CN103138705A - Band-pass filter - Google Patents
Band-pass filter Download PDFInfo
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- CN103138705A CN103138705A CN201110392774XA CN201110392774A CN103138705A CN 103138705 A CN103138705 A CN 103138705A CN 201110392774X A CN201110392774X A CN 201110392774XA CN 201110392774 A CN201110392774 A CN 201110392774A CN 103138705 A CN103138705 A CN 103138705A
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Abstract
The invention provides a band-pass filter which comprises an input signal electrode P1, an output signal electrode P2, a grounding electrode P3, a first series inductance and capacitance (LC) resonance circuit, a second series LC resonance circuit, a feedback capacitor C3 and a shunt inductor L3. The first series LC resonance circuit comprises a first inductor L1 and a first capacitor C1, wherein the first inductor L1 and the first capacitor C1 are in series connection, the input signal electrode P1 is connected with an input end of the first capacitor C1, and an output end of the first capacitor C1 is connected with an input end of the first inductor L1. The second series LC resonance circuit comprises a second inductor L2 and a second capacitor C2, wherein the second inductor L2 and the second capacitor C2 are in series connection, an input end of the second inductor L2 is connected with an output end of the first inductor L1, an output end of the second inductor L2 is connected with an input end of the second capacitor C2, and an output end of the second capacitor C2 is connected with the output signal electrode P2. An input end of the feedback capacitor C3 is connected to the input signal electrode P1 and the input end of the first capacitor C1, and an output end of the feedback capacitor C3 is connected to the output signal electrode P2 and the output end of the second capacitor C2. An input end of the shunt inductor L3 is connected to the output end of the first inductor L1 and the input end of the second inductor L2, and an output end of the shunt inductor L3 is connected to the grounding electrode P3. The band-pass filter has the advantages of being small in size, good in frequency-selecting performance, little in in-band insertion loss, strong in out-of-band rejection, simple and effective in method, wide in application range, low in manufacturing cost, suitable for mass production and the like.
Description
Technical field
The invention belongs to electronic technology field, it relates to a kind of band pass filter, and be specifically related to a kind of Novel belt bandpass filter with two transmission zeros based on multilayer LTCC Technology (Low Temperature Co-fired Ceramic, LTCC).
Background technology
Along with the more and more higher trend of IC degree of integration, on-chip system chip (SOC) and the application percentage of system encapsulation module (SIP) on communication system day by day raise, passive component shared area in system improves relatively in the case, so when dwindling the passive component size how, the raising element function has become a kind of core technology.
In wireless communication system, band pass filter (BPF) is the indispensable element of radio frequency prime.Band pass filter is the elementary cell of RF/Microwave transmitting-receiving subassembly, as a kind of frequency-selecting element, is used for selecting or limiting the band limits of radiofrequency signal, plays an important role in many RF application.
at present the RF/Microwave system is towards multi-functional, the miniaturization development, based on the multilayer circuit lamination techniques, as LTCC (Low Temperature Co-fired Ceramic, LTCC) multi-chip module of technique (Multi-Chip Module, MCM) technology is paid close attention to widely, it can be with various passive devices, as electric capacity, inductance, antenna, filters etc. are completely buried in medium, form with multilayer circuit structure realizes, and combine with active device be used to developing various high integration, small-power RF and microwave functional module cheaply.
The ceramic substrate of high-k is for design and process single band-pass filter component and have certain advantage, but and be not suitable for design processing multi-chip module, reason is mainly to process, RF/Microwave signal insertion loss is large.
Summary of the invention
Therefore, consider the existing technical problem of above-mentioned prior art, the object of the present invention is to provide a kind of miniaturization, filter with low insertion loss, broadband, high performance band pass filter.The present invention is in conjunction with the characteristics of multilayer circuit lamination techniques on the basis of analytic band bandpass filter original shape equivalent electric circuit type and characteristics, use T shape equivalent-circuit model, proposition adds a feedback capacity at input/output port, utilize intercoupling between two electric capacity, realize a kind of Novel belt bandpass filter that simply has two transmission zeros, effectively solved performance and the area for cutting of integrated belt bandpass filter.
In order to achieve the above object, the technical solution adopted in the present invention is:
The embodiment of the present invention provides a kind of band pass filter, comprising:
An input signal electrode P1 is by this electrode input electrical signal;
An output signal electrode P2 is by this electrode output electrical signals;
Grounding electrode P3 is connected to reference to ground by this electrode;
The first series LC resonant circuit comprises the first inductance L 1 and first capacitor C 1 of series connection, and wherein, input signal electrode P1 connects the C1 input, and the output of C1 connects the L1 input;
The second series LC resonant circuit comprises the second inductance L 2 and second capacitor C 2 of series connection, and wherein, the input of L2 connects the L1 output, and the output of L2 connects the input of C2, and the output of C2 connects output signal electrode P2;
Feedback capacity C3, the input of C3 is connected to the input of input signal electrode P1 and C1, and the output of C3 is connected to the output of output signal electrode P2 and C2;
Shunt inductance L3, the input of L3 are connected to the output of L1 and the input of L2, and the output of L3 is connected to grounding electrode P3.
Preferably, described band pass filter was made of multilayer dielectric substrate stacked adding.
Preferably, described band pass filter comprises first medium substrate and the undermost second medium substrate of the superiors;
The surface of first, second medium substrate is provided with the metallic conductor sheet.
Preferably, the metallic conductor sheet of described first medium substrate is the top crown of capacitor C 1 and C2;
Described second medium substrate metal conductor piece is ground plate.
Preferably, comprise also in described band pass filter that the surface is provided with the 3rd medium substrate of metallic conductor sheet, be arranged between first medium substrate and second medium substrate;
Described the 3rd medium substrate is with reference to metal ground, and is described with reference to metal ground realizing being electrically connected to by metal throuth hole with the metallic conductor sheet of second medium substrate.
Preferably, described reference metal excavates a rectangular channel in the middle of ground, be used for providing the metallic conductor sheet of formation L1 and the metallic conductor sheet of C1 bottom crown, and the metallic conductor sheet of the metallic conductor sheet of L2 and C2 bottom crown.
Preferably, comprise also in described band pass filter that the surface is provided with the 4th medium substrate of metallic conductor sheet;
Described the 4th medium substrate is arranged between the 3rd medium substrate and second medium substrate;
Described the 4th medium substrate is provided with the metallic conductor sheet of L3 on the 3rd medium substrate one side.
Preferably, the material of described multilayer dielectric substrate is LTCC.
Preferably, be provided with metal tray in described multilayer dielectric substrate.
Preferably, described C1, C2, C3 are parallel flat electric capacity;
Described L1, L2, L3 are planar spiral inductor, and L1, and L2 is on the same layer medium substrate, and L1, L2 and L3 are on the different layers medium substrate.
Can find out from the above, the band pass filter that the embodiment of the present invention provides includes an input signal electrode P1, by this electrode input electrical signal; An output signal electrode P2 is by this electrode output electrical signals; Grounding electrode P3 is connected to reference to ground by this electrode; The first series LC resonant circuit comprises the first inductance L 1 and first capacitor C 1 of series connection, and wherein, input signal electrode P1 connects the C1 input, and the output of C1 connects the L1 input; The second series LC resonant circuit comprises the second inductance L 2 and second capacitor C 2 of series connection, and wherein, the input of L2 connects the L1 output, and the output of L2 connects the input of C2, and the output of C2 connects output signal electrode P2; Feedback capacity C3, the input of C3 is connected to the input of input signal electrode P1 and C1, and the output of C3 is connected to the output of output signal electrode P2 and C2; Shunt inductance L3, the input of L3 are connected to the output of L1 and the input of L2, and the output of L3 is connected to grounding electrode P3.This band pass filter has that volume is little, the frequency-selecting performance is good, in-band insertion loss is little, and Out-of-band rejection is strong, and method is simply effective, can be widely used in multi-chip module (MCM), monolithic integrated microwave circuit (MMIC).And the Novel belt bandpass filter that the embodiment of the present invention provides is based on LTCC technique, low cost of manufacture, suitable batch production.This band pass filter can be widely used in the RF wireless communication such as mobile phone, Bluetooth system, WLAN (wireless local area network) field.
Description of drawings
The schematic equivalent circuit of the band pass filter that Fig. 1 provides for the embodiment of the present invention;
Decomposition, the perspective diagram of the band pass filter that Fig. 2 provides for the embodiment of the present invention;
The actual test result of the band pass filter that Fig. 3 provides for the embodiment of the present invention and 3 D electromagnetic field simulation result schematic diagram.
Embodiment
The embodiment of the present invention provides a kind of Novel belt bandpass filter with two transmission zeros.As shown in the electrical equivalent circuit figure of the Novel belt bandpass filter with two transmission zeros of accompanying drawing 1 example explanation, this bandpass filtering implement body can comprise:
An input signal electrode P1 is by this electrode input electrical signal;
An output signal electrode P2 is by this electrode output electrical signals;
Grounding electrode P3 is connected to reference to ground by this electrode;
The first series LC resonant circuit (the first inductance L 1 and the first capacitor C 1 that comprise series connection), wherein, input signal electrode P1 is electrically connected to the C1 input, and the output of C1 is connected to the L1 input;
The second series LC resonant circuit (the second inductance L 2 and the second capacitor C 2 that comprise series connection), wherein, the first series LC resonant circuit (L1, C1) in, the L1 output connects the second series LC resonant circuit (L2, C2) input of L2 in, the output of L2 is connected to the input of C2, and the output of C2 is connected to output signal electrode P2;
Feedback capacity C3, C3 is arranged between input signal electrode P1 and output signal electrode P2 two-port, it is the input that the input of C3 is connected to input signal electrode P1 and C1, the output of C3 is connected to the output of output signal electrode P2 and C2, and what feedback capacity C3 utilized is intercoupling between two electric capacity (C1, C2);
Shunt inductance L3, its access in parallel the first series LC resonant circuit (L1, C1) and first series LC resonant circuit (L2, C2) between, concrete, the input of L3 is connected to the output of L1 and the input of L2, and the output of L3 is connected to grounding electrode P3;
With reference to ground, by with reference to ground, introduce ground voltage.
Further, the band pass filter that provides of the embodiment of the present invention can be made of multilayer dielectric substrate stacked adding.Wherein, the superiors and orlop medium substrate surface are respectively equipped with the metallic conductor sheet, and the metallic conductor sheet of the superiors' medium substrate is namely the top crown of capacitor C 1 and C2, and orlop medium substrate metallic conductor sheet is namely ground plate.
Further, described electric capacity (C1, C2, C3) adopts parallel flat electric capacity to realize, wherein, C1, the top crown area of C2 are large and nearer apart, can form coupling capacitance C3 again.
Further, what described inductance (L1, L2, L3) adopted is that planar spiral inductor is realized, inductance L 1, L2 on the same layer medium substrate, both with L3 on the different layers dielectric-slab, it utilizes through hole to realize connector between the different layers metallic conductor.
Further, in one deck medium substrate in multilayer dielectric substrate, be provided with layer metallic conductor sheet for reference to metal ground, it realizes being electrically connected to both with bottom metal ground plate by through hole.
in the embodiment of the present invention, electric elements (electric capacity can be provided with, the upper surface of interlayer substrate inductance) or lower surface are provided with the metallic conductor sheet (except the superiors and orlop medium substrate, if being upper surface, intermediate layer machine medium substrate is provided with the metallic conductor sheet, the superiors' medium substrate can be provided with the metallic conductor sheet at upper surface, but orlop two sides or upper surface is provided with the metallic conductor sheet, if being lower surface, the interlayer substrate is provided with the metallic conductor sheet, the superiors' medium substrate can be on the two sides or lower surface be provided with the metallic conductor sheet, orlop can be provided with the metallic conductor sheet at lower surface), to play isolation, the effects such as protection.
The present invention is described in detail below in conjunction with the drawings and specific embodiments.
In a specific embodiment, as shown in Figure 2, the band pass filter that the embodiment of the present invention provides can be provided with 7 layers of medium substrate altogether, the thickness of medium substrate is about 84.5 μ m, every layer of thick 12 μ m that is about of conductor piece consider that processing technology metal micro-strip line and metal cylinder junction all will add the metal tray that diameter is 250 μ m.Annexation spaces out between layers as far as possible for convenience of explanation, and therefore, Fig. 2 can not represent that the present invention has the proportionate relationship of the Novel belt bandpass filter actual size of two transmission zeros.
as shown in Figure 2, the Novel belt bandpass filter with two transmission zeros that the embodiment of the present invention provides comprises first medium substrate 1, provides a metallic conductor sheet 9 thereon, as ground plate, the 6th medium substrate 6, be provided with a metallic conductor sheet thereon, as another reference metal ground 8, wherein excavate a rectangular channel in the middle of reference metal ground 8, be used for providing formation the first series LC resonance (L1, C1) the metallic conductor sheet 21b of the metallic conductor sheet 22 of the planar spiral inductor L1 of circuit and parallel capacity plate antenna C1 bottom crown and the second series LC resonance (L2, C2) the metallic conductor sheet 24b of the metallic conductor sheet 25 of the planar spiral inductor L2 of circuit and parallel capacity plate antenna C2 bottom crown, and reference metal ground 8 utilizes metal throuth hole to connect together with ground plate 9, realize unified with reference to ground.The 5th medium substrate 5 is provided with the metallic conductor sheet 23 of earth planar spiral inductor L3 thereon.The 7th medium substrate 7, provide thereon and form the first series LC resonance (L1, C1) the metallic conductor sheet 21a of parallel flat capacitor C 1 top crown of circuit and the second series LC resonance (L2, C2) the metallic conductor sheet 24a of parallel flat capacitor C 2 top crowns of circuit, and metallic conductor sheet 21a and metallic conductor sheet 24a capacitive coupling form coupling capacitance C3.
wherein the first medium substrate 1, the 6th medium substrate 6, the 5th medium substrate 5, on the 7th medium substrate 7 these four medium substrates, the metal of every one deck all adopts the LTCC typography to be printed on the upper surface of medium substrate, top covering metal conductor silver and thickness are 12 μ m, all the other medium substrates do not have the metallic conductor sheet on it, only has metal tray, as medium substrate 2, 3, 4, a plurality of sheet metals that consist of metal tray are provided thereon, medium substrate material used is LTCC pottery Ferro-A6S/M, dielectric constant 5.9, dielectric loss angle tangent 0.002, every a layer thickness is 84.5 μ m.
To be electrically connected to by metal throuth hole between first medium substrate 1, the 6th medium substrate 6, the 5th medium substrate 5, the 7th medium substrate 7, consider processing technology, the diameter of all metal throuth holes is all 175 μ m, and the metal micro-strip of every one deck is if the words that are connected with metal throuth hole, the position of this one deck metal level that must be connected with through hole in metal micro-strip adds that diameter is the metal tray of 250 μ m, the thickness of metal tray and the consistency of thickness of metal level are all 10 μ m.
On the 4th medium substrate 7, the top crown metallic conductor sheet 24a of the top crown metallic conductor sheet 21a of parallel flat capacitor C 1 and parallel capacity plate antenna C2 provides respectively the lead-in wire electrode, and the lead-in wire electrode is connected to corresponding outer electrode input/output port with input and output electrode separately.
Fig. 3 is actual test result and the 3 D electromagnetic field simulation result schematic diagram of the Novel belt bandpass filter of invention with two transmission zeros.Novel belt bandpass filter centre frequency of the present invention is 1.61GHz, and bandwidth is the band pass filter of 260MHz, and entire area is 3.2mm * 2.4mm * 0.6mm, and insertion loss is 0.71dB, standing wave 1.2, and filter has good Out-of-band rejection characteristic.By test result as can be known, insertion loss is compared bigger than normal a little with reflection loss a little with simulation result, centre frequency and bandwidth are unchanged, and test result shows that the low-k LTCC band pass filter that the present invention adopts the T-shaped equivalent electric circuit realization of feedback capacity to have two transmission zeros is a kind of simple and effective method.
Compared with prior art, the present invention has the following advantages:
1) add feedback capacity C3, thereby introduced two transmission zeros, realized very strong Out-of-band rejection, thus the mode that need not increase progression complete, effectively reduced the area of component number and device.
2) in forming feedback capacity C3, just utilize the first conductor surface layer that consists of 1 electric capacity to intercouple with the first conductor surface layer that consists of capacitor C 2 and form coupling capacitance C3, introduce very simply two transmission zeros.
3) circuit is simple, and frequency selectivity is good, and insertion loss is low, and superior performance has solved the performance and the area for cutting that collect band pass filter effectively.
The above is only embodiments of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (10)
1. a band pass filter, is characterized in that, comprising:
An input signal electrode P1 is by this electrode input electrical signal;
An output signal electrode P2 is by this electrode output electrical signals;
Grounding electrode P3 is connected to reference to ground by this electrode;
The first series LC resonant circuit comprises the first inductance L 1 and first capacitor C 1 of series connection, and wherein, input signal electrode P1 connects the C1 input, and the output of C1 connects the L1 input;
The second series LC resonant circuit comprises the second inductance L 2 and second capacitor C 2 of series connection, and wherein, the input of L2 connects the L1 output, and the output of L2 connects the input of C2, and the output of C2 connects output signal electrode P2;
Feedback capacity C3, the input of C3 is connected to the input of input signal electrode P1 and C1, and the output of C3 is connected to the output of output signal electrode P2 and C2;
Shunt inductance L3, the input of L3 are connected to the output of L1 and the input of L2, and the output of L3 is connected to grounding electrode P3.
2. band pass filter as claimed in claim 1, is characterized in that, described band pass filter was made of multilayer dielectric substrate stacked adding.
3. band pass filter as claimed in claim 2, is characterized in that, described band pass filter comprises first medium substrate and the undermost second medium substrate of the superiors;
The surface of first, second medium substrate is provided with the metallic conductor sheet.
4. band pass filter as claimed in claim 3, is characterized in that, the metallic conductor sheet of described first medium substrate is the top crown of capacitor C 1 and C2;
Described second medium substrate metal conductor piece is ground plate.
5. band pass filter as claimed in claim 4, is characterized in that, comprises also in described band pass filter that the surface is provided with the 3rd medium substrate of metallic conductor sheet, is arranged between first medium substrate and second medium substrate;
Described the 3rd medium substrate is with reference to metal ground, and is described with reference to metal ground realizing being electrically connected to by metal throuth hole with the metallic conductor sheet of second medium substrate.
6. band pass filter as claimed in claim 5, it is characterized in that, excavate a rectangular channel in the middle of described reference metal ground, be used for providing the metallic conductor sheet of formation L1 and the metallic conductor sheet of C1 bottom crown, and the metallic conductor sheet of the metallic conductor sheet of L2 and C2 bottom crown.
7. band pass filter as claimed in claim 4, is characterized in that, comprises also in described band pass filter that the surface is provided with the 4th medium substrate of metallic conductor sheet;
Described the 4th medium substrate is arranged between the 3rd medium substrate and second medium substrate;
Described the 4th medium substrate is provided with the metallic conductor sheet of L3 on the 3rd medium substrate one side.
8. band pass filter as described in claim 2 to 7 any one, is characterized in that, the material of described multilayer dielectric substrate is LTCC.
9. band pass filter as described in claim 2 to 7 any one, is characterized in that, is provided with metal tray in described multilayer dielectric substrate.
10. band pass filter as described in claim 1 to 7 any one, is characterized in that, described C1, C2, C3 are parallel flat electric capacity;
Described L1, L2, L3 are planar spiral inductor, and L1, and L2 is on the same layer medium substrate, and L1, L2 and L3 are on the different layers medium substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110392774XA CN103138705A (en) | 2011-12-01 | 2011-12-01 | Band-pass filter |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110392774XA CN103138705A (en) | 2011-12-01 | 2011-12-01 | Band-pass filter |
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| CN103138705A true CN103138705A (en) | 2013-06-05 |
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| CN201110392774XA Pending CN103138705A (en) | 2011-12-01 | 2011-12-01 | Band-pass filter |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106688179A (en) * | 2015-03-24 | 2017-05-17 | 株式会社村田制作所 | Lowpass filter |
| CN106788313A (en) * | 2017-02-13 | 2017-05-31 | 石家庄创天电子科技有限公司 | A kind of feed circuit of wave filter and the device based on the feed circuit |
| CN109510604A (en) * | 2018-11-13 | 2019-03-22 | 上海艾为电子技术股份有限公司 | A kind of filter circuit applied to radio-frequency front-end |
| CN112467322A (en) * | 2020-11-12 | 2021-03-09 | 南京国博电子有限公司 | IPD technology-based ultra-wideband and wide-stop-band-pass filter |
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| JP2000357932A (en) * | 1999-06-16 | 2000-12-26 | Murata Mfg Co Ltd | Band inhibition filter, reception module and portable radio equipment |
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| JP2000357932A (en) * | 1999-06-16 | 2000-12-26 | Murata Mfg Co Ltd | Band inhibition filter, reception module and portable radio equipment |
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| XING MENGJIANG,ET AL.: ""T-prototype Bandpass Filter with Two Finite Transmission Zeros"", 《11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING》 * |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106688179A (en) * | 2015-03-24 | 2017-05-17 | 株式会社村田制作所 | Lowpass filter |
| CN106688179B (en) * | 2015-03-24 | 2020-04-24 | 株式会社村田制作所 | Low-pass filter |
| CN106788313A (en) * | 2017-02-13 | 2017-05-31 | 石家庄创天电子科技有限公司 | A kind of feed circuit of wave filter and the device based on the feed circuit |
| CN106788313B (en) * | 2017-02-13 | 2023-10-10 | 石家庄创天电子科技有限公司 | Feed circuit of filter and device based on feed circuit |
| CN109510604A (en) * | 2018-11-13 | 2019-03-22 | 上海艾为电子技术股份有限公司 | A kind of filter circuit applied to radio-frequency front-end |
| CN109510604B (en) * | 2018-11-13 | 2023-10-13 | 上海艾为电子技术股份有限公司 | Filter circuit applied to radio frequency front end |
| CN112467322A (en) * | 2020-11-12 | 2021-03-09 | 南京国博电子有限公司 | IPD technology-based ultra-wideband and wide-stop-band-pass filter |
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Application publication date: 20130605 |