise by about 10 degrees, the operation protrusion 351 falls into the second cam surface 342, and the contact 40 is held at a position lower than the uppermost wafer 27. . Further, the operation protrusion 351 is connected to the third cam surface 3.
When lifted by 43, the contact 40 is separated to a position higher than the uppermost wafer 27.

The support lever 35 is always reciprocated within a predetermined angle range (approximately 60 degrees in the first embodiment) in FIG. That is, the support lever 35 is
7 during the rotation operation for mechanically initial moving the rotary cam 3
4 is stopped at a predetermined position by the one-way clutch 33, the operating projection 351 sequentially moves on the first to third cam surfaces by or against the pressing force of the spring 37,
The wafer 27 is mechanically started by the contact 40. At the time of the rotation operation for returning the support lever 35 to the original position after the start is completed, the operation projection 351 of the lever 35 is moved to the first cam surface 34.
Locking surface 34 formed at the boundary between first and third cam surfaces 342
The lever 35 is reversely rotated to the retracted position in a state where the lever 35 is locked. Therefore, the rotating cam 34 is rotated by a predetermined angle (approximately 60 degrees) due to the non-connection state of the one-way clutch 33, and is ready for a rotating operation for mechanically starting the wafer 27 next.

Since the contact 40 is formed of a thin leaf spring, when the wafer 27 is started mechanically, it is curved in an arc as shown by a two-dot chain line in FIG.
Therefore, if the adhesion of the uppermost wafer 27 to the lower wafer 27 is abnormally large due to some reason such as poor cleaning or the like, the arc-shaped portion of the contact 40 passes through the upper surface of the wafer 27, and There is no damage to the wafer. Further, the contact 40 is curved in an arc shape, and the horizontal surface below the contact 40 is in flat contact with the upper surface of the wafer 27, so that the wafer 27 is not damaged when the wafer is started. The contact 40 may be a flexible or elastic plate such as a soft resin or rubber other than a plate spring, or may be a brush.

Next, a mechanism for reciprocating the support lever 35 will be described. As shown in FIG. 3, a bracket 41 is fixed to the other end of the guide rod 18 by bolts 42, and a support shaft 43 is supported on the bracket 41 by a support pin 44 so as to be rotatable in a vertical plane. The support pin 44 is fixedly fastened to the support shaft 43 by a set bolt 45. The support shaft 43 includes a cylinder 46.
Is supported by a connecting pin 47 so as to be rotatable in a horizontal plane. A spherical bearing 49 is attached to the tip of a reciprocating rod 48 of the cylinder 46 as shown in FIG. A support pin 50 is supported downward at the tip of the support lever 35, and a spherical body 51 fitted to the pin 50 is supported by the spherical bearing 49.

Accordingly, the support arm 38 is arranged at the position indicated by the solid line in FIG. 3, and the cylinder 46 is operated while the contact 40 is separated from the wafer 27, and the support lever 35 is centered on the support pin 32 by the rod 48. Is rotated counterclockwise. Then, the support arm 38 is rotated in the same direction, the contact 40 is moved toward the wafer 27, and the wafer 27 is mechanically started. The cylinder 46 is rotatable in a vertical plane, and the distal end of the rod 48 and the support lever 35 have a spherical bearing structure.
This is for allowing the up-and-down operation of No. 5. In this embodiment, the rotary cam 34, the support lever 35, and the cylinder 4
The lifting mechanism of the contact 40 is constituted by 6 and the like.

The first water injection nozzle 59 as a holding means for preventing the wafer 27 from floating is provided with a guide rod 19.
The first water jet nozzle 59 sprays water from the upper oblique upper part of the uppermost wafer 27 at an obliquely downstream side in the unloading direction, thereby preventing each wafer 27 from being lifted up. Is done. The outlet of the first water injection nozzle 59 has a wide shape and extends in the horizontal direction.
It extends in a direction orthogonal to a transfer direction described later, and the ejection angle is about 60 degrees with respect to the upper surface of the wafer 27.

A second water injection nozzle 60 as a rotating means and a transfer means for the wafer 27 is disposed above the space between the guide rods 18 and in a state where the injection of the holding water from the first water injection nozzle 59 is interrupted. The second water injection nozzle 6
Due to 0, water is sprayed obliquely upward on the upstream side in the unloading direction onto the upper surface of the wafer 27 at the water surface position. At this time, FIG.
As shown in FIG. 2, the water from the second water spray nozzle 60 is sprayed toward the upper surface of the wafer 27 toward a position laterally deviated from the center of the wafer 27, and the water flow causes the water to flow to the uppermost wafer 27 in FIG. Is applied in the clockwise direction and the driving force in the unloading direction, and the wafer 27 is reliably separated from the second and subsequent lower wafers 27.

Therefore, the separated one wafer 27
Is reliably transported in the carry-out direction (to the right in FIGS. 1 and 2) by the propulsive force of the water flow generated by the water jet from the second water jet nozzle 60. At this time, as shown by a chain line in FIG. 2, with the wafer 27 slightly moved in the unloading direction,
The second wafer 27 between the first wafer 27 and the second wafer 27
Water injected from the water injection nozzle 60 enters. For this reason,
Buoyancy is generated in the first wafer 27, and the wafer 2
7 is promoted.

The second water jet nozzle 60 has a wide shape, is arranged so as to be inclined with respect to the horizontal plane and the transport direction, and jets water at an angle of about 30 degrees with respect to the upper surface of the wafer 27. In this embodiment, a separating means 75 for separating the uppermost wafer is constituted by the separating and pushing means 29 and the second water injection nozzle 60 as a rotating means.

The ultrasonic oscillator 61 is disposed in the water tank 11 at the end opposite to the overflow chamber 14, and the ultrasonic oscillator 61 applies ultrasonic vibration to the water 12 in the water tank 11. As a result, a longitudinal wave is generated on the water surface 121, which promotes the separating action of the wafer 27 and also causes the washing action on the slurry and the like adhering to the wafer 27.

The partition wall 74 partitions the water tank 11 at its center. The shooter 62 is fixed to the upper end of the partition wall 74 so as to be located near the water surface 121 in the water, and descends at a predetermined angle (about 2 degrees with respect to the horizontal plane in the first embodiment) toward the downstream side in the unloading direction. It is inclined. Then, one wafer 27 transferred from the transfer position is guided and guided along the shooter 62 in the unloading direction. Therefore, the shooter 62 also constitutes a transport unit. Then, the water 12 supplied into the water tank 11 from the water supply port 16 on the first lifting device 20 side flows on the chute 62 in the transport direction. This water flow becomes a transfer flow, and the transfer operation of the wafer 27 is promoted.

The second sensor 63 is disposed at the center of the edge of the shooter 62, and the starting end of the wafer 27 is
When transported up, a detection signal is output from the second sensor 63. Then, in response to the detection signal from the second sensor 63, the first lifting / lowering device 20 is moved down to lower a number of wafers 27 on the support 26 by a predetermined amount.
The detection signal from the sensor 28 is cleared.

The second lifting / lowering device 64 is disposed at an angle to the outside of the water tank 11 so as to be located on the downstream side of the chute 62, and is not shown for rotating the lifting / lowering plate 65, the screw 66 and the screw 66. It has a servo motor. The support plate 67 is suspended from the lower surface of the elevating plate 65 via a pair of suspension rods 68 and a mounting plate 69 so as to be placed underwater. The support plate 67 is inclined at a predetermined angle with respect to the horizontal plane so that the upper surface thereof becomes gradually lower in the carry-out direction.

A box-shaped cassette 70 having an open front surface is detachably supported on the support plate 67, and a through hole 71 is formed in the rear surface. The plurality of storage shelves 72 are cassettes 7
0, and are arranged at predetermined intervals in the vertical direction.
The wafers 27 transported from above are stored one by one on the storage shelf 72. And
Each time the wafers 27 are stored one by one on the storage shelf 72 of the cassette 70, a screw 66 based on the rotation of the servomotor is used.
The cassette 70 is lowered by a predetermined amount by the lowering operation of the second lifting / lowering device 64 by the action of the above, and the empty storage shelf 72 is arranged at the height position corresponding to the chute 62. Although the storage shelf 72 may be horizontal, the storage shelf 72 is inclined so that the entrance side is high and the inside depth is low so that the stored wafers 27 are prevented from erroneously coming out due to buoyancy or dynamic pressure of water. Is also good.

A pair of third sensors 73 are arranged at predetermined intervals on the partition plate 13 in the water tank 11, and are arranged opposite to the storage shelf 72 at the height position for storing the wafers 27. When the wafer 27 conveyed from the shooter 62 is stored at a predetermined position on the storage shelf 72, a detection signal is output from these third sensors 73, and the water is injected from the second water injection nozzle 60. At the same time, the second lifting / lowering device 64 is moved down.

Next, the operation of the wafer separating / transporting apparatus having the above-described structure will be described. Now, a wire saw device (not shown) cuts a brittle material such as silicon into a large number of wafers at the same time, so that a large number of wafers are stacked in a cut-off state.

In the wafer separating and transferring apparatus according to the first embodiment, prior to the operation of the apparatus, a large number of wafers 27 cut by a wire saw device or the like are supported on a support 26 in a stacked state. Then, it is submerged in the liquid 12 in the water tank 11. Further, the empty cassette 70 is supported on the support plate 67 at the raised position, and the lowermost storage shelf 7
2 faces the shooter 62.

In this state, when the operation of the apparatus is started,
By the ascending operation of the first elevating device 20, a large number of wafers 27 on the support base 26 are elevated, and one wafer 27 located at the uppermost position is arranged at the position of the water surface 121. At this time,
Water is sprayed from the pressing water spray nozzle 59 for the wafer 27 onto the upper surface of the uppermost wafer 27, thereby preventing each wafer 27 from floating.

As described above, when the uppermost wafer 27 is raised to the water surface position, the first sensor 28 outputs a detection signal. Then, based on this detection signal, the raising operation of the first lifting device 20 is stopped, the water injection from the first water injection nozzle 59 is interrupted, and the cylinder 46 of the separating and pushing means 29 in FIG. In operation, the support lever 35 and the support arm 38 are rotated counterclockwise around the support pin 32, and the contact 40 applies a mechanical starting force to the uppermost wafer 27, thereby causing the wafer 40 to move in the transport direction ( (To the right in FIG. 3).

Water is sprayed from the second water spray nozzle 60 to the wafer 27 at the water surface position to which the starting force has been applied. At this time, the water from the spray nozzle 60 is sprayed onto the upper surface of the wafer 27 from a diagonally upper side opposite to the unloading direction toward a position deviated from the center. Accordingly, a rotational force and a propulsive force are applied to one of the wafers 27 at the transfer position by the water flow of the jet water, and the wafer 27 is surely separated from the second and subsequent wafers 27. The action of the longitudinal wave generated by the ultrasonic oscillator 61 promotes the separation.

In addition, when the uppermost wafer 27 is separated and starts to move in the transport direction, the jetting water for separation enters between the uppermost wafer 27 and the lower wafer 27. Therefore, the separating operation is further promoted.

Further, the separated wafer 27 is formed by the water flow from the water supply port 16 flowing over the chute 62 and the water flow from the water supply port 16 flowing on the chute 62 by the propulsive force of the water flow generated by the injection of the water from the injection nozzle 60. The sheet is conveyed via the shooter 62 in the unloading direction indicated by the arrow in FIG. When the start end of the wafer 27 reaches the second sensor 63, the second sensor 6
3 outputs a detection signal. Based on this detection signal,
The first elevating device 20 is lowered, and a number of wafers 27 on the support 26 are lowered by a predetermined amount, and the detection signal from the first sensor 28 is cleared.

Further, the wafer 27 is transferred from the shooter 62 in the unloading direction by the propulsive force of the water flow or the like, and is stored on one storage shelf 72 in the cassette 70. When the wafer 27 is transferred, the support surface 261 of the wafer 27 and the shooter 62 are inclined downward toward the downstream side in the transfer direction, so that the transfer can be performed smoothly. At this time, when the cassette 70 is tilted in the same direction as the shooter 62 or more, the transferred wafer 27 is smoothly accommodated in the cassette 70.

When the wafer 27 is stored at a predetermined position on the storage shelf 72, a detection signal is output from the third sensor 73. Then, based on this detection signal, the injection of water from the second water injection nozzle 60 is stopped, and the injection of water from the first water injection nozzle 59 for holding is restarted. At the same time, the second elevating device 64 is lowered, the cassette 70 is lowered by a predetermined amount, and the next empty storage shelf 72 is arranged at a height position corresponding to the shooter 62. Subsequently, the first elevating device 20 shifts to the ascending operation, and the uppermost wafer 27 is placed at the water surface position detected by the first sensor 28.

Thereafter, the above-described separation and transfer operations of the wafers 27 are repeatedly performed, and a large number of wafers 27 are sequentially separated one by one from the uppermost one and transferred in the unloading direction. Are individually stored on the storage shelf 72 of the storage device. Then, when all the wafers 27 are stored on each storage shelf 72 of the cassette 70,
The cassette 70 is raised from the water in the water tank 11 to the water level 121 by the raising operation of the second lifting device 64. Therefore, the cassette 70 can be removed from the support plate 67, and the plurality of wafers 27 can be easily transferred together with the cassette 70 to the next step or the like.

The storage of the wafers 27 in the cassette 70 described above may be performed individually while raising the cassette 70. In this case, as compared with the method of storing the wafer while lowering the cassette 70 described above, the cassette 7
0 can be reduced, and the wafer unloading operation can be performed quickly. In this case, water may be sprayed on the wafer raised above the water level 121 from a sprayer (not shown).

As described above, in this separation and transfer apparatus, the wafer 27 is first mechanically given a starting force by the separation and extrusion means 29, and then the separation and transfer of the wafer 27 are performed in water. In addition, the wafer 27 at the time of starting having a large separation resistance can be reliably started due to the surface tension and the surface tension, and the damage of the wafer 27 can be reliably prevented. In addition, due to the transfer movement of the wafer 27 or the jet water flow,
The wafer 27 is cleaned, and the slurry and the like adhered to the wafer 27 at the time of cutting are washed away. Since the separation of the wafer 27 is performed by the jet water flowing in one direction, the configuration is simple unlike the above-described conventional apparatus having a complicated configuration.

Further, in this separation and transfer device, when the wafer 27 is not separated, the jet water flow causes the wafer 27 to be separated.
Is held down, so that the wafer 27 under the water surface can be prevented from being perturbed, and the wafers 27 can be reliably separated one by one.

The cassette 70 is lowered each time one wafer 27 is stored, and the stored wafers 27 are submerged in water. For this reason, sticking of foreign matter due to drying of the surface of the wafer 27 can be prevented. (Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIG.

In the water tank 11, a movable mounting plate 81 is provided with a support shaft 82.
, So as to be able to reciprocate in a vertical plane. The mounting plate 81 is a U clevis 85 connected to the lower end of a ball screw 84 supported by a mounting case 83 fixed to the water tank 11.
Are connected to each other by connecting pins 86. When the ball screw 84 is moved up and down by the lifting servomotor 87, the mounting plate 81 is moved up and down. In this embodiment, the movable mounting plate 81, the ball screw 84, the servomotor 87, and the like constitute an elevating mechanism of the rotor 90.

A rotating shaft 88 is mounted on the mounting plate 81 with a bearing 89.
, And is rotatably supported by the rotor 9.
0 is fitted. A servomotor 91 for a rotor is mounted on the mounting plate 81, and a driving pulley 92 is fixed to a rotating shaft thereof. A driven pulley 93 fixed to the rotating shaft 88 and a belt 94 are mounted on the driving pulley 92. Is wound.

Therefore, in the second embodiment, the operation of applying a mechanical starting force to the uppermost wafer 27 is first performed.
When the elevation servomotor 87 is activated and the ball screw 84 is lowered, the mounting plate 81 is rotated downward about the support shaft 82, and the rotator 90 contacts the upper surface of the wafer 27. Next, when the servo motor 91 is started, the drive pulley 9
2. The rotator 90 is rotated via the belt 94, the driven pulley 93, and the rotating shaft 88, and the wafer 27 is moved in the transfer direction. Next, water is sprayed toward the wafer 27 by the above-described second spray nozzle 60, and the wafer 27 is transported in the same manner as in the first embodiment.

In the second embodiment, since the starting force is applied to the wafer 27 by the rotor 90, the starting of the wafer can be surely performed. However, other operational effects are the same as those of the first embodiment.

The present invention can be embodied with the following modifications, for example. (1) Without pressing the water from the first water injection nozzle 59, the pressing member mechanically presses the wafer 27,
The wafer 27 is configured to be prevented from floating. (2) The ultrasonic oscillator 61 is omitted. (3) The water discharged from the water discharge port 17 is filtered and supplied again into the water tank 11 through the water supply port 16. (4) A plurality of first water injection nozzles 59 are provided to promote rotation of the wafer 27 and to perform separation and transfer more effectively. (5) A pair of water jet nozzles are configured to jet water to both upper sides of the wafer 27 in the same direction as the transfer direction. Then, without rotating the wafer 27, separation and
To be transported. (6) As shown in FIG. 8, the first water injection nozzle 59 is configured to inject water in an oblique direction and to facilitate rotation of the wafer 27 by the second water injection nozzle 60. (7) As shown in FIG. 9, the second water injection nozzle 60 is directed straight forward, and the pair of first water injection nozzles 5
9 is arranged in the opposite direction so as not to face the nozzle 60. Then, without rotating the wafer 27, the separated wafer 27 is moved forward as it is while preventing the wafer 27 from being lifted by the first water injection nozzle 59. Note that the nozzles 59 and 60 may be arranged above the wafer 27 so as to approach each other in the left-right direction in FIG. (8) As shown in FIG. 10, the pushing plate 95 having the locking portion 951 locked to the outer peripheral edge of the uppermost wafer 27 is supported by the lifting cylinder 96 and the horizontal moving cylinder 97. Then, after the push plate 95 is lowered by the lifting cylinder 96 to contact the lower surface of the tip portion with the upper surface of the wafer 27,
The push plate 95 is advanced by the cylinder 97 so that
Locking 51 on the outer peripheral edge of wafer 27 to apply a starting force to wafer 27.

In this embodiment, a mechanical starting force is applied to the wafer 27, so that the wafer can be started reliably. However, other effects are the same as those of the first embodiment. (9) As the liquid level adjusting means for adjusting the relative position between the water surface position and the upper surface of the wafer 27, the partition plate 13 is configured to be movable up and down, and the guide rods 18 and 19 are configured to be movable up and down. . Then, the vertical position of the partition plate 13 and the guide rods 18 and 19 is changed according to the thickness of the wafer 27 to separate the wafer 27 in water. In addition,
The uppermost wafer 27 may be completely submerged in water, only the upper surface may be exposed from the water surface, or the height of the lower surface of the wafer may match the water level. (10) The first water injection nozzle 59 for preventing floating is
In addition to the intermittent operation as in the first embodiment, the wafer 27
To be operated as needed when necessary for separation and transportation of paper.

Incidentally, the technical ideas grasped from the above embodiments will be described below. (A) A sensor is provided on the shooter 62 for detecting that the start end of the wafer has been transferred to the shooter.
Wafer separating and conveying apparatus according to 4.

According to this structure, the supporting means for raising the wafer group in the stacked state is lowered by a predetermined amount, and a physical gap can be provided between the uppermost wafer and the wafer immediately below it. Thus, the wafers can be smoothly separated and transported one by one onto the chute. 3. The wafer separation and transfer apparatus according to claim 1, wherein the pressing means sprays water in a wide shape from a diagonally upper portion on the downstream side in the wafer transfer direction toward the upper surface of the wafer.

With this configuration, it is possible to effectively prevent the wafer from being lifted, and to equalize the injection pressure on the wafer to prevent the wafer from being damaged. 3. The wafer separation and transfer apparatus according to claim 1, further comprising a holding means for preventing the wafer from lifting when the wafer is not separated. According to this configuration, the lifting of the wafer can be prevented by the same means even when the wafer is not separated.

[0078]

The present invention is configured as described above, and has the following effects. Claim 1 and Claim
According to the invention described in Item 12 , the structure is simple, and it is possible to reliably separate the wafers one by one from other wafers and transfer them in the unloading direction while rotating the uppermost wafer.

According to the second aspect of the present invention, it is possible to prevent the wafer from being lifted at the time of separating the wafers and to surely separate the wafers one by one . Moreover, the floating of the wafer
It is possible to prevent lifting while preventing wafer damage.
it can.

According to the third aspect of the present invention, the separation and transfer of the wafer can be more reliably performed according to the downward inclination. According to the fourth aspect of the present invention, the wafers can be smoothly guided and transported along the chute, and the wafers can be easily sorted and stored one by one on each storage shelf in the cassette. it can.

According to the fifth aspect of the present invention, the wafer on the shooter can be smoothly transferred. According to the sixth aspect of the present invention, the liquid level adjusting means can change the liquid level position with respect to the upper surface of the wafer to an appropriate liquid level, and the wafer can be separated smoothly.

According to the seventh aspect of the present invention, the separation of the wafer can be promoted by the ultrasonic oscillator. According to the eighth aspect of the present invention, it is possible to rotate the wafer and prevent the wafer from being lifted, so that the wafer can be reliably separated.

According to the ninth aspect of the present invention, it is possible to prevent the wafer from being lifted, and to promote the rotation of the wafer to more reliably perform the separation. According to the invention described in claim 10及<br/> beauty 11, since the wafer is mechanically moved can Rukoto surely to start the wafer.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a first embodiment of a wafer separation and transfer device.

FIG. 2 is a plan sectional view of the wafer separation and transfer device.

FIG. 3 is a partially broken plan view of a wafer separating and pushing means.

FIG. 4 is a partially omitted front view of a wafer separating and pushing means.

FIG. 5 is a sectional view taken along line 1-1 of FIG. 4;

FIG. 6 is an exploded perspective view of a rotating cam and a support lever.

FIG. 7 is a perspective view showing a second embodiment of a wafer separation and transfer device.

FIG. 8 is a partial plan view showing another embodiment of the wafer separation and transfer device.

FIG. 9 is a partial plan view showing another embodiment of the wafer separation and transfer device.

FIG. 10 is a partial side view showing another embodiment of the wafer separation and transfer device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 11 ... water tank, 12 ... water, 121 ... water surface, 13 ... partition board as liquid level adjustment means, 20 ... 1st raising / lowering apparatus, 26 ... support stand as a support means, 261 ... support surface, 27 ... wafer,
29: Separating / extruding means, 59: First injection nozzle as holding means, 60: Second water injection nozzle as rotating means and conveying means, 62 ... Shooter, 64 ... Second elevating device, 67
... Support plate, 70 ... Cassette, 72 ... Storage shelf, 75 ... Separation means constituted by the separation and extrusion means 29 and the second water injection nozzle 60.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-5-63058 (JP, A) JP-A-2-25028 (JP, A) JP-A-4-3744 (JP, A) 31236 (JP, U) Actually open 1953-77584 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/304 611 B23P 19/00 302 B65H 3/00 H01L 21 / 68

Claims (12)

(57) [Claims] 1. A fluid with a large number of wafers supported in a stacked state, a support means for raising their wafer group remains in a stacked state, the top which is raised disposed on the liquid surface position upper teeth the other In a wafer transfer device, comprising: a separation unit that separates the separated wafer from the wafer; and a transfer unit that transfers the separated wafer in the unloading direction by using a liquid flow, wherein the separation unit directly contacts the wafer and a separation pushing means for moving a wafer by the separation pushing means
After being started, with respect to the upper surface of the 該U Movement, by injecting a fluid from an oblique upward position offset from the center, in which the wafer is rotated in one direction consisting of a rotating means for separating from other wafer A wafer separation and transfer device. 2. A fluid with a large number of wafers supported in a stacked state, a support means for raising their wafer group remains in a stacked state, the top which is raised disposed on the liquid surface position upper teeth the other In a wafer transfer device, comprising: a separation unit that separates the separated wafer from the wafer; and a transfer unit that transfers the separated wafer in the unloading direction by using a liquid flow, wherein the separation unit directly contacts the wafer and And a separating / extruding means for moving the wafer.
A wafer separating and transferring apparatus provided with a holding means for ejecting liquid to prevent the wafer from floating. 3. The apparatus according to claim 1, wherein the supporting means is arranged in a next direction in the conveying direction.
First, tilt at a predetermined angle with respect to the horizontal plane so that
3. The separation of a wafer according to claim 1, wherein the wafer has an inclined support surface.
Transport device. 4. A transporting means downstream of the supporting means in the transporting direction.
Shoe for guiding a wafer conveyed by the transfer means
The chute is placed downstream of the chute in the conveyance direction.
To store separated wafers one by one
The cassette according to claim 1 or 2, wherein a cassette having a storage shelf is arranged.
3. The wafer separation and transfer device according to 2. 5. The shooter moves downstream in the transport direction.
5. The separation and transfer of a wafer according to claim 4, wherein the wafer is inclined downward.
Feeder. 6. A liquid level adjusting means capable of adjusting the liquid level position.
3. The separation and transfer of the wafer according to claim 1 or 2, wherein
Feeder. 7. A supersonic wave which promotes wafer separation in a liquid.
3. The wafer according to claim 1, further comprising a wave oscillating device.
C separating and conveying equipment. 8. A holding hand for preventing lifting of a wafer.
2. The apparatus according to claim 1, further comprising a step. 9. The holding means promotes rotation of the wafer.
9. The wafer according to claim 8, which acts in a different direction.
Separation transfer device. 10. The separating and pushing means contacts a wafer.
A contact for moving the wafer, wherein the contact is a lifting mechanism
Is held at a position away from the wafer when retracted
3. The separation of a wafer according to claim 1 or 2, wherein
Transport device. 11. The separating and extruding means rolls on the upper surface of the wafer.
A rotator for moving the wafer by dynamic contact, wherein the rotator
Is held at a position separated from the upper surface of the wafer by the lifting mechanism.
3. The wafer according to claim 1 or claim 2,
Separation transfer device. 12. A multi-layer supported in a liquid in a laminated state.
The number of wafers by a predetermined amount, and
When one wafer reaches the liquid level, the uppermost wafer
The wafer is started by bringing the contactor or rotor into contact with c.
And tilted to a position offset from the center of the wafer.
Spray the liquid from above and do not rotate the wafer in one direction.
Then, the top wafer is separated from other wafers,
The wafer that is transported in the unloading direction with the separated wafer
EHA separation and transportation method.