JPH0883981A - Manufacture of printed-wiring board - Google Patents

Abstract

PURPOSE: To provide the manufacturing method, of a printed-wiring board, whose lamination accuracy is good and which is excellent in productivity. CONSTITUTION: A manufacturing method is provided with a piling-up process wherein, while the required number of double-sided circuit boards 3 and the required number of prepreg sheets 1, 1 are being positioned sequentially, prescribed positions on the double-sided circuit boards 3 or the prepreg sheets 1, 1 are coated with an adhesive 8, they are piled up alternately and a laminate is formed, with a temporary fixation process wherein the laminate in which the adhesive 8 has been hardened at a temperature lower than the softening temperature of an epoxy resin for the prepreg sheets 1, 1 is fixed temporarily and with a thermal press process wherein the temporarily fixed laminate is taken out from the temporary fixation process, the laminate is thermally pressed independently or together with metal foils 9, 9 and a multilayer board is formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board on which a semiconductor LSI, chip parts, etc. are mounted and which are interconnected with each other, and more particularly to a method for manufacturing a printed wiring board using a multilayer board. .

[0002]

2. Description of the Related Art In recent years, with the miniaturization and high density of electronic devices, multilayer substrates have been widely used not only for industrial use but also for consumer use. And to increase the density of the multilayer substrate,
Along with the accuracy of the circuit pattern, the contribution of the stacking accuracy between the circuit patterns of a plurality of layers is large, so that the stacking accuracy is good and
There is a demand for a method for manufacturing a printed wiring board relating to a multi-layer board having high productivity.

A conventional example of a method for manufacturing a printed wiring board in which the multi-layer substrate is laminated with good precision will be described with reference to FIGS. 70 to 77.

First, a method of manufacturing a double-sided circuit board which is the base of a multilayer board will be described with reference to FIGS.

As shown in FIG. 70, the prepreg sheet 3
A required number of through holes 31 are provided at 0 by laser processing or the like. The prepreg sheet 3 is provided in these through holes 31.
A conductive paste 32 for electrically connecting metal foils such as copper attached to both sides of 0 is filled. The prepreg sheet 30 is made by impregnating a non-woven fabric such as an aromatic polyamide fiber with a thermosetting epoxy resin in an uncured state.
After curing it becomes part of the multilayer substrate.

As shown in FIG. 71, metal foils 34, 34 made of copper or the like are attached to both surfaces of the prepreg sheet 30 of FIG. 70, and in this state, they are heated and pressed by a hot press.

By the heating and pressurization of the above-mentioned hot press, FIG.
As shown in FIG. 2, metal foils 34, 34 made of copper or the like are attached to both surfaces of the prepreg sheet 30, and a required number of through holes 31 are formed.
The conductive paste 32 filled in the metal foil 3 on both sides
A product in which 4, 34 are electrically connected is obtained.

Then, as shown in FIG. 73, the metal foils 34, 34 on both sides are selectively etched to obtain a double-sided circuit board 32 on which circuit patterns 35, 35 are formed.

Next, a method of manufacturing a multilayer substrate will be described with reference to FIGS.

As shown in FIG. 74, two metal foils 34,
34, double-sided circuit board 36 having circuit patterns 35, 35 on both sides, and conductive paste 32 in a required number of through holes 31.
And two prepreg sheets 30 filled with are prepared, and positioning pins 38, 38 provided on the laminated die 37 are provided on these.
A required number of positioning holes 39 for positioning through the through holes are provided, and the positioning holes 39 are provided on the positioning pins 38, 38 provided on the laminated die 37 from the bottom to the metal foil 34, the prepreg sheet 30, the double-sided circuit board 36, Prepreg sheet 3
0 and the metal foil 34 are passed through in this order and stacked.

As shown in FIG. 75, from the bottom, the metal foil 3
4, the prepreg sheet 30, the double-sided circuit board 36, the prepreg sheet 30, and the metal foil 34 are stacked in this order, and the upper die 40 having the positioning holes 39 is placed on the prepreg sheet 30 and heated and pressed by a heat press to obtain the prepreg sheet 30. The uncured epoxy resin is once melted and adapted to the contact substance to be cured, and the metal foil 34, the prepreg sheet 30, the double-sided circuit board 36, the prepreg sheet 30 and the metal foil 34 are integrally bonded, and the circuit pattern 35, 35 is electrically connected to the metal foils 34, 34 by the required number of conductive pastes 32.

When the laminated body after hot pressing is removed from the laminated metal mold 37, as shown in FIG. 76, the metal foil 34, the prepreg sheet 30, the double-sided circuit board 36, and the prepreg sheet 3 are formed.
0 and the metal foil 34 are integrally bonded to each other.

Finally, as shown in FIG. 77, the metal foils 34, 34 adhered on both sides are selectively etched to form the circuit patterns 41, 41, whereby a four-layer substrate 42 is obtained.

[0014]

However, in the structure of the above-mentioned conventional example, the positioning holes 39 of the metal foil 34, the prepreg sheet 30, the double-sided circuit board 36, the prepreg sheet 30, and the metal foil 34 are passed through the positioning pins 38. In this state, the prepreg sheet 30 is heated and pressed by a hot press, and at that time, the uncured epoxy resin of the prepreg sheet 30 is once melted and adapted to the contact object to be cured. At the same time as the circuit board 36, the prepreg sheet 30 and the metal foil 34 are integrally bonded, the epoxy resin of the prepreg sheet 30 is bonded to the positioning pins 38. Therefore, although the stacking accuracy is good, it is troublesome to remove the multi-layer substrate 42 obtained by heating and pressing from the positioning pins 38 to which the epoxy resin is adhered, which causes a problem that the work efficiency is lowered, and the removal is difficult. Positioning pin 38
There is a problem that the layering accuracy may be deteriorated by deforming the layer.

Further, in order to secure the positioning accuracy of the positioning pin 38, it is necessary to make the positioning pin 38 thick and to use a thick laminated die 37, for example, a thick die 10 mm. , The problem that the number of circuit boards that can be processed by this thickness is reduced, and because the thickness is thick, the weight of the mold becomes heavy and the workability deteriorates,
There are problems that it is difficult to increase the substrate size and that a mold is required for each substrate size.

When hot pressing is performed without using the positioning pins 38, when the uncured epoxy resin of the prepreg sheet 30 is softened before curing, slippage occurs and circuit disconnection or short circuit occurs. Therefore, conventionally, the positioning pin 38 at the time of hot pressing was absolutely necessary.

An object of the present invention is to solve the above-mentioned problems and to provide a method for manufacturing a printed wiring board for a multilayer substrate, which has good stacking accuracy and excellent productivity.

[0018]

In order to solve the above-mentioned problems, the method for manufacturing a printed wiring board according to the first aspect of the present invention sequentially positions a required number of double-sided circuit boards and a required number of prepreg sheets, An overlaying step of applying an adhesive to a predetermined position of the double-sided circuit board or the prepreg sheet and alternately stacking to form a laminate, and curing the adhesive at a temperature lower than the softening temperature of the epoxy resin of the prepreg sheet. And a temporary fixing step of temporarily fixing the laminate,
The method includes a hot pressing step in which the temporarily fixed laminate is taken out from the temporary fixing step and heat-pressed alone or together with a metal foil to form a multilayer substrate.

In order to solve the above-mentioned problems, the method for manufacturing a printed wiring board according to the second invention of the present application, while positioning the required number of double-sided circuit boards and the required number of prepreg sheets in sequence, the double-sided circuit board and the double-sided circuit board. When the main component of the adhesive and the curing agent are separately applied to the predetermined positions of the prepreg sheet, and the main component and the curing agent are overlapped and mixed at the time of stacking, a laminate is formed by stacking them alternately. At the same time, a temporary fixing step of temporarily fixing the laminate by curing the adhesive, and taking out the temporarily fixed laminate from the temporary fixing step, alone or together with a metal foil, hot pressing And a hot pressing step of forming a multilayer substrate.

In order to solve the above-mentioned problems, the method for manufacturing a printed wiring board according to the third aspect of the present invention is arranged such that the required number of double-sided circuit boards and the required number of prepreg sheets are sequentially positioned while the double-sided circuit board or the double-sided circuit board is provided. A temporary fixing step of attaching a double-sided adhesive sheet to a predetermined position of a prepreg sheet, forming a laminate by alternately stacking the same, and at the same time temporarily fixing the laminate, and the temporary fixing step of temporarily fixing the laminate. And a hot pressing step of forming a multilayer substrate by hot pressing alone or together with a metal foil.

In order to solve the above-mentioned problems, in the method for manufacturing a printed wiring board according to the fourth aspect of the present invention, the required number of double-sided circuit boards and the required number of prepreg sheets are sequentially positioned while the double-sided circuit board or the double-sided circuit board is provided. At a predetermined temperature of the prepreg sheet, a low-temperature curable adhesive and a high-temperature curable adhesive are separately applied, and a lamination step of alternately superimposing them to form a laminate, and at a temperature lower than the softening temperature of the epoxy resin of the prepreg sheet. A temporary fixing step of curing the low temperature curing adhesive and temporarily fixing the laminate, and the temporarily fixed laminate is taken out from the temporary fixing step, and alone or together with a metal foil, hot pressed. And a hot pressing step of forming the multilayer substrate while curing the high temperature curing adhesive to prevent lateral displacement.

In order to solve the above-mentioned problems, the method for manufacturing a printed wiring board according to the fifth aspect of the present invention is arranged such that the required number of double-sided circuit boards and the required number of prepreg sheets are sequentially positioned while the double-sided circuit board or the double-sided circuit board is provided. An adhesive containing an inorganic substance powder is applied to a predetermined position of a prepreg sheet, and a superposing step of forming a laminate by superposing them alternately, the inorganic substance powder at a temperature lower than the softening temperature of the epoxy resin of the prepreg sheet. A temporary fixing step of curing the adhesive containing and temporarily fixing the laminate, and the temporarily fixed laminate is taken out from the temporary fixing step, and alone or together with a metal foil, hot pressed And a hot pressing step of forming a multilayer substrate while preventing lateral displacement due to the inorganic substance powder being caught by the upper and lower laminates.

In the method for manufacturing a printed wiring board according to the first, third, fourth or fifth aspect of the present invention, in order to solve the above problems, the adhesive is cured by at least one of heat, light and electron beam. It is preferred to use one.

In order to solve the above problems, in the method for manufacturing a printed wiring board according to the sixth aspect of the present invention, a required number of double-sided circuit boards and a required number of prepreg sheets are positioned and alternately laminated to form a laminate. And a temporary fixing step of temporarily binding the laminated product by penetrating a predetermined position of the laminated product with a metal penetrating piece, and temporarily fixing the temporarily fixed laminated product. And a heat pressing step of forming a multilayer substrate by hot pressing alone or together with a metal foil.

In order to solve the above problems, the printed wiring board manufacturing method of the seventh invention of the present application positions a required number of double-sided circuit boards and a required number of prepreg sheets, and alternately stacks them to form a laminate. A superimposing step of forming, a temporary fixing step of driving a metal- or resin-made convex lateral deviation prevention piece into a predetermined position of the laminate to temporarily fix it, and the temporarily fixed laminate described above. And a hot pressing step of forming a multilayer substrate by hot pressing alone or together with the metal foil from the temporary fixing step.

Further, in the method for manufacturing a printed wiring board according to the seventh aspect of the present invention, in order to solve the above problems, it is preferable to provide a counterbore at a position where the lateral deviation prevention piece is driven. .

In order to solve the above problems, the printed wiring board manufacturing method according to the eighth invention of the present application positions a required number of double-sided circuit boards and a required number of prepreg sheets, and alternately stacks them to form a laminate. And a through hole penetrating the front and back at a predetermined position of the laminate, and a resin having a softening temperature higher than the curing temperature of the epoxy resin of the prepreg sheet is injected by injection into this through hole. A temporary fixing step and a hot pressing step of taking out the temporarily fixed laminate from the temporary fixing step and hot pressing it alone or with a metal foil to form a multilayer substrate, To do.

In the printed wiring board manufacturing method of the first, second, third, fourth, fifth, sixth, seventh or eighth invention of the present application, in order to solve the above-mentioned problems, positioning is performed by a positioning jig, or Alternatively, it is preferable to perform position recognition by image processing.

[0029]

In the first invention of the present application, the adhesive is applied to predetermined positions of the double-sided circuit board or the prepreg sheet while the required number of double-sided circuit boards and the required number of prepreg sheets are sequentially positioned in the superposing step, and the two are alternately arranged. To form a laminate, and in the temporary fixing step, since the adhesive is cured and the laminate is temporarily fixed at a temperature lower than the softening temperature of the epoxy resin of the prepreg sheet, in the temporary fixing step, the prepreg sheet is The epoxy resin does not adhere to the jig, the laminate can be easily taken out from the jig, the jig is not damaged, and the productivity is improved.

Since the layers are temporarily fixed, no misalignment occurs between layers during the hot pressing process, the stacking accuracy is good, and
Since hot pressing can be performed with a general-purpose flat mold, it is easy to handle and it is easy to increase the substrate size.

In the second invention of the present application, instead of the adhesive of the first invention of the present application, the main agent and the curing agent are separately applied, and when they are overlapped, the main agent and the curing agent are mixed so as to overlap each other. Therefore, in addition to the effect of the first invention of the present application, the curing treatment of the adhesive is not required, the productivity is further improved, and a strong temporary fixing force can be maintained even when heated in the hot press step. The stacking accuracy is further improved.

In the third invention of the present application, since the double-sided adhesive sheet is used in place of the adhesive of the first invention of the present application, in addition to the function of the first invention of the present application, the curing treatment of the adhesive becomes unnecessary, Productivity is improved.

In the fourth invention of the present application, a low-temperature curing adhesive and a high-temperature curing adhesive are used in place of the adhesive of the first invention of the present application, and the temperature is lower than the softening temperature of the epoxy resin of the prepreg sheet in the temporary fixing step. Since the low temperature curable adhesive is cured to prevent the layers from being displaced from each other in the laminate, and the high temperature curable adhesive is cured to prevent lateral displacement in the hot pressing process, the multilayer substrate is formed. In addition, the stacking accuracy is improved.

In the fifth invention of the present application, an adhesive containing an inorganic substance powder is used in place of the adhesive of the first invention of the present application. Therefore, even if the adhesive softens due to heating in the hot pressing step, Since the inorganic substance powder is caught on the upper and lower layers to prevent lateral displacement, the stacking accuracy is improved in addition to the effect of the first invention of the present application.

In the sixth invention of the present application, instead of the adhesive of the first invention of the present application, after the superposing step, a predetermined position of the laminate is penetrated by a metal penetrating piece to temporarily bind and fix the laminate. Therefore, in addition to the effect of the first invention of the present application, the processing is simple and the productivity is improved, and the stacking accuracy is improved without being displaced by the heating in the hot pressing step.

In the seventh invention of the present application, instead of the adhesive of the first invention of the present application, after the superimposing step, a metal- or resin-made convex-shaped lateral deviation prevention piece is driven into a predetermined position of the laminate to temporarily use it. Since it is fixed, in addition to the function of the first invention of the present application,
The processing is simple and the productivity is improved, and the stacking accuracy is improved without being displaced by the heating in the hot pressing step.

In the eighth invention of the present application, in place of the adhesive of the first invention of the present application, after the superposing step, a through hole penetrating through the front and back is formed at a predetermined position of the laminate, and the through hole is injected to form a through hole. Since the resin having a softening temperature higher than the curing temperature of the epoxy resin of the prepreg sheet is injected, in addition to the function of the first invention of the present application, there is no deviation due to heating in the hot pressing step, and the stacking accuracy is improved.

[0038]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS.

In this embodiment, a four-layer board is taken as an example. In FIG. 1, 7 is a positioning plate for temporary fixing having a required number of positioning pins 6. Reference numeral 1 is a prepreg sheet made of a composite material in which a nonwoven fabric of aromatic polyamide fiber having a thickness of about 150 μm is impregnated with a thermosetting epoxy resin in an uncured state, and a conductive paste 2 is formed in a through hole processed by a laser or the like. Is filled. A predetermined number of positioning holes 5, 5 for temporary fixing are provided at predetermined positions of the prepreg sheet 1, and the positioning holes 5, 5 are passed through the positioning pins 6, 6 of the positioning plate 7 for temporary fixing to perform positioning. Place the prepreg sheet 1 on the positioning plate 7,
The adhesive 8 is applied to two or more predetermined positions using a dispenser or the like. It is possible to prevent misalignment by applying it to two or more places, but in this embodiment, 4 of the prepreg sheet 1 is used.
It is applied to the corners.

In FIG. 2, 3 is a double-sided circuit board having a thickness of about 170 μm, and the circuit patterns 4 and 4 formed on both sides are electrically conductive by the conductive paste 2 filled in the through holes provided at predetermined positions. Connected to each other. A required number of positioning holes 5 and 5 for temporary fixing are provided at predetermined positions of the double-sided circuit board 3, and the positioning holes 5 and 5 are passed through the positioning pins 6 and 6 of the positioning plate 7 to position the double-sided circuit board. 3 is placed on the prepreg sheet 1, and the adhesive 8 is applied to two or more predetermined positions using a dispenser or the like. In this embodiment, the double-sided circuit board 3
Is applied to the four corners.

In FIG. 3, reference numeral 1 is the same prepreg sheet as described above, and the conductive paste 2 is filled in through holes processed by laser or the like. This prepreg sheet 1
A predetermined number of positioning holes 5 and 5 for temporary fixing are provided at predetermined positions of the prepreg sheet 1 while positioning the positioning holes 5 and 5 through the positioning pins 6 and 6 of the positioning plate 7. Place it on the substrate 3. And
Approximately 2 kg / cm ² from the outside at the position where the adhesive 8 was applied
Of the prepreg sheets 1 and 1 and the double-sided circuit board 3 so that the adhesive 8 inside the prepreg sheets 1 and 1 and the double-sided circuit board 3 are put into the furnace, and the uncured epoxy resin of the prepreg sheet 1 flows out. At a temperature lower than the temperature, for example, a temperature of 110 ° C. or lower, in this embodiment, 50
The adhesive 8 is cured by heating at ° C. In this way, since the uncured epoxy resin of the prepreg sheet 1 does not flow out, even if the adhesive is temporarily softened,
No gap between layers occurs.

The same effect can be obtained by using, as the curing agent 8, an adhesive which is cured by light or an electron beam in addition to a thermosetting adhesive which is placed in a furnace and thermally cured. When using light, the applied adhesive 8 is irradiated with ultraviolet rays to start a curing reaction, and in this state, the double-sided circuit board 3 or the prepreg sheet 1 is placed thereon, and the curing reaction continues and the curing is completed. To do. In the case of an electron beam, since it has a penetrating power, it is sufficient to irradiate the application position of the adhesive 8 with the electron beam in a laminated state after laminating.

When the above-mentioned curing is completed, the laminate fixed by the cured adhesive 8 in a laminated state is fixed to the positioning pin 3.
Remove from 4, 34. In this case, since the adhesive 8 is heated at a temperature lower than the temperature at which the uncured epoxy resin of the prepreg sheet 1 flows out, the epoxy resin of the prepreg sheet 1 is bonded to the positioning pins 34. It is easy to remove.

Then, as shown in FIG. 4, metal foils 9, 9 are superposed on both sides of the laminate temporarily fixed in a laminated state by a cured adhesive 8, and the pressure is 50 Kg / c by hot pressing.
m ^2, by performing the heating and pressurizing a temperature 200 ° C1 hours, a double-sided circuit board 3 is cured after familiar around epoxy resin of the prepreg sheet 1 is once softened in the vicinity 110 ° C 2 prepreg sheets The metal foils 1, 1 and 2 are bonded to each other, and the circuit patterns 4, 4 and the metal foils 9, 9 are electrically connected by the conductive paste 2 to form a multilayer substrate.

Finally, as shown in FIG. 5, metal foils 9, 9
Is selectively etched to form the circuit patterns 10 and 10, the four-layer substrate 11 is obtained. In the case of a multi-layered substrate having five or more layers, the four-layered substrate 11 is passed through the positioning pins 6, 6 of the positioning plate 7 for temporary fixing, and the adhesive 8 is applied onto the positioning pins 6, 6 to temporarily fix the prepreg sheet 1. Further, the metal foil 9 may be further stacked thereon, hot-pressed, and etching may be repeated.

A second embodiment of the present invention will be described with reference to FIGS.

In this embodiment, a four-layer board is taken as an example. In FIG. 6, 7 is a positioning plate for temporary fixing having a required number of positioning pins 6. Reference numeral 3 is a double-sided circuit board having a thickness of about 170 μm, and the circuit patterns 4 and 4 formed on both surfaces are electrically connected by a conductive paste 2 filled in through holes provided at predetermined positions. The required number of positioning holes 5 and 5 for temporary fixing are provided at predetermined positions on the double-sided circuit board 3, and the positioning holes 5 and 5 are passed through the positioning pins 6 and 6 of the positioning plate 7 for positioning. Is placed on the positioning plate 7, and the adhesive 8 is applied to two or more predetermined positions using a dispenser or the like. In this embodiment, it is applied to the four corners of the double-sided circuit board 3.

In FIG. 7, reference numeral 1 denotes a prepreg sheet made of a composite material obtained by impregnating a nonwoven fabric of aromatic polyamide fiber having a thickness of about 150 μm with a thermosetting epoxy resin in an uncured state, and processed by a laser or the like. The through hole is filled with the conductive paste 2.

A predetermined number of positioning holes 5 and 5 for temporary fixing are provided at predetermined positions of the prepreg sheet 1, and the positioning holes 5 and 5 are used for positioning pins 6 of the positioning plate 7.
The prepreg sheet 1 is placed on the double-sided circuit board 3 while being positioned through 6 and the adhesive 8 is applied to two or more predetermined positions using a dispenser or the like. In this embodiment, it is applied to the four corners of the prepreg sheet 1.

In FIG. 8, 3 is a double-sided circuit board having a thickness of about 170 μm, and the circuit patterns 4 and 4 formed on both sides are electrically conductive by the conductive paste 2 filled in the through holes provided at predetermined positions. Connected to each other. A required number of positioning holes 5 and 5 for temporary fixing are provided at predetermined positions of the double-sided circuit board 3, and the positioning holes 5 and 5 are passed through the positioning pins 6 and 6 of the positioning plate 7 to position the double-sided circuit board. 3 is placed on the prepreg sheet 1 described above. Then, at the position where the adhesive 8 is applied, approximately 2
By applying a pressure of Kg / cm ² , the adhesive 8 inside is made to conform to the prepreg sheet 1 and the double-sided circuit boards 3 and 3, and in this state, the positioning plate 7 is put in a furnace to uncured the prepreg sheet 1. The adhesive 8 is cured by heating at a temperature lower than the temperature at which the epoxy resin flows out, for example, at a temperature of 110 ° C. or lower, in this embodiment, at 50 ° C.

The same effect can be obtained by using, as the curing agent 8, an adhesive which is cured by light or an electron beam, in addition to a thermosetting adhesive which is placed in a furnace and thermally cured. When using light, the applied adhesive 8 is irradiated with ultraviolet rays to start a curing reaction, and in this state, the double-sided circuit board 3 or the prepreg sheet 1 is placed thereon, and the curing reaction continues and the curing is completed. To do. In the case of an electron beam, since it has a penetrating power, it is sufficient to irradiate the application position of the adhesive 8 with the electron beam in a laminated state after laminating.

When the above-mentioned curing is completed, the laminate temporarily fixed in the laminated state by the cured adhesive 8 is removed from the positioning pin 34. In this case, since the adhesive 8 is heated at a temperature lower than the temperature at which the uncured epoxy resin of the prepreg sheet 1 flows out, the epoxy resin of the prepreg sheet 1 is bonded to the positioning pins 34. It is easy to remove.

Next, the laminate temporarily fixed in the laminated state with the cured adhesive 8 is subjected to a pressure of 50 Kg / c by hot pressing.
The epoxy resin of the prepreg sheet 1 is softened once at around 110 ° C. by being heated and pressed at m ² and a temperature of 200 ° C. for 1 hour, and then hardened after being blended with the surroundings to form two double-sided circuit boards 3 and 3. One prepreg sheet 1 is adhered to form a four-layer substrate 12. When the number of layers is five or more, the double-sided circuit board 3 and the prepreg sheet 1 depending on the number of layers may be used.

In the first and second embodiments, the positioning pin 6 is attached to the positioning plate 7 for temporary fixing.
The positioning guide is not limited to the positioning pin, and may be a positioning guide that regulates the position from the surroundings, and the jig used for positioning can be designed freely.

A third embodiment of the present invention will be described with reference to FIGS.

In this embodiment, a four-layer board is taken as an example. The structure of the four-layer board of this embodiment is the same as that of the first embodiment shown in FIGS. 1 to 5 except that in the first embodiment, the prepreg sheet 1 and the double-sided circuit board 3 to be stacked are stacked. In the present embodiment, the adhesive main agent 13 is applied to one of the facing surfaces and the adhesive curing agent 14 is applied to the other side. is there. In this way, when a predetermined pressure is applied so that the main agent 13 and the curing agent 14 are sufficiently blended and mixed at the time of stacking, the main agent 13 and the curing agent 14 are mixed, and at the same time, they are rapidly cured at room temperature to cure and bond. The agent 15 is formed and the temporary fixing is completed. Therefore, no special heating device is required and the adhesive strength is strong.

Since a heating device is not particularly required, as shown in FIG. 69, by using the recognition circuit pattern 26 and the recognition conductive paste filling hole 27 on the positioning plate 25 having no positioning pin, It may be positioned by the image recognition means.

A fourth embodiment of the present invention will be described with reference to FIGS.

In this embodiment, a four-layer board is taken as an example. The structure of the four-layer board of this embodiment is the same as that of the second embodiment shown in FIGS. 6 to 9 except that in the second embodiment, the prepreg sheet 1 and the double-sided circuit board 3 to be stacked are stacked. In the present embodiment, the adhesive main agent 13 is applied to one of the facing surfaces and the adhesive curing agent 14 is applied to the other side. is there. In this way, when a predetermined pressure is applied so that the main agent 13 and the curing agent 14 are sufficiently blended and mixed at the time of stacking, the main agent 13 and the curing agent 14 are mixed, and at the same time, they are rapidly cured at room temperature to give a cured adhesive. It becomes 15 and the temporary fixing is completed. Therefore, no special heating device is required and the adhesive strength is strong.

Since no heating device is particularly required, as shown in FIG. 69, by using the recognition circuit pattern 26 and the recognition conductive paste filling hole 27 on the positioning plate 25 having no positioning pin, It may be positioned by the image recognition means.

A fifth embodiment of the present invention will be described with reference to FIGS.

In this embodiment, a four-layer board is taken as an example. The structure of the four-layer board of this embodiment is the same as that of the first embodiment shown in FIGS. 1 to 5 except that in the first embodiment, the prepreg sheet 1 and the double-sided circuit board 3 to be stacked are stacked. That the adhesive 8 is applied to the lower side is that in this embodiment, the double-sided adhesive sheet 16 in which the adhesive is applied to both sides of the woven cloth is used. In this way, when a predetermined pressure is applied so that the adhesive of the double-sided adhesive sheet 16 fits in the surroundings at the time of stacking, the temporary fixing is quickly completed at room temperature. Therefore, no special heating device is required.

Since a heating device is not particularly required, as shown in FIG. 69, by using the recognition circuit pattern 26 and the recognition conductive paste filling hole 27 on the positioning plate 25 having no positioning pin, It may be positioned by the image recognition means.

When the adhesive of the double-sided adhesive sheet 16 is hardened by heat, light or electron beam, the above-mentioned treatment of the first embodiment may be carried out.

A sixth embodiment of the present invention will be described with reference to FIGS.

In this embodiment, a four-layer board is taken as an example. The structure of the four-layer board of this embodiment is the same as that of the second embodiment shown in FIGS. 6 to 9 except that in the second embodiment, the prepreg sheet 1 and the double-sided circuit board 3 to be stacked are stacked. That the adhesive 8 is applied to the lower side is that in this embodiment, the double-sided adhesive sheet 16 in which the adhesive is applied to both sides of the woven cloth is used. In this way, when a predetermined pressure is applied so that the adhesive of the double-sided adhesive sheet 16 fits in the surroundings at the time of stacking, the temporary fixing is quickly completed at room temperature. Therefore, no special heating device is required.

Since a heating device is not particularly required, as shown in FIG. 69, by using the recognition circuit pattern 26 and the recognition conductive paste filling hole 27 on the positioning plate 25 having no positioning pin, It may be positioned by the image recognition means.

When the adhesive of the double-sided adhesive sheet 16 is hardened by heat, light or electron beam, the above-mentioned treatment of the second embodiment may be carried out.

The seventh embodiment of the present invention will be described with reference to FIGS.

In this embodiment, a four-layer board is taken as an example. The structure of the four-layer board of this embodiment is the same as that of the first embodiment shown in FIGS. 1 to 5 except that in the first embodiment, the prepreg sheet 1 and the double-sided circuit board 3 to be stacked are stacked. In this embodiment, the adhesive 8 is applied to the lower side. In this embodiment, the low temperature curing adhesive 17 and the high temperature curing adhesive 18 are separated on the lower side using a dispenser or the like. That is the application. The low temperature curing adhesive 17 is cured at a temperature lower than the softening temperature before the uncured epoxy resin of the prepreg sheet 1 is cured, that is, 50 ° C. in this embodiment. The high temperature curing adhesive 18 is at a temperature near the softening temperature before the uncured epoxy resin of the prepreg sheet 1 is cured, and in this embodiment, 1
It cures at 00 ° C to 120 ° C. In this way, 2 Kg / cm from the outside is applied to the position where the adhesives 17 and 18 are applied.
^Applying a pressure of ² , apply the adhesive 17 and 18 inside to the surroundings and put it in a furnace to temporarily fix it to about 50 °.
By heating to C, only the low temperature curing adhesive 17 is cured and temporarily fixed. The high-temperature curing adhesive 18 is cured by placing metal foils on both sides of the laminated plate that has been temporarily fixed, and applying a heat press at a pressure of 50K.
It is performed when the uncured epoxy resin of the prepreg sheet 1 is cured by heating at a temperature of 200 ° C. for 1 hour at g / cm ² . In this case, the high-temperature curing adhesive 18 is cured at a temperature around 110 ° C. at which the uncured epoxy resin of the prepreg sheet 1 starts to soften, so that the displacement of the epoxy resin due to softening can be effectively prevented.

The eighth embodiment of the present invention will be described with reference to FIGS.

In this embodiment, a four-layer board is taken as an example. The structure of the four-layer board of this embodiment is the same as that of the second embodiment shown in FIGS. 6 to 9 except that in the second embodiment, the prepreg sheet 1 and the double-sided circuit board 3 to be stacked are stacked. In this embodiment, the adhesive 8 is applied to the lower side. In this embodiment, the low temperature curing adhesive 17 and the high temperature curing adhesive 18 are applied to the lower side using a dispenser or the like. It is that you are.
The low temperature curing adhesive 17 is cured at a softening temperature of less than 110 ° C. before curing the uncured epoxy resin of the prepreg sheet 1, that is, 50 ° C. in this embodiment. The high temperature curing adhesive 18 is cured at a softening temperature before the uncured epoxy resin of the prepreg sheet 1 is cured, for example, at a temperature near 110 ° C, and in this embodiment, at 100 ° C to 120 ° C. In this way, a pressure of ² Kg / cm ² is applied from the outside to the positions where the adhesives 17 and 18 are applied, so that the adhesives 17 and 18 inside are made to fit around and temporarily fixed,
The whole is put in a furnace and heated to about 50 ° C. to cure only the low temperature curing adhesive 17 and temporarily fix it. The high-temperature curing adhesive 18 is cured by pressing the laminated body, which has been temporarily fixed, with a hot press at a pressure of 5
This is performed when the uncured epoxy resin of the prepreg sheet 1 is cured by heating and pressing at 0 Kg / cm ² and a temperature of 200 ° C. for 1 hour. In this case, the high temperature curing adhesive 18 is
Since the uncured epoxy resin of the prepreg sheet 1 is cured at a temperature at which it begins to soften, it is possible to effectively prevent the positional displacement due to the softening of the epoxy resin.

The ninth embodiment of the present invention will be described with reference to FIGS.

In this embodiment, a four-layer board is taken as an example. The structure of the four-layer board of this embodiment is the same as that of the first embodiment shown in FIGS. 1 to 5 except that in the first embodiment, the prepreg sheet 1 and the double-sided circuit board 3 to be stacked are stacked. The fact that the adhesive 8 is applied to the lower side means that the adhesive 19 to which the inorganic substance powder is added is applied to the lower side using a dispenser or the like in this embodiment. . In this embodiment, zinc whisker powder was used as the inorganic substance powder. Other powders may be used, but it is desirable that they can penetrate into the upper and lower layers due to their size and shape. When the adhesive 19 to which the inorganic substance powder is added is used, metal foils are laminated on both sides of the laminated plate which has been temporarily fixed, and when heat is applied at a pressure of 50 Kg / cm ² and a temperature of 200 ° C. for 1 hour by hot pressing, Even if the adhesive 19 is softened, the inorganic substance powder can be caught on the upper and lower laminates, and the gap between the laminates can be prevented.

The tenth embodiment of the present invention will be described with reference to FIGS. 38 to 41.

In this embodiment, a four-layer board is taken as an example. The structure of the four-layer board of this embodiment is the same as that of the second embodiment shown in FIGS. 6 to 9 except that in the second embodiment, the prepreg sheet 1 and the double-sided circuit board 3 to be stacked are stacked. The fact that the adhesive 8 is applied to the lower side means that the adhesive 19 to which the inorganic substance powder is added is applied to the lower side using a dispenser or the like in this embodiment. . In this embodiment, zinc whisker powder was used as the inorganic substance powder. Other powders may be used, but it is desirable that they can penetrate into the upper and lower layers due to their size and shape. When the adhesive 19 containing the inorganic substance powder is used, the adhesive 19 is softened when the laminate, which has been temporarily fixed, is heated by a hot press at a pressure of 50 Kg / cm ² and a temperature of 200 ° C. for 1 hour. Also, it is possible to prevent the inorganic substance powder from being caught in the upper and lower laminates and being displaced from each other.

The eleventh embodiment of the present invention will be described with reference to FIGS.

In FIG. 42, the prepreg sheet 1 is attached to the positioning pins 6 of the positioning plate 7 for temporary fixing.
The double-sided circuit board 3 and the prepreg sheet 1 are positioned and stacked through the positioning holes 5 and 5 in this order, and in FIG. 43, the metal penetrating piece 20 is hammered in to bind and temporarily fix the laminate.

In FIG. 44, the temporarily fixed laminate is taken out from the positioning pins 6 of the positioning plate 7 for temporary fixing.

Since the eleventh embodiment does not require a heating device, as shown in FIG. 69, the recognition circuit pattern 26 and the recognition conductive paste filling hole 27 are provided on the positioning plate 25 having no positioning pin. It may be used and positioned by the image recognition means.

In FIG. 45, the metal foils 9 are stacked on the upper and lower surfaces of the temporarily fixed laminate.

In FIG. 46, a pressure of 50K is obtained by hot pressing.
g / cm ^2, subjected to a heat temperature 200 ° C1 hours, the metal foil 9,9 is bonded to prepreg sheet 1,1, the double-sided circuit board 3 circuit pattern 4, 4 and the metal foil 9,9 and conductive paste 2 electrically connected.

In FIG. 47, metal foils 9 and 9 on both sides are selectively etched to form circuit patterns 4 and 4,
The layer substrate 11 is obtained.

The twelfth embodiment of the present invention will be described with reference to FIGS.

In FIG. 48, the double-sided circuit board 3, the prepreg sheet 1, and the double-sided circuit board 3 are positioned and superposed on the positioning pins 6 and 6 of the positioning plate 7 for temporary fixing in order through these positioning holes 5 and 5. 49, the metal penetrating piece 20 is driven in to bind and temporarily fix the laminate.

In FIG. 50, the temporarily fixed laminate is taken out from the positioning pins 6 and 6 of the positioning plate 7 for temporary fixing, and is heat-pressed at a pressure of 50 Kg / cm ² and a temperature of 2.
The double-sided circuit board 3, the prepreg sheet 1 and the double-sided circuit board 3 are bonded by heating at 00 ° C for 1 hour, and the circuit patterns 4 and 4 of the two double-sided circuit boards 3 are electrically connected by the conductive paste 2. A layered substrate 12 is obtained.

Since the twelfth embodiment does not require a heating device, as shown in FIG. 69, the recognition circuit pattern 26 and the recognition conductive paste filling hole 27 are provided on the positioning plate 25 having no positioning pin. It may be used and positioned by the image recognition means.

The thirteenth embodiment of the present invention will be described with reference to FIGS.

In FIG. 51, the prepreg sheet 1 and the positioning pins 6 of the positioning plate 7 for temporary fixing are attached to
The double-sided circuit board 3 and the prepreg sheet 1 are positioned and superposed in order through the positioning holes 5 and 5, and in FIG. 52, a convex lateral deviation prevention piece 21 made of metal or resin for preventing lateral deviation of the laminate is formed. , And is temporarily fixed by hammering into the laminate of FIG.

In FIG. 53, the temporarily fixed laminated product is taken out from the positioning pins 6 of the positioning plate 7 for temporary fixing.

Since the thirteenth embodiment does not particularly require a heating device, as shown in FIG. 69, the recognition circuit pattern 26 and the recognition conductive paste filling hole 27 are provided on the positioning plate 25 having no positioning pin. It may be used and positioned by the image recognition means.

In FIG. 54, the metal foils 9 are overlaid on the upper and lower surfaces of the temporarily fixed laminate.

In FIG. 55, the pressure is 50K by hot pressing.
g / cm ^2, subjected to a heat temperature 200 ° C1 hours, the metal foil 9,9 is bonded to prepreg sheet 1,1, the double-sided circuit board 3 circuit pattern 4, 4 and the metal foil 9,9 and conductive paste 2 electrically connected.

In FIG. 56, the metal foils 9 and 9 on both sides are selectively etched to form circuit patterns 4 and 4.
The layer substrate 11 is obtained.

A fourteenth embodiment of the present invention will be described with reference to FIGS. 57 to 59.

In FIG. 57, the double-sided circuit board 3, the prepreg sheet 1, and the double-sided circuit board 3 are positioned and superposed on the positioning pins 6 and 6 of the positioning plate 7 for temporary fixing in order through these positioning holes 5 and 5. . in this case,
Counterbore 22 penetrating the two double-sided circuit boards 3 and 3 at two or more predetermined positions is provided.

In FIG. 58, a convex lateral deviation prevention piece 21 made of metal or resin for preventing lateral deviation of the laminate.
Is hammered into the laminate of FIG. 57 from the counterbore 22, 22 and temporarily fixed.

In FIG. 59, the temporarily fixed laminate is taken out from the positioning pins 6, 6 of the positioning plate 7 for temporary fixing, and is heat-pressed at a pressure of 50 Kg / cm ² and a temperature of 2.
The double-sided circuit board 3, the prepreg sheet 1 and the double-sided circuit board 3 are bonded by heating at 00 ° C for 1 hour, and the circuit patterns 4 and 4 of the two double-sided circuit boards 3 are electrically connected by the conductive paste 2. A layered substrate 12 is obtained.

Since the 14th embodiment does not require a heating device in particular, as shown in FIG. 69, the recognition circuit pattern 26 and the recognition conductive paste filling hole 27 are provided on the positioning plate 25 having no positioning pin. It may be used and positioned by the image recognition means.

A fifteenth embodiment of the present invention will be described with reference to FIGS. 60 to 65.

In FIG. 60, the prepreg sheet 1 and the positioning pins 6, 6 of the positioning plate 7 for temporary fixing are
The double-sided circuit board 3 and the prepreg sheet 1 are positioned and stacked in this order through the positioning holes 5 and 5. In this case, through holes 23 penetrating the boards are provided at two or more predetermined positions of the two prepreg sheets 1 and the double-sided circuit board 3.

In FIG. 61, a resin 24 having a softening temperature higher than the curing temperature of the epoxy resin of the prepreg sheet 1 is injected into the through hole 23 by using an injection machine 25 to temporarily fix the laminate.

In FIG. 62, the temporarily fixed laminate is taken out from the positioning pins 6 of the positioning plate 7 for temporary fixing.

In FIG. 63, the metal foils 9 are stacked on the upper and lower surfaces of the temporarily fixed laminate.

In FIG. 64, a pressure of 50K is obtained by hot pressing.
g / cm ^2, subjected to a heat temperature 200 ° C1 hours, the metal foil 9,9 is bonded to prepreg sheet 1,1, the double-sided circuit board 3 circuit pattern 4, 4 and the metal foil 9,9 and conductive paste 2 electrically connected.

In FIG. 65, metal foils 9 and 9 on both sides are selectively etched to form circuit patterns 4 and 4,
The layer substrate 11 is obtained.

A sixteenth embodiment of the present invention will be described with reference to FIGS. 66 to 68.

In FIG. 66, the double-sided circuit board 3, the prepreg sheet 1, and the double-sided circuit board 3 are positioned and superposed on the positioning pins 6 and 6 of the positioning plate 7 for temporary fixing in order through these positioning holes 5 and 5. . in this case,
Through holes 23 penetrating the two double-sided circuit boards 3 and the prepreg sheet 1 are provided at two or more predetermined positions.

In FIG. 67, a resin 24 having a softening temperature higher than the curing temperature of the epoxy resin of the prepreg sheet 1 is injected into the through hole 23 by using an injection machine 25 to temporarily fix the laminate.

In FIG. 68, the temporarily fixed laminate is taken out from the positioning pins 6 and 6 of the positioning plate 7 for temporary fixing, and is heat-pressed at a pressure of 50 Kg / cm ² and a temperature of 2.
The double-sided circuit board 3, the prepreg sheet 1 and the double-sided circuit board 3 are bonded by heating at 00 ° C for 1 hour, and the circuit patterns 4 and 4 of the two double-sided circuit boards 3 are electrically connected by the conductive paste 2. A layered substrate 12 is obtained.

In the above examples, a prepreg sheet obtained by impregnating a thermosetting resin into a non-woven fabric composed mainly of an organic material was used. However, a prepreg sheet obtained by impregnating a woven cloth with a thermosetting resin or an inorganic material is used. The same effect can be obtained by using a prepreg sheet obtained by impregnating a non-woven fabric or a woven fabric mainly composed of the above with a thermosetting resin. Further, in the example, the prepreg sheet having the through holes filled with the conductive paste was used,
The same effect can be obtained by using a raw prepreg sheet.

[0112]

The method of manufacturing a printed wiring board according to the present invention comprises:
Before the heat pressing step, there is a temporary fixing step, and the temporary fixing process in the temporary fixing step is performed at a temperature equal to or lower than the softening temperature of the epoxy resin of the prepreg sheet. There is an effect that it is easy to take out the laminate from the positioning jig without adhering to the positioning jig, the positioning jig is not damaged, and the productivity is improved.

Since it is temporarily fixed, the stacking accuracy is good,
In addition, in the conventional technique, since hot pressing can be performed with a general-purpose flat mold that does not have the necessary positioning pins, it is easy to handle and the size of the substrate can be easily increased.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of the present invention.

FIG. 2 is a sectional view showing the first embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a first embodiment of the present invention.

FIG. 4 is a sectional view showing a first embodiment of the present invention.

FIG. 5 is a sectional view showing a first embodiment of the present invention.

FIG. 6 is a sectional view showing a second embodiment of the present invention.

FIG. 7 is a sectional view showing a second embodiment of the present invention.

FIG. 8 is a sectional view showing a second embodiment of the present invention.

FIG. 9 is a sectional view showing a second embodiment of the present invention.

FIG. 10 is a sectional view showing a third embodiment of the present invention.

FIG. 11 is a sectional view showing a third embodiment of the present invention.

FIG. 12 is a sectional view showing a third embodiment of the present invention.

FIG. 13 is a sectional view showing a third embodiment of the present invention.

FIG. 14 is a sectional view showing a fourth embodiment of the present invention.

FIG. 15 is a sectional view showing a fourth embodiment of the present invention.

FIG. 16 is a sectional view showing a fourth embodiment of the present invention.

FIG. 17 is a sectional view showing a fourth embodiment of the present invention.

FIG. 18 is a sectional view showing a fifth embodiment of the present invention.

FIG. 19 is a sectional view showing a fifth embodiment of the present invention.

FIG. 20 is a sectional view showing a fifth embodiment of the present invention.

FIG. 21 is a sectional view showing a fifth embodiment of the present invention.

FIG. 22 is a sectional view showing a sixth embodiment of the present invention.

FIG. 23 is a sectional view showing a sixth embodiment of the present invention.

FIG. 24 is a sectional view showing a sixth embodiment of the present invention.

FIG. 25 is a sectional view showing a sixth embodiment of the present invention.

FIG. 26 is a sectional view showing a seventh embodiment of the present invention.

FIG. 27 is a sectional view showing a seventh embodiment of the present invention.

FIG. 28 is a sectional view showing a seventh embodiment of the present invention.

FIG. 29 is a sectional view showing a seventh embodiment of the present invention.

FIG. 30 is a sectional view showing an eighth embodiment of the present invention.

FIG. 31 is a sectional view showing an eighth embodiment of the present invention.

FIG. 32 is a sectional view showing an eighth embodiment of the present invention.

FIG. 33 is a sectional view showing an eighth embodiment of the present invention.

FIG. 34 is a sectional view showing a ninth embodiment of the present invention.

FIG. 35 is a sectional view showing a ninth embodiment of the present invention.

FIG. 36 is a sectional view showing a ninth embodiment of the present invention.

FIG. 37 is a sectional view showing a ninth embodiment of the present invention.

FIG. 38 is a sectional view showing a tenth embodiment of the present invention.

FIG. 39 is a sectional view showing a tenth embodiment of the present invention.

FIG. 40 is a sectional view showing a tenth embodiment of the present invention.

FIG. 41 is a sectional view showing a tenth embodiment of the present invention.

FIG. 42 is a sectional view showing an eleventh embodiment of the present invention.

FIG. 43 is a sectional view showing an eleventh embodiment of the present invention.

FIG. 44 is a sectional view showing an eleventh embodiment of the present invention.

FIG. 45 is a sectional view showing an eleventh embodiment of the present invention.

FIG. 46 is a sectional view showing an eleventh embodiment of the present invention.

FIG. 47 is a sectional view showing an eleventh embodiment of the present invention.

FIG. 48 is a sectional view showing a twelfth embodiment of the present invention.

FIG. 49 is a sectional view showing a twelfth embodiment of the present invention.

FIG. 50 is a sectional view showing a twelfth embodiment of the present invention.

FIG. 51 is a sectional view showing a thirteenth embodiment of the present invention.

52 is a sectional view showing a thirteenth embodiment of the present invention. FIG.

FIG. 53 is a sectional view showing a thirteenth embodiment of the present invention.

FIG. 54 is a sectional view showing a thirteenth embodiment of the present invention.

FIG. 55 is a sectional view showing a thirteenth embodiment of the present invention.

FIG. 56 is a sectional view showing a thirteenth embodiment of the present invention.

FIG. 57 is a sectional view showing a fourteenth embodiment of the present invention.

FIG. 58 is a sectional view showing a fourteenth embodiment of the present invention.

FIG. 59 is a sectional view showing a fourteenth embodiment of the present invention.

FIG. 60 is a sectional view showing a fifteenth embodiment of the present invention.

FIG. 61 is a sectional view showing a fifteenth embodiment of the present invention.

FIG. 62 is a sectional view showing a fifteenth embodiment of the present invention.

FIG. 63 is a sectional view showing a fifteenth embodiment of the present invention.

FIG. 64 is a sectional view showing a fifteenth embodiment of the present invention.

FIG. 65 is a sectional view showing a fifteenth embodiment of the present invention.

FIG. 66 is a sectional view showing a sixteenth embodiment of the present invention.

FIG. 67 is a sectional view showing a sixteenth embodiment of the present invention.

FIG. 68 is a sectional view showing a sixteenth embodiment of the present invention.

FIG. 69 is a sectional view showing a seventeenth embodiment of the present invention.

FIG. 70 is a cross-sectional view showing the method of manufacturing the double-sided circuit board.

FIG. 71 is a cross-sectional view showing the method of manufacturing the double-sided circuit board.

FIG. 72 is a cross-sectional view showing the method of manufacturing the double-sided circuit board.

FIG. 73 is a cross-sectional view showing the method of manufacturing the double-sided circuit board.

FIG. 74 is a cross-sectional view showing the manufacturing method of the conventional example.

FIG. 75 is a cross-sectional view showing the manufacturing method of the conventional example.

FIG. 76 is a cross-sectional view showing the manufacturing method of the conventional example.

FIG. 77 is a cross-sectional view showing the manufacturing method of the conventional example.

[Explanation of symbols]

 1 Prepreg Sheet 2 Conductive Paste 3 Double-sided Circuit Board 4 Circuit Pattern 5 Positioning Hole 6 Positioning Pin 7 Positioning Plate 8 Adhesive 9 Metal Foil 10 Circuit Pattern 11 4 Layer Substrate 12 4 Layer Substrate 13 Main Agent 14 Curing Agent 15 Curing Adhesive 16 Both Sides Adhesive sheet 17 Low temperature curing adhesive 18 High temperature curing adhesive 19 Adhesive with inorganic powder 20 Penetration piece 21 Side slip prevention piece 22 Counterbore 23 Through hole 24 Resin 25 Injection machine 26 Recognition circuit pattern 27 Recognition conductive paste filling hole

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kunio Kishimoto 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (12)

[Claims] 1. An adhesive is applied to a predetermined position of the double-sided circuit board or the prepreg sheet while sequentially positioning a required number of double-sided circuit boards and a required number of prepreg sheets, and the layers are laminated alternately to form a laminate. A forming step, a temporary fixing step of curing the adhesive at a temperature lower than the softening temperature of the epoxy resin of the prepreg sheet to temporarily fix the laminate, and the temporary fixing of the temporarily fixed laminate. Take it out of the process, alone or with a metal foil,
A hot pressing step of hot pressing to form a multilayer substrate. 2. A main component of an adhesive agent and a curing agent are separately applied to predetermined positions of the double-sided circuit board and the prepreg sheet while sequentially positioning the required number of double-sided circuit boards and the required number of prepreg sheets. A temporary fixing step of temporarily fixing the laminate by curing the adhesive at the same time as forming a laminate by alternately superimposing the main component and the curing agent when they are overlapped and mixed. Taking out the temporarily fixed laminate from the temporary fixing step,
A method for producing a printed wiring board, which comprises a hot pressing step of forming a multilayer substrate by hot pressing alone or together with a metal foil. 3. A double-sided adhesive sheet is attached to a predetermined position of the double-sided circuit board or the prepreg sheet while sequentially positioning the required number of double-sided circuit boards and the required number of prepreg sheets, and the layers are laminated alternately. And a temporary fixing step of temporarily fixing the laminate, and taking out the temporarily fixed laminate from the temporary fixing step, and alone or with a metal foil, hot pressing to form a multilayer substrate. A method of manufacturing a printed wiring board, comprising: 4. A low-temperature curable adhesive and a high-temperature curable adhesive are separated at predetermined positions of the double-sided circuit board or the prepreg sheet while sequentially positioning a required number of double-sided circuit boards and a required number of prepreg sheets. A stacking step of applying and alternately stacking to form a laminate, and a temporary fixing step of temporarily fixing the laminate by curing the low temperature curing adhesive at a temperature lower than the softening temperature of the epoxy resin of the prepreg sheet, A hot press for removing the temporarily fixed laminate from the temporary fixing step and forming a multi-layer substrate while preventing the lateral deviation by curing the high temperature curing adhesive by heat pressing alone or together with a metal foil. A method for manufacturing a printed wiring board, comprising: 5. An adhesive containing an inorganic substance powder is applied to predetermined positions of the double-sided circuit board or the prepreg sheet while sequentially positioning the required number of double-sided circuit boards and the required number of prepreg sheets, and alternately. A superimposing step of forming a laminate by superimposing, a temporary fixing step of temporarily fixing the laminate by curing the adhesive containing the inorganic substance powder at a temperature lower than the softening temperature of the epoxy resin of the prepreg sheet, The temporarily fixed laminate of is taken out from the temporary fixing step, and alone or together with a metal foil, hot pressed to prevent lateral slippage by preventing the inorganic substance powder from being caught in the upper and lower laminates to form a multilayer substrate. And a hot pressing step of forming the printed wiring board. 6. The method for manufacturing a printed wiring board according to claim 1, wherein at least one of heat, light and electron beam is used to cure the adhesive. 7. A stacking step in which a required number of double-sided circuit boards and a required number of prepreg sheets are positioned and alternately stacked to form a laminate, and a predetermined position of the laminate is made of a metal penetrating piece. A temporary fixing step of temporarily fixing the laminated product by penetrating with, and the temporarily fixed laminated product is taken out from the temporary fixing process, alone or together with a metal foil,
A hot pressing step of hot pressing to form a multilayer substrate. 8. A stacking step of positioning a required number of double-sided circuit boards and a required number of prepreg sheets and alternately stacking them to form a laminate, and preventing lateral displacement of a convex shape made of metal or resin. A temporary fixing step of driving a piece into a predetermined position of the laminate and temporarily fixing it, and taking out the temporarily fixed laminate from the temporary fixing step, alone or
A method of manufacturing a printed wiring board, comprising: a hot pressing step of hot pressing with a metal foil to form a multilayer substrate. 9. The method for manufacturing a printed wiring board according to claim 8, wherein a counterbore is provided at a position where the lateral deviation prevention piece is driven. 10. A stacking step of positioning a required number of double-sided circuit boards and a required number of prepreg sheets and alternately stacking them to form a laminate, and penetrating the front and back sides at predetermined positions of the laminate. From the temporary fixing step, a temporary fixing step of injecting a resin having a softening temperature higher than the curing temperature of the epoxy resin of the prepreg sheet by injecting a hole and injecting the through hole into the through hole A method for producing a printed wiring board, which comprises a hot-pressing step of taking out and hot-pressing it alone or together with a metal foil to form a multilayer substrate. 11. The method of manufacturing a printed wiring board according to claim 1, wherein the positioning is performed by a positioning jig. 12. The method for manufacturing a printed wiring board according to claim 1, wherein the positioning is performed by position recognition by image processing.