JPH0888036A - Electronic part with lead terminal - Google Patents

Abstract

PURPOSE: To obtain an electronic part with a lead terminal capable of improving reliability of parts and work efficiency by securing connection of a lead terminal to a terminal electrode. CONSTITUTION: In an electronic part 6 with a lead terminal composed of a lead terminal 5 connected to a terminal electrode 3 formed on the end edge of an insulation board 1, a sectional roughly U-shaped pinching part 4 composed of a shape memory alloy on the tip end of the lead terminal 5 is formed. The terminal electrode 3 of the insulation board 1 is pinched by restoring action of this pinching part 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic parts with lead terminals such as R networks and hybrid ICs.

[0002]

2. Description of the Related Art As shown in FIG. 3, a conventional electronic component 21 with lead terminals has an insulating substrate 23 having a plurality of terminal electrodes 22 formed on its edges and a sandwiching portion 24 having a substantially U-shaped cross section at its tip. And a plurality of lead terminals 25 formed with.

In joining the lead terminal 25 to the terminal electrode 22 of the insulating substrate 22 in the electronic component with lead terminal 21 having such a structure, first, the lead terminal 2
The terminal electrode 22 is clamped by the clamping portion 24 of 5 to be temporarily fixed, then the terminal electrode 22 and the lead terminal 25 are dipped in a flux (not shown), and further melted solder (not shown).
Solder by immersing in.

[0004]

However, in such a conventional electronic component with lead terminal 21, the lead terminal 25 before soldering is held (temporarily fixed) to the insulating substrate 23 by the spring pressure of the holding portion 24. Is going by. Therefore, if the spring pressure is weak, the position shifts with respect to the terminal electrode 22, or in extreme cases, the lead terminal 25 drops from the insulating substrate 23.

Therefore, a main object of the present invention is to provide an electronic component with a lead terminal which can improve the reliability of the component by ensuring the connection of the lead terminal to the terminal electrode and the working efficiency. Is to provide.

[0006]

In order to achieve the above object, the present invention provides an electronic component with a lead terminal in which a lead terminal is joined to a terminal electrode formed on an edge of an insulating substrate. It is characterized in that a sandwiching portion made of a shape memory alloy and having a substantially U-shaped cross section is formed at the tip of the terminal, and the terminal electrode of the insulating substrate is sandwiched by the returning operation of the sandwiching portion.

[0007]

According to the above construction, the holding portion of the lead terminal is preliminarily processed in an open state at room temperature, the holding portion of the lead terminal is attached to the terminal electrode of the insulating substrate, and then the high temperature processing is performed to remove the holding portion of the holding portion. The terminal electrode of the insulating substrate can be sandwiched by the returning operation.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electronic component with lead terminals according to the present invention will be described below with reference to the drawings. In FIG. 1, reference numeral 1 is a substantially strip-shaped insulating substrate, various electronic component elements 2 are attached to the surface, and a plurality of terminal electrodes 3 are formed at the edges. By sandwiching the terminal electrode 3 with a sandwiching portion 4 formed at the tip of the lead terminal 5 and made of a shape memory alloy and having a substantially U-shaped cross section, an electronic component 6 with a lead terminal is formed.

Next, a method of manufacturing the electronic component 6 with lead terminals constructed as described above will be described. First, a lead terminal 5 having a holding portion 4 having a substantially U-shaped cross section at its tip is manufactured in advance using a shape memory alloy. Specifically, FIG. 2 (A)
As shown in FIG. 5, the holding portion 4 made of a shape memory alloy is stored in a substantially U-shaped cross section having a first gap dimension A1 that is equal to or smaller than the thickness L of the insulating substrate 1. The shape memory alloys are Ni-Ti alloy, Cu-Al-N.
An i alloy, a Cu-Zn-Al alloy, or the like is used. In this case, a Cu-Zn-Al alloy, which is relatively inexpensive and has good plastic workability, is preferable because it is not repeatedly used.

Next, as shown in FIG. 2B, an opening process is performed to expand the gap size of the holding portion 4 of the lead terminal 5 to a second gap size A2 larger than the thickness L of the insulating substrate 1 at room temperature. , Is attached to the terminal electrode 3 of the insulating substrate 1 with the holding portion 4 opened. And when high heat processing in such a state,
Since the holding portion 4 made of a shape memory alloy returns to its original state, the insulating substrate 1 is held by the holding portion 4 and the terminal electrode 3 and the lead terminal 5 are joined, as shown in FIG. 2 (C). . Although the lead terminal 5 is sufficiently connected and fixed to the terminal electrode 3 even in such a state, if the impact resistance is required at a higher level, the lead terminal 5 may be further soldered to the insulating substrate. It may be fixed to 1.

Further, in the above embodiment, the shape memory alloy itself is used as the lead terminal 5, but the shape memory alloy may be bonded only to the sandwiching portion of the lead terminal.

[0012]

As described above, according to the electronic component with lead terminal of the present invention, the holding portion having the substantially U-shaped cross section made of the shape memory alloy is formed at the tip of the lead terminal, and the holding portion is restored. Since the terminal electrodes of the insulating substrate are sandwiched by the operation, the lead terminals can be reliably connected to the insulating substrate, the reliability of the parts can be improved, and the work efficiency is significantly improved. can do.

[Brief description of drawings]

FIG. 1 is a perspective view showing an electronic component with lead terminals according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a method of connecting lead terminals to an insulating substrate.

FIG. 3 is a perspective view showing a conventional electronic component with a terminal.

[Explanation of symbols]

 1 Insulating substrate 3 Terminal electrode 4 Holding part 5 Lead terminal 6 Electronic component with lead terminal

Claims (1)

[Claims] 1. An electronic component with a lead terminal, wherein a lead terminal is joined to a terminal electrode formed on an edge of an insulating substrate. A holding portion having a substantially U-shaped cross section made of a shape memory alloy at a tip of the lead terminal. And a terminal electrode of the insulating substrate is sandwiched by the returning operation of the sandwiching portion.