JPH087626Y2 - エッチング装置 - Google Patents
エッチング装置Info
- Publication number
- JPH087626Y2 JPH087626Y2 JP1987172460U JP17246087U JPH087626Y2 JP H087626 Y2 JPH087626 Y2 JP H087626Y2 JP 1987172460 U JP1987172460 U JP 1987172460U JP 17246087 U JP17246087 U JP 17246087U JP H087626 Y2 JPH087626 Y2 JP H087626Y2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- sample
- pretreatment
- ion beam
- ion source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005530 etching Methods 0.000 title claims description 53
- 238000010884 ion-beam technique Methods 0.000 claims description 28
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 description 30
- 239000000463 material Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000011149 active material Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987172460U JPH087626Y2 (ja) | 1987-11-11 | 1987-11-11 | エッチング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987172460U JPH087626Y2 (ja) | 1987-11-11 | 1987-11-11 | エッチング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0176034U JPH0176034U (enrdf_load_stackoverflow) | 1989-05-23 |
JPH087626Y2 true JPH087626Y2 (ja) | 1996-03-04 |
Family
ID=31464431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987172460U Expired - Lifetime JPH087626Y2 (ja) | 1987-11-11 | 1987-11-11 | エッチング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH087626Y2 (enrdf_load_stackoverflow) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57157523A (en) * | 1981-03-25 | 1982-09-29 | Hitachi Ltd | Forming method for pattern |
JPS57208143A (en) * | 1981-06-17 | 1982-12-21 | Mitsubishi Electric Corp | Method for forming fine pattern |
JPS6170726A (ja) * | 1984-09-14 | 1986-04-11 | Mitsubishi Electric Corp | パタ−ン形成方法 |
JPS61267324A (ja) * | 1985-05-21 | 1986-11-26 | Fuji Electric Co Ltd | 乾式薄膜加工装置 |
JPS625636A (ja) * | 1985-07-01 | 1987-01-12 | Nec Corp | Siドライエツチング・表面処理装置 |
JPS6377120A (ja) * | 1986-09-19 | 1988-04-07 | Mitsubishi Electric Corp | プラズマ処理装置 |
-
1987
- 1987-11-11 JP JP1987172460U patent/JPH087626Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0176034U (enrdf_load_stackoverflow) | 1989-05-23 |
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