JPH0864923A - Pattern inductor and radio communication equipment - Google Patents

Pattern inductor and radio communication equipment

Info

Publication number
JPH0864923A
JPH0864923A JP19913694A JP19913694A JPH0864923A JP H0864923 A JPH0864923 A JP H0864923A JP 19913694 A JP19913694 A JP 19913694A JP 19913694 A JP19913694 A JP 19913694A JP H0864923 A JPH0864923 A JP H0864923A
Authority
JP
Japan
Prior art keywords
inductor
ground conductor
conductor layer
pattern
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19913694A
Other languages
Japanese (ja)
Inventor
Kaoru Tenjin
薫 天神
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP19913694A priority Critical patent/JPH0864923A/en
Publication of JPH0864923A publication Critical patent/JPH0864923A/en
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Waveguide Connection Structure (AREA)

Abstract

PURPOSE: To provide a pattern inductor wherein stray capacitance can be reduced when an inductor and a ground conductor layer are three-dimensionally arranged on the surface and the back by using a double-sided board, and the electrostatic breakdown voltage characteristics of a surface acoustic wave filter can be improved. CONSTITUTION: This pattern inductor 20 is provided with a belt-shaped conductor which is formed on one conductor layer of the facing conductor layers of a printed board 21 having at least two conductor layers via an insulating layer, so as to be turned into an inductor, and a ground conductor layer 23 formed on the other conductor layer. A ground conductor in a part facing an inductor of the ground conductor layer 23 is eliminated. A radio communication equipment which is used by inserting the pattern inductor 20, in series, in the input part of a surface acoustic wave filter is also provided.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明はプリントタイプのイン
ダクタに関し、特に絶縁層を介して接地導体層と帯状導
体とを具備し、浮遊容量を小さくし、且つ静電耐圧を改
善するパターンインダクタに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a print type inductor, and more particularly to a pattern inductor having a ground conductor layer and a strip conductor via an insulating layer to reduce stray capacitance and improve electrostatic breakdown voltage.

【0002】[0002]

【従来の技術】従来、コードレス電話機等の無線通信機
の受信キャリア通過バンドパスフィルタとして、挿入損
失が少なく、ストリップバンドの減衰量が大きい弾性表
面波フィルタが広く使用されている。しかし、この弾性
表面波フィルタは通過帯のリップルが大きく、静電耐圧
が低い等の欠点を有している。そこで、これらの欠点を
解消するため、図4に示すように、アンテナ1で捕らえ
られた受信信号が入力される弾性表面波フィルタ2の入
力部に直列に、接地導体層3を有するインダクタ4を接
続している。インダクタ4はリップルを小さくし、接地
導体層3はインダクタ4をシールドする。加えて、接地
導体層3ををインダクタ4に近接配設することで、静電
放電経路として放電ギャップを形成して、弾性表面波フ
ィルタの静電耐圧特性を向上させている。
2. Description of the Related Art Conventionally, a surface acoustic wave filter having a small insertion loss and a large strip band attenuation has been widely used as a reception carrier passing band pass filter of a wireless communication device such as a cordless telephone. However, this surface acoustic wave filter has drawbacks such as a large ripple in the pass band and a low electrostatic breakdown voltage. Therefore, in order to eliminate these drawbacks, as shown in FIG. 4, an inductor 4 having a ground conductor layer 3 is provided in series with the input portion of the surface acoustic wave filter 2 to which the reception signal captured by the antenna 1 is input. Connected. The inductor 4 reduces ripples, and the ground conductor layer 3 shields the inductor 4. In addition, by disposing the ground conductor layer 3 close to the inductor 4, a discharge gap is formed as an electrostatic discharge path to improve the electrostatic breakdown voltage characteristic of the surface acoustic wave filter.

【0003】このようなインダクタとして、絶縁層を介
して両面に導体層を有するプリント基板、いわゆる両面
基板5を用いて、図5に示すように、表面に帯状導体パ
ターンを形成し、図6に示すように、裏面を接地導体層
3としたパターンインダクタ6が使用されている。イン
ダクタ4の入力端子部7、接地端子部8は、それぞれ外
部リード(図示せず)の挿入用貫通孔9,10を介し
て、半田接続できるように、両面基板5の表裏に導体パ
ターンで形成されている。また、出力端子部11も、コ
ンデンサ(図示せず)等のリードを貫通孔12に挿入し
て半田接続できるように、両面基板5の表裏に導体パタ
ーンで形成されている。
As such an inductor, a printed board having conductor layers on both sides with an insulating layer in between, a so-called double-sided board 5, is used to form a strip-shaped conductor pattern on the surface as shown in FIG. As shown, the pattern inductor 6 having the ground conductor layer 3 on the back surface is used. The input terminal portion 7 and the ground terminal portion 8 of the inductor 4 are formed with conductor patterns on the front and back surfaces of the double-sided substrate 5 so that they can be soldered to each other through through holes 9 and 10 for insertion of external leads (not shown). Has been done. The output terminal portion 11 is also formed with a conductor pattern on the front and back sides of the double-sided substrate 5 so that leads such as a capacitor (not shown) can be inserted into the through holes 12 and soldered.

【0004】ところが、上述した構成のパターンインダ
クタ6は、接地導体層3との間に両面基板5のガラスエ
ポキシ等の絶縁層を介して対向しているため、浮遊容量
を持っている。この浮遊容量は、最近の軽薄短小化傾向
により、両面基板5の絶縁層が薄くなると大きくなり、
無線通信機等の高周波回路に使用する場合、特に入力信
号の挿入損失を大きくし、受信感度を劣化させる。そこ
で、この浮遊容量を小さくするために、図7に示すよう
に、誘電体基板上に、インダクタ13とこのインダクタ
13の周囲に接地導体層14を平面的に配置し、且つイ
ンダクタ13の入出力部が接地導体層14を跨いで設け
られた構成のパターンインダクタが開示されている(特
開平2−163913号公報参照)。
However, the patterned inductor 6 having the above-described structure has a stray capacitance because it is opposed to the ground conductor layer 3 via the insulating layer such as glass epoxy of the double-sided substrate 5. This stray capacitance increases as the insulating layer of the double-sided substrate 5 becomes thinner due to the recent tendency toward lightness, thinness, shortness, and miniaturization.
When it is used in a high frequency circuit such as a wireless communication device, in particular, the insertion loss of the input signal is increased and the reception sensitivity is deteriorated. Therefore, in order to reduce the stray capacitance, as shown in FIG. 7, the inductor 13 and the ground conductor layer 14 around the inductor 13 are planarly arranged on the dielectric substrate, and the input / output of the inductor 13 is reduced. There is disclosed a pattern inductor having a structure in which a portion is provided so as to straddle the ground conductor layer 14 (see JP-A-2-163913).

【0005】[0005]

【発明が解決しようとする課題】接地導体層を平面的に
配置した上述のパターンインダクタは、誘電体基板上に
形成するため、基板の材料が限定されるという問題があ
る。さらに、平面的に接地導体層を配置するために、構
成面積が大きくなるとともに、接地導体層によるインダ
クタのシールド効果が不十分となるという問題があっ
た。したがって、この発明は上述する問題点を解決する
ために提案されたものであり、浮遊容量が小さく、且つ
静電放電経路として放電ギャップを形成して静電耐圧を
改善したパターンインダクタの提供を目的とする。
Since the above-described patterned inductor having the ground conductor layer arranged in a plane is formed on the dielectric substrate, there is a problem that the substrate material is limited. Further, since the ground conductor layer is arranged in a plane, there is a problem that the configuration area becomes large and the shield effect of the inductor by the ground conductor layer becomes insufficient. Therefore, the present invention has been proposed in order to solve the above-mentioned problems, and an object of the present invention is to provide a pattern inductor having a small stray capacitance and improving discharge voltage by forming a discharge gap as an electrostatic discharge path. And

【0006】[0006]

【課題を解決するための手段】絶縁層を挟んで帯状導体
と接地導体層とを形成したしたパターンインダクタにお
いて、前記接地導体層は前記帯状導体と対向する位置の
接地導体層を削除した構成とする。また、受信バンドの
バンドパスフィルタとして弾性表面波フィルタを使用す
る無線通信機において、前記弾性表面波フィルタの入力
部に直列に挿入されるインダクタとして使用する無線通
信機を提供する。
In a pattern inductor in which a strip conductor and a ground conductor layer are formed with an insulating layer sandwiched therebetween, the ground conductor layer has a configuration in which the ground conductor layer at a position facing the strip conductor is removed. To do. Also provided is a wireless communication device that uses a surface acoustic wave filter as a bandpass filter for a reception band, and that is used as an inductor that is inserted in series with the input portion of the surface acoustic wave filter.

【0007】[0007]

【作用】上記の構成によれば、インダクタの帯状導体と
接地導体とは対向して配置していないため、インダクタ
と接地導体との間の浮遊容量は小さくできるとともに、
インダクタと接地導体層との間に、静電放電経路として
放電ギャップが近接して配設されるため、弾性表面波フ
ィルタの静電耐圧特性を向上できる。また、インダクタ
と接地導体層とがプリント基板の絶縁層を介して、立体
的に配置されるため、同一平面に構成するものに比し
て、構成面積が少なくできるとともに、接地導体の削除
された部分がインダクタに対向する部分だけなので、接
地導体層全体の面積に対して非常に少ないため、実用上
のシールド効果は損なわれない。
According to the above structure, since the strip conductor and the ground conductor of the inductor are not arranged to face each other, the stray capacitance between the inductor and the ground conductor can be reduced, and
Since the discharge gap is disposed in close proximity as an electrostatic discharge path between the inductor and the ground conductor layer, the electrostatic breakdown voltage characteristic of the surface acoustic wave filter can be improved. In addition, since the inductor and the ground conductor layer are three-dimensionally arranged via the insulating layer of the printed circuit board, the area of the structure can be reduced as compared with the case where the inductor and the ground conductor layer are formed on the same plane, and the ground conductor is eliminated. Since the part is only the part facing the inductor, it is very small with respect to the area of the entire ground conductor layer, so that the practical shield effect is not impaired.

【0008】[0008]

【実施例】以下、本発明の一実施例につき図面を参照し
て説明する。図において従来例と同一部分には同一符号
を付し説明を省略する。本発明のパターンインダクタ
は、接地導体層のパターン構成に特徴を有する。すなわ
ち、本発明のパターンインダクタ20は、図2に示すよ
うに、両面基板21の表面の導体層には、帯状導体パタ
ーンのインダクタ22が形成されている。そして、図1
に示すように、裏面の接地導体層23は表面の導体層の
インダクタ22のパターンと対向する位置の接地導体が
削除された構成となっている。そして、従来例と同様
に、両面基板21の表裏に、インダクタ22の入力端子
部7、接地端子部8、出力端子部11の導体パターン
が、それぞれの外部リード(図示せず)を貫通孔9、1
0、12を介して半田接続できるように形成されてい
る。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In the figure, the same parts as those in the conventional example are designated by the same reference numerals and the description thereof will be omitted. The pattern inductor of the present invention is characterized by the pattern configuration of the ground conductor layer. That is, in the patterned inductor 20 of the present invention, as shown in FIG. 2, a strip-shaped conductor pattern inductor 22 is formed on the conductor layer on the surface of the double-sided substrate 21. And FIG.
As shown in FIG. 5, the ground conductor layer 23 on the back surface has a configuration in which the ground conductor at a position facing the pattern of the inductor 22 on the front conductor layer is removed. Then, similar to the conventional example, the conductor patterns of the input terminal portion 7, the ground terminal portion 8 and the output terminal portion 11 of the inductor 22 are formed on the front and back surfaces of the double-sided substrate 21 through the external leads (not shown) through the holes 9. 1
It is formed so that solder connection can be made via 0 and 12.

【0009】このように構成することにより、図3に示
すように、インダクタ22と対向する裏面には、接地導
体が存在しないため、インダクタ22と接地導体とは対
向せず、浮遊容量は非常に小さくなり、しかも、インダ
クタ22と接地導体層23とは、接地導体の削除部分2
4の周囲(例えば図3に矢印で示した部分)で近接して
配置されているため、静電放電経路として放電ギャップ
が形成され、弾性表面波フィルタの静電耐圧特性を向上
できる。したがつて、両面基板21の厚さを薄くして、
軽薄短小化しても実用上問題になる大きさの浮遊容量の
発生はない。また、接地導体の削除部分24が、インダ
クタ22に対向する部分だけで接地導体層23全体の面
積に対して非常に少ないため、シールド効果も低下しな
い。
With this structure, as shown in FIG. 3, since the ground conductor does not exist on the back surface facing the inductor 22, the inductor 22 and the ground conductor do not face each other, and the stray capacitance is very large. In addition, the inductor 22 and the ground conductor layer 23 are made smaller, and
Since they are arranged close to each other around 4 (for example, a portion indicated by an arrow in FIG. 3), a discharge gap is formed as an electrostatic discharge path, and the electrostatic breakdown voltage characteristic of the surface acoustic wave filter can be improved. Therefore, reduce the thickness of the double-sided substrate 21,
Even if it is made light, thin, short, and small, stray capacitance of a size that poses a practical problem does not occur. In addition, since the removed portion 24 of the ground conductor is very small in only the portion facing the inductor 22 with respect to the area of the entire ground conductor layer 23, the shield effect does not decrease.

【0010】以上、両面基板を用いた、コードレスホン
の表面弾性波フイルタの入力部に直列に接続したパター
ンインダクタの例について説明したが、本発明はこれに
限定されず、例えば、3層のプリント基板を用い、1層
目および2層目を上記構成とし、3層目を全面的に接地
導体層として、シールド効果を更に向上したり、4層の
プリント基板を用い、1層目及び2層目、3層目及び4
層目を、それぞれ本発明の構成とし、2回路のパターン
インダクタを立体的に配置することにより、2回路のバ
ンドパス用弾性表面波フィルタを有する無線通信機の受
信入力回路を小型にすることができる等種々の利用法が
可能である。
The example of the pattern inductor using the double-sided board and connected in series to the input section of the surface acoustic wave filter of the cordless phone has been described above, but the present invention is not limited to this, and for example, a three-layer printed circuit board. The first layer and the second layer are configured as described above, and the third layer is entirely used as a ground conductor layer to further improve the shield effect, and a four-layer printed circuit board is used. 3rd layer and 4
Each of the layers has the configuration of the present invention, and the pattern inductors of two circuits are three-dimensionally arranged, whereby the reception input circuit of the wireless communication device having the two circuits of the surface acoustic wave filter for bandpass can be downsized. Various uses such as possible are possible.

【0011】[0011]

【発明の効果】本発明のパターンインダクタによれば、
インダクタの導体層と接地導体とは対向して配置してい
ないため、インダクタと接地導体との間の浮遊容量は小
さくできるとともに、インダクタと接地導体層との間に
近接して放電ギャップを形成できるため、弾性表面波フ
ィルタの静電耐圧特性を向上できる。また、インダクタ
と接地導体層とがプリント基板の絶縁層を介して、立体
的に配置されるため、構成面積が少なくできるととも
に、シールド効果は損なわれない。
According to the pattern inductor of the present invention,
Since the conductor layer of the inductor and the ground conductor are not arranged so as to face each other, the stray capacitance between the inductor and the ground conductor can be reduced, and a discharge gap can be formed close to the inductor and the ground conductor layer. Therefore, the electrostatic breakdown voltage characteristic of the surface acoustic wave filter can be improved. Further, since the inductor and the ground conductor layer are three-dimensionally arranged via the insulating layer of the printed board, the construction area can be reduced and the shielding effect is not impaired.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の一実施例のパターンインダクタの裏
面の要部平面図
FIG. 1 is a plan view of an essential part of a back surface of a patterned inductor according to an embodiment of the present invention.

【図2】 本発明の一実施例のパターンインダクタの表
面の要部平面図
FIG. 2 is a plan view of a main portion of a surface of a pattern inductor according to an embodiment of the present invention.

【図3】 本発明の一実施例のパターンインダクタの要
部断面図
FIG. 3 is a sectional view of an essential part of a pattern inductor according to an embodiment of the present invention.

【図4】 無線通信機の受信入力部の構成図FIG. 4 is a configuration diagram of a reception input unit of a wireless communication device.

【図5】 従来のパターンインダクタの表面の要部平面
FIG. 5 is a plan view of a main part of a surface of a conventional pattern inductor.

【図6】 従来のパターンインダクタの裏面の要部平面
FIG. 6 is a plan view of the main part of the back surface of a conventional pattern inductor.

【図7】 従来の他のパターンインダクタの斜視図FIG. 7 is a perspective view of another conventional pattern inductor.

【符号の説明】[Explanation of symbols]

20 パターンインダクタ 21 両面基板(プリント基板) 22 インダクタ 23 接地導体層 24 接地導体の削除部分 20 Pattern Inductor 21 Double-sided Board (Printed Circuit Board) 22 Inductor 23 Grounding Conductor Layer 24 Deleted Part of Grounding Conductor

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】絶縁層を挟んで帯状導体と接地導体層とを
形成したパターンインダクタにおいて、前記接地導体層
は前記帯状導体と対向する位置の接地導体層を削除され
ていることを特徴とするパターンインダクタ。
1. A pattern inductor in which a strip conductor and a ground conductor layer are formed with an insulating layer sandwiched therebetween, wherein the ground conductor layer has a ground conductor layer at a position facing the strip conductor removed. Pattern inductor.
【請求項2】受信バンドのバンドパスフィルタとして弾
性表面波フィルタと前記弾性表面波フィルタの入力部に
直列に挿入される請求項1記載のパターンインダクタと
を具備することを特徴とする無線通信機。
2. A radio communication device comprising a surface acoustic wave filter as a band pass filter for a reception band and the pattern inductor according to claim 1, which is inserted in series with an input portion of the surface acoustic wave filter. .
JP19913694A 1994-08-24 1994-08-24 Pattern inductor and radio communication equipment Pending JPH0864923A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19913694A JPH0864923A (en) 1994-08-24 1994-08-24 Pattern inductor and radio communication equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19913694A JPH0864923A (en) 1994-08-24 1994-08-24 Pattern inductor and radio communication equipment

Publications (1)

Publication Number Publication Date
JPH0864923A true JPH0864923A (en) 1996-03-08

Family

ID=16402748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19913694A Pending JPH0864923A (en) 1994-08-24 1994-08-24 Pattern inductor and radio communication equipment

Country Status (1)

Country Link
JP (1) JPH0864923A (en)

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