JPH09125244A - Jig for film formation and film formation - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to form external electrodes of chip-like circuit part with high accuracy and ease by making it possible to three-dimensionally form the thin films over plural intersected surfaces of chip elements with good accuracy. SOLUTION: This jig for film formation has a planar jig body 5 which is bored with holes 6 having the sizes corresponding to the heights and widths of the second flanks and end faces of parts (a) and is formed with recessed parts 7, 7 alongside the apertures of these holes 6 and a planar mask 1 which is superposed on the jig body 5 and is bored with holes 8 so as to make both sides correspondent to the shapes of the recessed parts 7, 7 and to make the central parts cross the apertures of the holes 6. The parts (a) are housed in the spaces partially closed by the holes 6 of the jig body 5 and the mask 1. The parts (a) are irradiated with the particles of a film forming material diagonally toward their first flanks from the direction where the recessed parts 7, 7 overhang. The particles of the film forming material infiltrate not only to the first flanks of the parts (a) but to the second flanks intersecting therewith as well, by which the films are formed on the flanks. The film formation patterns are regulated by the holes 8 of the mask 1 and the recessed parts 7, 7 of the jig body.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to forming a film by depositing particles of a film-forming material on a predetermined position on a side surface of a hexahedral part and a part of a surface adjacent to the side surface. The present invention relates to a film forming jig used to regulate a film pattern and a film forming method using the jig.

[0002]

2. Description of the Related Art Chip-shaped circuit components such as a monolithic ceramic capacitor and a monolithic ceramic inductor are generally in the shape of a rectangular parallelepiped, that is, a so-called hexahedron. In such a chip-shaped circuit component, the internal electrode pattern is drawn to the outside and has an external electrode on the side surface for soldering to the land electrode formed on the circuit board. In such a chip-shaped circuit component, conventionally, the chip element body is dipped in the conductive paste to apply the conductive paste at a predetermined position, which is dried and baked to form the external electrodes. Further, as another method of forming the external electrodes of the chip-shaped circuit component, there is also a method of forming the external electrodes by forming a conductor film at a predetermined position on the chip element body by a vacuum deposition method or a sputtering method. Has been done.

[0003]

However, in the former method of forming the external electrodes by applying the conductive paste by the former dipping method, the accuracy of applying the conductive paste to the chip body is poor, so that the size of the external electrodes is reduced. And the film thickness tends to vary. Therefore, defective products are likely to be produced and the yield is low. Further, since the coating thickness of the conductive paste tends to be thick, there is also a problem that the external electrodes formed in the ultra-small chip-shaped circuit component are too thick. On the other hand, when the external electrodes are formed by using the latter vacuum film forming apparatus, it is suitable for forming a thin film on a flat surface such as a circuit board with high accuracy, but it is not suitable for chip-like circuit components. In addition, it is not suitable for forming a three-dimensional film over a plurality of intersecting surfaces. Therefore, it was difficult to apply depending on the shape of the required external electrode.

In view of the above problems in the conventional external electrode forming means, the present invention makes it possible to form a thin film three-dimensionally with high precision over a plurality of intersecting surfaces of the chip body. It is an object of the present invention to make it possible to easily form the external electrodes of the circuit component with high accuracy.

[0005]

According to the present invention, in order to achieve the above object, the particles of the film-forming material are obliquely applied to the side surface of the part a on which the film is to be formed, and the particles of the film-forming material are applied to the part a. Of the jig main body 5 having the recesses 7 and 7 corresponding to the portion where the component a is housed and the film is formed, and the jig main body 5 corresponding to the recesses 7 and 7 The mask 1 having the holes 8 was used, and the film formation size was regulated. Thereby, the film can be formed in a predetermined pattern on the side surface of the component a and the other surface intersecting with the side surface.

That is, in the film-forming jig according to the present invention, a hole 6 having a size corresponding to the height and width of the second side surface and the end surface of the component a is formed, and the opening of the hole 6 is located laterally. A plate-shaped jig main body 5 having concave portions 7 and 7 formed therein, and a jig body 5 that is overlapped with the jig main body 5 and that corresponds to the shape of the concave portions 7 and 7 and that crosses the opening of the hole 6. 8 has a plate-shaped mask 1 which is opened.

Here, the jig body 5 is constructed by stacking a plurality of plate-shaped members 2, 3, and 4. The recesses 7, 7 are formed by the edges of part of the holes of the plate-shaped members 2, 2 which are superposed on the outermost side and the surfaces of the plate-shaped members 3, 3 inside the holes. The thickness β of the plate-shaped members 2 and 2 stacked on the outermost side corresponds to the film formation height of the film on the surface adjacent to the side surface of the component a. Further, it is preferable that the mask 1 is made of a material such as ceramic that is not easily deformed by heat.

Next, in the film forming method according to the present invention, the film forming jig as described above is used, and the first side surface of the component a is exposed from the opening side of the hole 6 of the jig body 5. The part a is housed in the hole 6, the both sides of the hole 8 are aligned with the shapes of the recesses 7, 7 and the mask 1 is placed on the jig main body 5. From the direction in which the recesses 7, 7 project, It is characterized in that particles of the film-forming material are applied obliquely toward the first side surface.

Here, it is appropriate that the angle between the incident direction of the particles of the film-forming material on the part a and the side surface of the part a is 30 to 60 °. The recesses 7 and 7 and the holes 8 of the mask 1 are patterned on the part a as a film-forming use according to the incident direction of the particles of the film-forming material to the part a, and the shadow of the particles of the film-forming material is formed. It must be offset by a width that does not cause it. The "particles of the film-forming material" here generally mean molecules of the film-forming material, but they are fine particles having a size equal to or larger than the molecules, and the particles are deposited on the surface of the component a to form a film. Those that can be formed are included.

In the film forming jig and the film forming method using the same according to the present invention as described above, the particles of the film forming material are applied obliquely toward the first side surface of the part a, so that Particles of a film-forming material can be deposited not only on one side surface but also on a second side surface intersecting with the one side surface to form a film. The film-forming width is regulated by the width of the hole 8 in the mask 1. The dimension for forming the film on the second side surface of the component a is
Recesses 7 formed on both sides of the opening of the hole 6 of the jig body 5,
Regulated by a depth of 7. Accordingly, it is possible to accurately form a film in a predetermined pattern on a predetermined position on the first side surface of the component a and the second side surface intersecting with the first side surface.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Next, embodiments of the present invention will be described specifically and in detail with reference to the drawings. FIG. 1 is an exploded view of an example of a film-forming jig according to the present invention, and FIGS. 2 and 3 show an assembly of the film-forming jig.
It is a longitudinal cross-sectional view of the width direction and the length direction of the component a with the component a set therein. As shown in these figures, the film-forming jig is composed of a pair of masks 1 and a jig body 5.

The jig body 5 comprises a total of four plate-shaped members 2,
It is configured by stacking 2, 3, 3, and 4, of which the plate-shaped member 4 at the center is thick, and the plate-shaped members 2, 2, 3, and 3 stacked on the outside thereof are thinner than this.
Further, the thickness of the plate-like members 2 and 2 superposed on the outermost side is, as will be described later, the thickness of the film to be formed on the second side surface of the component a (the widest lateral surface in FIG. 1). It is set to be the same as the minimum height dimension. The total thickness when the plate-shaped members 2, 2, 3, 3 and 4 having such dimensions are overlapped is the same as the height in FIG. 1 of the component a to be film-formed.

These plate-like members 2 constituting the jig body 5,
At the positions corresponding to each other at 2, 3, 3 and 4, according to the vertical and horizontal dimensions of the main film-forming surface of the component a to be film-formed, that is, the first side surface (the upper and lower surfaces in FIG. 1). A slightly larger hole 6 is formed. Among these, the vertical and horizontal dimensions of the hole of the thick central plate-like member 4 are the largest, and the vertical and horizontal dimensions of the holes of the plate-like members 3 and 3 on both sides thereof are slightly smaller than the vertical and horizontal dimensions of the plate-like member 4. Further, the central portions of the plate-shaped members 2 and 2 which are superposed on the outermost sides are projected and opened on both sides. The width of this overhanging portion is set to be substantially the same as the width for forming a film on the second side surface of the component a.

These plate-shaped members 2, 2, 3, 3, 4 are
The jig body 5 is formed by sequentially stacking the plate-shaped members 3 and 3 and the plate-shaped members 2 and 2 on both sides of the thickest plate-shaped member 4. A hole 6 having the same height as the height of the component a is formed in such a jig body 5, and the hole 6 is formed by the plate-shaped members 2, 2,
It is slightly wider at the intermediate plate-shaped member 4 portion than at the third and third portions. Further, due to the edges of the portions of the plate-shaped members 2 and 2 that project to both sides of the holes and the surfaces of the plate-shaped members 3 and 3, the recesses 7 having the same depth as the thickness of the plate-shaped members 2 and 2 are formed on both sides of the hole 6. , 7 are formed. From the above dimensions, the width of these recesses 7, 7 is
The width is the same as the width of the film to be formed on the second side surface of the component a, and the depth of the recesses 7 is the same as the height of the film to be formed on the second side surface of the component a. become.

The mask 1 is made of a thin flat plate and has a hole 8 at a position corresponding to the hole 6 of the jig body 5.
Both ends of the hole 8 correspond to the recesses 7 and 7 of the jig body 5, and when the hole 8 is overlapped with the recesses 7 and 7 and overlapped with each other, the middle portion of the hole 8 is the jig body 5. The opening of the hole 6 is crossed in the width direction. Therefore, this mask 1
The hole 8 is the same as the width of the recesses 7, 7 and the same width as the film to be formed on the first side surface of the component a.

The plate-shaped members 2, 2, 3, 3, 4 and the mask 1 constituting the jig body 5 are usually made of a metal having a high heat resistance, such as molybdenum, tungsten or stainless steel. It is preferable to use ceramics such as alumina, zirconia, aluminum nitride, and silicon nitride. Since the jig body 5 and the mask 1 made of such a ceramic have a small coefficient of thermal expansion, even if the temperature rises due to the impact of particles of the film-forming material during film formation, the dimensional change due to thermal expansion is small. The film can be formed with high accuracy. Then, the jig body 5 includes the plurality of plate-shaped members 2, 2, 3, 3, as described above.
Since the holes 5 are overlapped with each other, the hole 6 having a relatively complicated shape can be easily and accurately formed. at least,
Only the plate-shaped members 2, 2, 3, 3 that are superposed on the outside of the mask 1 and the jig body 5, that is, the plate-shaped member 4 inserted in the center is made of ceramic, while the plate-shaped member 4 is It may be made of metal. In addition, in FIGS.
Only one set of the jig body 5 and the holes 6 and 8 of the mask 1 is shown.
In reality, many holes 6 and 8 are arranged vertically and horizontally.

Next, a method of forming a film on the part a using this film forming jig will be described. First, as shown in FIG. 1, thin plate-shaped members 3, 3 and 2, 2 are sequentially superposed on both sides of a thick plate-shaped member 1 at predetermined positions to form a jig body 5. As a result, the holes 6 and the recesses 7 as described above are formed. Next, from the state shown in FIG. 1, for example, the direction of the component a which is the chip element of the chip-shaped circuit component is aligned with the hole 6, and the component a is stored in the hole 6 as shown in FIGS. 2 and 3. To do. As described above, since the height of the component a in FIG. 1 and the thickness of the jig body 5 are the same, the two opposing first side surfaces of the component a have upper and lower surfaces of the jig body 5, that is, a plate. It can be stored so as to be flush with the surfaces of the shape members 2, 2. In this state, as shown in FIG. 2, only the upper and lower parts of the central portion of the first side surface of the component a and the second side surface orthogonal to the first side surface, that is, the portions corresponding to the recesses 7, 7 are exposed to the outside. Exposed. The gap between the housed part a and the plate-shaped members 2, 2, 3, 3 on the outside of the jig body 5 is indicated by g in FIG.

Next, the mask 1 is formed on both sides of the recesses 7, 7.
Are superposed at a predetermined position. In this state, the mask 1
The edges on both sides of the hole 8 overlap the edges of the recesses 7, 7 and the central portion of the hole 8 crosses the center of the first side surface of the component a. As a result, due to the holes 8 and the recesses 7 and 7 of the mask 1, only the central part of the component a and the recesses 7 and 7 on both sides thereof are exposed to the outside, and the other parts are closed.

In this state, the film forming jig is set in, for example, a vacuum chamber of the film forming apparatus. At this time, the film forming jig is arranged so that the emission source of the film forming material is located in the longitudinal direction of the hole 8 of the mask 1, that is, in the lateral direction of the first side surface of the component a. Then, the hole 8 of the mask 1 and the recess 7 of the jig body 5,
Particles of the film-forming material are applied to the surface of the component a exposed from 7 from the oblique d direction, and the particles are adhered to the surface of the component a.
In FIG. 2 and FIG. 3, only one of the incident directions d of the particles of the film-forming material to the part a is shown, but when forming a film on the second side surface opposite to the drawing, The film is arranged on the opposite side and is similarly formed. In that case, it is preferable to make the incident direction d of the particles of the film-forming material symmetrical on both sides in order to suppress the variation of the film.

Particles of the film-forming material are controlled by the holes 8 of the mask 1 at the site of incidence on the surface of the component a.
No film is formed on the shadowed part of the. Therefore, on the first side surface of the component a, the hole 8 of the mask 1 is formed only in the central portion.
The film-forming material is deposited with the same width as that to form a film. Further, since the particles of the film forming material are obliquely applied from the side of the first side surface of the component a, the particles of the film forming material also enter the second side surface orthogonal to the first side surface of the component a and adhere to the second side surface. Be filmed. The portion where the film is formed is regulated by the hole 8 of the mask 1 and the concave portion 7 of the jig body 5, the width thereof is substantially equal to the width of the hole 8 of the mask 1, and the height thereof is the depth of the concave portion 7, that is, In the illustrated example, the thickness β of the outermost plate-shaped members 2 and 2 (see FIG. 2) is substantially equal.

The incident angle θ of the particles of the film forming material with respect to the first side surface of the part a is suitably 30 to 60 °.
This is because when θ exceeds 60 °, the particles of the film-forming material infiltrate through the gap g between the narrowest inner wall of the hole 6 of the jig body 5 and the second side surface of the component a, and the film pattern becomes blurred. ,
This is because the accuracy of the pattern is reduced. Also, θ is 30
If the length is less than 0, the edge of the hole 8 of the mask 1 becomes a shadow and the required film cannot be formed on the second side surface of the component a unless the length α of the recess 7 is set to a sufficient value. Therefore, the arrangement pitch of the jig body 5 and the holes 6 and 8 of the mask 1 is appropriately narrowed so that a large number of parts a can be stored in the film forming jig, and at the same time, the sharp contour and accuracy of the film can be improved. In order to obtain it, it is preferable that θ is 30 ° or more.

Thereafter, the film forming jig is taken out of the vacuum chamber, the film forming jig is disassembled as shown in FIG. 1, and the part a is taken out from the hole 6. As shown in FIG. 1, the film c thus formed is formed in the center of the first side surface of the component a so as to cross the same side surface, and the end thereof is a second surface orthogonal to the first side surface. Is formed on the side surface of. The width of the film is the same as the width of the hole 8 of the mask 1, and the height at which the film is formed on the second side surface of the component a is the depth of the concave portion 7 of the jig body 5, that is, the jig body 5. Thickness β of the outermost plate-shaped members 2 and 2
(See FIG. 2). Such film formation can be performed simultaneously on both side surfaces by disposing the emission sources on both the first side surfaces of the component a, and the film forming jig is set again in the vacuum chamber. It is also possible to carry out sequentially and individually.

In the above example, the jig body 5 was constructed by stacking a plurality of plate-shaped members 2, 2, 3, 3 and 4, but the number of stacked plates can be appropriately changed.
For example, the outermost plate-shaped members 2 and 2 may be integrated with the masks 1 and 1, respectively, the plate-shaped members 2 and 3 may be integrated, or the jig body 5 itself may be integrated as a whole.
Further, in the above-described example, one film is formed on each of the opposing first side surfaces of the component a and on each of the second side surfaces on both sides thereof, but it is also possible to form a plurality of films as shown in FIG. 4, for example. It is possible. In FIG. 4, an example is shown in which the film is formed at two locations from the first side surface to the second side surface. Also,
The film can be formed not only on the side surface but also on the end surface.

[0024]

As described above, according to the present invention, it is possible to form a three-dimensional film easily and highly accurately over a plurality of surfaces of the component a by the vacuum deposition method or the sputtering method. Therefore, it is possible to obtain a film forming jig and a film forming method which are particularly advantageous for forming the external electrodes of a small chip-shaped component.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of essential parts showing an example of a film forming jig according to the present invention.

FIG. 2 is a vertical sectional front view of an essential part showing an example of the film forming jig.

FIG. 3 is a vertical sectional side view of an essential part showing an example of the film forming jig.

FIG. 1 is an exploded perspective view of essential parts showing another example of a film forming jig according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Mask 2 Plate-shaped member constituting jig main body 3 Plate-shaped member constituting jig main body 4 Plate-shaped member constituting jig main body 5 Jig main body 6 Hole in jig main body 7 Recessed portion of jig main body 8 Mask Hole a part

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[Procedure amendment]

[Submission date] February 22, 1996

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Brief description of drawings

[Correction method] Change

[Correction contents]

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of essential parts showing an example of a film forming jig according to the present invention.

FIG. 2 is a vertical sectional front view of an essential part showing an example of the film forming jig.

FIG. 3 is a vertical sectional side view of an essential part showing an example of the film forming jig.

FIG. 4 is an exploded perspective view of essential parts showing another example of the film forming jig according to the present invention.

[Explanation of reference numerals] 1 mask 2 plate-shaped member constituting the jig body 3 plate-shaped member constituting the jig body 4 plate-shaped member constituting the jig body 5 jig body 6 hole in the jig body 7 jig Recess in main body 8 Hole in mask a Part

Claims (8)

[Claims] 1. A method of depositing particles of a film-forming material on a first side surface and a second side surface adjacent to the first side surface of a hexahedral part (a) to form a film, A film forming jig for regulating a film pattern, wherein a hole (6) having a dimension corresponding to the height and width of the second side surface and the end surface of the component (a) is formed. A plate-shaped jig body (5) having recesses (7) and (7) formed on the sides of the opening.
And a plate which is superposed on the jig body (5) and which has a hole (8) corresponding to the shape of the recesses (7) and (7) and which intersects the opening of the hole (6). Forming mask (1). 2. The film forming apparatus according to claim 1, wherein the jig body (5) is formed by stacking a plurality of plate-shaped members (2), (3) and (4). Jig. 3. The recesses (7), (7) have a part of the holes of the outermost plate-like members (2), (2) and the plate-like members (3) inside thereof. The film forming jig according to claim 2, which is formed by the surface of (3). 4. A plate-shaped member (2) stacked on the outermost side,
The thickness (β) of (2) corresponds to the film forming height on the second side surface adjacent to the first side surface of the component (a). Film forming jig. 5. The film forming jig according to claim 1, wherein the mask (1) is made of ceramic. 6. A method for forming particles by depositing particles of a film-forming material at predetermined positions on a first side surface of a hexahedral component (a) and a second side surface adjacent thereto. , A hole (6) having a dimension corresponding to the height and width of the second side surface and the end surface of the part (a) is opened, and this hole (6)
And a plate-shaped jig main body (5) having concave portions (7) and (7) formed on the sides of the opening of the concave portion (7), (7) and (7). ) And a plate-shaped mask (1) having a hole (8) opened so as to cross the opening of the hole (6). 5) The part (a) is placed in the hole (6) so that the first side surface of the part (a) is exposed from the opening of the hole (6).
The mask (1) was placed on the jig body (5) by accommodating both sides of the hole (8) with the shapes of the recesses (7) and (7), and the recesses (7) and (7) were projected. From the direction, parts (a)
Of the film-forming material is obliquely applied to the first side surface of the film. 7. The film forming method according to claim 6, wherein an angle between the incident direction of the particles of the film forming material to the part (a) and the side surface of the part (a) is 30 to 60 °. Method. 8. The recesses (7), (7) and the holes (8) of the mask (1) are offset by a width that does not shade the particles of the film-forming material incident on the component a. The film forming method according to claim 6 or 7.