JPH09123654A - Manufacture of non-contact type ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to execute the printing of high quality on the surface. SOLUTION: An antenna 6 is assembled in the interior of the non-contact type IC card, and the card board 7 that the connecting terminals 5a, 5b of the antenna 6 are exposed from the recess 7a is manufactured. Then, the predetermined print of a photograph, a graphic form and characters is conducted on the surface of the board 7. Thereafter, an IC module 8 is engaged with the recess 7a, stuck thereto, and terminals 5a, 5b are respectively electrically connected to connecting terminals 9a, 9b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contactless IC card for transmitting and receiving data to and from an external device in a contactless manner, and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, from the viewpoint of efficiency of data processing and excellent security, IC cards having an IC circuit formed of a semiconductor element have become popular. Such an IC card is classified into a contact type in which an external terminal is connected to a terminal of an external device to transmit and receive data, and a non-contact type in which an antenna is provided and data is transmitted and received to and from the external device by electromagnetic waves. is there. Recently, the drive power of the IC circuit is supplied by electromagnetic induction, and the demand for a non-contact type IC card without a built-in battery is increasing.

In a conventional non-contact type IC card, for example, as shown in FIG. 10, an IC module composed of an IC chip 68 and an antenna 66 is mounted between a front resin sheet 62 and a back resin sheet 64. It is configured. In the manufacturing process of the non-contact type IC card, the upper and lower surfaces of a white core of vinyl chloride resin are sandwiched by a transparent over sheet and a white over sheet, and they are heated and compressed by a heat press to form an antenna,
The resin sheet 62 on the front side and the resin sheet 64 on the back side are separately manufactured by cutting recesses that match the shapes of components such as a non-contact type IC module, a coil, a capacitor, and a battery. Next, for example, after a thermosetting type adhesive is applied to the resin sheet 64 on the back, parts such as the IC chip 68 and the antenna 66 are mounted in alignment with the positions of the recesses, and the resin sheet 62 on the front side is adhered. Press the mixture with a press until it hardens. Then, predetermined printing such as photographs, figures and characters is performed on the front surface of the front resin sheet 62 and the back resin sheet 64.

[0004]

However, in the method of manufacturing a non-contact type IC card described above, the IC chip 68 is used.
After mounting parts such as the above, predetermined printing of photographs, figures, characters, etc. is performed on the surface of the front resin sheet 62 and the back resin sheet 64, so that the front resin sheet 62 and the back resin sheet 64 surface There is a problem in that the printing applied to the print may be defective. This is because when components such as the IC chip 68 are mounted, irregularities corresponding to these components occur on the front surface of the resin sheet 62 on the front side and the resin sheet 64 on the back side, and the quality of printing deteriorates due to the influence of these irregularities. This is because.

Further, when a card is manufactured by sandwiching an electronic component between resin sheets such as upper and lower vinyl chloride in a sandwich shape, and heating and compressing the same, unevenness of the electronic component is reflected on the front and back resin sheets, and In some cases, there is a case where the electronic component and the resin sheet are warped or sag due to a difference in thermal conductivity between the electronic component and the resin sheet, resulting in a poor appearance, or failure due to pressure or heat applied to the electronic component.

The present invention has been made in view of the above-mentioned problems of the prior art, and an object of the present invention is to provide a method for manufacturing a non-contact type IC card capable of performing high quality printing on the surface of the non-contact type IC card. To do. It is another object of the present invention to provide a non-contact type IC card and a method for manufacturing the same, which can suppress the occurrence of a defective appearance due to warpage or thermal sag during manufacturing.

[0007]

In order to solve the above-mentioned problems of the prior art and to achieve the above-mentioned object, the method for manufacturing a non-contact type IC card of the present invention has an antenna for data transmission and reception inside. A card board having a recess for exposing the terminals of the antenna to the outside is manufactured, and a circuit module having a connection terminal and mounting a required IC circuit is electrically connected to the connection terminal and the terminal of the antenna. It is mounted in the recess so as to be connected to.

In the method for manufacturing a non-contact type IC card of the present invention, preferably, the circuit module is bonded to the recess by using an anisotropic conductive film as an adhesive sheet. Further, the non-contact type IC card of the present invention comprises an antenna substrate having an antenna for data transmission / reception incorporated therein, a plurality of resin sheets for supporting the antenna substrate from both sides, and an IC circuit connected to the terminals of the antenna. And a circuit module mounted in a recess formed in the resin sheet, wherein the antenna substrate and the resin sheet are laminated symmetrically and integrated as viewed from the center position in the thickness direction of the card. .

Further, in the method for manufacturing a non-contact type IC card of the present invention, an antenna provided with a connection terminal having a thickness larger than a tolerance of counterbore processing is incorporated into an antenna substrate, and the antenna substrate is covered with a plurality of resin sheets on both sides. After sandwiching it from above and hot pressing to integrate it, so that the connection terminals will appear,
A recess is formed in the heat-pressed resin substrate by counterboring, and a circuit module is mounted in the recess so that an IC circuit is electrically connected to the connection terminal.

Further, according to the method of manufacturing a non-contact type IC card of the present invention, a dummy made of a material which is not fused to the antenna substrate at the time of hot pressing from one surface side of the antenna substrate incorporating the antenna having the connection terminal. The first resin sheet incorporating the member is heat-pressed so that the connection terminal and the dummy member are in contact with each other, and the second resin sheet is heat-pressed and integrated from the other surface side of the antenna substrate. , The heat-pressed card substrate is cut from a side opposite to the connection terminal to a position reaching the dummy member, and the dummy member is removed to form a concave portion in which the connection terminal is exposed. The circuit module is mounted in the recess so that the circuit module is electrically connected to the connection terminal.

Further, in the method for manufacturing a non-contact type IC card of the present invention, injection molding is performed using a mold in a state where the connection terminal of the antenna substrate incorporating the antenna having the connection terminal is covered with the covering means. After forming the resin layers on both sides of the antenna substrate, the covering means is removed to form a recess in which the connection terminal is exposed, and a circuit module is formed so as to electrically connect the IC circuit to the connection terminal. It is mounted in the recess.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION First Embodiment Hereinafter, an embodiment of a method for manufacturing a non-contact type IC card according to the first embodiment of the present invention will be described.

1 and 2 are views for explaining the method of manufacturing the non-contact type IC card of this embodiment. First, FIG.
As shown in, the thin resin films 2 and 4 and the substrate 3 are manufactured according to the shape of the non-contact type IC card to be manufactured. The resin films 2 and 4 and the substrate 3 are manufactured using a resin such as glass epoxy, polyimide and PET (polyethylene terephthalate). Then, on the surface of the substrate 3, the coiled antenna 6 and the connection terminals 5a. And 5b.

Next, as shown in FIG. 1, the card board 7 is manufactured by laminating the board 3 sandwiched by the resin films 2 and 4. The lamination processing of the resin films 2 and 4 and the substrate 3 is performed by using a hot press and an adhesive, or by so-called insert molding in which a component is fixed in a mold for injection molding and integrally molded.

Then, predetermined printing such as photographs, figures and characters is performed on the surface of the card substrate 7. Next, as shown in FIG. 2, a countersink process is performed on the surface of the card substrate 7 to form a recess 7a, and the connection terminals 5a and 5b printed on the surface of the substrate 3 are exposed.

Next, as shown in FIG. 2, the IC module 8 having the connection terminals 9a and 9b on the lower surface is connected to the connection terminal 5
a, 5b and the connection terminals 9a, 9b are electrically connected to each other, the recess 7 of the card substrate 7 is provided with an adhesive.
The non-contact type IC card 1 is completed by fitting in a. still,
In the bonding, at least the bonding surfaces of the connection terminals 5a, 5b and the connection terminals 9a, 9b are each made of a conductive adhesive to ensure insulation between the connection terminals 5a, 5b and between the connection terminals 9a, 9b. Need to keep.

The IC module 8 is formed by resin-molding a substrate on which an IC circuit using a semiconductor element or the like and other electronic parts are mounted so that the connection terminals 9a and 9b are exposed. As described above, in the method for manufacturing the non-contact type IC card according to this embodiment, the antenna 6
Other than the IC chip and electronic parts are printed on the surface of the card board 7 which is not incorporated in the card board 7,
Printing can be performed with high accuracy. That is, when printing is performed, the IC chip and electronic components other than the antenna 6 are not incorporated in the card substrate 7, so that the card substrate 7
The surface of has a relatively small unevenness and has good printing conditions.

Further, in the method for manufacturing a non-contact type IC card according to this embodiment, the card substrate 7 to be printed and the IC
Since the module 8 and the module 8 are manufactured separately, the yield can be improved and the manufacturing time can be shortened. The operation of the non-contact type IC card 1 manufactured by the manufacturing method according to this embodiment described above will be described below.

For example, as shown in FIG. 3, an electric field corresponding to a communication signal from the data processing device is generated in the coil 73 via the amplifier 70, and the magnetic field from the coil 73 causes the antenna 6 of the non-contact type IC card 1 to operate. The magnetic field is induced without contact. Then, the current due to the electromotive force generated by the magnetic field induced in the antenna 6 is rectified by the rectifier circuit 72 via the capacitor C1, and the communication signal from the data processing device is sent to the IC chip 40 via the capacitor C2 and the resistor R. A voltage corresponding to the voltage is generated, and based on this voltage, the IC chip 4
0 detects a communication signal from the data processing device.

On the other hand, when the communication signal is output from the IC chip 40 to the data processing device, the signal is propagated in the reverse flow of the above flow. Second Embodiment A method for manufacturing a non-contact type IC card according to this embodiment is
The method is basically the same as the method for manufacturing the non-contact type IC card according to the first embodiment described above, but the anisotropic conductive film is used as an adhesive sheet to fit the IC module 8 into the recess 7a of the card substrate 7. The difference is that they are glued together.

FIG. 4 is a view for explaining the method of manufacturing the non-contact type IC card of this embodiment. In the method for manufacturing a non-contact type IC card of this embodiment, as shown in FIG. 4, the IC module 8 is fitted and fixed in the recess 7 a of the card substrate 7 via the anisotropic conductive film 10. The anisotropic conductive film 10 is a film having conductivity in the thickness direction and insulating properties in the surface direction. IC module 8 is recessed 7a
Then, the connection terminals 9a and 9b and the connection terminals 5a and 5b are positioned to face each other via the anisotropic conductive film 10. Therefore, the connecting terminals 9a, 9b and the connecting terminals 5a, 5b are formed by the conductivity of the anisotropic conductive film 10 in the thickness direction.
b is electrically connected to the connection terminals 5a and 5b.
The insulation between them and between the connection terminals 9a and 9b is maintained.

Therefore, the non-contact type I according to this embodiment is
According to the method of manufacturing the C card, the card substrate 7 and the IC module 8 can be bonded by a simple method, and the yield can be further improved and the manufacturing time can be shortened. It is not limited to the above-described embodiments of the present invention. For example, in the above-described embodiment, the case where printing is performed on the surface of the card substrate 7 after the card substrate 7 is manufactured has been exemplified, but the present invention, for example, applies the resin films 2 and 4 before the card substrate 7 is manufactured. You may make it print on the surface.

Further, in the above-described embodiment, the case where the card substrate 7 is countersunk to form the concave portion 7a as the concave portion is exemplified, but the present invention is integrated with the card substrate 7 at the time of injection molding, for example. The concave portion 7a may be formed in the recess. Third Embodiment FIG. 5 is a configuration diagram of the non-contact type IC card 11 of the present embodiment.

As shown in FIG. 5, the non-contact type IC card 1
1, resin films 13a and 13b are arranged so as to sandwich a substrate 14 having an antenna (not shown) from both sides. Further, oversheets 12a and 12b are arranged so as to sandwich the resin films 13a and 13b from both sides.

Here, the substrate 14 has a thickness of about 15 to 3
An antenna made of 0 μm copper foil is incorporated inside. The substrate 14 is made of glass epoxy or polyimide. The resin films 13a and 13b and the oversheets 12a and 12b are made of vinyl chloride (PV
P) and the like.

In the non-contact type IC card 11, the substrate 14 has a thickness of 0.26 mm, the resin films 13a and 13b each have a thickness of 1.15 mm, and the oversheets 12a and 1b.
The thickness of 2b is 0.1 mm, and the total thickness is 0.76 mm.

The non-contact type IC card 11 has a first
Similar to the embodiment, a recess is formed on the surface by counterbore processing, the IC module is fitted in this recess, and the terminal of the antenna incorporated in the substrate 14 and the IC module are electrically connected. is there. IC module
For example, it is realized by COB (Chip On Board).

As shown in FIG. 5, the non-contact type IC card 11 includes an over sheet 12b, a resin film 13b, a substrate 14, a resin film 13a and an over sheet 12.
It is manufactured by hot pressing from both sides in a state of overlapping a and forming a recess by counterboring, and mounting the IC module in this recess.

At this time, the thermal conductivity of the resin films 13a and 13b is about 3 to 4 times higher than that of the substrate 14. Therefore, if the resin films 13a and 13b have different thicknesses, warping or thermal sag may occur when hot pressing is performed. However, according to the non-contact type IC card 11, the thickness of the resin films 13a and 13b may be reduced. By making them equal,
It is possible to effectively suppress the occurrence of such warpage and thermal sag.

Fourth Embodiment FIG. 6 is a block diagram of the non-contact type IC card 21 of the present embodiment. The non-contact type IC card 21 uses two layers of substrates 24a and 24b incorporating an antenna. The reason why the antenna is formed in two layers is to obtain a desired output.

As shown in FIG. 6, the non-contact type IC card 2
1 has a structure in which the core substrate 25 is sandwiched between the substrates 24a and 24b from both sides, and the substrates 24a and 24b are sandwiched between the oversheets 22a and 22b from both sides. here,
Antennas made of copper foil having a thickness of about 15 to 30 μm are incorporated inside the substrates 24a and 24b. Substrate 2
4a and 24b are made of glass epoxy or polyimide. The substrate 24a and the core substrate 25 are made of vinyl chloride or the like.

According to the non-contact type IC card 21, the substrate 2
By making the thicknesses of 4a and 24b equal, the core substrate 25
On the other hand, the configuration of the card in the thickness direction is vertically symmetrical, and as in the case of the third embodiment described above, it is possible to effectively suppress the generation of warpage or thermal sag in the card during the manufacturing process.

Fifth Embodiment FIG. 7 is a diagram for explaining a non-contact type IC card 31 according to the present embodiment. The non-contact type IC card 31 is
Basically, it is the same as the non-contact type IC card 1 of the first embodiment described above.

However, in the non-contact type IC card 31, the thickness in the vicinity of the connection terminals 5a and 5b of the antenna 6 incorporated in the base 3 shown in FIGS. 1 and 7 is made thicker than the precision of counter boring. For example, the tolerance for counter boring is 10 to 50μ.
If it is m, the thickness in the vicinity of the connection terminals 5a and 5b is 3
5 μm to 100 μm.

As a result, when the recess for mounting the IC module is formed by counter boring, the connection terminals 5a, 5
It is possible to effectively prevent the b from being scraped off. Sixth Embodiment FIG. 8 is a diagram for explaining a manufacturing process of the non-contact type IC card 41 according to the present embodiment.

The structure of the non-contact type IC card 41 is basically the same as that of the non-contact type IC card 11 of the third embodiment described above. As shown in FIG. 8, the non-contact type IC card 4
In the manufacturing process of No. 1, first, in a state where the oversheet 42b, the resin film 43b, the substrate 44, the resin film 43a and the oversheet 42a are overlapped with each other, heat pressing is performed from both sides to manufacture the card base 41b.

Here, the substrate 44 has a thickness of about 15 to 3
The antenna is built in with a copper foil of 0 μm, and the connection terminals 5a and 5b are provided at the ends of the antenna. Substrate 4
4 is made of PVC or polycarbonate (PC). The resin films 43a and 43b are made of PV.
It is configured by using C or the like. Oversheet 42a,
42b is configured by using PVC or the like.

A dummy spacer 45 used to form a recess 41a for mounting the IC module 8 is incorporated in the resin film 43a. The dummy spacers 45 are connected to the connection terminals 5 formed on the substrate 44 at the time of hot pressing, depending on the positions of the recesses 41a to be finally formed.
It is arranged so as to be in contact with a and 5b.

The dummy spacer 45 is made of PET (polyethylene terephthalate), polyimide, or the like that does not heat-bond with the substrate 44 during hot pressing. The size and shape of the dummy spacer 45 is determined according to the IC module 8.

The substrate 44 has a thickness of 0.26 mm, the resin films 43a and 43b each have a thickness of 0.15 mm, and the oversheets 42a and 42b each have a thickness of 0.1 m.
m, and the thickness of the base body 41b as a whole is 0.76 mm
It has become. Next, the oversheet 42a and the resin film 43a are countersunk to form the IC module 8
A concave portion 41a1 which is a part of the concave portion 41a for mounting is formed. At this time, counterbore processing is performed up to the position where the surface of the dummy spacer 45 is reached. Also, the resin film 4
A counter boring process is performed to a depth reaching the vicinity of 3b to finally form a recess 41a3 which will be a part of the recess 41a. Here, when the IC module 8 is mounted, the recess 41a3 is
This is a portion for accommodating the mold portion including the IC of the IC module 8 and the capacitor therein.

Next, the dummy spacer 45 is removed to form a recess 41a2 which is a part of the recess 41a. As a result, the recess 41a composed of the recesses 41a1, 41a2, 41a3 is completed. Then, this recess 41
The IC module 8 is mounted and fixed to a, and the connection terminals 5a and 5b of the card base and the connection terminal 8 of the IC module are attached.
b and 8c are electrically connected via an anisotropic conductive sheet.

As described above, according to the method of manufacturing the non-contact type IC card 41, by using the dummy spacer 45, the connecting terminals 5a, 5b are not damaged by the counter boring processing and the connecting terminals 5a, 5b are not damaged. 5b can be exposed in the recess 41a. As a result, the yield in the thermal process in the manufacturing process of the non-contact type IC card 41 can be improved.

Seventh Embodiment FIG. 9 is a diagram for explaining a manufacturing process of the non-contact type IC card 51 according to the present embodiment. In the manufacturing process of the non-contact type IC card 51, as shown in FIG. 9, injection molding is performed using a mold 52 composed of an upper mold 52a and a lower mold 52b each having a movable piece 53 at a predetermined position. Done. The mold 52 has a shape corresponding to the non-contact type IC card 51 to be manufactured.

First, as shown in FIG. 9A, the upper mold 52a is formed.
After a predetermined gap is maintained between the lower mold 52b and the lower die 52b, the substrate 54 in which the antenna is incorporated is inserted through this gap as shown in FIG. 9B. At this time, the substrate 54
Connection terminal 55 located at the end of the antenna incorporated in the
The substrate 54 is arranged so that a and 55b are located so as to face the lower surface of the movable piece 53.

Next, as shown in FIG. 9C, the movable piece 53 is lowered toward the connection terminals 55a and 55b of the substrate 54, and as shown in FIG.
Press 55b. At this time, the pressing force of the movable piece 53 is determined in consideration of the strength of the substrate 54. Board 54
Is made of, for example, glass epoxy or polyimide.

Next, as shown in FIG. 9 (D), vinyl chloride or an acrylonitrile-butadiene-styrene copolymer (ABS) which becomes a resin film of the non-contact type IC card 51 is passed through the resin injection port 52a1 and the like. ) Resin is injected and compressed to form a card. At this time, the movable top 5
Since the lower surface of 3 is pressed against the connection terminals 55a and 55b, no resin is formed on the connection terminals 55a and 55b.

Next, as shown in FIG. 9 (E), the movable piece 53 is moved upward to complete the molding process. As described above, according to the method for manufacturing the non-contact type IC card of the present embodiment, by exposing the connection terminals 55a and 55b and molding the card at the same time, the number of manufacturing steps is reduced, and the cost is reduced. The manufacturing time can be shortened.

[0048]

As described above, according to the method for manufacturing a non-contact type IC card of the present invention, printing can be performed on the card substrate with high accuracy. Further, the non-contact type IC of the present invention
In the card and its manufacturing method, the card manufacturing including the antenna and the circuit module are manufactured in separate steps, and finally the circuit module is mounted on the card and integrated, so that the yield is improved and the manufacturing time is shortened. be able to.

[Brief description of the drawings]

FIG. 1 is a non-contact type IC according to a first embodiment of the present invention.
It is a figure for demonstrating the manufacturing method of a card.

FIG. 2 is a non-contact type IC according to the first embodiment of the present invention.
It is a figure for demonstrating the manufacturing method of a card.

FIG. 3 is a diagram for explaining a communication mode of the non-contact type IC card shown in FIGS. 1 and 2.

FIG. 4 is a non-contact type IC according to a second embodiment of the present invention.
It is a figure for demonstrating the manufacturing method of a card.

FIG. 5 is a non-contact type IC according to a third embodiment of the present invention.
It is a block diagram of a card.

FIG. 6 is a non-contact type IC according to a fourth embodiment of the present invention.
It is a block diagram of a card.

FIG. 7 is a diagram for explaining a manufacturing process of the non-contact type IC card according to the fifth embodiment of the present invention.

FIG. 8 is a diagram for explaining a manufacturing process of the non-contact type IC card according to the sixth embodiment of the present invention.

FIG. 9 is a diagram for explaining a manufacturing process of the non-contact type IC card according to the seventh embodiment of the present invention.

FIG. 10 is a diagram for explaining a conventional method for manufacturing a non-contact type IC card.

[Explanation of symbols]

2, 4 ... Resin film 3 ... Substrate 5a, 5b, 9a, 9b ... Connection terminal 6 ... Antenna 7 ... Card substrate 7a ... Recessed portion 8 ... IC module 8a ... Resin mode portion 8b, 8c ... Connection terminal 10 ... Anisotropic conductive film 11, 21, 41 ... Non-contact type IC card 12a, 12b, 22a, 22b ... Over sheet 13a, 13b ... Resin film 14, 24a, 24b ... Substrate (incorporating antenna) 25 ... Core substrate 45 ... Dummy spacer 51 ... Non-contact IC card 52 ... Mold 53 ... Movable piece

Claims (6)

[Claims] 1. A circuit module having a built-in antenna for transmitting and receiving data, having a recess for exposing the terminal of the antenna to the outside, and having a connecting terminal and mounting a required IC circuit. A non-contact type IC mounted in the recess so as to electrically connect the connection terminal and the terminal of the antenna
Card manufacturing method. 2. The method for manufacturing a non-contact type IC card according to claim 1, wherein the anisotropic conductive film is used as an adhesive sheet to adhere the circuit module to the recess. 3. An antenna substrate having an antenna for data transmission / reception built therein, a plurality of resin sheets for supporting the antenna substrate from both sides, and an IC circuit connected to terminals of the antenna are mounted on the resin sheet. A non-contact type IC card, which has a circuit module mounted in the formed recess, and in which the antenna substrate and the resin sheet are symmetrically laminated and integrated as viewed from the center position in the thickness direction of the card. 4. An antenna having a connecting terminal having a thickness larger than a tolerance of counterbore processing is incorporated into an antenna substrate, and the antenna substrate is sandwiched by a plurality of resin sheets from both sides and heat-pressed so that the connecting terminal appears. A non-contact type IC card in which a recess is formed in the heat-pressed and integrated resin substrate by counterbore processing, and a circuit module is mounted in the recess so as to electrically connect an IC circuit to the connection terminal. Production method. 5. A first resin sheet, in which a dummy member made of a material that does not fuse to the antenna substrate during hot pressing is incorporated, is connected from one surface side of an antenna substrate incorporating an antenna having a connection terminal. The second resin sheet is heat-pressed from the other surface side of the antenna substrate while hot pressing so that the terminal and the dummy member are in contact with each other, and the hot-pressed first resin sheet is connected to the connection. By cutting from a side opposite to the terminal to a position reaching the dummy member and removing the dummy member, a concave portion where the connection terminal is exposed is formed, and an IC circuit is electrically connected to the connection terminal. A method for manufacturing a non-contact type IC card in which a circuit module is mounted in the recess. 6. An antenna substrate incorporating an antenna having a connection terminal, wherein the connection terminal is covered with a covering means.
After injection molding is performed using a mold to form resin layers on both surfaces of the antenna substrate, the covering means is removed to form a recess in which the connection terminal is exposed, and an IC circuit is electrically connected to the connection terminal. A method for manufacturing a non-contact type IC card, in which a circuit module is mounted in the recess so as to be connected.