JPH09129660A - Manufacture of electronic component and manufacturing device of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing electronic components, which can seal a plurality of the electronic components at one time excluding a defective electronic component of a marking for defective electronic component use provided on a defective portion on a sealing film, and the manufacturing device of the electronic components. SOLUTION: A sealing film 30 bonded with electronic components is fed out from a feed-out reel 31 to a wind-up reel 37. A detector 32 detects a hole for defect use, a marking for defective electronic component use and the like, which are provided in or on a defective portion on the film 30, and outputs the detected result. A control part 33 controls each of squeegees 34 on the basis of this detected result to seal the electronic components other than the defective electronic component of the marking provided on the defective portion on the film 30 at one time.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing electronic components such as semiconductor chips.

[0002]

2. Description of the Related Art Generally, an electronic component such as a semiconductor chip is bonded to an electrode member in which a plurality of electrodes of a circuit or the like are continuously formed, and is continuously sealed with an epoxy resin or the like. . Examples of the electrode member include a film carrier formed by attaching a tin-plated copper foil to an organic film and patterning a circuit by etching or the like. A method for continuously sealing electronic components using this film carrier or the like is described in TAB (Tape Automat).
ic Bonding). 3A and 3B are a top view and a cross-sectional view taken along the line AA 'of a film carrier used for TAB, respectively. 3 (a) and 3 (b), reference numeral 1 denotes an electrically insulating film made of an organic material such as polyimide or polyester, for example, a tape having a width of about 35 [mm].

[0003] 2 is a conductor such as a tin-plated copper foil,
A desired circuit or the like is formed on the upper surface of the film 1 by etching or the like. The conductor 2 is provided with a hole 3 according to the shape of the circuit. Reference numeral 4 denotes an electronic component such as a semiconductor chip. The electronic component 4 has a plurality of columnar bumps 5 formed thereon. The bumps 5 are electrodes of a circuit formed inside the semiconductor chip 4. Each of the plurality of bumps 5 is bonded to a circuit formed on the conductor 2.

[0004] Reference numeral 6 denotes a defect hole formed in the film 1 and the conductor 2 at a defective portion in the case of a defect such as a circuit or the like of the conductor 2 not being formed in a desired shape. When the circuit formed on the conductor 2 has a defective portion, the defective hole 6 is simply wasted even if the good electronic component 4 is bonded to the defective portion. Therefore, the defective portion is removed in advance. It is provided for.

[0005] Reference numeral 7 denotes a marking, and
Is bonded to the conductor 2, the operation of the electronic component 2 is electrically inspected, and a connection failure between the conductor 2 and the electronic component 4 is detected.
Alternatively, the electronic component 4 is provided at a place where the operation is not normal due to a defect of the electronic component 4 itself. The marking 7 is made of, for example, a white paint. In the above configuration, the electronic components 4 described above are sealed one by one by a method such as dispensing using an epoxy resin or the like.

In recent years, using a stencil provided with a plurality of holes along the shape of a portion to be sealed, a liquid sealing resin is printed in the shape of the stencil, and a plurality of electronic components are collectively sealed. A method of manufacturing an electronic component has been devised. A method for manufacturing this electronic component will be described with reference to FIG. FIG. 4 is a cross-sectional view showing a schematic configuration of an electronic component manufacturing apparatus that performs printing and sealing using a liquid sealing resin, and portions common to FIG. Is omitted.

In FIG. 4, reference numeral 10 denotes a stencil in which a hole 11 having a desired shape is formed according to the shape of the electronic component 4, and is arranged near the upper portion of the film 1 to which the electronic component 4 is bonded. Reference numeral 12 denotes a liquid sealing resin. Reference numeral 13 denotes a squeegee for flowing the liquid sealing resin 12 into the holes 11 provided in the stencil 10. The squeegee 13 has a substantially plate shape and is attached to a movable portion (not shown). The film 1 is arranged near the upper portion of the stencil 10 and reciprocates in the length direction of the film 1 in a plane parallel to the stencil 10.

In the above configuration, when the electronic component 4 is sealed, the operator first arranges the electronic component 4 horizontally, and places the stencil 10 near the upper portion of the film 1 to which the electronic component 4 is bonded so as to be parallel to the film 1. Further, the holes 11 provided in the stencil 10 are arranged so as to be located above the electronic component 4. Next, the liquid sealing resin 12 is applied to the upper surface of the stencil 10, and the squeegee 13 is moved in parallel with the stencil 10 so that the liquid sealing resin 12 flows into the holes 11. The liquid sealing resin 12 poured into the hole 11 is
As shown in FIG. 5, the side surface of the electronic component 4, the surface on which the bumps 5 are formed, the bumps 5, and a part of the conductor 2 are sealed. Then, when the film 1 and the conductor 2 are cut and separated from each other, the manufacture of the electronic component is completed.

[0009]

However, there is a problem that the method of sealing the electronic components 4 one by one by the above-described method such as dispensing is extremely inefficient. Further, when the electronic component 1 is a semiconductor chip, it is required to increase the chip area by increasing the functions of the semiconductor chip, and to reduce the size of the semiconductor chip by saving space when mounting the semiconductor chip. There has been a problem that it is difficult to respond to these demands by a conventional method such as dispensing.

The method of manufacturing an electronic component in which electronic components are sealed using the liquid sealing resin 12 can seal a large number of electronic components 4 at one time. Therefore, there is a problem that the operation of all the electronic components must be electrically inspected after sealing to select non-defective products, and the inspection takes an extremely long time. Further, there is a problem that the liquid sealing resin 12 used for sealing the defective portion is wasted and uneconomical. Further, there is a problem that the liquid sealing resin 12 flows down from the above-described defect hole 6 at the time of sealing, thereby not only contaminating the sealing device, but also contaminating subsequent non-defective products.

The present invention has been made in view of the above circumstances, and provides an electronic component manufacturing method and an electronic component manufacturing apparatus capable of sealing a plurality of electronic components at once except for a defective portion. The purpose is to:

[0012]

According to the first aspect of the present invention,
A stencil having a plurality of holes formed at the same intervals as the predetermined intervals is provided in the vicinity of the upper part of the plurality of electronic parts arranged at the predetermined intervals so that the holes are located above the electronic parts. , Arranging a liquid sealing resin on the upper surface of the stencil,
In a method of manufacturing an electronic component in which the liquid sealing resin is poured into the hole by a squeegee to print, and a plurality of the electronic components are sealed at one time, a position of a defective product among the plurality of electronic components is detected in advance, It is characterized in that each of the plurality of squeegees is controlled based on the detection result to seal only good electronic components.

According to a second aspect of the present invention, a liquid sealing resin for sealing a plurality of electronic components arranged at a predetermined interval and a plurality of holes at the same interval as the predetermined interval are formed, A stencil on which a sealing resin is arranged on the upper surface, at least two squeegees arranged near the upper part of the stencil and sliding on the stencil, and a position of a defective product among the plurality of electronic components is detected in advance, A detection means for outputting a detection result; and a control means for sliding a squeegee corresponding to the hole when a non-defective electronic component is located right under any of the plurality of holes based on the detection result. It is characterized by doing.

According to a third aspect of the present invention, in the electronic component manufacturing apparatus according to the second aspect, the at least two squeegees are individual piece printing squeegees for printing one electronic component, and a plurality of electronic components at a time. It is characterized by comprising a plurality of squeegees for printing. According to a fourth aspect of the present invention, in the electronic component manufacturing apparatus according to the second aspect, the at least two squeegees are provided with a plurality of individual-piece printing squeegees for printing one electronic component. To do.

[0015]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a schematic configuration of an electronic component manufacturing apparatus according to an embodiment of the present invention. In FIG. 1, reference numeral 30 denotes a sealing film to which an electronic component such as a semiconductor chip is bonded. The sealing film 30 is made of an organic material such as polyimide or polyester similar to the film 1 described in the related art, has electrical insulation properties, and is, for example, a tape having a width of about 35 [mm]. is there. The sealing film 30 is provided with a defect hole or a marking or the like at a defective portion to indicate that the electronic component bonded is electrically malfunctioning.

Reference numeral 31 denotes a delivery reel on which the sealing film 30 is wound and for supplying the sealing film 30 to the apparatus. The delivery reel 31 is attached to a shaft (not shown) so as to be rotatable. Also,
Reference numeral 32 denotes a portion near the delivery reel, which is
Detector (detection means) such as a CCD camera or a photo sensor arranged above 0. The detector 32 detects a defect hole provided in a defective portion of the sealing film 30 and a marking of a defective electronic component, and outputs a detection result. Reference numeral 33 denotes a control unit (control means) for specifying a defective portion based on a detection result output from the detector 32. Further, the control unit 33 includes the control unit 3
3 controls the operation of the substantially plate-shaped squeegee 34 disposed below. The control unit 33 is disposed forward of the detector 32 in the traveling direction of the sealing film 30.

A plurality of the squeegees 34 are provided, and the surfaces thereof are parallel to the traveling direction of the sealing film 30, and each is arranged so as to be perpendicular to the surface of the sealing film 30 and in a straight line. They are arranged so that they do not overlap. The squeegee 34 reciprocates on a plane perpendicular to the length direction of the sealing film 30 and parallel to the surface of the sealing film 30. The control unit 33 reciprocates each of the squeegees 34 independently. As shown in FIG. 2 (a), the squeegee 34 has a single piece printing squeegee 34a-1 having a small width and a large squeegee 34a-1 having a large width.
It may be a divided squeegee 34a composed of two of the two or more printing squeegees 34a-2. Alternatively, as shown in FIG. 2B, a divided squeegee 34b composed of a plurality of individual printing squeegees 34b-1 having a small width may be used. The configuration of the squeegee 34 in FIG. 1 is the same as that of the divided squeegee 34 in FIGS. 2A and 2B.
The configuration is not limited to a and 34b.

Reference numeral 35 denotes a stencil in which a plurality of holes having a desired shape are formed in accordance with the shape of the electronic component to be sealed.
It is arranged so as to be parallel to the sealing film 30.
The holes formed in the stencil 35 are each squeegee 34
It is arranged to be located below. Reference numeral 36 denotes a curing furnace for curing the sealed liquid sealing resin.
It is set to ~ 200 ° C. The curing furnace 36 is disposed in front of the control unit 33 in the traveling direction of the sealing film 30. Reference numeral 37 denotes a take-up reel for taking up the sealed electronic component and the sealing film 30 at a constant speed.

The operation of sealing the electronic component in the above structure will be described with reference to FIGS. 1 and 2A and 2B. First, the operator rotates the take-up reel 37, and advances the sealing film 30 to which the electronic component is bonded from the delivery reel 31 to the take-up reel 37. As the sealing film 30 advances, the detector 32 detects the positions of the defect holes and the marking of the defective electronic component provided in the sealing film 30 within the detection range, and sends the detection result to the control unit 33. Output.

The control unit 33 determines whether or not the position of the defect hole and the marking of the defective electronic component is located below the stencil 35 based on the above detection result and the traveling speed of the sealing film 30. . The squeegee 34 in FIG.
As shown in (a), the squeegee 34 is composed of two, one narrow printing squeegee 34a-1 and one wide printing squeegee 34a-2.
In the case of a, the control unit 33 determines, based on the detection result,
When there are no defective parts and only good products are continuous, a plurality of electronic components are printed at once by the plurality of printing squeegees 34a-2. Also, a plurality of printing squeegees 34a-
In the case where a defective portion is printed when sealing is performed at a time in step 2, printing is performed individually by the individual printing squeegee 34a-1.

The squeegee 34 in FIG.
As shown in (b), in the case of a divided squeegee 34b composed of a plurality of individual printing squeegees 34b-1 having a small width, the control unit 33 controls the individual printing squeegee 34b-1 corresponding to a defective portion. Control not to operate,
The division squeegee 34b is controlled so that only non-defective products are sealed without printing. Next, the electronic component on which the liquid sealing resin is printed is sent to the curing furnace 36, and the printed liquid sealing resin is cured. Then, the electronic component and the sealing film 30 sealed by the winding reel 37 are wound. Finally, when the sealing film 30 wound on the take-up reel 37 is cut and the sealed electronic components are individually separated, the sealing of the electronic components is completed.

After the sealing is completed, an inspection of the electrical operation of only the sealed electronic component is performed. The unsealed electronic component is a defective electronic component that is marked or the like, and is visually inspected. It is easily sorted by such as. Incidentally, the sealing film 30 used in the present invention is not limited to a film such as polyimide or polyester, but a thin sheet material such as glass epoxy or glass polyimide, or a package such as glass epoxy and a metallic lead frame. It may be a material or the like.

The method and apparatus for manufacturing an electronic component according to one embodiment of the present invention have been described above. In this embodiment, the shape of the holes provided in the stencil 35 in FIG. 1 is set arbitrarily. Therefore, it is possible to easily cope with a demand for an increase in the area of the semiconductor chip and a slimness of the semiconductor chip. In addition, since the defective portion on which the marking or the like is provided is not sealed, the inspection of the electrical operation of the electronic component after the sealing can be reduced. In addition, since the position of the defect hole 6 is detected in advance, the liquid sealing resin 12 is not printed at this position, and the sealing device is not stained.

[0024]

As described above, in the method for manufacturing an electronic component and the apparatus for manufacturing an electronic component according to the present invention,
Since only a good electronic component is printed and sealed without sealing the defective electronic component, there is an effect that the liquid sealing resin is not wasted and the cost can be reduced. In addition, since a plurality of electronic components are printed at once except for a defective portion, there is an effect that printing and sealing can be efficiently performed.

[Brief description of the drawings]

FIG. 1 is a diagram showing a schematic configuration of an electronic component manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a configuration diagram showing a configuration example of a squeegee 34.

FIG. 3 is a top view (a) and an AA ′ cross-sectional view (b) of a film carrier used for TAB.

FIG. 4 is a cross-sectional view illustrating a schematic configuration of a method of manufacturing an electronic component that performs print sealing using a liquid sealing resin.

FIG. 5 is a cross-sectional view after the electronic component 4 is sealed.

[Explanation of symbols]

 Reference Signs List 4 electronic component 6 defect hole 7 marking 10, 35 stencil 11 hole 12 liquid sealing resin 13, 34 squeegee 32 detector 33 control unit 34a, 34b split squeegee

Claims (4)

[Claims] 1. A stencil plate having a plurality of holes formed at the same intervals as the predetermined intervals in the vicinity of an upper portion of the plurality of electronic parts arranged at the predetermined intervals, the holes being located above the electronic parts. A liquid encapsulating resin is disposed on the upper surface of the stencil, the liquid encapsulating resin is poured into the holes by a squeegee for printing, and a plurality of electronic components are sealed at one time. In the manufacturing of an electronic component, the position of a defective product among the plurality of electronic components is detected in advance, and each of the plurality of squeegees is controlled based on the detection result to seal only a good electronic component. Method. 2. A liquid sealing resin for sealing a plurality of electronic components arranged at a predetermined interval, and a plurality of holes having the same interval as the predetermined interval, wherein the liquid sealing resin is formed on the upper surface. A stencil to be arranged, at least two squeegees arranged near the upper part of the stencil and sliding on the stencil, and a position of a defective product among the plurality of electronic components is detected in advance,
A detection unit that outputs a detection result; and a control unit that slides a squeegee corresponding to the hole when a non-defective electronic component is located right under any of the plurality of holes based on the detection result. An electronic component manufacturing apparatus characterized by: 3. The at least two squeegees are composed of an individual printing squeegee for printing one electronic component and a plural printing squeegee for printing a plurality of electronic components at one time. The manufacturing apparatus of the electronic component described. 4. The electronic component manufacturing apparatus according to claim 2, wherein the at least two squeegees are provided with a plurality of individual-piece printing squeegees for printing one electronic component.