CN109150130A - A kind of inductive type bandpass filter - Google Patents
A kind of inductive type bandpass filter Download PDFInfo
- Publication number
- CN109150130A CN109150130A CN201810883004.7A CN201810883004A CN109150130A CN 109150130 A CN109150130 A CN 109150130A CN 201810883004 A CN201810883004 A CN 201810883004A CN 109150130 A CN109150130 A CN 109150130A
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- CN
- China
- Prior art keywords
- capacitor
- inductance
- bandpass filter
- inductive type
- type bandpass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0153—Electrical filters; Controlling thereof
- H03H7/0161—Bandpass filters
Abstract
The invention discloses a kind of inductive type bandpass filters, belong to wave filter technology field, including earth plate G1, input port P1, capacitor C1, coupling inductance L1, parasitic capacitance C2, coupling inductance L2, capacitor C3 and output port P2.It is of the invention to be unique in that based on LTCC technology using new structure, realize that simple high reliablity, excellent electrical property, structure, high yield rate, batch consistency be good, bandpass filter of low cost for the extremely low centre frequency of 80M.It solves existing bandpass filter need of work bulky capacitor and big inductance under tens mhz frequencies and constitutes resonator, but the problem of conventional process techniques can not effectively reduce device size area.
Description
Technical field
The present invention relates to short wave filter technical field, in particular to a kind of inductive type bandpass filter.
Background technique
In recent years, the micromation of mobile communication, satellite communication and Defensive Avionics System rapidly develops, high-performance, low cost
Have become microwave current/RF application developing direction with miniaturization, and filter is then the critical electronic received and dispatched in branch
Component describes this component capabilities and refers mainly to indicate: passband operating frequency range, stop band frequency range, pass band insertion loss,
Stopband attenuation, passband input/output voltage standing-wave ratio, insertion phase shift and delay/frequency characteristic, temperature stability, volume, weight,
Reliability etc..
Bandpass filter need of work bulky capacitor and big inductance under tens mhz frequencies constitute resonator.In order to meet
The small form factor requirements of device, initial method are reduced using high dielectric constant, high quality factor, low-loss dielectric material
The size of resonator, and then reduce the volume of device.But traditional technology can not effectively reduce the size of device
Area.
Summary of the invention
It is an object of the invention to: a kind of inductive type bandpass filter is provided, by inductance it is three-dimensionally integrated and coupling,
Reduce the area of plane of filter.
The technical solution adopted by the invention is as follows:
A kind of inductive type bandpass filter including the laminated body being made of multilayer dielectric substrate stacking and is arranged in layer
Filter circuit in stack is mutually connected conducting between adjacent media substrate by metal conduction band and via hole, the medium substrate
Using LTCC ceramic substrate, there is one layer of ground plane in medium substrate, ground connection layer surface is provided with input terminal P1 and output end P2.
The filter circuit includes capacitor C1, C2, C3 and inductance L1, L2, and the one end capacitor C1 is connected with input port P1, and one
End is connected with coupling inductance L1;Coupling inductance L1 other end ground connection;Coupling inductance L2 intercouples with coupling inductance L1, and generates
Parasitic capacitance C2;One end coupling inductance L2 to ground, the other end are connected with capacitor C3, the capacitor C3 other end and output port P2 phase
Even.
The inductance L1 and L2 is the three-dimensional spiral inductance formed by the metal conduction band being set on medium substrate.
The capacitor C2 is the parasitic capacitance that three-dimensional spiral inductance L1, the L2 to intercouple is generated.
Using interdigital capacitor structure, the substrate by being located at different layers is realized by described capacitor C1, C3.
The input port P1 and output port P2 is the port of 50 ohmages of coplanar waveguide structure.
Above-mentioned inductive type bandpass filter includes vertical capacitor and three-dimensional spiral inductance, it is characterised in that filter
In two three-dimensional spiral inductance use coupled structure, series connection vertical capacitor and three-dimensional spiral inductance are logical in the top of filter
Microstrip line connection is crossed, shunt capacitance is in the filter bottom after terminating three-dimensional spiral inductance.
Including earth plate G1, input port P1, capacitor C1, coupling inductance L1, parasitic capacitance C2, coupling inductance L2, capacitor
C3 and output port P2.A kind of inductive type bandpass filter lower left is equipped with the input port P1, described one kind
Inductive type bandpass filter upper right side is equipped with the output port P2, a kind of inductive type bandpass filter bottom right
Side is equipped with the earth plate G1, and the earth plate G1 is horizontally disposed;The one end the capacitor C1 is connected with the input port P1,
One end is connected with the coupling inductance L1;The coupling inductance L1 other end to ground;The coupling inductance L2 couples electricity with described
Sense L1 intercouples, and generates the parasitic capacitance C2;The one end the coupling inductance L2 is to ground, one end and the capacitor C3 phase
Even, the capacitor C3 other end is connected with the output port P2.
The input port P1 and output port P2 is the port of 50 ohmages.
The medium substrate is all made of LTCC ceramic substrate.
The middle layer of the medium substrate is equipped with metal ground plane, which is connected to ground by side plate.
In conclusion by adopting the above-described technical solution, the beneficial effects of the present invention are:
1. a kind of inductive type bandpass filter of the present invention, small in size, light-weight, superior performance is at low cost, is suitble to criticize
Amount production
2. a kind of inductive type bandpass filter of the present invention, can be processed into the form of patch, convenient in microwave system
It is integrated in system.
Detailed description of the invention
Examples of the present invention will be described by way of reference to the accompanying drawings, in which:
Fig. 1 is equivalence filter schematic diagram of the invention;
Fig. 2 is structural schematic diagram of the invention;
Specific embodiment
All features disclosed in this specification or disclosed all methods or in the process the step of, in addition to mutually exclusive
Feature and/or step other than, can combine in any way.
It elaborates below with reference to Fig. 1, Fig. 2 to the present invention.
Embodiment 1
A kind of inductive type bandpass filter, including the laminated body constituted, adjacent media is laminated by multilayer dielectric substrate
Mutually it is connected between substrate by conduction band and via hole and is connected, surface is equipped with input terminal P1, output end P2.Filter circuit includes electricity
Hold C1, C2, C3 and inductance L1, L2, the one end capacitor C1 are connected with input port P1, one end is connected with coupling inductance L1;Coupling electricity
The L1 other end is felt to ground;Coupling inductance L2 intercouples with coupling inductance L1, parallel to generate parasitic capacitance C2;Coupling inductance L2 mono-
It holds to ground, one end is connected with capacitor C3, and the capacitor C3 other end is connected with output port P2.
The present embodiment is all made of LTCC ceramic substrate using medium substrate, is equipped with metallic ground in the middle layer of medium substrate
Layer GND, metal ground plane GND is connected to ground by side plate.Inductance L1 and L2 are the metal by being set on medium substrate
The three-dimensional spiral inductance that conduction band is formed.Capacitor C1, C3 are real by the substrate for being located at different layers using interdigital capacitor structure
It is existing.Capacitor C2 is the parasitic capacitance that the three-dimensional spiral inductance to intercouple generates.
In the present embodiment constitute spiral inductance each layer be all the rectangle being coiled by the metal conduction band of 0.1mm width or
3/4 rectangle is linked together the metal conduction band of adjacent layer by via hole;Wherein, the spiral inductance in left side is L1, the spiral shell on right side
Rotation inductance is L2, and two spiral inductance structures are completely the same.
The input port P1 and output port P2 is the port of 50 ohmages of coplanar waveguide structure.
A kind of inductive type bandpass filter of the present invention is made of multilayer low-temperature co-fired ceramics technique.
The working principle of the invention/the course of work are as follows:
A kind of inductive type bandpass filter of the present invention is realized using multilayer low-temperature co-fired ceramics technique,
Its low-temperature co-burning ceramic material and metallic pattern sinter at a temperature of about 900 DEG C, thus have extreme high reliability and
Temperature stability, be grounded using three-dimensional integration and multilayer folding structure and outer surface metallic shield due to structure and
Encapsulation, so that volume be made substantially to reduce.
A kind of inductive type bandpass filter of the present invention, is realized using LTCC technology, has light-weight, volume
Small, high reliablity, good electrical property, temperature stability are good, electrical property batch consistency is good, it is at low cost, can be mass-produced etc. it is excellent
Point, suitable for satellite communication etc. to volume, electrical property, temperature stability and reliability have rigors occasion and corresponding system
In system.
The above, only the preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto, it is any
Those skilled in the art within the technical scope disclosed by the invention, can without the variation that creative work is expected or
Replacement, should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be limited with claims
Subject to fixed protection scope.
Claims (6)
1. a kind of inductive type bandpass filter, laminated body and setting including being made of multilayer dielectric substrate stacking are being laminated
Filter circuit on body is mutually connected conducting between adjacent media substrate, it is characterised in that: described by metal conduction band and via hole
Medium substrate uses LTCC ceramic substrate, has one layer of ground plane in medium substrate, ground connection layer surface be provided with input terminal P1 and
Output end P2.
2. a kind of inductive type bandpass filter according to claim 1, it is characterised in that: the filter circuit includes
Capacitor C1, C2, C3 and inductance L1, L2;The one end capacitor C1 is connected with input port P1, and one end is connected with coupling inductance L1, coupling
Inductance L1 other end ground connection, coupling inductance L2 intercouples with coupling inductance L1, and generates parasitic capacitance C2, coupling inductance L2 mono-
It holds to ground, the other end is connected with capacitor C3, and the capacitor C3 other end is connected with output port P2.
3. a kind of inductive type bandpass filter according to claim 2, it is characterised in that: the inductance L1 and L2 is equal
For the three-dimensional spiral inductance formed by the metal conduction band being set on medium substrate.
4. a kind of inductive type bandpass filter according to claim 3, it is characterised in that: the capacitor C2 is mutual
The parasitic capacitance that three-dimensional spiral inductance L1, L2 of coupling are generated.
5. a kind of inductive type bandpass filter according to claim 2, it is characterised in that: described capacitor C1, C3 are adopted
It is interdigital capacitor structure, the substrate by being located at different layers is realized.
6. a kind of inductive type bandpass filter according to claim 1, it is characterised in that: the input port P1 and
Output port P2 is the port of 50 ohmages of coplanar waveguide structure.
Priority Applications (1)
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CN201810883004.7A CN109150130A (en) | 2018-08-06 | 2018-08-06 | A kind of inductive type bandpass filter |
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CN201810883004.7A CN109150130A (en) | 2018-08-06 | 2018-08-06 | A kind of inductive type bandpass filter |
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CN201810883004.7A Pending CN109150130A (en) | 2018-08-06 | 2018-08-06 | A kind of inductive type bandpass filter |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112511126A (en) * | 2020-10-30 | 2021-03-16 | 诺思(天津)微系统有限责任公司 | Multiplexer and method for improving isolation of multiplexer and communication equipment |
CN114447546A (en) * | 2022-01-22 | 2022-05-06 | 北京邮电大学 | High-isolation subminiature planar duplexer for communication |
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CN103413997A (en) * | 2013-08-01 | 2013-11-27 | 南京理工大学 | Vertical interdigital LTCC band-pass filter |
CN103490126A (en) * | 2013-09-18 | 2014-01-01 | 电子科技大学 | Multilayer broadband band-pass filter |
CN104966868A (en) * | 2015-06-29 | 2015-10-07 | 南京理工大学 | 3D integrated superminiature band pass filter |
CN106960996A (en) * | 2017-03-09 | 2017-07-18 | 南京邮电大学 | A kind of LTCC bandpass filters with spurious reduction type vertical inter-digital electric capacity |
CN107482291A (en) * | 2017-08-16 | 2017-12-15 | 电子科技大学 | A kind of new double-passband filter |
US20180159508A1 (en) * | 2016-12-05 | 2018-06-07 | Taiyo Yuden Co., Ltd. | Filter and multiplexer |
CN108322197A (en) * | 2018-04-09 | 2018-07-24 | 广东风华高新科技股份有限公司 | A kind of LTCC low-pass filters |
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2018
- 2018-08-06 CN CN201810883004.7A patent/CN109150130A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103413997A (en) * | 2013-08-01 | 2013-11-27 | 南京理工大学 | Vertical interdigital LTCC band-pass filter |
CN103490126A (en) * | 2013-09-18 | 2014-01-01 | 电子科技大学 | Multilayer broadband band-pass filter |
CN104966868A (en) * | 2015-06-29 | 2015-10-07 | 南京理工大学 | 3D integrated superminiature band pass filter |
US20180159508A1 (en) * | 2016-12-05 | 2018-06-07 | Taiyo Yuden Co., Ltd. | Filter and multiplexer |
CN106960996A (en) * | 2017-03-09 | 2017-07-18 | 南京邮电大学 | A kind of LTCC bandpass filters with spurious reduction type vertical inter-digital electric capacity |
CN107482291A (en) * | 2017-08-16 | 2017-12-15 | 电子科技大学 | A kind of new double-passband filter |
CN108322197A (en) * | 2018-04-09 | 2018-07-24 | 广东风华高新科技股份有限公司 | A kind of LTCC low-pass filters |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112511126A (en) * | 2020-10-30 | 2021-03-16 | 诺思(天津)微系统有限责任公司 | Multiplexer and method for improving isolation of multiplexer and communication equipment |
CN112511126B (en) * | 2020-10-30 | 2022-03-15 | 诺思(天津)微系统有限责任公司 | Multiplexer and method for improving isolation of multiplexer and communication equipment |
CN114447546A (en) * | 2022-01-22 | 2022-05-06 | 北京邮电大学 | High-isolation subminiature planar duplexer for communication |
CN114447546B (en) * | 2022-01-22 | 2023-04-11 | 北京邮电大学 | High-isolation subminiature planar duplexer for communication |
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