JPH0878270A - Multilayer capacitor board - Google Patents

Abstract

PURPOSE: To obtain a multilayer capacitor board for realizing high density mounting by decreasing the planar occupation area of a capacitor structure suitable for trimming the capacitance. CONSTITUTION: The multilayer capacitor board 10 comprises a pair of common electrode films 21, 22 and electrode rod conductors 21a, 21b,..., 22a, 22b,... extending therefrom while meshing each other which are formed in a laminate 1 of a plurality of ceramic layers 1a-1e. At least one, e.g. 21, of the common electrode films is formed on the surface of a the laminate 1 and the electrode rod conductors 21a, 21b,..., 22a, 22b,... are extending to penetrate the ceramic layers 1a-1e in the thickness direction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a monolithic capacitor substrate which is excellent in adjustment of capacitance value and can be miniaturized.

[0002]

2. Description of the Related Art Conventionally, in a capacitor substrate having a capacitor structure for generating a predetermined capacitance value, one example of a typical capacitor structure is one in which a lower electrode film is formed on the substrate surface,
The dielectric layer is formed so as to cover the lower electrode film, and the upper electrode film is further formed so as to face the lower electrode film with the dielectric layer in between.

However, in such a capacitor structure, a capacitance value different from a desired constant capacitance value is actually obtained due to a positional shift when forming the lower electrode film and the upper electrode film and a variation in the thickness of the dielectric layer. turn into. In order to adjust such a capacitance value, the capacitance value at the time of design is set large in advance, a part of the upper electrode film is removed, and the facing area between the upper electrode film and the lower electrode is adjusted. However, in this case, since the upper electrode film and the lower electrode film face each other, there is a problem that it is very difficult to set the condition of the removing means.

An example of another typical capacitor structure is composed of a pair of common electrode conductor films and a plurality of comb-teeth electrode films extending from the respective common electrode films on the surface of the dielectric substrate. The respective comb-teeth electrode films are formed so as to mesh with each other.

In this capacitor structure, a predetermined capacitance can be obtained by the facing distance and the facing distance between the comb-teeth electrode films facing each other. Although this structure has a small capacitance value, for example,
By sequentially cutting the comb-teeth electrode film among a plurality of comb-teeth electrode films that mesh with each other, the cut comb-teeth electrode film becomes a floating electrode that does not contribute to the generation of capacitance, and as a result, the capacitance value decreases linearly. It has been widely used when it is necessary to adjust the capacitance value with high accuracy.

Further, in the resonance means of the oscillation circuit and other circuits, when the capacitance value is used to adjust the characteristics of the entire circuit, the above-mentioned capacitor structure in which the comb-teeth electrode films mesh with each other is used. Was there.

For example, in the capacitor substrate shown in FIG. 5 in which the coil element and the capacitor element are arranged in parallel, the coil pattern 52 and the pair of common electrode films 5 are formed on the dielectric substrate 51.
3, 54 and comb-teeth electrode films 53a, 53b ..., Comb-teeth electrode films 54a, 54b extending from the common electrode films 53, 54
... and formed. The other end of the first common electrode film 53 was connected to one end of the coil pattern 52.

Further, the first common electrode film 53, the second common electrode film 54 and the comb-teeth electrode film 53a on the first common electrode film side,
53b ..., comb-teeth electrode film 54 on the second common electrode film side
In the capacitor structure composed of a, 54b, ..., The comb-teeth electrode film 53a on the side of the first common electrode film meshes with the comb-teeth electrode film 54a on the side of the second common electrode film in a plane with respect to the substrate,
Further, the comb-teeth electrode film 53b on the side of the first common electrode film meshes with the comb-teeth electrode films 54a and 54b on the side of the second common electrode film in a plane, and the comb-teeth electrode film on the side of the first common electrode film is formed. Electrode film 53
c meshes with the comb-teeth electrode films 54b, 54c on the second common electrode film side in a plane, ... Capacitance components are generated at the meshing portions thereof, and these capacitance components are combined.

When adjusting the characteristic determined by the inductor component of the coil pattern 52 and the combined capacitance component of the capacitor structure, for example, the resonance frequency to a predetermined frequency, for example, each extending from the first common electrode film 53. The root portions of the comb-teeth electrode films 53a, 53b, 53c ... Are sequentially cut, and the comb-teeth electrode films 53a, 53 at the tips of the cut portions are cut.
.., b, 53c, ... As floating electrodes that do not substantially contribute to the generation of capacitance, the capacitance value is gradually decreased to reach the predetermined resonance frequency.

[0010]

However, as described above, the comb-teeth electrode films 53a, 53b, 5 on one side of the comb-teeth electrode films formed on the dielectric substrate 50 so as to mesh with each other.
3c ... Or both comb-teeth electrode film conductors 53a, 53
.., 54a, 54b, 54c ... In order to finely adjust the capacitance value, the capacitor structure is excellent in adjusting the capacitance value, but the rate of change of the capacitance value is small. In this case, it is necessary to form a large number of comb-teeth electrode films that mesh with each other.

Therefore, a large number of comb-teeth electrode films 53a, 53b, 53c ..., 54a, 54b, 5 are formed on the substrate 50.
4c ... has to be formed, and there has been a problem that the occupied area thereof greatly increases.

The present invention has been devised in view of the above-mentioned problems, and an object thereof is that a capacitor structure having interlocking rod-shaped electrode conductors suitable for adjusting a capacitance value occupies an area occupied by a planar substrate. It is an object of the present invention to provide a multilayer capacitor substrate that can be formed with a small size.

[0013]

According to the present invention, a pair of common electrode films and rod-shaped electrode conductors extending from the common electrode film in mutually opposing directions and meshing with each other are arranged in a laminated body in which a plurality of ceramic layers are laminated. In the laminated capacitor substrate, wherein the rod-shaped electrode conductors are arranged so as to penetrate through the thickness direction of the laminated body.

That is, the rod-shaped electrode conductors are formed as via-hole conductors and through-hole conductors that penetrate the ceramic layers in the thickness direction, and the rod-shaped electrode conductors extending from the respective common electrode films are three-dimensional. Are arranged so as to mesh with. Then, the actual adjustment of the capacitance value is performed by cutting the common electrode formed on the surface of the laminated body.

[0015]

As described above, according to the present invention, the rod-shaped electrode conductors extending from the pair of common electrode films in the opposing direction are arranged in the laminate in which the ceramic layers are laminated in the thickness direction of the ceramic layers. Since only the linear common electrode film exists, the planar area occupied by the substrate can be greatly reduced.

As a result, the shape of the capacitor substrate can be made very small, and when forming other wiring patterns on the surface of the substrate, the degree of freedom of wiring can be improved, and the high density of the wiring pattern can be obtained. Can be achieved.

Further, since the rod-shaped electrode conductor for generating the capacitance is surrounded by the dielectric ceramic, the effective dielectric constant is improved as compared with the conventional comb-teeth electrode film formed flat on the surface of the substrate. .

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The multilayer capacitor substrate of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is an external perspective view showing an example of the multilayer capacitor substrate of the present invention, and FIG. 2 is a cross-sectional perspective view taken along the line AA. In the examples, a laminated capacitor substrate having a coil pattern formed on the surface of the substrate will be described.

In the figure, reference numeral 10 is a multilayer capacitor substrate, and the multilayer capacitor substrate 10 is composed of a multilayer body 1 and a structure (hereinafter referred to as a capacitor structure) 2 for generating a capacitance component, and wiring of a predetermined circuit is further provided as necessary. A pattern, such as a coil pattern 3 in the figure, is formed. The capacitor structure 2 includes a first common electrode film 21, rod-shaped electrode conductors (hereinafter, referred to as comb-teeth electrode conductors) 21 a, 21 b, ..., Second common electrode film extending from the first common electrode film 21. Two
2, comb-teeth electrode conductor 22 extending from the second common electrode film 22
a, 22b ...

The laminated body 1 is constituted by laminating, for example, five dielectric ceramic layers 1a to 1e, and each of the ceramic layers 1a to 1e is composed mainly of, for example, a ceramic whose main component is aluminum and barium titanate. Ceramic as an ingredient,
Further, it is composed of glass-ceramic or the like in which these ceramics and glass components are mixed.

On the main surface on the front surface side of the laminate 1, a substantially straight first common electrode film 21 constituting the capacitor structure 2 is formed.
For example, a spiral coil pattern 3 is formed. In the figure, the other end of the first common electrode film 21 is connected to one end of the coil pattern 3. The first common electrode film 21 and the coil pattern 3 are Ag-based (Ag simple substance, Ag-based).
Alloy), Cu-based (Cu simple substance, Cu alloy) material and the like.

A substantially straight second common electrode film 22 constituting the capacitor structure 2 is formed on the main surface on the back surface side of the laminate 1. The first common electrode film 21 and the second
The planar positional relationship of the common electrode film 22 is such that the first common electrode film 21 and the second capacitor electrode film 22 overlap with each other and are slightly displaced so as to be in parallel relationship with each other. .

Furthermore, inside the laminate 1, comb-teeth electrode conductors 21a, 2a extending downward from the first common electrode film 21 are formed.
Are formed, and comb-teeth electrode conductors 22a, 22b, ... That extend upward from the second common electrode film 22 are formed. Each comb-teeth electrode conductor 21a, 21b ...
., 22a, 22b ... are Ag-based (Ag simple substance, Ag
Alloy), Cu-based (Cu simple substance, Cu alloy) material, W, Mo
It is made of high melting point metal materials such as.

Specifically, as shown in FIG. 2, the comb-teeth electrode conductors 21a, 21b, ... Are made of ceramic layers 1a to 1d.
Of the comb-teeth electrode conductors 22a, 22b ... Are formed so as to penetrate the ceramics 1b to 1e, and the comb-teeth electrode conductors 21a, 21b ...
, And the comb-teeth electrode conductors 22a, 22b ... Are arranged in parallel with each other and in a straight line so as to alternately mesh with each other in the thickness portions of the ceramic layers 1b to 1d. That is, the first
Comb-shaped electrode conductors 21a, 21 extending from the common electrode film 21 of
b ... comb-shaped electrodes extending downward from the main surface on the front surface side of the laminated body 1 at predetermined intervals from one end side of the first common electrode film 21 and extending from the second common electrode film 22. Conductor 22
.. a, 22b ... Extend upward from the back-side main surface of the laminated body 1 at a predetermined interval from one end side of the second common electrode film 22.

With the above structure, the first common electrode film 21 is formed.
The comb-teeth electrode conductor 21a extending from the dielectric layers 1b to 1d.
The comb-teeth electrode conductor 21a extending from the first common electrode film 21 meshes with the comb-teeth electrode conductor 22a extending from the second common electrode film 22 in the thickness part of Comb-shaped electrode conductor 22 extending from the common electrode film 22
The comb-teeth electrode conductor 21c that meshes with a and 22b and extends from the first common electrode film 21 is a comb-teeth electrode conductor 22 that extends from the second common electrode film 22 in the thickness portions of the dielectric layers 1b to 1d.
B, 22c are meshed with each other, and a predetermined capacity is generated in the meshed portion. That is, the capacitance generated at each meshing portion is combined to form the total capacitance, which is connected to the coil pattern 3.

In the multilayer capacitor substrate of the present invention as described above, the comb-teeth electrode conductors 21a, 21b ... And the comb-teeth electrode conductors 22a, 22b. Therefore, only the substantially linear first common electrode film 21 forming the capacitor structure 2 is formed on the surface of the multilayer body 1. Therefore, the planar occupied area of the capacitor structure 2 on the multilayer capacitor substrate 10 can be greatly reduced as compared with the conventional occupied area.

Along with this, for example, restrictions on various wiring patterns formed on the surface of the laminate 1, for example, wiring arrangement in the formation of the coil pattern 3 are alleviated, and a mounting position of a plurality of electronic components can be secured. For example, high density mounting is possible.

Further, the comb-teeth electrode conductors 21a, 21b ...
.., 22a, 22b ... Are formed in the ceramic layers 1a to 1e, so that they are all surrounded by the dielectric ceramic material, so that the effective dielectric constant for generating capacitance is improved. As compared with the conventional capacitor structure formed flat on the surface of the substrate 50, higher capacitance can be obtained.

In the multilayer capacitor substrate 10 having such a capacitor structure 2, as a method for adjusting the capacitance, for example, the first common electrode film 21 formed on the main surface on the front surface side of the multilayer body 1 is provided at a predetermined position (X ₁ , X ₂ , X ₃ ···). For example, by cutting the first common electrode film 21 between the line X ₁ portion shown in FIG. 2, that is, the position where the comb-teeth electrode conductor 21a extends and the position where the comb-teeth electrode conductor 21b extends, the comb-teeth electrode Conductor 2
1a substantially becomes a floating electrode conductor and does not contribute to capacity generation. In addition, by cutting the first common electrode film 21 between the line X ₂ portion shown in FIG. 2, that is, the position where the comb-teeth electrode conductor 21b extends and the position where the comb-teeth electrode conductor 21c extends, the comb-teeth electrode is formed. The conductors 21a and 21b substantially become floating electrode conductors and do not contribute to the generation of capacitance. By thus cutting the first common electrode film 21 at a predetermined position, it is possible to adjust the capacitance value to a desired value.

Next, a method of manufacturing the above-mentioned laminated capacitor substrate 10 will be briefly described.

First, the ceramic layers 1a to 1d, for example, a glass-ceramic material-containing layer having a thickness of 40 to 120 .mu.m.
m green sheets are prepared, and the comb-teeth electrode conductors 21a, 21b ..
.. at the positions where the comb-teeth electrode conductors 22a, 22b ...
The through holes are formed by punching or the like. The diameter of the through hole is about 40 to 200 μm.

For example, the green sheet to be the dielectric layer 1a is provided with through holes to be the comb-teeth electrode conductors 21a, 21b, 21c ... And the green sheets to be the dielectric layers 1b to 1d are to be the comb-teeth electrode. Conductors 21a, 21b, 21c ...
22a, 22b, 22c ... Through holes are formed in the green sheet which becomes the dielectric layer 1e, and the comb-teeth electrode conductor 22 is formed.
The through holes to be a, 22b, 22c ... Are formed.

Next, each through hole is filled with an Ag-based conductor by printing Ag-based conductive paste or the like.

Next, the green sheets are stacked and integrated according to the stacking order.

Next, this laminated body is subjected to, for example, an air atmosphere,
Baking is performed at a peak temperature of 800 to 1050 ° C. in an oxidizing atmosphere.

Next, a conductor film to be the first common electrode film 21 for connecting the ends of the comb-teeth electrode conductors 21a, 21b, ... Exposed on the main surface of the laminate 1 to each other is formed by printing. , Bake. At this time, the coil pattern 3, which is another wiring pattern, is simultaneously formed.

Next, a conductor film to be the second common electrode film 22 for connecting the ends of the comb-teeth electrode conductors 22a, 22b, ... , Bake.

As a result, the first common electrode film 21 and the plurality of comb-teeth electrode conductors 21a, 21b, ... Are connected to each other, and the second common electrode film 22 and the plurality of comb-teeth electrode conductors 22a, 22b.
b ... and will be connected. The comb-teeth electrode conductors 21a, 21b, ...
The distance between a, 22b, ... Is about 50 μm or more.

If the thickness is less than about 50 μm, sufficient strength for forming the through holes in the green sheet cannot be obtained. In addition, the upper limit of the distance can be set to such an extent that the desired capacitance is generated in consideration of the dielectric constant of the dielectric material.

As described above, the multilayer capacitor substrate 10
Is achieved.

In the actual manufacturing method, the shape of the green sheet is a large green sheet from which a plurality of laminated capacitor substrates 10 can be extracted. For this reason, it is desirable to form the dividing grooves corresponding to the shape of each laminated capacitor substrate 10 in a state where the green sheets are laminated, and perform the dividing process along the dividing grooves near the final step of the manufacturing process.

A common baking process is used to form the first common electrode film 21 for the front and back surfaces, the second common electrode film 22, and the baking process required for forming the coil pattern 3 and the like. It doesn't matter. In addition, a conductor film that will be the first common electrode film 21, a conductor film that will be the second common electrode film 22, a conductor film that will be the coil pattern 3, etc. will be formed in advance on the green sheet, or immediately after the lamination process. Alternatively, they may be integrally formed by firing the laminated body.

FIG. 3 is a perspective view of a capacitor structure 2 showing another embodiment of the present invention. This embodiment shows a structure in which adjustment of the capacitance value can be particularly simplified.

The difference from FIGS. 1 and 2 is that the first common electrode film 21 has a common electrode main line 210 and the common electrode main line 210.
, Which are to be cut, and which are to be cut, and the comb-teeth electrode conductors 21a, 21b, ... Are formed near the tips of the branches 210a, 210b ,. Along with this, the second common electrode film 22 may have the same structure as the first common electrode film 21, and FIG.
As shown in, the second common electrode film 22 may be linearly formed and slightly displaced from the common electrode main line 210 of the first common electrode film 21. In short, capacitance is generated between the comb-teeth electrode conductors 21a, 21b ... On the first common electrode film 21 side and the comb-teeth electrode conductors 22a, 22b ... On the second common electrode film 22 side. It suffices that they are arranged in a straight line or alternately in a zigzag pattern.

In the above structure, when adjusting the capacitance value, the root parts of the tributaries 210a, 210b ...
The capacity can be adjusted by sequentially cutting along the arrow Y in FIG.

In this embodiment, the cutting for the capacity adjustment is
While it is necessary to perform the cutting a plurality of times in the directions different from X ₁ , X ₂ , X _3, ... As shown in FIGS. 1 and ₂ , in the embodiment of FIG. Therefore, as the cutting means, an optical cutting means by laser irradiation and scanning which can be easily automated can be used.

FIG. 4 is a perspective view of a capacitor structure 2 showing still another embodiment of the present invention.

In this embodiment, the adjustment of the capacitance value can be simplified,
Moreover, a structure in which the rate of change in capacitance adjustment is different, that is, a structure in which coarse adjustment and fine adjustment can be selectively performed is shown.

The difference from FIG. 1 and FIG. 2 shown in FIG.
The common electrode film 21 of the common electrode main line 210 and the branch lines 210a, 210 to be cut extending from the common electrode main line 210.
The second common electrode film 22 includes a common electrode main line 220 and tributaries 220a, 220b ...
In the branch 210a of the common electrode film 21 of the
11a, 212a, 213a are formed, and the branch 210b
Are formed with comb-teeth electrode conductors 211b, 212b, 213b, and the branch path 210c is formed with comb-teeth electrode conductors 211c, 2b.
12c and 213c are formed. Also, for example, the second
In the branch 220a of the common electrode film 22 of the
21a and 222a are formed, comb-teeth electrode conductors 221b and 222b are formed in the branch 220b, and the branch 220c is formed.
The comb-teeth electrode conductors 221c and 222c are formed on the.

In addition, the branch 210 of the first common electrode film 21.
a of the comb-teeth electrode conductors 211a, 212a, 213a and the second
Comb-shaped electrode conductor 221 of the branch 220a of the common electrode film 22 of
a and 222a, the comb-teeth electrode conductor 211a of the branch 210a of the first common electrode film 21 corresponds to the second common electrode film 2a.
Meshes with the comb-teeth electrode conductor 221a of the second branch 220a,
The comb-teeth electrode conductor 2 of the branch 210a of the first common electrode film 21
12a meshes with the comb-teeth electrode conductors 221a, 222a of the branch 220a of the second common electrode film 22, and the comb-teeth electrode conductor 213a of the branch 210a of the first common electrode film 21 forms the second common electrode film 22. Comb-shaped electrode conductor 222a of the branch 220a
It is supposed to mesh with.

Branch 210b, branch 220b, branch 210
c and the branch electrodes 220c ...
12b, 213b, 221b, 222b, 211c, 2
12c, 213c, 221c, 222c, ... Have the same arrangement structure.

In the capacitor structure 2 as described above, when the capacitance is adjusted, the tributaries 210a, 210b, 210c on the side of the first common electrode film 21 are cut off. In the case of cutting along Z ₁ , arrow Z ₂ and arrow Z ₃ , the comb-teeth electrode conductor 211 on the side of the first common electrode
a, 212a, 213a, comb-teeth electrode conductors 211b, 21
2b, 213b, comb-teeth electrode conductors 211c, 212c, 2
13c and 221c serve as floating electrodes and are different in the state in which they do not contribute to the generation of capacitance. Therefore, in the adjustment of the capacitance value, the rate of capacitance change can be made different, and rough adjustment, fine adjustment, etc. can be arbitrarily performed.

For example, the branch 21 on the side of the first common electrode 21.
0a, 210b, 210c, ... When sequentially cut along arrow Z ₁ , the comb-teeth electrode conductors 211a, 211b, 2
11c ... sequentially become floating electrodes, and the rate of change in capacitance is very small.

For example, the branch 21 on the side of the first common electrode 21.
0a, 210b, 210c, ..., When sequentially cut by the arrow Z ₂ , the comb-teeth electrode conductors 211a and 212a, the comb-teeth electrode conductors 211b and 212b, the comb-teeth electrode conductor 211
C, 212c ... sequentially become floating electrodes, and the capacitance change rate becomes an intermediate value.

For example, the branch 21 on the side of the first common electrode 21.
0a, 210b, 210c, ..., When sequentially cut by the arrow Z ₃ , all the comb-teeth electrode conductors 211a, 212a, 213a formed in the branch 210a, and the branch 210b.
All the comb-teeth electrode conductors 211b, 212b formed on the
213b and all the comb-teeth electrode conductors 211c, 212c, 213c formed in the branch 210c sequentially become floating electrodes, and the capacitance change rate becomes large.

By combining the capacity adjustments having different rates of change, that is, by performing the rough adjustment to bring it close to the desired capacity, and then performing the intermediate adjustment and the fine adjustment, the predetermined capacity can be quickly and accurately performed.

In the capacitor structure 2 shown in FIGS. 3 and 4, since the first common electrode film 21 on the main surface on the front surface side of the laminated body 1 has a branch line in addition to the straight common electrode trunk line, Figure 1,
Although the occupied area of the capacitor structure 2 is slightly increased as compared with FIG. 2, the occupied area is greatly reduced as compared with the conventional case.

In the above embodiments, the number of ceramic layers in the laminated body is five, but the number of laminated layers can be arbitrarily changed by designing the capacitance value and the like.

The capacitor structure 2 is formed on the surface of the laminated body 1.
Although the coil pattern 3 is shown as an electronic component to be connected with, the predetermined surface wiring pattern is not limited to the coil pattern, and various electronic components may be mounted on the surface wiring pattern.

Further, although only the comb-teeth electrode conductor is formed inside the laminated body 1, an internal wiring conductor may be formed at a portion unrelated to the capacitor structure to form a laminated ceramic circuit board.

In the capacitor structure, the capacitance is adjusted on the first common electrode film side on the front surface side of the substrate.
This may be performed on the second common electrode film on the back surface side.

Further, a common electrode film on the side not used for capacitance adjustment, for example, a second common common electrode film, may be provided inside the ceramic layers. That is, in the figure, the structure is such that another dielectric layer is arranged outside the dielectric layer 1e.

Further, in the manufacturing method, the green sheet multilayer is used in the description, but a ceramic slip material containing a photocurable monomer is used to apply and dry the ceramic slip material to form a ceramic film. After the formation, a selective exposure process and development are performed to form the through-holes that will become the comb-teeth electrode conductors, the through-holes that have been formed are filled with the conductors that will become the comb-teeth electrode conductors, and the surface of the ceramic Even if a ceramic film is formed from a slip material, the through holes are selectively exposed and developed in the ceramic film, the through holes are filled with a conductor, and the like ... I do not care.

Furthermore, the comb-teeth electrode conductor may be formed so as to penetrate the entire thickness of the laminated substrate. In this case, the common electrode film has a branch path other than the straight common electrode main line as in the first common electrode film 21 of FIG. In this case, in particular, in the manufacturing process, it suffices to print on the fired laminated substrate having the through holes so that the conductor film is attached to at least the inner wall surface of the through holes.

[0066]

As described above, according to the present invention, since the rod-shaped electrode conductors that penetrate the ceramic layers in the thickness direction and mesh with each other are formed in the laminated substrate in which the ceramic layers are laminated, the substrate surface is substantially formed. Since only the linear common electrode film is present, the planar area occupied by the substrate can be greatly reduced.

As a result, it is possible to form other wiring patterns on the surface of the substrate without restriction, and it is possible to achieve high density wiring patterns.

[Brief description of drawings]

FIG. 1 is a plan view of a multilayer capacitor substrate according to the present invention.

FIG. 2 is a cross-sectional perspective view taken along the line AA of FIG.

FIG. 3 is a transparent perspective view of a capacitor structure portion showing another embodiment of the present invention.

FIG. 4 is a transparent perspective view of a capacitor structure portion showing another embodiment of the present invention.

FIG. 5 is a plan view of a conventional capacitor substrate.

[Explanation of symbols]

10 ... Multilayer capacitor substrate 1 ... Multilayer body 1a to 1e ... Ceramic layer 2 ... Capacitor structure 21 ... First common electrode Membrane 22 ..... Second common electrode film 21a, 21b ..... Rod-shaped electrode conductor 22a, 22b on the side of the first common electrode film ..... First common electrode Membrane-side rod-shaped electrode conductor 3 ... Coil pattern

Claims (1)

[Claims] 1. A multilayer capacitor substrate in which a pair of common electrode films and rod-shaped electrode conductors extending from the respective common electrode films in mutually opposing directions are arranged in a laminate in which a plurality of ceramic layers are laminated, A multilayer capacitor substrate in which the rod-shaped electrode conductors are arranged in the thickness direction of the multilayer body.