JPH087634Y2 - Ｔａｂ式半導体装置 - Google Patents

Ｔａｂ式半導体装置

Info

Publication number
JPH087634Y2
JPH087634Y2 JP1990009267U JP926790U JPH087634Y2 JP H087634 Y2 JPH087634 Y2 JP H087634Y2 JP 1990009267 U JP1990009267 U JP 1990009267U JP 926790 U JP926790 U JP 926790U JP H087634 Y2 JPH087634 Y2 JP H087634Y2
Authority
JP
Japan
Prior art keywords
hole
semiconductor device
conductive pattern
tab
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990009267U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03101527U (enrdf_load_stackoverflow
Inventor
勲 野瀬
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1990009267U priority Critical patent/JPH087634Y2/ja
Publication of JPH03101527U publication Critical patent/JPH03101527U/ja
Application granted granted Critical
Publication of JPH087634Y2 publication Critical patent/JPH087634Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1990009267U 1990-01-31 1990-01-31 Ｔａｂ式半導体装置 Expired - Lifetime JPH087634Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990009267U JPH087634Y2 (ja) 1990-01-31 1990-01-31 Ｔａｂ式半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990009267U JPH087634Y2 (ja) 1990-01-31 1990-01-31 Ｔａｂ式半導体装置

Publications (2)

Publication Number Publication Date
JPH03101527U JPH03101527U (enrdf_load_stackoverflow) 1991-10-23
JPH087634Y2 true JPH087634Y2 (ja) 1996-03-04

Family

ID=31512872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990009267U Expired - Lifetime JPH087634Y2 (ja) 1990-01-31 1990-01-31 Ｔａｂ式半導体装置

Country Status (1)

Country Link
JP (1) JPH087634Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH03101527U (enrdf_load_stackoverflow) 1991-10-23

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Legal Events

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