JP2000276071A - Electrooptic device, its manufacture, and electronic equipment mounted with same device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure superior productivity for the electrooptic device which actualizes a desired display by applying a proper electric field to the electrooptic substance interposed between two light-transmissive substrates. SOLUTION: A TCP(tape carrier package) 34 is fixed to a liquid crystal panel 32 which actualizes a desired display by applying an electric field to the liquid crystal interposed between two light-transmissive substrates 36 and 38 which are arranged opposite to each other. The TCP 34 is equipped with a base film 47 which is electrically connected to the liquid crystal panel 32, a driving integrated circuit 48 and a chip component 50 mounted on the base film 47. The driving integrated circuit 48 and chip component 50 supply the liquid crystal panel 32 with a driving signal generated according to an externally supplied control signal. The TCP 34 is manufactured by a tape carrier system.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an electro-optical device, a method of manufacturing the same, and an electronic apparatus equipped with the device. In particular, the present invention relates to an electro-optical device that realizes a desired display by applying an appropriate electric field to an electro-optical material interposed between two light-transmitting substrates, a method of manufacturing the same, and an electronic apparatus equipped with the device.

[0002]

2. Description of the Related Art Conventionally, as an electro-optical device, for example, a passive matrix type liquid crystal device (hereinafter simply referred to as "liquid crystal device")
Is known). FIG. 9 shows a plan view of a conventional liquid crystal device. A conventional liquid crystal device has two
A liquid crystal panel 14 including a plurality of light transmissive substrates 10 and 12 is provided. A plurality of data lines, which are wired and extend in parallel with each other, are formed of a transparent conductive material such as ITO (Indium Tin Oxide) on the surface of one of the light transmissive substrates 10 and 12 on the opposite side. ing. Light transmitting substrate 10,
A plurality of scanning lines extending in parallel with each other are formed of a transparent conductive material such as ITO on the surface on the opposite side of the other substrate 12.

The light-transmitting substrates 10 and 12 are bonded by a sealant so that scanning lines and data lines are orthogonal to each other, and a liquid crystal is filled between the two substrates 10 and 12. . Hereinafter, a portion where the scanning line and the data line intersect is referred to as a “pixel”. The light-transmitting substrate 10 has an overhanging region that extends outward from the outer shape of the light-transmitting substrate 12, and is formed on an opposite surface of the light-transmitting substrate 10 at an end of the overhanging region. A plurality of connection terminals directly derived from the scanning line or the data line, and a plurality of connections electrically connected to the scanning line or the data line formed on the surface on the opposite side of the substrate 12 through the conductive particles. Terminals are formed.

In a conventional liquid crystal device, a TCP (Tape Carrier Package) conductively connected to the liquid crystal panel 14 by an anisotropic conductive film (Anisotropic Conductive Film) or heat sealing.
16 is provided.

A driving integrated circuit 18 is mounted on the TCP 16 by an inner lead bonding method. That is, the TCP 16 is provided with a plurality of finger leads formed by applying a tin (Sn) plating process on a copper (Cu) foil. On the other hand, the driving integrated circuit 18 includes
Gold (Au) for conductive connection with those finger leads
A bump is provided. The driving integrated circuit 18 is mounted on the TCP 16 by thermocompression bonding so that an Au-Sn eutectic bond is formed between the Au bump and the finger lead. The joint between the Au bump and the finger lead is sealed with a resin mold.

The TCP 16 is further provided with an output terminal which is conductively connected to the connection terminal on the light transmitting substrate 10 described above. These output terminals are connected to the driving integrated circuit 1
The drive signal generated in 8 is supplied. That is, in the conventional liquid crystal device, the driving integrated circuit 18 supplies an arbitrary driving signal to an arbitrary data line and an arbitrary scanning line in the liquid crystal panel 14 to drive the liquid crystal in pixel units. Can be. The conventional liquid crystal device realizes a desired display by controlling the alignment state of the liquid crystal in pixel units as described above.

In a conventional liquid crystal device, a printed circuit board (PCB) is attached to the TCP 16 by a technique such as soldering.
ard) 20 is connected. A plurality of functional components 22 electrically connected to the driving integrated circuit 18 described above are mounted on the PCB 20, and a transmission line or the like for supplying a control signal supplied from the outside to the driving integrated circuit 18 is formed. Have been. The functional component 22 includes an adjusting resistor for adjusting a voltage signal generated by the driving integrated circuit 18, a smoothing capacitor for smoothing a signal generated by the driving integrated circuit 18, and the like.

That is, in the conventional liquid crystal device, a control signal corresponding to the content to be displayed on the liquid crystal panel 14 is externally input to the driving integrated circuit 18 via the PCB 20. The driving integrated circuit 18 operates together with the functional component 22 mounted on the PCB 20 to generate a driving signal for realizing a desired display, and supplies the driving signal to the scanning lines and the data lines of the liquid crystal panel. I do.

[0009]

As described above, the conventional electro-optical device has a driving signal for applying an electric field to an electro-optical material (for example, liquid crystal) interposed between the light-transmitting substrates 10 and 12, ie, a driving signal. And a driving signal for obtaining a desired display is mounted on the TCP 16 by the driving integrated circuit 1.
8 and a functional component 22 mounted on the PCB 20. That is, in the conventional electro-optical device,
Two substrates (the base film of the TCP 16 and the PCB 20) are used for a circuit that generates a drive signal based on a control signal supplied from the outside.

In order to realize such a structure, a large number of parts are required and the size of the electro-optical device is increased, and a process for electrically connecting the two substrates is also required. Becomes Further, the structure described above includes P
A circuit using the CB20 as a substrate, that is, a circuit having lower productivity than TCP is included. As described above, the conventional electro-optical device has various elements that hinder securing excellent productivity.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an electro-optical device which can ensure excellent productivity by including a functional component necessary for generating a driving signal in a TCP. The primary purpose is to provide.

A second object of the present invention is to provide a manufacturing method capable of manufacturing an electro-optical device with excellent productivity by including a functional component necessary for generating a drive signal in TCP. And

Further, a third object of the present invention is to provide an electronic apparatus equipped with the above-described electro-optical device having excellent productivity.

[0014]

(1) The present invention is directed to an electro-optical device which realizes a desired display by applying an electric field to an electro-optical material interposed between two substrates disposed opposite to each other. A tape carrier package that supplies a drive signal for realizing a desired display to the substrate while being electrically connected to the substrate, wherein the tape carrier package includes a base that is electrically connected to the substrate. It is characterized by comprising a film, a driving integrated circuit mounted on the base film, and a functional component mounted on the base film separately from the driving integrated circuit.

According to such a configuration of the present invention, the tape carrier package electrically conductively connected to the substrate can include the driving integrated circuit and the desired functional component. According to such a structure, functional components to be externally added to the driving integrated circuit can be accommodated in the tape carrier package. Therefore, according to the present invention, an electro-optical device having excellent productivity can be realized.

(2) The present invention provides a drive signal generation circuit in which the drive integrated circuit and the functional component receive a control signal corresponding to the content to be displayed and generate a drive signal for realizing the display. It is desirable to configure

According to such a configuration, the process of generating the drive signal to be supplied to the substrate based on the control signal supplied from the outside can be completed inside the tape carrier package. Therefore, according to the present invention, it is possible to realize an electro-optical device with a small number of components and excellent productivity.

(3) In the present invention, it is preferable that the functional component includes an adjusting resistor for adjusting a voltage signal generated by the driving integrated circuit.

According to such a configuration, the voltage signal generated by the driving integrated circuit can be accurately adjusted by using the adjusting resistor included in the tape carrier package.

(4) In the present invention, it is preferable that the functional component includes a smoothing capacitor for smoothing a signal generated by the driving integrated circuit.

According to such a configuration, the signal emitted from the driving integrated circuit can be smoothed to a desired state by using the smoothing capacitor included in the tape carrier package.

(5) In the present invention, it is preferable that the functional component includes a connector for obtaining electrical continuity between the tape carrier package and an external device.

According to such a configuration, a tape carrier package which can be easily connected to an external control circuit can be realized.

(6) The present invention is a method of manufacturing an electro-optical device which realizes a desired display by applying an electric field to an electro-optical material interposed between two substrates disposed opposite to each other. Mounting the driving integrated circuit and a functional component different from the driving integrated circuit on a base film for a tape carrier package conveyed in a tape state, and completing the mounting of the driving integrated circuit and the functional component. After that, cutting out the base film into a predetermined shape, a circuit formed of the driving integrated circuit and the functional component, and a predetermined shape so that desired conduction is secured between the substrate and the circuit. Conductively connecting the cut-out base film to the substrate.

According to such a configuration of the present invention, a tape carrier package including a driving integrated circuit and a desired functional component is manufactured with high productivity, and an electro-optical device is manufactured using the tape carrier package. The device can be manufactured. Therefore, according to the present invention, an electro-optical device including a driving integrated circuit and a functional component can be efficiently manufactured.

(7) A drive signal generating circuit according to the present invention, wherein the drive integrated circuit and the functional component receive a control signal corresponding to the content to be displayed and generate a drive signal for realizing the display. It is desirable to constitute.

According to such a configuration, it is possible to efficiently manufacture an electro-optical device capable of completing a process of generating a drive signal based on a control signal inside a tape carrier package.

(8) The electro-optical device according to the present invention is desirably mounted on electronic equipment.

According to such a configuration, the productivity of the electronic equipment including the electro-optical device can be improved.

[0030]

Embodiments of the present invention will be described below with reference to the drawings.

[First Embodiment] FIG. 1 is a plan view of a passive matrix type liquid crystal device 30 which is a first embodiment of the electro-optical device according to the present invention. As shown in FIG. 1, the liquid crystal device 30 of the present embodiment includes a liquid crystal panel 32 and T
CP34.

The TCP 34 is mounted with a driving integrated circuit which is collectively bonded (gang-bonded) by an inner lead bonding method. That is, the TCP 34 is provided with a plurality of finger leads formed by performing a tin (Sn) plating process on a copper (Cu) foil. On the other hand, the driving integrated circuit is provided with gold (Au) bumps for conductive connection with the finger leads. The driving integrated circuit is gang-bonded on the TCP 16 by thermocompression so as to form an Au-Sn eutectic bond between the Au bump and the finger lead.
The joint between the Au bump and the finger lead is sealed with a resin mold so that the exposed portion is covered.

In the present specification, the driving integrated circuit is mounted on a base film conveyed in a continuous tape state by gang bonding, and other necessary elements and the like are mounted. An individual manufactured by cutting into a shape is called TCP.

The liquid crystal device 30 is a device that receives a control signal supplied from a control device (not shown) and displays on the liquid crystal panel 32 the contents corresponding to the control signal. In the present embodiment, the liquid crystal device 30 is characterized in that the process of generating a drive signal for driving the liquid crystal panel 32 based on the control signal is generated only by the internal circuit of the TCP 34.

FIG. 2 is an exploded perspective view of the liquid crystal device 30. As shown in FIG. 2, the liquid crystal panel 32 includes two light-transmitting substrates 36 and 38 which are arranged to face each other. The light transmitting substrates 36 and 38 are made of a transparent material such as glass. On one light transmitting substrate 36, a plurality of data lines 40 extending in parallel with each other are formed by a transparent conductive material such as ITO. On the other light transmitting substrate 38, a plurality of scanning lines 42 extending in parallel with each other are formed by a transparent conductive material such as ITO.

The light transmitting substrates 36 and 38 are connected to the data lines 40.
And the scanning line 42 are bonded so as to be orthogonal to each other, and the space between the two substrates 36 and 38 is filled with liquid crystal. Hereinafter, a portion where the scanning line and the data line intersect is referred to as a “pixel”. A polarizing plate 44 is attached to the surface (the upper surface in FIG. 2) of the light transmitting substrate 36. on the other hand,
A polarizing plate (not shown) is attached to the surface (the lower surface in FIG. 2) of the light transmitting substrate 38. The two polarizing plates are provided with orthogonal polarization characteristics.

A plurality of connection terminals 46 are formed at the end of the light transmitting substrate 36. A part of the connection terminal 46 is directly derived from the data line 40 formed on the light transmitting substrate 36. The remaining connection terminals 46 are made of conductive particles (not shown) interposed between the two substrates 36 and 38.
Through the scanning lines 4 formed on the light transmissive substrate 38
Conduction to No. 2.

According to the above-described configuration, any connection terminal 4
By supplying a drive signal to the data line 6,
By applying a predetermined potential to 0 and any scanning line 42, that is, an electric field can be generated in any pixel. That is, according to the above configuration, by inputting an appropriate drive signal to the connection terminal 46, the two substrates 3
It is possible to control the alignment state of the liquid crystal filled between 6, 38 on a pixel-by-pixel basis. Therefore, according to the liquid crystal device 30, a desired display can be formed on the liquid crystal panel 32 by supplying an appropriate drive signal to the connection terminal 46.

As shown in FIG. 2, the TCP 34 includes a base film 47 made of polyimide resin or the like, a driving integrated circuit 48 mounted on the surface thereof, a plurality of chip elements 50, and a connector 52. Base film 47
Are formed with a plurality of output terminals 54 that are electrically connected to the output terminals of the driving integrated circuit 48, and wires and the like for ensuring necessary conduction between the driving integrated circuit 48 and the chip element 50 and the connector 52. ing. The TCP 34 is fixed to the liquid crystal panel 32 via the anisotropic conductive film 56 such that each of the output terminals 54 of the base film 47 is electrically connected to each of the connection terminals 46 of the light transmissive substrate 36.

FIG. 3 is a circuit diagram showing a connection state between the driving integrated circuit 48 and the chip element 50. In FIG.
V _DD and V _SS both indicate a drive voltage signal externally supplied to the drive integrated circuit 48. The driving integrated circuit 48 includes a power supply circuit. Its power supply terminal, generates a reference voltage _{V 5} of the drive signal, by resistance dividing the _{V 5} potential internally, _V 1 required for driving the liquid crystal panel _32, V 2, _{V 3,} and _{V 4} Generate a potential. The driving integrated circuit 48 supplies the V ₁ , V ₂ , V ₃ , and V ₄ potentials generated as described above to the connection terminal 46 of the liquid crystal panel 32 after changing the impedance with a built-in voltage follower.

[0041] In FIG. _{3, V SS2 terminal, V OUT} terminal, CAP3 _- terminal, CAP1 ₊ terminal, CAP1 _- terminal, CAP2 ₊ terminal, CAP2 _- terminal, _{V 5} terminals (Fig. 3
Upper V _5), and V _R terminals in is a terminal for conducting a power supply circuit described above. At these terminals, chip components such as a smoothing capacitor (C ₁ ) and voltage-adjusting resistors (R _{1 to} R ₃ ) such that a stable potential (V _{1 to} V ₅ ) is generated in the power supply circuit. 50 are connected.

Further, in FIG. 3, _{V 1} terminal, _{V 2} terminal _{V 3} terminals, _{V 4} terminals, and _{V 5} terminal _(V 5 lower)
From the power supply circuit described above, V
₁ ~V ₅ potential is terminal derived. A chip component 50 such as a smoothing capacitor (C ₂ ) is connected to these terminals in order to stabilize a drive signal supplied to the liquid crystal panel 32. As described above, in the present embodiment, the TCP
The chip component 50 mounted on the driving integrated circuit 4
8 is an external component for generating a stable drive signal.

The connector 52 shown in FIG.
(Not shown). TCP34 is
Power is supplied via the connector 52, and a signal for causing the liquid crystal panel 32 to form a desired display, specifically, a data signal related to display contents, a timing signal related to display timing, and the like are received.

Driving integrated circuit 48 and plural chip parts 5
0 (hereinafter, this circuit is referred to as a “drive signal generation circuit”) generates an appropriate drive signal based on the data signal and the timing signal supplied from the control circuit, and The drive signal is supplied to appropriate data lines 40 and scanning lines 42 via connection terminals 46. As a result, in each of the pixels on the liquid crystal panel 32,
The liquid crystal is in an appropriate alignment state, and a desired display is formed.

As described above, in the liquid crystal device 30 of the present embodiment, the drive signal generation circuit for generating the drive signal based on the signal supplied from the control circuit is realized only by the TCP 34. In other words, the liquid crystal device 3 of the present embodiment
According to No. 0, the circuit board on which the external components are mounted
4, a stable drive signal can be generated without providing any other components. Therefore, according to the liquid crystal device 30 of the present embodiment, the number of components can be reduced as compared with a device requiring a circuit board for external components in addition to TCP, and the manufacturing process is greatly simplified. can do.

Next, a method of manufacturing the liquid crystal device 30 of the present embodiment will be described with reference to FIGS.

FIG. 4 is a flowchart for explaining the contents of a series of processes executed in the process of manufacturing the liquid crystal device 30 of the present embodiment. FIG. 5 is a plan view of a TCP tape material 58 used in the manufacturing process. TCP 34 included in the liquid crystal device 30 of the present embodiment
Is manufactured by the processing of S1 to S4 shown in FIG.

In step S1, the base film 47 is transported and supplied using a known technique, and gang bonding of the driving integrated circuit is performed. The base film 47 is
In the manufacturing process of the TCP 34, the tape material 5 shown in FIG.
8, ie, in a continuous tape form. The tape member 58 is wound around a take-up reel in a state wound around a take-up reel and a take-out reel (neither is shown), so that the tape member 58 moves in one direction (the direction indicated by an arrow in FIG. 5). Conveyed. The driving integrated circuit is mounted on the tape conveyed by the reel by gang bonding.

In S2, the connection state between the driving integrated circuit 48 and the base film 47 is inspected. As a result, only the products determined to have a normal connection state are sent to the subsequent process.

In S3, the chip component 50 and the connector 52 are executed on the base film 47 conveyed in the form of the tape material 58. The chip component 50 and the connector 52 can be mounted on the base film 47 by, for example, soldering. When the above processing ends, the state shown in FIG. 5 is formed.

In S4, the base film 47 conveyed in the form of the tape material 58 is punched into a predetermined shape by a punching die. By executing the above processing, the form of the TCP 34 shown in FIG. 2 is completed.

In S5, the liquid crystal panel 3 is formed by a known method.
2 is manufactured.

In S6, an anisotropic conductive film 56 (see FIG. 2) is attached to the liquid crystal panel 32 manufactured by the processing in S8 so that the connection terminals 46 are covered.

In step S7, the TCP 34 manufactured by the above-described steps S1 to S4 is temporarily bonded to the liquid crystal panel 32 via the anisotropic conductive film 56. More specifically, TC
In a state where each of the output terminals 54 of P34 faces each of the connection terminals 46 of the liquid crystal panel 32, the TCP 34
And the liquid crystal panel 32 are temporarily compressed.

In S8, the provisionally pressed portion between the TCP 34 and the liquid crystal panel 32 is heated to a predetermined temperature under a predetermined pressure. As a result, the TCP 34 is fully press-bonded to the liquid crystal panel 32, and desired conduction between the output terminal 54 and the connection terminal 46 is obtained.

At S9, an operation test of the liquid crystal device 30 is performed. In this step S9, for example, a predetermined inspection signal is supplied to the connector 52 of the TCP 52 so that the liquid crystal panel 32
The status of the device is checked based on whether a normal display appears on the display.

As described above, according to the manufacturing method of the present embodiment, the drive signal generation circuit of the liquid crystal device 30 can be formed thereon while the base film 47 is transported in the form of the tape material 58. That is, according to the manufacturing method of the present embodiment, the drive signal generation circuit of the liquid crystal device 30 can be manufactured only by the tape carrier type manufacturing line.

The drive signal generation circuit of the liquid crystal device 30 can be formed on a single substrate by, for example, a COF (Chip On FPC) method. In a COF-type production line, an FPC board is generally conveyed in a form capable of taking many pieces, and various elements are mounted on the surface thereof.

In a tape carrier type production line, superior productivity can be obtained as compared with a COF type production line. The tape carrier method is CO
Since the positioning accuracy in the transport process is superior to that of the F method, it is advantageous in miniaturizing the terminal interval and the wiring pitch of the integrated circuit. Therefore, according to the manufacturing method of the present embodiment, in which the drive signal generation circuit of the liquid crystal device 30 can be manufactured using only the tape carrier type line, a finer pitch can be obtained compared to the COF type in which the FPC boards are sequentially conveyed. Can be manufactured with better productivity.

Further, the tape carrier system is a mature technology as a system for manufacturing semiconductor products requiring fine processing, and many technologies have already been accumulated for the system. Therefore, according to the manufacturing method of the present embodiment, it is possible to efficiently manufacture the electro-optical device by effectively utilizing the already accumulated technology.

In the above embodiment, the chip component 50 and the connector 52 correspond to the “functional component” according to the first or sixth aspect.

[Second Embodiment] Next, FIGS.
A second embodiment of the present invention will be described with reference to FIG. 6 and FIG. 7, FIG. 1 or FIG.
The same reference numerals are given to the same or corresponding parts as the constituent parts shown in (1), and the description thereof is omitted or simplified.

The liquid crystal device according to the present embodiment has a TCP
34. FIG. 6 is a cross-sectional view of the TCP 34 included in the liquid crystal device of the present embodiment. The base film 47 of the TCP 34 includes a conductive layer 60 for realizing a wiring layer for connecting the driving integrated circuit to the chip element 50 and the like, an output terminal 54 (see FIG. 2), and an insulating coat 62 for covering the conductive layer 60. And The insulating coat 62 is an epoxy-based or UV-curable paint, which insulates the conductive layer 60 and prevents dust, foreign matter, solder, or the like from adhering to the conductive layer 60.

In FIG. 6, the driving integrated circuit 48 is connected to the conductive layer 60 of the base film 47 by gang bonding as in the case of the first embodiment.
The joint between the conductive layer 60 and the driving integrated circuit 48, that is, the joint between the finger lead and the Au bump is sealed with a resin mold 63. In addition, chip component 5
Numeral 0 is connected to the conductive layer 60 of the base film 47 by soldering.

In the tape carrier system, which is a manufacturing system of the TCP 34, both surfaces of the base film 47 can be used as a component mounting surface. For this reason, in the present embodiment, the driving integrated circuit 48 and the chip element 50
And are mounted on different surfaces of the base film 47, respectively. As described above, the TCP 34 has a high degree of freedom regarding the arrangement of elements to be mounted.

FIG. 7 is a sectional view of a main part of a drive signal generation circuit manufactured by the COF method. In FIG.
The FPC 66 includes a conductive layer 60 and an insulating coat 62, like the base film 47 of the TCP. The driving integrated circuit 48 and the chip component 50 are TC
As in the case of P34, each is connected to the conductive layer 60 via the anisotropic conductive film 64 or by soldering.

In the COF method, the component mounting surface is specified as one surface of the FPC. Therefore, when the drive signal generation circuit is manufactured by the COF method, the drive integrated circuit 48 and the chip component 50 are always mounted on the same surface of the FPC 66 as shown in FIG. Base film 47
The tape carrier system in which elements can be mounted on both sides is superior to the COF system in that respect as well. Therefore,
ADVANTAGE OF THE INVENTION According to the electro-optical device concerning this invention, compared with the apparatus provided with the drive signal generation circuit manufactured by the COF method, the design flexibility can be greatly secured.

In the first and second embodiments, a liquid crystal device is exemplified as an example of the electro-optical device. However, the electro-optical device is not limited to this. That is, the technology of the present invention may be applied to an optical device using electroluminescence (EL), a plasma display device (PDP), or the like.

[Example of Electronic Apparatus] Next, an embodiment of an electronic apparatus provided with the above-described electro-optical device will be described with reference to FIG.

FIG. 8 is a perspective view of an information terminal device 100 equipped with the electro-optical device of the present invention. Information terminal equipment 10
0 has a display unit 102 for displaying information such as a telephone number. The display unit 102 is configured by the electro-optical device of the present invention. As described above, the electro-optical device of the present invention (1) has excellent productivity, (2) is suitable for fine pitching of wiring and the like, (3) enables effective utilization of accumulated technology, and (4) It has the feature of having a high degree of freedom in design. Therefore, according to the information terminal device 100, the display unit 10
2 can enjoy the effects resulting from those features.

The electro-optical device of the present invention can be used by being mounted on, for example, a wristwatch-type electronic device or an electro-optical television, in addition to the information terminal device 100 described above.

[Brief description of the drawings]

FIG. 1 is a plan view of a liquid crystal device which is a first embodiment of an electro-optical device according to the invention.

FIG. 2 is an exploded perspective view of a liquid crystal device which is a first embodiment of the electro-optical device according to the invention.

FIG. 3 is a diagram illustrating a connection between a driving integrated circuit and a chip component included in the liquid crystal device according to the first embodiment of the electro-optical device according to the invention.

FIG. 4 is a flowchart for explaining a method for manufacturing a liquid crystal device which is the first embodiment of the electro-optical device according to the present invention.

FIG. 5 is a plan view illustrating a state of a process of manufacturing a TCP included in the liquid crystal device according to the first embodiment of the electro-optical device according to the invention.

FIG. 6 is a sectional view illustrating a main part of a liquid crystal device which is a second embodiment of the electro-optical device according to the invention.

FIG. 7 is a cross-sectional view illustrating a main part of a liquid crystal device to be compared with the electro-optical device according to the invention.

FIG. 8 is a perspective view of an information terminal device equipped with the electro-optical device according to the present invention.

FIG. 9 is a plan view of a conventional electro-optical device.

[Explanation of symbols]

 Reference Signs List 30 liquid crystal device 32 liquid crystal panel 34 TCP (Tape Carrier Package) 36, 38 light transmitting substrate 40 data line 42 scanning line 46 connecting terminal 47 base film 48 driving integrated circuit 50 chip component 52 connector 54 output terminal 56; 64 anisotropic Conductive conductive film 58 Tape material 66 FPC (Flexible Printed Circuit) 100 Information terminal equipment

Claims (8)

[Claims] 1. An electro-optical device for realizing a desired display by applying an electric field to an electro-optical material interposed between two substrates disposed opposite to each other, wherein the electro-optical device is electrically connected to the substrates. A tape carrier package for supplying a drive signal for realizing a desired display to the substrate in the state, wherein the tape carrier package is mounted on the base film and a base film conductively connected to the substrate. An electro-optical device comprising: a driving integrated circuit; and a functional component mounted on the base film separately from the driving integrated circuit. 2. The driving integrated circuit and the functional component form a driving signal generation circuit that receives a control signal according to the content to be displayed and generates a driving signal for realizing the display. The electro-optical device according to claim 1, wherein: 3. The electro-optical device according to claim 1, wherein the functional component includes an adjusting resistor for adjusting a voltage signal generated by the driving integrated circuit. 4. The electro-optical device according to claim 1, wherein the functional component includes a smoothing capacitor for smoothing a signal generated by the driving integrated circuit. . 5. The electro-optical device according to claim 2, wherein the functional component includes a connector for obtaining electrical continuity between the tape carrier package and an external device. 6. A method for manufacturing an electro-optical device for realizing a desired display by applying an electric field to an electro-optical material interposed between two substrates disposed opposite to each other, comprising: A step of mounting a driving integrated circuit and a functional component different from the driving integrated circuit on a base film for a tape carrier package to be conveyed, and after the mounting of the driving integrated circuit and the functional component is completed, Cutting a film into a predetermined shape; and a circuit formed by the driving integrated circuit and the functional component, and a desired conduction between the substrate and the substrate is ensured.
Electrically conductively connecting the base film cut into a predetermined shape to the substrate. 7. The driving integrated circuit and the functional component constitute a driving signal generation circuit that receives a control signal according to the content to be displayed and generates a driving signal for realizing the display. The method for manufacturing an electro-optical device according to claim 6, wherein: 8. An electronic apparatus comprising the electro-optical device according to claim 1.