JPH09142970A - Formation of glass coating layer - Google Patents

Formation of glass coating layer

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Publication number
JPH09142970A
JPH09142970A JP29510295A JP29510295A JPH09142970A JP H09142970 A JPH09142970 A JP H09142970A JP 29510295 A JP29510295 A JP 29510295A JP 29510295 A JP29510295 A JP 29510295A JP H09142970 A JPH09142970 A JP H09142970A
Authority
JP
Japan
Prior art keywords
glass
coating layer
firing
glass coating
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP29510295A
Other languages
Japanese (ja)
Inventor
Koji Uchida
浩次 内田
Yoshinori Shinohara
義典 篠原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP29510295A priority Critical patent/JPH09142970A/en
Publication of JPH09142970A publication Critical patent/JPH09142970A/en
Withdrawn legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To form a glass coating layer uniformly with high accuracy at a low cost by forming an Al film on the surface of an insulating substrate to be formed with the glass coating layer, then immersing and arranging this substrate together with a counter electrode into a dispersion of the fine powder of glass, impressing a DC voltage between the electrode and the Al film to form an electrodeposited layer of the fine powder of the glass on the Al film, then firing the layer. SOLUTION: The Al film is formed by a sputtering method and its thickness is specified to 5 to 100nm. The dispersion of the fine powder of the glass is formed by dispersing the glass having 1.0 to 4.0μm average grain size at a ratio of 0.075 to 0.25wt.% into a dispersion medium. The dispersion medium prepd. by adding water at 2.0 to 5.0vol.% to an org. solvent, such as isopropyl alcohol, is used. The DC voltage is specified to 400 to 600V. Firing is executed by holding for the prescribed time at a temp. lower than the m.p. of the Al in an oxidizing atmosphere, then heating up to a temp. above the softening point of the glass. For example, the temp. is held at 580 to 650 deg.C for 3 to 5 hours in a first firing stage and is heated up to 1100 to 1250 deg.C and is then lowered down to room temp. in a second firing stage.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、ガラス被覆層の形
成方法に係り、特に、絶縁基板の表面に所望の機能性を
付与するためのガラス被覆層を容易かつ均一に形成する
方法に関する。
TECHNICAL FIELD The present invention relates to a method for forming a glass coating layer, and more particularly to a method for easily and uniformly forming a glass coating layer for imparting desired functionality to the surface of an insulating substrate.

【0002】[0002]

【従来の技術】従来、アルミナ基板等の絶縁基板上にガ
ラスの被覆層を面状に或いは所定のパターン形状に形成
する方法としては、一般にスクリーン印刷法又はスプレ
ーによる吹き付け法が用いられている。
2. Description of the Related Art Conventionally, as a method for forming a glass coating layer on an insulating substrate such as an alumina substrate in a plane or in a predetermined pattern, a screen printing method or a spraying method using a spray is generally used.

【0003】[0003]

【発明が解決しようとする課題】上記従来の方法のう
ち、スクリーン印刷法では、高精度なパターニング又は
厚い被覆層の形成のためには印刷回数を多く必要とし、
このことが製造効率の低下、生産コストの高騰を招いて
いた。
Among the above-mentioned conventional methods, the screen printing method requires a large number of printings for highly accurate patterning or formation of a thick coating layer,
This has led to a decrease in manufacturing efficiency and a rise in production costs.

【0004】一方、スプレーによる吹き付け法では吹き
付け後のガラス粉の回収率が悪く、またマスキング工程
や不要な部分に付着したガラス粉の除去工程等が必要と
され、工数が多く、スクリーン印刷法と同様に製造効率
が悪くコスト高という問題があった。
On the other hand, the spraying method using a spray has a poor recovery rate of the glass powder after spraying, and requires a masking step and a step of removing the glass powder adhering to an unnecessary portion. Similarly, there is a problem that the manufacturing efficiency is poor and the cost is high.

【0005】本発明は上記従来の問題点を解決し、絶縁
基板上に所望のガラス被覆層を容易かつ低コストに、し
かも均一かつ高精度に形成することができるガラス被覆
層の形成方法を提供することを目的とする。
The present invention solves the above-mentioned conventional problems and provides a method for forming a glass coating layer on an insulating substrate, which allows a desired glass coating layer to be formed easily and at low cost, uniformly and with high precision. The purpose is to do.

【0006】[0006]

【課題を解決するための手段】本発明のガラス被覆層の
形成方法は、絶縁基板上にガラス微粉末を付着させた
後、焼成することによりガラス被覆層を形成する方法に
おいて、該ガラス被覆層を形成する絶縁基盤表面にアル
ミニウム膜を形成した後、ガラス微粉末の分散液中に対
向電極と共に浸漬配置し、該対向電極と前記アルミニウ
ム膜との間に直流電圧を印加して該アルミニウム膜上に
ガラス微粉末の電着層を形成し、その後焼成することを
特徴とする。
The method for forming a glass coating layer of the present invention is a method for forming a glass coating layer by depositing glass fine powder on an insulating substrate and then firing the powder. After forming an aluminum film on the surface of the insulating substrate that forms the glass substrate, the glass substrate is immersed in a dispersion of fine glass powder together with a counter electrode, and a DC voltage is applied between the counter electrode and the aluminum film to form a film on the aluminum film. It is characterized in that an electrodeposition layer of fine glass powder is formed on and then fired.

【0007】ガラス微粉末を電着法で付着させることに
より、工程の簡素化、コストの低減が図れ、厚み制御も
容易で均一膜厚のガラス被覆層を精度良く形成すること
ができる。
By adhering the fine glass powder by the electrodeposition method, the process can be simplified and the cost can be reduced, the thickness can be easily controlled, and the glass coating layer having a uniform thickness can be accurately formed.

【0008】特に、ガラス微粉末の電着層形成後の焼成
を、酸化雰囲気中にてアルミニウムの融点より低い温度
に所定時間保持した後、ガラスの軟化点以上の温度まで
昇温して行うことにより、絶縁基板上に平坦で均一なガ
ラス被覆層を付着性良く形成することができる。
Particularly, firing after forming the electrodeposition layer of fine glass powder is carried out by holding the temperature below the melting point of aluminum for a predetermined time in an oxidizing atmosphere, and then raising the temperature to the softening point of the glass or higher. Thereby, a flat and uniform glass coating layer can be formed on the insulating substrate with good adhesiveness.

【0009】[0009]

【発明の実施の形態】以下に本発明を詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.

【0010】本発明においては、まず、絶縁基板表面の
ガラス被覆層形成部にアルミニウム膜を形成する。絶縁
基板としてはアルミナ基板が一般に使用されるが、何ら
これに限定されるものではなく、アルミナ以外の絶縁材
料よりなる基板であっても良い。
In the present invention, first, an aluminum film is formed on the glass coating layer forming portion on the surface of the insulating substrate. An alumina substrate is generally used as the insulating substrate, but the insulating substrate is not limited to this and may be a substrate made of an insulating material other than alumina.

【0011】また、形成するアルミニウム膜の厚さは、
ガラス微粉末の電着層形成後の焼成で、アルミニウムが
酸化されてアルミナ(Al23 )となり、これがガラ
ス被覆層に十分に吸収されるためには、過度に厚くない
ことが要求される。また、このアルミニウム膜の厚さが
過度に薄いと均一な厚さのアルミニウム膜を形成するこ
とが困難である。このようなことから、アルミニウム膜
の厚さは5〜100nmとするのが好ましい。
The thickness of the aluminum film formed is
In the baking after forming the electrodeposition layer of fine glass powder, aluminum is oxidized to alumina (Al 2 O 3 ), which is required to be not excessively thick in order to be sufficiently absorbed in the glass coating layer. . Further, if the thickness of this aluminum film is too thin, it is difficult to form an aluminum film having a uniform thickness. Therefore, the thickness of the aluminum film is preferably 5 to 100 nm.

【0012】アルミニウム膜を絶縁基板上に形成する方
法としては、スパッタリング法が好適である。
As a method for forming the aluminum film on the insulating substrate, the sputtering method is suitable.

【0013】絶縁基板上にアルミニウム膜を形成した後
は、これを、対向電極となる金属板と共に、ガラス微粉
末の分散液中に浸漬配置し、対向電極と絶縁基板上のア
ルミニウム膜との間に直流電圧を印加してアルミニウム
膜上にガラス微粉末の電着層を形成する。
After the aluminum film is formed on the insulating substrate, the aluminum film is immersed in a dispersion liquid of fine glass powder together with the metal plate to be the counter electrode, and the aluminum film is formed between the counter electrode and the aluminum film on the insulating substrate. A DC voltage is applied to the electrode to form an electrodeposition layer of glass fine powder on the aluminum film.

【0014】ここで、ガラス微粉末の分散液としては、
所望のガラス組成を有し、平均粒径1.0〜4.0μm
程度のガラス微粉末を分散媒中に0.075〜0.25
重量%程度の割合で分散させたものが用いられる。分散
媒としては、イソプロピルアルコール等の有機溶媒に対
して2.0〜5.0体積%程度の水を添加したものが好
適である。
Here, as the dispersion liquid of glass fine powder,
It has a desired glass composition and an average particle size of 1.0 to 4.0 μm.
Glass fine powder of about 0.075-0.25 in the dispersion medium
What is dispersed at a ratio of about wt% is used. As the dispersion medium, it is preferable to add about 2.0 to 5.0% by volume of water to an organic solvent such as isopropyl alcohol.

【0015】また、直流電圧の大きさは、電着効率や設
備等の面から、400〜600Vの範囲とするのが好ま
しい。
Further, the magnitude of the DC voltage is preferably in the range of 400 to 600 V from the viewpoint of electrodeposition efficiency and equipment.

【0016】形成されるガラス微粉末の電着層の厚さ
は、アルミニウム膜と対向電極との間に印加する直流電
圧の大きさや時間を調節することにより容易に制御する
ことができ、この電着法によれば、均一厚さの電着層を
形成することができる。なお、ガラス微粉末の付着状況
は、分散液の濁度を観察することにより容易に確認する
ことができる。
The thickness of the electrodeposition layer of fine glass powder formed can be easily controlled by adjusting the magnitude and time of the DC voltage applied between the aluminum film and the counter electrode. According to the deposition method, an electrodeposition layer having a uniform thickness can be formed. The state of adhesion of the fine glass powder can be easily confirmed by observing the turbidity of the dispersion liquid.

【0017】絶縁基板表面のアルミニウム膜上にガラス
微粉末の電着層を形成した後は、該絶縁基板を分散液か
ら引き上げて乾燥した後、焼成する。
After the electrodeposition layer of glass fine powder is formed on the aluminum film on the surface of the insulating substrate, the insulating substrate is pulled out from the dispersion liquid, dried, and then baked.

【0018】本発明において、この焼成は、酸化雰囲気
中、例えば、大気中にてアルミニウムの融点より低い温
度に所定時間保持した後、ガラスの軟化点以上の温度ま
で昇温することにより行うのが好ましい。
In the present invention, the firing is carried out by holding the temperature in the oxidizing atmosphere, for example, in the air at a temperature lower than the melting point of aluminum for a predetermined time, and then raising the temperature to the softening point of the glass or higher. preferable.

【0019】即ち、酸化雰囲気中にてアルミニウムの融
点より低い温度に所定時間保持する(以下、この工程を
「第1焼成工程」と称す。)ことにより、ガラス微粉末
の電着層が均一な被覆層になると共に、アルミニウム膜
が酸化されてアルミナとなり、これがガラス被覆層中に
取り込まれ、絶縁基板とガラス被覆層とは強固に接着一
体化する。前述の如く、アルミニウム膜の膜厚が100
nmより厚いと、焼成における酸化が不十分となりアル
ミニウムの表面層の一部はガラス中に取り込まれている
が、殆どはアルミニウム金属での酸化物としてガラス層
内に残留してしまい、好ましくない。
That is, by keeping the temperature lower than the melting point of aluminum for a predetermined time in the oxidizing atmosphere (hereinafter, this step is referred to as "first firing step"), the electrodeposition layer of the fine glass powder becomes uniform. At the same time as forming the coating layer, the aluminum film is oxidized to become alumina, which is taken into the glass coating layer, and the insulating substrate and the glass coating layer are firmly bonded and integrated. As mentioned above, the thickness of the aluminum film is 100
When it is thicker than nm, the oxidation during firing becomes insufficient and a part of the surface layer of aluminum is taken in the glass, but most of it remains as an oxide of aluminum metal in the glass layer, which is not preferable.

【0020】このように酸化雰囲気中にてアルミニウム
の融点より低い温度に所定時間保持した後、ガラスの軟
化点以上の温度まで昇温して焼成する(以下、この工程
を「第2焼成工程」と称す。)ことにより、ガラス被覆
層の表面が平坦化され、表面平滑で均一なガラス被覆層
とすることができる。
After being kept at a temperature lower than the melting point of aluminum in the oxidizing atmosphere for a predetermined time in this way, the temperature is raised to a temperature equal to or higher than the softening point of the glass and fired (hereinafter, this step is referred to as "second firing step"). The surface of the glass coating layer is flattened, and the surface of the glass coating layer can be made smooth and uniform.

【0021】なお、第1焼成工程は、具体的には、20
〜50℃/minの昇温速度でアルミニウムの融点より
10〜80℃低い温度、例えば、580〜650℃に昇
温し、この温度で3〜5時間保持することにより実施さ
れる。また、第2焼成工程は、この第1焼成工程後、2
5〜50℃/minの昇温速度でガラスの軟化点より2
50〜400℃高い温度、例えば1100〜1250℃
に昇温し、その後、室温まで降温することにより実施さ
れる。
The first firing step is, specifically, 20
It is carried out by raising the temperature to a temperature lower than the melting point of aluminum by 10 to 80 ° C., for example, 580 to 650 ° C. at a temperature rising rate of ˜50 ° C./min, and holding this temperature for 3 to 5 hours. In addition, the second firing step is performed after the first firing step by 2
2 from the softening point of glass at a heating rate of 5 to 50 ° C / min
50 to 400 ° C higher temperature, for example 1100 to 1250 ° C
The temperature is raised to room temperature, and then to room temperature.

【0022】[0022]

【実施例】以下に実施例及び比較例を挙げて本発明をよ
り具体的に説明する。
The present invention will be described more specifically below with reference to examples and comparative examples.

【0023】実施例1 厚さ0.5mm、幅50mm、長さ75mmの96%ア
ルミナ基板上に、本発明の方法に従って、ガラス被覆層
を形成した。
Example 1 A glass coating layer was formed on a 96% alumina substrate having a thickness of 0.5 mm, a width of 50 mm and a length of 75 mm according to the method of the present invention.

【0024】まず、このアルミナ基板を水洗浄した後、
表面に約40nmの厚さのアルミニウム膜をスパッタリ
ングにより形成した。別に、イソプロピルアルコール5
00mlに対して、3体積%の水を添加した分散媒に、
下記組成のガラス微粉末(平均粒径3.0μm、軟化点
850℃)を0.3g分散させた分散液を調製した。
First, after washing this alumina substrate with water,
An aluminum film having a thickness of about 40 nm was formed on the surface by sputtering. Separately, isopropyl alcohol 5
In a dispersion medium to which 3% by volume of water was added to 00 ml,
A dispersion liquid was prepared in which 0.3 g of glass fine powder having the following composition (average particle diameter 3.0 μm, softening point 850 ° C.) was dispersed.

【0025】ガラス組成(重量%) Al23 :11.8 SiO2 :61.0 CaO:9.8 BaO:7.2 ビーカー内にこの分散液を入れ、対向電極となる金属板
と共に、この金属板の中心位置に上記アルミニウム膜を
形成したアルミナ基板が位置するように、該アルミナ基
板を浸漬配置し、金属板とアルミナ基板のアルミニウム
膜との間に600Vの直流電圧を印加した。ガラス微粉
末の付着状態は、分散液の濁度を目視により確認するこ
とにより行い、分散液中のガラス微粉末を十分に付着さ
せた。
Glass composition (% by weight) Al 2 O 3 : 11.8 SiO 2 : 61.0 CaO: 9.8 BaO: 7.2 This dispersion was placed in a beaker, together with a metal plate serving as a counter electrode. The alumina substrate having the aluminum film formed thereon was immersed and placed so that the alumina substrate on which the aluminum film was formed was positioned at the center of the metal plate, and a DC voltage of 600 V was applied between the metal plate and the aluminum film of the alumina substrate. The adhered state of the glass fine powder was confirmed by visually confirming the turbidity of the dispersion liquid, and the glass fine powder in the dispersion liquid was sufficiently adhered.

【0026】その後、アルミナ基板を取り出し、熱風で
乾燥した後、カンタルスーパー(ボックス炉)を用い
て、下記焼成条件にて焼成した。
After that, the alumina substrate was taken out, dried with hot air, and then fired using Kanthal Super (box furnace) under the following firing conditions.

【0027】焼成条件 第1焼成工程:大気中にて、25℃/minで600℃
に昇温し、600℃で3時間保持 第2焼成工程:第1焼成工程後、更に、30℃/min
で1210℃まで昇温した後、50℃/minで大気温
度まで降温した その結果、厚さ25μmの、平坦で均一なガラス被覆層
を、付着性良く形成することができた。
Firing conditions First firing step: 600 ° C. at 25 ° C./min in air
And hold at 600 ° C. for 3 hours Second firing process: After the first firing process, further 30 ° C./min
After that, the temperature was raised to 1210 ° C. and the temperature was lowered to the atmospheric temperature at 50 ° C./min. As a result, a flat and uniform glass coating layer having a thickness of 25 μm could be formed with good adhesion.

【0028】なお、アルミニウム膜の厚さを150nm
としたこと以外は上記と同様にしてガラス被覆層を形成
したところ、焼成によるアルミニウムの酸化が不十分と
なり、十分な不着性を得ることができなかった。また、
アルミニウム膜の厚さを2〜3nmに形成しようとした
ところ、均一なアルミニウム膜を形成し得ず、このため
所望のガラス被覆層を形成することが困難であった。
The thickness of the aluminum film is 150 nm.
When a glass coating layer was formed in the same manner as described above except for the above, the oxidation of aluminum due to firing was insufficient, and sufficient non-adhesiveness could not be obtained. Also,
When an attempt was made to form the aluminum film to have a thickness of 2 to 3 nm, a uniform aluminum film could not be formed, which made it difficult to form a desired glass coating layer.

【0029】比較例1 実施例1で用いたものと同様のアルミナ基板に、実施例
1で用いたものと同様のガラス微粉末によるスクリーン
印刷法でガラス被覆層の形成を行ったところ、実施例1
で形成したガラス被覆層と同等の厚さのガラス被覆層を
形成するためには、スクリーン印刷を3回繰り返し行う
必要があり、工程数が多く、効率的なガラス被覆層の形
成を行えなかった。
Comparative Example 1 A glass coating layer was formed on the same alumina substrate as that used in Example 1 by the screen printing method using the same fine glass powder as that used in Example 1. 1
In order to form a glass coating layer having the same thickness as the glass coating layer formed in step 3, it was necessary to repeat screen printing three times, and the number of steps was large, so that the glass coating layer could not be formed efficiently. .

【0030】[0030]

【発明の効果】以上詳述した通り、本発明のガラス被覆
層の形成方法によれば、絶縁基板上に所望のガラス被覆
層を容易かつ低コストに、しかも均一かつ高精度に形成
することができる。
As described in detail above, according to the method for forming a glass coating layer of the present invention, a desired glass coating layer can be formed on an insulating substrate easily and at low cost, uniformly and with high precision. it can.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 絶縁基板上にガラス微粉末を付着させた
後、焼成することによりガラス被覆層を形成する方法に
おいて、 該ガラス被覆層を形成する絶縁基板表面にアルミニウム
膜を形成した後、ガラス微粉末の分散液中に対向電極と
共に浸漬配置し、該対向電極と前記アルミニウム膜との
間に直流電圧を印加して該アルミニウム膜上にガラス微
粉末の電着層を形成し、その後焼成することを特徴とす
るガラス被覆層の形成方法。
1. A method for forming a glass coating layer by depositing fine glass powder on an insulating substrate and then firing the glass substrate, comprising forming an aluminum film on the surface of the insulating substrate on which the glass coating layer is formed, and then forming a glass. Immersed in a dispersion liquid of fine powder together with a counter electrode, a DC voltage is applied between the counter electrode and the aluminum film to form an electrodeposition layer of glass fine powder on the aluminum film, and then firing. A method for forming a glass coating layer, comprising:
【請求項2】 請求項1の方法において、焼成は、酸化
雰囲気中にてアルミニウムの融点より低い温度に所定時
間保持した後、ガラスの軟化点以上の温度まで昇温する
ことにより行うことを特徴とするガラス被覆層の形成方
法。
2. The method according to claim 1, wherein the firing is performed by holding the temperature at a temperature lower than the melting point of aluminum for a predetermined time in an oxidizing atmosphere, and then raising the temperature to a temperature equal to or higher than the softening point of the glass. And a method for forming a glass coating layer.
【請求項3】 請求項1又は2の方法において、アルミ
ニウム膜の厚さが5〜100nmであることを特徴とす
るガラス被覆層の形成方法。
3. The method for forming a glass coating layer according to claim 1, wherein the aluminum film has a thickness of 5 to 100 nm.
JP29510295A 1995-11-14 1995-11-14 Formation of glass coating layer Withdrawn JPH09142970A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29510295A JPH09142970A (en) 1995-11-14 1995-11-14 Formation of glass coating layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29510295A JPH09142970A (en) 1995-11-14 1995-11-14 Formation of glass coating layer

Publications (1)

Publication Number Publication Date
JPH09142970A true JPH09142970A (en) 1997-06-03

Family

ID=17816327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29510295A Withdrawn JPH09142970A (en) 1995-11-14 1995-11-14 Formation of glass coating layer

Country Status (1)

Country Link
JP (1) JPH09142970A (en)

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