CN117914277A - PCB structure of split type band-stop filter - Google Patents
PCB structure of split type band-stop filter Download PDFInfo
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- CN117914277A CN117914277A CN202410097120.1A CN202410097120A CN117914277A CN 117914277 A CN117914277 A CN 117914277A CN 202410097120 A CN202410097120 A CN 202410097120A CN 117914277 A CN117914277 A CN 117914277A
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- 239000000919 ceramic Substances 0.000 claims abstract description 110
- 239000003990 capacitor Substances 0.000 claims abstract description 41
- 230000008054 signal transmission Effects 0.000 claims abstract description 38
- 230000008030 elimination Effects 0.000 claims abstract 4
- 238000003379 elimination reaction Methods 0.000 claims abstract 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- 230000008878 coupling Effects 0.000 abstract description 5
- 238000010168 coupling process Methods 0.000 abstract description 5
- 238000005859 coupling reaction Methods 0.000 abstract description 5
- 230000000903 blocking effect Effects 0.000 abstract 1
- 230000001629 suppression Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 230000005764 inhibitory process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The invention provides a PCB structure of a split band-stop filter, which comprises a PCB, a dielectric ceramic resonator, a coil inductor, a ceramic chip and a patch capacitor, wherein the dielectric ceramic resonator, the coil inductor, the ceramic chip and the patch capacitor are arranged on the PCB; through setting up a plurality of dielectric ceramic resonators side by side, can realize band elimination filter's resonant frequency, through laying first conducting layer at the potsherd upper and lower surface, can make the potsherd form electric capacity to cooperate the coil inductance of establishing ties on PCB board signal transmission line to realize the coupling of blocking filter, through setting up the paster electric capacity, can also adjust band elimination filter's standing wave, thereby make this band elimination filter can realize better in-band suppression effect effectively.
Description
Statement of divisional application
The application discloses a split band-stop filter with good in-band inhibition effect, which is filed by 2023, 11 and 07, and is a split application of Chinese application patent application with the application number 202311465305.5.
Technical Field
The invention belongs to the technical field of band-stop filters, and particularly relates to a PCB structure of a split band-stop filter.
Background
As is well known, the high-frequency filter includes a band-pass filter, a band-stop filter, a low-pass filter, a high-pass filter, and the like in terms of functions; the main characteristic of the band-stop filter is that signals in certain frequency bands are suppressed to the maximum extent, and other signals pass through to the maximum extent, so that the band-stop filter is widely applied to devices such as mobile phones, televisions, displays, tablet computers, intelligent watches, servers, base stations and the like; however, the PCB structure of the traditional band-stop filter is difficult to realize the compromise of the resonance frequency and the coupling of the band-stop filter, and standing waves of the band-stop filter cannot be adjusted, so that the band-stop filter adopting the PCB structure has a general in-band inhibition effect, and the industry is difficult to meet the higher and higher requirements of the band-stop filter.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a PCB structure of a split band-stop filter, which can realize the resonance frequency and coupling of the band-stop filter and adjust the standing wave of the band-stop filter.
In order to achieve the above purpose, the product in the technical scheme adopted by the invention is a PCB structure of a split band-stop filter, comprising: the PCB is provided with a signal transmission line, a first grounding pad, a second grounding pad and a communication line;
The signal transmission line extends along the left-right direction, an input electrode is formed at the left end part of the signal transmission line, an output electrode is formed at the right end part of the signal transmission line, and the first grounding pad and the second grounding pad are respectively positioned at the front side and the rear side of the signal transmission line and are spaced from the signal transmission line;
the dielectric ceramic resonators are arranged side by side along the left-right direction, adjacent dielectric ceramic resonators are spaced, and the number of the ceramic plates, the coil inductors and the patch capacitors is the same as the number of the dielectric ceramic resonators;
The coil inductor is connected in series on the signal transmission line;
the upper surface and the lower surface of the ceramic plate are coated with a first conductive layer, the ceramic plate is connected in series with the dielectric ceramic resonator, one end of the ceramic plate, which is connected in series, is welded on the signal transmission line and is positioned at one side of the coil inductor, and the other end of the ceramic plate is welded on the second grounding pad;
The patch capacitor and the ceramic plate are arranged corresponding to the coil inductor, one pole of the patch capacitor is welded on the signal transmission line and is positioned on one side of the coil inductor, and the other pole of the patch capacitor is welded on the first grounding pad, so that the patch capacitor corresponds to the ceramic plate and the dielectric ceramic resonator.
Preferably, the patch capacitor is C1, the capacitor formed by coating the ceramic sheet with the first conductive layer is C2, and the equivalent circuit of the dielectric ceramic filter is a capacitor C3 and an inductor L3 connected in parallel, where the values of the capacitors C1, C2 and C3 are not equal.
Further preferably, the coil inductance is L1, and the inductance formed by the signal transmission line itself is L2, wherein the values of the inductances L1, L2, and L3 are not equal.
Further preferably, the ceramic plate is a monolithic long strip ceramic plate, the first conductive layer includes three independent silver plating areas laid on the upper surface of the ceramic plate and three independent silver plating areas laid on the lower surface of the ceramic plate, and the silver plating areas corresponding to the upper and lower surfaces of the ceramic plate form a capacitor C2.
Preferably, the dielectric ceramic resonator comprises a dielectric ceramic body and a second conductive layer, the dielectric ceramic body is a cuboid extending along the front-back direction, the front surface of the dielectric ceramic body is provided with a resonant hole penetrating through the dielectric ceramic body along the front-back direction, and the second conductive layer is laid on the front surface, the upper surface, the lower surface, the left surface, the right surface and the inner wall surface of the resonant hole of the dielectric ceramic body.
Further preferably, the second conductive layer on the lower surface of the dielectric ceramic body is welded with the second grounding pad.
Further preferably, the cross-sectional shape of the resonance hole is circular.
Preferably, the first conductive layer on the upper surface of the ceramic plate is electrically connected with the second conductive layer on the inner wall surface of the resonant hole through a single wire, and the first conductive layer on the lower surface of the ceramic plate is connected with the signal transmission line through the communication line and is located at one side of the coil inductor.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
according to the PCB structure of the split type band-stop filter, the resonant frequency of the band-stop filter can be realized by arranging the dielectric ceramic resonators side by side, the ceramic sheets can form a capacitor by laying the first conductive layers on the upper surface and the lower surface of the ceramic sheets, the coupling of the band-stop filter is realized by matching with the coil inductor connected in series on the signal transmission line of the PCB, and the standing wave of the band-stop filter can be regulated by arranging the patch capacitor, so that the band-stop filter can effectively realize a good in-band inhibition effect.
In addition, the dielectric ceramic body has higher dielectric constant, so that the volume of the dielectric ceramic resonator can be greatly reduced, the whole volume of the band-stop filter is small, electromagnetic waves entering the dielectric ceramic resonator can be closed due to the arrangement of the second conductive layer, the electromagnetic waves are prevented from radiating into free space, only small dielectric loss and ohmic loss formed by the second conductive layer exist, and the passband loss is small.
Drawings
Fig. 1 is a schematic top view of a preferred embodiment of the present invention.
Fig. 2 is a schematic left-hand view of a preferred embodiment of the present invention.
Fig. 3 is an enlarged partial schematic view at a in fig. 2.
Fig. 4 is a schematic top view of the preferred embodiment of the present invention with the shield removed.
Fig. 5 is a schematic cross-sectional view in the direction B-B of fig. 4.
Fig. 6 is an equivalent circuit diagram of fig. 1.
Fig. 7 is an electrical performance diagram of fig. 1.
Fig. 8 is a schematic top view of another embodiment of the present invention with the shield removed.
Wherein: a PCB board; 11. a signal transmission line; 111. an input electrode; 112. an output electrode; 12. a first ground pad; 13. a second ground pad; 14. a communication line; 20. a ceramic sheet; 21. a first conductive layer; 22. a connecting wire; 30. a coil inductance; 40. a patch capacitor; 50. a shield case; 51. a window; 60. a dielectric ceramic resonator; 61. a dielectric ceramic body; 611. a resonance hole; 62. and a second conductive layer.
Detailed Description
As shown in fig. 1 to 6, the split band reject filter with good in-band rejection effect provided by the invention comprises a PCB board 10, and a ceramic chip 20, a coil inductor 30, a patch capacitor 40, a shielding shell 50 and a dielectric ceramic resonator 60 which are arranged on the PCB board 10, wherein a signal transmission line 11, a first grounding pad 12, a second grounding pad 13 and a communication line 14 are arranged on the PCB board 10, the signal transmission line 11 extends along the left-right direction, the left end part of the signal transmission line 11 forms an input electrode 111, the right end part of the signal transmission line 11 forms an output electrode 112, and the first grounding pad 12 and the second grounding pad 13 are respectively positioned at the front side and the rear side of the signal transmission line 11 and are spaced (not conducted) from the signal transmission line 11; the dielectric ceramic resonator 60 is arranged on the PCB board 10, the dielectric ceramic resonator 60 comprises a dielectric ceramic body 61 and a second conductive layer 62, the dielectric ceramic body 61 is a cuboid extending along the front-back direction, the front surface of the dielectric ceramic body 61 is provided with a resonant hole 611 penetrating the dielectric ceramic body 61 along the front-back direction, and the second conductive layer 62 is laid on the front surface, the upper surface, the lower surface, the left surface, the right surface and the inner wall surface of the resonant hole 611 of the dielectric ceramic body 61; in this embodiment, three dielectric ceramic resonators 60 are arranged side by side along the left-right direction, and adjacent dielectric ceramic resonators 60 are spaced apart (to increase the welding space of the coil inductor 30) to form a split structure, and in other embodiments, adjacent dielectric ceramic resonators 60 may be bonded together; the number of the ceramic plates 20, the coil inductors 30 and the patch capacitors 40 is the same as that of the dielectric ceramic resonators 60, wherein the three coil inductors 30 are sequentially connected in series on the signal transmission line 11, the patch capacitors 40 and the ceramic plates 20 are correspondingly arranged with the coil inductors 30, specifically, one pole of each patch capacitor 40 is welded on the signal transmission line 11 and is positioned at one side of the coil inductor 30, so that the electric connection (conduction) with one side of the coil inductor 30 is realized, and the other pole is welded on the first grounding pad 12, so that the grounding is realized; the upper and lower surfaces of the ceramic plate 20 are coated with a first conductive layer 21, the ceramic plate 20 is connected in series with the dielectric ceramic resonator 60, one end of the ceramic plate 20 connected in series is welded on the signal transmission line 11 and positioned on one side of the coil inductor 30, so that the electric connection (conduction) with one side of the coil inductor 30 is realized, and the other end is welded on the second grounding pad 13, so that the grounding is realized, and the ceramic plate 20, the dielectric ceramic resonator 60 and the patch capacitor 40 are corresponding; the shield case 50 covers the ceramic sheet 20, the coil inductance 30, the chip capacitor 40, and the dielectric ceramic resonator 60.
The band-stop filter has the advantages that the resonance frequency of the band-stop filter can be realized, the coupling of the band-stop filter can be realized, and the standing wave of the band-stop filter can be adjusted, so that the band-stop filter can effectively realize a better in-band inhibition effect; meanwhile, the whole volume of the band-stop filter is reduced, and the passband loss of the band-stop filter is reduced.
In the present embodiment, the cross-sectional shape of the resonance hole 611 is circular, and in other embodiments, the cross-sectional shape of the resonance hole 611 is rectangular.
Further, the first conductive layer 21 on the upper surface of the ceramic wafer 20 is electrically connected (conducted) with the second conductive layer 62 on the inner wall surface of the resonant hole 611 through the connection wire 22 (single wire), and the first conductive layer 21 on the lower surface of the ceramic wafer 20 is connected with the signal transmission line 11 through the communication line 14 on the PCB board 10 and is located at one side of the coil inductor 30, so as to realize electrical connection (conduction) with one side of the coil inductor 30; meanwhile, the second conductive layer 62 located on the lower surface of the dielectric ceramic body 61 is welded with the second grounding pad 13, so as to realize grounding.
In this embodiment, for the convenience of observation, the shielding case 50 is provided with a window 51, the window 51 is disposed above the ceramic chip 20 and the signal transmission line 11, and the window 51 exposes a part of the chip capacitor 40, the inductor 30, the ceramic chip 20 and the signal transmission line 11.
Further, midpoints of four long sides of the dielectric ceramic body 61 are connected to form a virtual plane, and the front end face of the shield shell 50 is flush with the virtual plane.
In this embodiment, the ceramic sheet 20 is made of alumina ceramic or dielectric ceramic, and the second conductive layer 62 and the first conductive layer 21 are made of the same material and are all silver layers formed by curing conductive silver paste.
In this embodiment, the length-width-height dimension of the dielectric ceramic filter 60 is 15×15×4.5mm, as shown in fig. 7, the passband frequency on the left side of the band stop filter is DC-1450MHz, the passband frequency on the right side is 1610-2000MHz, the stopband frequency is 1500-1550MHz, the passband loss is less than or equal to 1.5dB, and the in-band rejection is greater than or equal to 35dB.
Note that, in fig. 6, the capacitor C1 is the patch capacitor 40, the inductance L1 is the coil inductance 30, the inductance L2 is the inductance formed by the signal transmission line 11 itself, the capacitor C2 is the capacitor formed by the ceramic sheet 20 coated with the first conductive layer 41, the parallel capacitor C3 and the inductance L3 are equivalent circuits of the dielectric ceramic filter 60, the values of C1, C2, and C3 are not equal, and the values of L1, L2, and L3 are also not equal.
In another embodiment, as shown in fig. 8, the ceramic plate 20 is a monolithic long ceramic plate, the first conductive layer 21 includes three independent silver plating areas coated on the upper surface of the ceramic plate 20 and three independent silver plating areas coated on the lower surface of the ceramic plate 20, the silver plating areas corresponding to the upper and lower surfaces of the ceramic plate 20 form a capacitor, and the three capacitors are not connected, so that only one ceramic plate 20 is needed for manufacturing, and the operation is simple and convenient.
The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the present invention and to implement the same, but are not intended to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (8)
1. The PCB structure of the split band elimination filter includes: the PCB is provided with a signal transmission line, a first grounding pad, a second grounding pad and a communication line;
The method is characterized in that:
The signal transmission line extends along the left-right direction, an input electrode is formed at the left end part of the signal transmission line, an output electrode is formed at the right end part of the signal transmission line, and the first grounding pad and the second grounding pad are respectively positioned at the front side and the rear side of the signal transmission line and are spaced from the signal transmission line;
the dielectric ceramic resonators are arranged side by side along the left-right direction, adjacent dielectric ceramic resonators are spaced, and the number of the ceramic plates, the coil inductors and the patch capacitors is the same as the number of the dielectric ceramic resonators;
The coil inductor is connected in series on the signal transmission line;
the upper surface and the lower surface of the ceramic plate are coated with a first conductive layer, the ceramic plate is connected in series with the dielectric ceramic resonator, one end of the ceramic plate, which is connected in series, is welded on the signal transmission line and is positioned at one side of the coil inductor, and the other end of the ceramic plate is welded on the second grounding pad;
The patch capacitor and the ceramic plate are arranged corresponding to the coil inductor, one pole of the patch capacitor is welded on the signal transmission line and is positioned on one side of the coil inductor, and the other pole of the patch capacitor is welded on the first grounding pad, so that the patch capacitor corresponds to the ceramic plate and the dielectric ceramic resonator.
2. The printed circuit board structure of the split band reject filter of claim 1, wherein: the patch capacitor is C1, the capacitor formed by the ceramic plate after being coated with the first conductive layer is C2, and the capacitor C3 and the inductor L3 which are connected in parallel with the equivalent circuit of the dielectric ceramic filter are formed, wherein the values of the capacitor C1, the capacitor C2 and the capacitor C3 are unequal.
3. The printed circuit board structure of the split band reject filter of claim 2, wherein: the coil inductance is L1, and the inductance formed by the signal transmission line is L2, wherein the values of the inductances L1, L2 and L3 are not equal.
4. The printed circuit board structure of the split band reject filter of claim 2, wherein: the ceramic plate is a whole strip-shaped ceramic plate, the first conductive layer comprises three independent silver plating areas laid on the upper surface of the ceramic plate and three independent silver plating areas laid on the lower surface of the ceramic plate, and the silver plating areas corresponding to the upper surface and the lower surface of the ceramic plate form a capacitor C2.
5. The printed circuit board structure of the split band reject filter of claim 1, wherein: the dielectric ceramic resonator comprises a dielectric ceramic body and a second conductive layer, wherein the dielectric ceramic body is a cuboid extending along the front-back direction, the front surface of the dielectric ceramic body is provided with a resonant hole penetrating through the dielectric ceramic body along the front-back direction, and the second conductive layer is laid on the front surface, the upper surface, the lower surface, the left surface, the right surface and the inner wall surface of the resonant hole of the dielectric ceramic body.
6. The split band stop filter PCB panel structure of claim 5, wherein: and the second conductive layer positioned on the lower surface of the dielectric ceramic body is welded and connected with the second grounding pad.
7. The split band stop filter PCB panel structure of claim 5, wherein: the cross section of the resonant hole is circular.
8. The printed circuit board structure of the split band reject filter of claim 1, wherein: the first conductive layer on the upper surface of the ceramic plate is electrically connected with the second conductive layer on the inner wall surface of the resonant hole through a single wire, and the first conductive layer on the lower surface of the ceramic plate is connected with the signal transmission line through the communication line and is positioned on one side of the coil inductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410097120.1A CN117914277A (en) | 2023-11-07 | 2023-11-07 | PCB structure of split type band-stop filter |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410097120.1A CN117914277A (en) | 2023-11-07 | 2023-11-07 | PCB structure of split type band-stop filter |
| CN202311465305.5A CN117200728B (en) | 2023-11-07 | 2023-11-07 | Split type band elimination filter with good in-band inhibition effect |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311465305.5A Division CN117200728B (en) | 2023-11-07 | 2023-11-07 | Split type band elimination filter with good in-band inhibition effect |
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| Publication Number | Publication Date |
|---|---|
| CN117914277A true CN117914277A (en) | 2024-04-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410097120.1A Pending CN117914277A (en) | 2023-11-07 | 2023-11-07 | PCB structure of split type band-stop filter |
| CN202311465305.5A Active CN117200728B (en) | 2023-11-07 | 2023-11-07 | Split type band elimination filter with good in-band inhibition effect |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311465305.5A Active CN117200728B (en) | 2023-11-07 | 2023-11-07 | Split type band elimination filter with good in-band inhibition effect |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05218705A (en) * | 1992-02-05 | 1993-08-27 | Ngk Insulators Ltd | Lamination type band elimination filter |
| JPH07201592A (en) * | 1993-12-28 | 1995-08-04 | Murata Mfg Co Ltd | Laminated lc composite component |
| JP5360087B2 (en) * | 2011-02-14 | 2013-12-04 | 株式会社村田製作所 | Band elimination filter |
| CN204348875U (en) * | 2015-01-07 | 2015-05-20 | 合肥恒青电子技术有限公司 | A kind of Ceramic Dielectric Filter with absorbing resonant cavity |
| CN213752980U (en) * | 2020-11-30 | 2021-07-20 | 江苏灿勤科技股份有限公司 | Low-frequency dielectric filter |
| CN115513625A (en) * | 2022-10-20 | 2022-12-23 | 中国电子科技集团公司第二十六研究所 | High out-of-band rejection split dielectric filter |
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2023
- 2023-11-07 CN CN202410097120.1A patent/CN117914277A/en active Pending
- 2023-11-07 CN CN202311465305.5A patent/CN117200728B/en active Active
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| Publication number | Publication date |
|---|---|
| CN117200728A (en) | 2023-12-08 |
| CN117200728B (en) | 2024-02-02 |
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