JPH0885715A - Silicone-modified phenolic resin and its production - Google Patents

Abstract

PURPOSE: To obtain a silicone-modified phenolic resin suitable for producing a sealing resin composition having reduced internal stress, excellent adhesion, and high reliability by polymerizing a silicone oligomer in a solution of a phenolic resin. CONSTITUTION: A silicone oligomer is polymerized in either a liquid phenolic resin or a solution of a phenolic resin to obtain a silicone-modified phenolic resin as a homogeneous mixture of a silicone and the phenolic resin. For example, the silicone oligomer preferably contains a siloxane having a carbon-carbon unsaturated group and an organohydrogensiloxane and gives a silicone through the hydrosilylation of these. Preferred examples of the phenolic resin include a phenolic novolak, a bisphenol novolak, and a cresol novolak epoxy resin.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a method for producing a resin suitable for semiconductor encapsulation.

[0002]

2. Description of the Related Art With the advance of technology in recent years, semiconductors are now highly integrated such as LSI and VLSI. This highly integrated semiconductor device is sealed with a synthetic resin composition to protect it from the external environment. However, the coefficient of thermal expansion of a synthetic resin composition generally used as a semiconductor encapsulating material is much higher than the coefficient of thermal expansion of a semiconductor element. Therefore, the difference in the coefficient of thermal expansion is
Excessive internal stress is applied to the semiconductor element by encapsulation, after-cure, or subsequent thermal history (Nikkei Microdevice, issued June 11, 1984). In addition, it also causes cracks in the semiconductor encapsulating material and creates a gap between the semiconductor encapsulation material and water, which intrudes into the gap to corrode the wiring and cause deterioration of the semiconductor element.

It is known that the composition of silicone having a damper effect is effective for relieving the internal stress of the semiconductor encapsulating material, and that the internal stress can be further relieved by increasing the compounding amount of the silicone. There is. Therefore, it has been attempted to add a larger amount of silicone. According to this method, the fluidity of the sealing material was remarkably reduced, and casting, transfer molding, potting, dropping and other operations were substantially impossible.

Therefore, it has been proposed to use a thermosetting resin composition having a low coefficient of thermal expansion and a low internal stress without lowering the fluidity as a semiconductor encapsulating material. Japanese Examiner Sho 62
-28971, a thermosetting epoxy resin composition in which a polymer cured product containing 10% by weight or more of a linear organosiloxane block is dispersed, or Japanese Patent Publication No. 3-30
No. 620 and Japanese Patent Publication No. 63-12489,
A spherical cured polymer and a thermosetting epoxy resin composition having the polymer dispersed therein are disclosed.

However, in general, silicone has poor adhesiveness as used as a release agent and has the property of peeling at the interface. Therefore, the use of silicone in the encapsulating material causes a defect that the adhesiveness between the encapsulating material and the semiconductor element is reduced. As a result, water enters the interface between the sealing material and the semiconductor element, corrodes the wiring, and deteriorates the semiconductor element. That is, the encapsulating material containing silicone has one side inferior in moisture resistance.

Particularly, in recent years, the semiconductor itself has become vulnerable to stress in terms of high-density packaging. In addition, packages tend to be smaller and thinner for surface mounting, and there has been a phenomenon that the life of the package is extremely shortened due to a shortened water entry path. For this reason, measures have been taken to add special functional groups to silicone and to reduce the particle size.
Various problems such as an increase in impurities and a decrease in liquidity have occurred and have not been solved yet.

On the other hand, the conventional silicone fine powder has a problem that secondary aggregation easily occurs, and therefore it is not easy to uniformly mix the silicone fine powder when producing the epoxy resin composition and the like.

Further, it is a block copolymer in which a phenolic resin and an organopolysiloxane are linked by a Si--C bond (not containing a Si--O--C bond) and has a functional group capable of reacting with an epoxy resin. Copolymers are known (Japanese Patent Publication No. 61-48544, Amendment by Patent Law Articles 64 and 17-3). However, the stress relaxation obtained is not sufficient, and the reliability of the sealed semiconductor is insufficient.

[0009]

DISCLOSURE OF THE INVENTION The present invention provides a silicone-modified phenolic resin suitable for preparing a highly reliable encapsulating resin composition having a small internal stress, excellent adhesion, and a method for producing the same. I will provide a.

[0010]

The present invention provides a method for producing a silicone-modified phenolic resin, comprising:
The method is characterized in that a silicone oligomer is polymerized in a liquid phenolic resin or in a solvent solution of phenolic resin to obtain a uniform mixture of silicone and phenolic resin.

The phenolic resins used in the present invention are known per se and include bisphenols, brominated bisphenols, phenols and / or condensates of naphthols and aldehydes, phenols and / or naphthols and xylylene. Examples thereof include a condensate of glycol, a condensate of phenol and isopropenylacetophenone, a reaction product of phenol and dicyclopentadiene, and other bifunctional phenols or naphthols.

Examples of bisphenols and brominated bisphenols include bisphenol A, tetrabromobisphenol A, bisphenol F, tetrabromobisphenol F, bisphenol S and bisphenol K.

Phenols used in the reaction with aldehydes or xylene glycols include phenol, cresol, xylenol, butylphenol, amylphenol, nonylphenol, catechol, resorcinol, methylresorcinol, hydroquinone,
Examples include phenylphenol, bisphenol A, bisphenol F, bisphenol K, bisphenol S, biphenol, and tetotamethyl biphenol.

Examples of naphthols used in the reaction with aldehydes or xylene glycols include 1-naphthol, 2-naphthol, dihydroxynaphthalene, dihydroxymethylnaphthalene, dihydroxydimethylnaphthalene and trihydroxynaphthalene.

Aldehydes used in the reaction with phenols and / or naphthols include formaldehyde, acetaldehyde, propylaldehyde, butyraldehyde, valeraldehyde, capronaldehyde, benzaldehyde, chlorbenzaldehyde, bromobenzaldehyde, glyoxal, malonaldehyde. , Succinaldehyde, glutaraldehyde, adipine aldehyde, pimelin aldehyde, sebacin aldehyde, acrolein, croton aldehyde, salicyl aldehyde, phthal aldehyde, hydroxybenzaldehyde and the like.

Other bifunctional phenols or naphthols include biphenol, tetramethylbiphenol, hydroquinone, methylhydroquinone, dimethylhydroquinone, trimethylhydroquinone, resorcinol, methylresorcinol, catechol, methylcatechol, dihydroxynaphthalene, dihydroxymethylnaphthalene, dihydroxy. Examples thereof include dimethylnaphthalene.

Preferred phenolic resins are phenol novolac resins, phenol novolac epoxy resins,
Bisphenol novolac resin, biphenol novolac resin, cresol novolac resin, bisphenol novolac epoxy resin, biphenol novolac epoxy resin and cresol novolac epoxy resin.
Ionic impurities such as Na ⁺ in the phenolic resin,
If the content of Cl ⁻ is large, the moisture resistance reliability of the semiconductor is adversely affected. Therefore, it is preferable that the content of Cl ⁻ is as small as possible. The silicone-modified product of these according to the present invention can be used as a resin composition for semiconductor encapsulation in combination with a curable resin known per se, for example, an epoxy resin. Alternatively, a product obtained by epoxy-modifying the above phenolic resin can also be used as the phenolic resin in the present invention. The silicone-modified products of these according to the present invention can be used as a semiconductor encapsulating resin composition in combination with a curing agent for epoxy resin known per se (for example, phenol novolac resin). The epoxy modification can be performed by a method known per se, for example, by reacting a phenolic resin with epichlorohydrin.

Examples of the solvent for dissolving the phenolic resin include ketones such as methyl isobutyl ketone, acetone, methyl ethyl ketone and methyl isobutyl ketone, benzene, toluene and chloroform. It is also possible to dissolve the phenolic resin in a solvent in advance, mix this with a silicone oligomer (or a solution thereof), and subject it to silicone polymerization. Alternatively, the phenolic resin can be dissolved in a solution consisting of a solvent and a silicone oligomer and then subjected to silicone polymerization. When the phenolic resin is liquid at room temperature or under heating, the silicone oligomer can be polymerized in the liquid phenolic resin without using a solvent.

The silicone-modified phenolic resin obtained in the present invention is roughly classified into those having an epoxy group and those not having an epoxy group. The silicone modified phenolic epoxy resin is preferably produced as follows. That is, the resin solution obtained after the epoxidation by reacting the phenol resin with epichlorohydrin is used as it is, and the silicone is synthesized therein. Preferably, the resin solution is washed with water after the epoxidation to separate the solvent layer from the water tank, and this is used.

The silicone-modified phenolic resin having no epoxy group is preferably the product immediately before pelletization in the usual phenol resin production process, and the silicone is synthesized therein. In this case, there is no solvent.

The silicone is produced by a hydrosilylation reaction of a siloxane having a carbon-carbon unsaturated group (for example, methylvinylsiloxane, phenylvinylsiloxane, a dimethylvinyldiphenylbisiloxane copolymer) with an organohydrogensiloxane; silanol modification. The dehydration condensation reaction of polysiloxane; the dealcoholization condensation reaction of alkoxy-modified polysiloxane can be performed, but the invention is not limited thereto. Hydrosilylation reaction is preferable, 50 ° C. or higher, preferably 60 to 1
It can be carried out at 80 ° C. The dehydration condensation and dealcoholization condensation reaction are 80 ° C. or higher, preferably 100 to 180.
It can be performed at ° C. In these reactions, platinum,
Known catalysts such as acids or alkalis can be used.
Preferably, the silicone itself has a crosslinked structure. It is obtained by polymerizing silicone with a siloxane having three or more functional groups.

The degree of polymerization of silicone is preferably 10 to 10.
1,000, particularly preferably 20 to 1,000,
When the amount is less than the above lower limit, the effect on the thermal expansion coefficient and internal stress of the encapsulating resin composition is small. If the upper limit is exceeded, the silicone is unlikely to become fine and is not suitable for semiconductor encapsulation.

It is preferable that the silicone raw material contains a small amount of ionic impurities. Total ion content when extracted with pure water at 120 ° C for 20 hours is 50ppm or less, especially 10p
It is preferably pm or less. If the total amount of ions exceeds the above value, corrosion of the wiring of the semiconductor element may be accelerated.

In the product obtained according to the invention, the silicone and the phenolic resin are finely and uniformly mixed with one another. Here, "finely uniform" means a much finer and more uniform sea-island structure than the sea-island structure that is conventionally found in the product obtained by kneading silicone fine particles into a molten phenolic resin for sealing. To do. Typically, the size of the silicone is between 1 and on average as measured by SEM.
It is 10μ.

Preferably, the obtained silicone modified phenolic resin is further added with a silane coupling agent and subjected to elevated temperature. At this time, a silanol group is generated from a hydrolyzable group (eg, an alkoxy group) of the silane coupling agent, which is a residual SiH of silicone.
It is considered to react with the silanol group generated by hydrolysis of the group.

The preferred silane coupling agent further has a group selected from an epoxy group, an alkoxy group, a silanol group, a SiH group, an amino group, a hydroxyl group, a mercapto group, a vinyl group and a methacryloxy group. Preferred silane coupling agents include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrisilane. Methoxysilane; γ-aminopropyltriethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl)
γ-aminopropyltriethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, N-β (aminoethyl) γ-aminoisobutylmethyldimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane; γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane; vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane; and γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropyl Methyldimethoxysilane may be mentioned. Here, the addition amount of the silane coupling agent is preferably 0.1 to 10 parts by weight with respect to 100 parts by weight of silicone. The treatment is carried out with stirring, preferably at 20 to 140 ° C. for 1 minute to 24 hours. At this time, an acid or a base may be added as a catalyst. The treatment with the silane coupling agent further improves the adhesion to the resin.

The silicone-modified phenolic resin having an epoxy group obtained by the present invention can be used for semiconductor encapsulation in combination with a curing agent known per se.
Examples of the curing agent include polyhydric phenols, aromatic polybasic acids, aromatic polyamines, acid anhydrides, silicones, and the like. For example, novolaks such as phenol novolac, biphenol type novolak, and bisphenol A type novolak. Acid anhydrides such as phthalic anhydride, pyromellitic anhydride and benzophenonetetracarboxylic acid, or amines such as diaminodiphenylmethane, diaminodiphenylsulfone and metaphenylenediamine are used. Novolac is preferred.

The silicone-modified phenolic resin having no epoxy group obtained by the present invention can be used for semiconductor encapsulation in combination with a curable resin known per se. Examples of the curable resin include bisphenol type, biphenol type, cresol novolac type epoxy resin, silicone resin, polyimide resin, alkyd resin, unsaturated polyester resin, acrylic resin, and the resins described in Japanese Patent Publication No. 62-28971. And a block copolymer of silicone and the like. Epoxy resins of the above type are preferred. If the content of ionic impurities is large, these resins adversely affect the moisture resistance reliability of the semiconductor after encapsulation. Therefore, it is preferable that the content of ionic impurities such as sodium ions and chlorine ions is as small as possible.

The amount of the silicone component in the silicone-modified phenolic resin obtained by the present invention is based on the total weight of the silicone-modified phenolic resin and the curing resin or curing agent, that is, the total weight of the sealing resin. Preferably 0.1 to 60% by weight, particularly preferably 0.5 to
30% by weight is included. If it is less than the lower limit, the effect of alleviating the internal stress cannot be obtained, and if it exceeds the upper limit, the coefficient of thermal expansion or the viscosity of the resin composition is increased and the fluidity is lowered, which is not preferable.

The semiconductor encapsulating resin composition may further contain other conventional components, and in particular a filler. As the filler, silica, silicon nitride, alumina,
A material having a small coefficient of thermal expansion such as aluminum nitride, talc, or clay is used. Further, for example, a curing catalyst such as a tertiary amine or an organic phosphorus compound, or a flame retardant, a colorant, a release agent, a coupling agent, or the like can be added.

The resin composition is prepared by using the above-mentioned components
For example, it can be performed by kneading with a kneader, roll, mixer or the like.

The encapsulating resin composition is extremely useful as an encapsulating material for electronic parts such as transistors, ICs, diodes and thermistors, and various electric parts such as transformer coils and resistors.

Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples.

[0034]

EXAMPLES The evaluation methods used in the present invention are as follows. <Flowability> According to EMMI 1-66, the spiral flow method was used to measure the flow length. <Bending strength> Based on JIS K-6911, it measured using the bending elasticity meter. <Cold and thermal shock resistance (T / C)> I sealed in the examples
Package cracks were observed after C was subjected to a thermal history of -65 ° C to room temperature to 150 ° C for 1000 cycles, and the results are shown as the number of cracks generated / total number of tests. <Moisture resistance (PCT)> 1 of the sealed IC in the example
The results after 1000 hours of standing at 25 ° C. and 100% humidity are shown by the number of corrosion occurrences / total number of tests.

[0035]

Example 1 <Preparation of Cresol Novolac Epoxy Resin> The following chemical formula (I) (the value of n is 2 to 3)

[0036]

Embedded image 178.5 g (1.5 mol) of cresol novolac resin (phenolic hydroxyl equivalent 119) represented by is dissolved in epichlorohydrin (ECH) 693.8 g (7.5 mol) with stirring, and the pressure in the reaction system is adjusted to 150 mmHg. After that, the temperature was raised to 68 ° C. A 125 wt% aqueous solution of sodium hydroxide (hereinafter referred to as NaOH) 125
g (1.5 mol) was continuously added dropwise to react for 3.5 hours. During this time, the water generated by the reaction and the water of the NaOH aqueous solution were separated by refluxing the water-ECH azeotrope and continuously removed outside the reaction system. After the reaction was completed, the reaction system was returned to normal pressure and the temperature was raised to 110 ° C. The temperature was raised to and the water in the reaction system was completely removed. Excess ECH was removed by evaporation under normal pressure, and further evaporated at 140 ° C. under a reduced pressure of 15 mmHg.

Methyl isobutyl ketone (hereinafter referred to as MIBK) 26 was added to the mixture of the produced resin and sodium chloride.
2.5 g and 35.5 g of 10% by weight NaOH aqueous solution
(0.09 mol) was added, and the reaction was carried out at a temperature of 80 to 85 ° C. for 1.5 hours. After the reaction, 525 g of MIBK and 3 parts of water
00 g was added, and the lower layer aqueous sodium chloride solution was separated and removed. The MIBK liquid layer was washed by adding 150 g of water, neutralizing with phosphoric acid, separating the water layer, and further washing with 150 g of water, and separating the water layer to obtain a MIBK resin solution (solution A) . <Synthesis of Silicone> A dimethylpolysiloxane having a viscosity of 1,000 centipoise with a molecular chain end blocked with a dimethylvinylsiloxy group (vinyl group content: 0.5% by weight) 1
To 00 g, 6 g of a methylhydrogenpolysiloxane having a viscosity of 10 centipoise (both silicon atom-bonded hydrogen atom content 1.0% by weight) in which both ends of the molecular chain were blocked with trimethylsiloxy groups was added and mixed to obtain a mixture. B).
Next, 0.3 g of an isopropyl alcohol solution of chloroplatinic acid (platinum content: 3% by weight) was added to 100 g of the same dimethylpolysiloxane as above, and mixed to obtain a mixture (mixture C). The mixture B and the mixture C were put in a mixer equipped with a stirrer which had been cooled to -10 ° C in advance, and mixed at a ratio of 1: 1 (mixture D).

The solution A obtained above was put in a mixer equipped with a stirrer which had been cooled to 5 ° C. in advance, and 80 g of the mixture D obtained above was added thereto using a pressure pump to obtain a mixed solution (mixture E). ).

This mixture E was immediately mixed with MIBK2 at 80 ° C.
The mixture was continuously fed into a mixer with a stirrer filled with 000 g to cause a hydrosilylation reaction (mixture F). <Treatment with silane coupling agent> Next, 5% γ
-Glycidoxypropyltrimethoxysilane (trade name K
16 g of an aqueous solution (BM-403, manufactured by Shin-Etsu Chemical Co., Ltd.) was added, and the mixture was stirred and mixed at 80 ° C. for 30 minutes.

After removing most of MIBK from this mixture by evaporation under normal pressure, the mixture was further reduced under reduced pressure of 5 mmHg at 140 ° C.
Evaporation was carried out at the temperature of 3 to obtain 324 g of silicone-modified cresol novolac epoxy resin (resin A).

[0041]

Example 2 <Preparation of Silicone-Modified Phenol Novolac Resin Not Epoxy-Modified> 100 parts by weight of phenol and 65 parts by weight of formalin (37% formaldehyde aqueous solution) were placed in a steam-heated reaction kettle and stirred to 95 ° C. Heated. At this time, 0.45 of oxalic acid as a catalyst
Parts by weight were gradually added. The reaction was carried out as it was at 95 ° C. for 2 hours. Next, the temperature is raised to 160 ° C. under normal pressure to carry out dehydration treatment, and unreacted phenol is removed under reduced pressure to obtain a resin (phenol novolac) 110 which is solid at room temperature.
Parts by weight were obtained.

The phenol novolac thus obtained was subjected to a temperature of 1
At 20 ° C., 23.5 parts by weight of the mixture D of Example 1 was gradually added to carry out a hydrosilylation reaction. Then Example 1
By treating with a coupling agent in the same manner as described above, a silicone-modified phenol resin was obtained (resin B).

[0043]

Example 3 In Example 2, instead of γ-glycidoxypropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane (trade name K
A silicone-modified phenolic resin was obtained by the same method as in Example 2 except that BM603 (manufactured by Shin-Etsu Chemical Co., Ltd.) was used (resin C).

[0044]

[Example 4] The same method as in Example 1 except that the treatment with the silane coupling agent was not carried out.
A silicone-modified cresol novolac epoxy resin (resin E) was obtained.

[0045]

[Comparative Example 1] Japanese Patent Publication No. 61-48544, Patent Law No. 64
No. 1 of Reference Example 1 in the gazette of amendment under the provisions of Article 3 and Article 17-3. 5, a phenol novolac-organopolysiloxane copolymer (resin D) was prepared as follows.

A phenol novolak resin 50 containing phenol and o-allylphenol (molar ratio 7/3) was placed in a 500-neck four-necked flask equipped with a reflux condenser, a thermometer, a stir bar, and a dropping funnel.
g, 0.05 g of 2-ethylhexanol-modified chloroplatinic acid solution at a concentration of 2% and methyl isobutyl ketone 200
g, completely dissolve the novolak resin, and azeotropically dehydrate for 1 hour. Then, at both reflux temperatures, the hydrogen silicone oligomers with both ends represented by formula (II)

[0047]

Embedded image 50 g was added dropwise from the dropping funnel over 20 minutes. After the completion of dropping, the reaction was further continued for 2 hours, followed by washing with water and distilling off the solvent to obtain a block copolymer. <Production of resin composition for semiconductor encapsulation> A resin composition for semiconductor encapsulation was produced using the silicone-modified phenolic (epoxy or non-epoxy) resin produced above or a comparative substance. The other components used are as follows.

Resin: Cresol novolac epoxy resin (EOCN-1020, trademark, manufactured by Nippon Kayaku Co., Ltd.) Curing agent: phenol novolac (HF-1, trademark, manufactured by Meiwa Kasei Co., Ltd.) Filler: silica (spherical silica, FB) -48, Denki Kagaku Kogyo Co., Ltd.) Curing accelerator: triphenylphosphine (manufactured by Hokuko Kagaku Co., Ltd.) Coupling agent: KBM403 (trademark, manufactured by Shin-Etsu Chemical Co., Ltd.) Release agent: Fine powder carnauba (manufactured by Toa Kasei Co., Ltd.) ) Dimethyl silicone powder: SG-3M (trademark, Siegel Co., Ltd.) Pigment: carbon black (CK45, trademark, Mitsubishi Kasei Co., Ltd.) Flame retardant: BREN-S (trademark, Nippon Kayaku Co., Ltd.), and antimony trioxide. The amount (parts by weight) of the silicone-modified phenolic resin or comparative substance produced as described above in Table 1, The amount (parts by weight) of the epoxy resin or the curing agent shown in Table 1, 0.2 parts by weight of triphenylphosphine as a curing accelerator, 0.8 parts by weight of the coupling agent, 0.5 parts by weight of the release agent, and pigment 0. 0.5 parts by weight, 2 parts by weight of BREN-S as a flame retardant and 2 parts by weight of antimony trioxide, 3 parts by weight of dimethyl silicone powder in Comparative Example 2 and silica (the balance) as a filler were added to form a whole. It was 100 parts by weight. next,
The mixture was mixed with a Lödige mixer and then kneaded using a twin-screw extruder at a barrel setting temperature of 90 ° C. and a rotation speed of 200 rpm for 3 minutes to prepare pellets. Next, the finished pellets are heated to a cylinder temperature of 150 ° C. and a mold temperature of 175.
A test piece was prepared by molding with an injection molding machine set at 0 ° C., and subjected to measurement of fluidity and elastic modulus. <Semiconductor element encapsulation> Monitor IC (external size 4 mm x 10
mm, SiN coat, without circuit) 16-pin T
SOP (300 mills) was sealed (cured at 175 ° C. for 2 minutes) by the low-pressure transfer molding method using the above resin composition, and further cured at 175 ° C. for 4 hours, and subjected to evaluation of cold heat shock resistance.

A monitor IC having a simulated aluminum circuit
(Outer dimensions 3 mm x 6 mm, aluminum circuit width 10 μm, gap 1
0 μm) was sealed and cured in the same manner as above, and then subjected to a moisture resistance test. The results are shown in Table 1.

[0050]

[Table 1] Examples 1 to 4 are cases of compositions containing the silicone-modified phenolic resin of the present invention as a curable resin or a curing agent. In each of Examples 1 to 4, the fluidity and the bending strength of the resin composition are good. The test results of thermal shock resistance and moisture resistance of the encapsulated semiconductor were also extremely good.

On the other hand, Comparative Example 1 using a phenol novolac-organopolysiloxane copolymer according to the prior art
In, the fluidity and bending strength of the resin composition is poor,
The thermal shock resistance and moisture resistance of the encapsulated semiconductor are also insufficient.

In Comparative Example 2, silicone powder was added according to the prior art. The thermal shock resistance and moisture resistance are poor.

In Comparative Example 3, no silicone powder was added. The fluidity and flexural strength of the resin composition were poor, and the thermal shock resistance and moisture resistance were also extremely poor because there was no damper effect.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiromi Morita 263 Inumakata, Urawa-shi, Saitama (72) Inventor Yoshiro Shimamura 4-31-1, Shimo Kita-ku, Tokyo

Claims (8)

[Claims] 1. A method for producing a silicone-modified phenolic resin, wherein a silicone oligomer is polymerized in a liquid phenolic resin or in a solvent solution of a phenolic resin to homogenize the silicone and the phenolic resin. A method characterized in that a mixture is obtained. 2. The method according to claim 1, wherein the silicone oligomer comprises a siloxane having a carbon-carbon unsaturated group, and an organohydrogensiloxane, and a hydrosilylation reaction of these produces a silicone. 3. A siloxane having a carbon-carbon unsaturated group is dimethylpolysiloxane whose both molecular chain terminals are sealed with dimethylvinylsiloxy groups, and the organohydrogensiloxane is methylhydrogenpolysiloxane. 2. The method described in 2. 4. The obtained silicone-modified phenolic resin is further reacted with a silane coupling agent.
The method according to any one of 3 above. 5. The phenolic resin is selected from the group consisting of phenol novolac resin, phenol novolac epoxy resin, bisphenol novolac resin, biphenol novolac resin, cresol novolac resin, bisphenol novolac epoxy resin, biphenol novolac epoxy resin and cresol novolac epoxy resin. The method according to claim 1, wherein the method is performed. 6. A silicone-modified phenolic resin for semiconductor encapsulation, wherein the silicone and phenolic resin are finely and uniformly mixed with each other in the silicone-modified phenolic resin for semiconductor encapsulation. 7. The silicone has a crosslinked structure.
The listed resin. 8. The phenolic resin is selected from the group consisting of phenol novolac resin, phenol novolac epoxy resin, bisphenol novolac resin, biphenol novolac resin, cresol novolac resin, bisphenol novolac epoxy resin, biphenol novolac epoxy resin and cresol novolac epoxy resin. The resin according to claim 6 or 7.