JPH088327A - Stage unit - Google Patents

Abstract

PURPOSE:To strip an adhesive sheet easily from a chip device by a structure vacuum sucking the adhesive sheet to the stage surface where protrusions and recesses are repeated periodically in two directions at substantially the same interval as that of the chip device. CONSTITUTION:The stage unit being employed for stripping an adhesive sheet from a chip device 3 comprises a mounting stage 12A and a vacuum suction means 12B. The stage 12A has a stage surface where protrusions and recesses are repeated periodically at a substantially the same interval as that of the chip device 3. The vacuum suction means 12B sucks the adhesive sheet to the stage surface and deforms the adhesive sheet along the protrusions and recesses so that the chip device 3 can be stripped easily from the adhesive sheet. Consequently, the chip device 3 can be stripped easily from the adhesive sheet by partially stripping the chip device 3, on the rear side thereof, from the adhesive sheet.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stage device, which can be applied to, for example, a die bonder.

[0002]

2. Description of the Related Art Conventionally, in this type of die bonder, a die is mounted on a lead frame by a series of procedures shown in FIG. First, as shown in FIG. 4A, the dies 3 are peeled off one by one from the dicing-completed wafer 2 that is adhesively fixed to the wafer sheet 1 made of an adhesive resin tape. Next, as shown in FIG.
Move them one by one to the small room and rearrange them. When the tray 4 is installed at a predetermined position of the die bonder, the die bonder takes out the dies 3 in order from the tray 4 and then, as shown in FIG.
The lead frame 5 is positioned at a predetermined position as shown in FIG.

[0003]

However, in this method, the work of temporarily transferring a large amount of dies 3 to the tray 4 (man-hours)
Is required, so it takes time. In addition, it is necessary to prepare a tray 4 suitable for the size of the die, and in the case of small-volume production, the production cost and the maintenance cost are high, which causes some problems. Further, since the transfer mechanism for removing the die 3 from the wafer sheet 1 and transferring it to the tray 4 and the transfer mechanism for transferring the die 3 from the tray 4 to the lead frame 5 are conventionally different mechanisms, there is a problem that the entire die bonder becomes large. It was

The present invention has been made in consideration of the above points, and an object thereof is to propose a stage device capable of easily peeling a chip component from an adhesive sheet as compared with the prior art.

[0005]

In order to solve the above problems, in the present invention, a rectangular chip part (3) is used.
In a stage device used for peeling the chip parts (3) from the adhesive sheet (2) in which the chip parts are arranged in a matrix on the adhesive surface, the concave parts and the convex parts are arranged at substantially the same intervals as the chip parts (3) are arranged. And a mounting table (12A) having a stage surface in which the parts are periodically repeated in two directions on a plane, and the pressure-sensitive adhesive sheet (2) is vacuum-adsorbed on the stage surface to form the pressure-sensitive adhesive sheet (2) into concave and convex portions A vacuum suction means (12B) is provided to facilitate deformation of the chip part (3) by deforming the chip part (3).

[0006]

The adhesive sheet (2) is placed on the stage surface in which the concave portions and the convex portions are formed so as to be periodically repeated in the two directions on the plane at substantially the same spacing as the chip components (3). Then, since the pressure-sensitive adhesive sheet (2) is vacuum-adsorbed on the stage surface, the pressure-sensitive adhesive sheet (2) is deformed along the unevenness of the stage surface. On the other hand, since the chip part (3) does not deform along the stage surface unlike the adhesive sheet (2), a part of the back surface of the chip part (3) is naturally peeled off from the adhesive sheet (2). As a result, the adhesive force can be weakened and the chip part (3) can be easily peeled off.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

In FIG. 1, reference numeral 10 denotes a semi-automatic die bonder as a whole, which is a process of peeling the dies 3 one by one from the dicing-completed wafer 2 adhered to the wafer sheet 1 and transferring them to the lead frame 5 in order. The simplification is characterized by eliminating the transfer process to the tray 4. Therefore, the semi-automatic die bonder 10 is mounted on the workbench 11A of the main body 11 on the intermediate stage 13
And the wafer stage 12 is prepared.

The wafer stage 12 has a structure in which a net 12A woven so that the positional relationship of wire rods extending in two directions orthogonal to each other alternate up and down is fixed on a pedestal 12B. The mesh size of the mesh 12A is substantially the same as the size of the die 3. As described above, the net 12A on which the wafer sheet 1 is placed is not flat but is uneven.
Therefore, the wafer sheet 1 made of a highly flexible sheet member is deformed along the surface shape of the net 12A.

On the other hand, the die 3 does not deform. As a result, a part of the back surface of the die 3 is naturally peeled off from the wafer sheet 1,
A gap is created. Further, in the case of this embodiment, it is devised to enhance this effect by reducing the pressure on the back surface of the net 12A. Wafer sheet 1 is net 1
It is deformed more and more by being vacuum-adsorbed by 2A, and a larger deflection can be obtained than when it is simply placed. Therefore, the adhesive force between the die 3 and the wafer sheet 1 is further reduced,
If the die 3 is vacuum-sucked by the vacuum pinset 12C, it can be easily peeled from the wafer sheet 1.

Next, the intermediate stage 13 on which the die 3 peeled off by the vacuum pins 12C is placed will be described. As shown in FIG. 3A, the intermediate stage 13 has a structure in which two surfaces 13A and 13B having a height difference are provided on the surface of a disk-shaped pedestal. Of these, the shape of the lower surface 13B on which the die 3 is positioned is a fan shape that spreads at an angle of 90 °. As a result, when the die 3 vacuum-adsorbed by the vacuum pinset 12C is conveyed onto the lower surface 13B, the
The sides are respectively brought into contact with the two side walls 13C so that they can be uniquely positioned.

A chip suction hole 13D is formed at the fan top of the lower surface 13B, and the die 3 is positioned.
The position can be fixed by vacuum suction from the back side. Further, the area of the lower surface 13B is sufficiently larger than the area of the die 3, so that the die 3 having different chip areas can share the intermediate stage 13 without any design change, as shown in FIGS. 3B and 3C. Has been done.

In addition to these components, the main body 11 is provided with a robot arm 14 and a paste coating nozzle 15. Of these, the robot arm 14 is the intermediate stage 13
This is a mechanism for transporting the die 3 positioned to the lead frame 5. The paste application nozzle 15 is a mechanism for applying the silver paste to the die pad on the lead frame 5.

The bonding operation of the die bonder 10 having the above structure will be described. First, the wafer sheet 1 holding the wafer 2 that has been diced is placed on the wafer stage 1
It is placed on the second net 12A. Then, the wafer sheet 1 is vacuum-sucked on the surface of the net 12A, and the die 3 that is adhesively fixed on the wafer sheet 1 is controlled to be easily peeled from the sheet surface.

Next, the die 3 is attached by the vacuum pinset 12C.
Are peeled from the wafer sheet 1 one by one, and are manually transferred to the intermediate stage 13. At this time, the operator positions the die 3 so that the two side surfaces of the die 3 come into contact with the side wall 13C and positions the die 3 at the origin which is the fan top of the lower surface 13B. When this positioning work is completed, the die 3 is vacuum-sucked through the chip suction holes 13D and sucked onto the lower surface 13B so that the die 3 does not move from the positioned position. Then, the vacuum suction by the vacuum pins 12C is stopped.

After that, the robot arm 14 provided on the main body 11 is driven and moved above the intermediate stage 13. At this stage, the vacuum suction by the chip suction hole 13D is cut off, and the die 3 is transferred to the robot arm 14. At this time, the paste application nozzle 15 applies the silver paste onto the target die pad. After this, the robot arm 14 places the die 3 on the die pad. When the transfer of the die 3 onto the die pad is completed in this way, the robot arm 14 returns to above the origin of the intermediate stage 13 and moves to the next transfer operation.

According to the above construction, the die-bonding work can be completed within approximately the same work time as the work for transferring to the tray, and the work efficiency can be improved. This is particularly effective in the case of a die bonder intended to bond a small amount of die 3.

Further, since a jig such as a tray which is conventionally required is not required, the cost for producing or purchasing the tray can be reduced. Further, since the tray is not necessary, it is not necessary to provide a space for installing the tray in the die bonder 10 or a mechanism for transporting the tray from the tray onto the lead frame, and the die bonder 10 can be downsized accordingly.

Since the die 3 can be easily peeled from the wafer sheet 1 by the wafer stage 12, the back surface of the wafer sheet 1 is supported by hand and the die 3 from the back surface of the wafer sheet 1 is supported by a fingertip as in the conventional case. It is possible to eliminate the trouble of pushing up to bend the wafer sheet 1. Similarly, this work can eliminate the risk of damaging the die 3 due to the impact of the mechanical pin that is moved up and down, as compared with the case where a mechanical lifting mechanism is used.

Further, the lower surface 13B, which is the mounting surface of the intermediate stage 13, is fan-shaped, and the two sides of the die 3 can be easily positioned by pressing them against the side wall 13C, so that the time required for the positioning is short. Further, since the area of the intermediate stage 13 is sufficiently larger than the chip size, the die 3 having a small chip size and the die 3 having a large chip size can be easily positioned, and the die bonder 10 having high versatility can be realized.

In the above-mentioned embodiment, the case where the orientation flat is aligned so that the two sides of the die 3 are parallel to the extending directions of the wire rods constituting the mesh of the mesh 12A as shown in FIG. 2 has been described. The present invention is not limited to this, and the orientation flat may be aligned so that the extending direction of the wire and the two sides of the die 3 intersect. Thus, if the two sides are placed so as to intersect with the extending direction of the wire rod, the peeling area becomes wider and the peeling can be further facilitated.

In the above-mentioned embodiment, the case where the mesh 12A is knitted so that the mesh is almost the same as that of the die 3, that is, the rectangular shape (including the square) is used. Not limited to this, various shapes such as those woven into a parallelogram can be used. Further, the present invention is not limited to the case of a net, and the case where the surface is provided with regular chip-like regular irregularities is also applicable. Also in this case, if the concave portion is provided with a suction hole so that vacuum suction can be performed, the ease of peeling can be enhanced.

Further, in the above-mentioned embodiment, the case where the intermediate stage 13 having the shape shown in FIG. 3 is used, but the present invention is not limited to this and the lower surface 13 is inclined with respect to the surface of the workbench 11A. It may be formed so that. The point is that the die 3 can be positioned with two of the side surfaces in contact with each other.

Further, although the die bonder 10 is described in the above embodiment, the present invention is not limited to this, and the work of peeling the chip parts arranged in a matrix on the upper surface of the adhesive sheet material one by one. It can be widely applied as long as it is a stage device used in this case.

[0025]

As described above, according to the present invention, the pressure-sensitive adhesive sheet is vacuumed on the stage surface in which the concave portions and the convex portions are periodically repeated in two directions on the plane at substantially the same spacing as the chip components are arranged. By adsorbing and deforming the adhesive sheet along the concave and convex parts, peel off part of the back surface of the chip component that does not deform along the stage surface from the adhesive sheet, making it easier to peel the chip component from the adhesive sheet It is possible to easily obtain a stage device capable of performing the above.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of an apparatus using a stage device according to the present invention.

FIG. 2 is a cross-sectional view for explaining a deformed state of a sheet material at the time of suction.

FIG. 3 is a perspective view for explaining an intermediate stage.

FIG. 4 is a perspective view showing a conventionally used work procedure.

[Explanation of symbols]

1 ... Wafer sheet, 2 ... Wafer, 3 ... Die, 4 ...
... Tray, 5 ... Lead frame, 10 ... Die bonder, 11 ... Main body, 11A ... Work table, 12 ... Wafer stage, 12A ... Net, 12B ... Pedestal, 12C ...
Vacuum pin set, 13 ... Intermediate stage, 14 ... Robot arm, 15 ... Paste application nozzle.

Claims (2)

[Claims] 1. A stage device used for peeling a chip component, which is formed by arranging rectangular chip components in a matrix pattern on an adhesive surface, in a stage device, the spacing being substantially the same as the arrangement interval of the chip components. And a mounting table having a stage surface in which concave portions and convex portions are periodically repeated in two directions on a plane, and the pressure-sensitive adhesive sheet is vacuum-sucked to the stage surface, and the pressure-sensitive adhesive sheet is fixed to the concave portion and the convex portion. A stage device comprising: vacuum suction means for facilitating peeling of the chip component by deforming the chip component along the vacuum suction means. 2. The stage device according to claim 1, wherein the mounting table is made of a mesh member.