CN207559957U - A kind of bandpass filter - Google Patents
A kind of bandpass filter Download PDFInfo
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- CN207559957U CN207559957U CN201721898575.5U CN201721898575U CN207559957U CN 207559957 U CN207559957 U CN 207559957U CN 201721898575 U CN201721898575 U CN 201721898575U CN 207559957 U CN207559957 U CN 207559957U
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Abstract
The utility model is related to a kind of bandpass filters, filter circuit composition including multilager base plate and on substrate, the filter circuit includes multiple inductance and multiple capacitances, the capacitance uses patch capacitor, and the patch capacitor is mounted on the surface of substrate, and the inductance uses spiral inductance, the inside of multilager base plate is embedded in the spiral inductance, it is connected with each other and is connected by via between multilager base plate, be isolated between adjacent component by strip line, grounding through hole is additionally provided on the substrate.Capacitance and inductance is isolated in bandpass filter described in the utility model, eliminate the coupling effect between inductance element and capacity cell, so as to which the performance parameter for making element itself obtains more precise control, avoid the occurrence of VIC and increase the decline problem for leading to excessive parasitic capacitance and mutual inductance and element self performance with interdigital number as interdigital area increases.
Description
Technical field
The utility model is related to wave filter technology fields, and in particular to a kind of bandpass filter.
Background technology
As a kind of signal processor, the major function of wave filter is to carry out frequencyselective transmission to signal, i.e., believes in output
Retain the useful signal of particular frequency range in input signal in number, inhibit the interference signal or garbage signal of other frequencies.Closely
Nian Lai, with the rapid development of the micromation of mobile communication, satellite communication and electronic system, high-performance, high reliability, miniaturization
Have become the developing direction of microwave current/RF application, the performance, reliability and size of wave filter are proposed higher
It is required that.
Bandpass filter is one of most important device of radio-frequency front-end in wireless communication system, is being obtained more and more extensive
Application.A bandpass filter haveing excellent performance requires low logical in-band insertion loss, to improve signal-to-noise ratio；Simultaneously
It asks and inhibits with higher stopband, to improve message capacity and avoid the interference between adjacent channel；In addition, system compact becomes
Gesture also requires designed wave filter that must possess sufficiently small size.
The miniaturization technology of wave filter mainly has at present：Simplify circuit by optimizing topological structure, to sacrifice element
Component size under the premise of energy reduces, however the miniaturization space that these technologies are brought is limited.Low-temperature co-fired ceramics
（LTCC）Technology use multi-layer ceramics technology, passive element can be built in inside medium substrate, at the same can also by it is passive/
Active component is mounted on substrate surface and passive/active integrated function module is made.It, can be with based on the stack technology of LTCC techniques
Realize the three-dimensionally integrated of capacitive/inductive element.The wave filter being processed into using LTCC techniques has that size is small, light-weight, property
Can be excellent, reliability is high, batch production performance consistency is good and inexpensive many advantages, such as.Existing other forms filter size
It is all larger or cannot be balanced well in size and performance.Wave filter based on LTCC techniques is realizing miniaturization condition
While performance also obtain good guarantee.
Mini filter based on LTCC techniques appears in the newspapers repeatly in recent years, and wherein combline bandpass filter is because of its structure
Compact and be widely used in microwave frequency band, it based on resonant element is 1/4 Wavelength distribution strip line that design principle, which is,.Due to penetrating
The operation wavelength of frequency is long, using distributed constant circuit form realize filter size it is generally bigger, and use collect Headquarters of the General Staff
Number element can greatly reduce the size of wave filter.Especially in the application of low-k LTCC substrates, wave filter it is small
Typeization design is more challenging, therefore low band filter carrys out structure usually using big lumped capacity and big lumped inductance
Into resonator.Reduce the size of wave filter while realizing bulky capacitor, at present usually using vertical inter-digital type capacitor
（Vertically Inter-digital Capacitor, VIC）To realize.The increase of VIC values is mainly interdigital by increasing
Area or interdigital quantity.However, the size of wave filter can be increased, while embedded element can be caused mutual by increasing interdigital area
It is close, so as to generate excessive parasitic capacitance and mutual inductance.Increase interdigital quantity and be easy to cause the reduction of capacitance self-resonant frequency, make
Available band is obtained to reduce, and these can all influence the performance of element itself and the accuracy of circuit design.
Utility model content
The purpose of this utility model is to provide a kind of bandpass filters, and capacitance and inductance are isolated, and eliminate
Coupling effect between inductance element and capacity cell so as to which the performance parameter for making element itself obtains more precise control, is kept away
Exempt to occur VIC as interdigital area increases and interdigital number increases and leads to excessive parasitic capacitance and mutual inductance and element itself property
The decline problem of energy.
To achieve the above object, the utility model employs following technical scheme：
A kind of bandpass filter, the filter circuit composition including multilager base plate and on substrate, the filter circuit packet
Multiple inductance and multiple capacitances are included, the capacitance uses patch capacitor, and the patch capacitor is mounted on the surface of substrate, the electricity
Sense uses spiral inductance, and the inside of multilager base plate is embedded in the spiral inductance, is connected with each other between multilager base plate by via
It is connected, is isolated between adjacent component by strip line, grounding through hole is additionally provided on the substrate.
Further, the filter circuit is made of five inductance and 13 capacitances, and one end of the first inductance passes through first
Capacity earth, the other end of the first inductance pass sequentially through the second capacitance, third capacitance, the 4th capacitance, the 5th capacitance and the second electricity
One end connection of sense, for the other end of the second inductance through the 12nd capacity earth, the 6th capacitance is connected in parallel on the both ends of the second inductance, the
13 capacitances are connected in parallel on the both ends of the third and fourth capacitance；
One end of 7th capacitance is connected to the node between the first inductance and the second capacitance, another termination of the 7th capacitance
Ground, one end after third inductance is in parallel with the 8th capacitance is connected to the node between the second capacitance and third capacitance, after in parallel
The other end is grounded, and one end after the 4th inductance is in parallel with the 9th capacitance is connected to the node between third capacitance and the 4th capacitance,
Other end ground connection after parallel connection, one end after the 5th inductance is in parallel with the tenth capacitance is connected between the 4th capacitance and the 5th capacitance
Node, it is in parallel after other end ground connection；One end of 11st capacitance is connected to the node between the 5th capacitance and the second inductance,
The other end ground connection of 11st capacitance.
Further, the substrate is made of ceramic chips sintering.
Further, by outer two circle of spiral inductance, its via coordinated connects the adjacent substrate, on every laminar substrate
The electric current direction of rotation of inductance is consistent.
Further, the inductance includes square and rectangle.
As shown from the above technical solution, the utility model by select the high Q sheet capacitors of Surface Mount replace in bury VIC capacitances with
And improved multilayer spiral inductance structure is used, while realizing wave filter miniaturization, improving the Q values of inductance also has centainly
The raising of degree.It buries inside and adds a kind of shielding construction between inductance coil, effectively improve the performance of wave filter.This practicality
It is novel that fundamentally capacitance and inductance are isolated, the coupling effect between inductance element and capacity cell is eliminated, from
And the performance parameter of element itself is made to obtain more precise control.In addition, realize that the high low-impedance line of passive element passes through
The thin conductor slurry sintering that silk-screen printing forms is made, and used conductor paste is not ideal good conductor, and there are one
Fixed resistance loss.Thus, the reduction of embedded element number can reduce the loss of entire circuit, while decrease LTCC processing
Influence of the error to circuit design.
Description of the drawings
Fig. 1 is the structure diagram of the utility model；
Fig. 2 is the circuit diagram of the utility model filter circuit；
Fig. 3 is the wave filter simulation result of the utility model；
Fig. 4 is the utility model modified and the Electromagnetic Simulation inductance value of conventional type multi-layer helical inductance and Q values；
Fig. 5 is plan view, Electromagnetic Simulation inductance value and the Q values of the multi-layer helical inductance of the utility model；
Fig. 6 is the test result figure of the utility model wave filter；
Fig. 7 is the plan view of the utility model rectangle spiral inductor；
Fig. 8 is the plan view of the utility model square spiral inductance；
Fig. 9 is the simulation result figure of prior art median filter；
Figure 10 is the simulation result figure of the utility model wave filter.
Specific embodiment
The utility model is described further below in conjunction with the accompanying drawings：
As shown in Figure 1, the bandpass filter of the present embodiment, the filter circuit group including multilager base plate 1 and on substrate 1
Into the substrate is made of ceramic chips sintering；As shown in Fig. 2, the filter circuit is made of five 4 and 13 capacitances 5 of inductance, the
One end of one inductance L1 is grounded by the first capacitance C1, and the other end of the first inductance L1 passes sequentially through the second capacitance C2, third electricity
Hold C3, the 4th capacitance C4, the 5th capacitance C5 to connect with one end of the second inductance L2, the other end of the second inductance L2 is through the 12nd electricity
Hold C12 ground connection, the 6th capacitance C6 is connected in parallel on the both ends of the second inductance L2, and the 13rd capacitance C10 is connected in parallel on third capacitance C3 and the
The connecting pin of the both ends of four capacitance C4, the second inductance L2 and the 12nd capacitance C12 are output terminal 2, and the first capacitance C1 and first is electric
The connecting pin for feeling L1 is input terminal 3；
One end of 7th capacitance C7 is connected to the node between the first inductance L1 and the second capacitance C2, and the 7th capacitance C7's is another
One end is grounded, and one end after third inductance L3 is in parallel with the 8th capacitance C8 is connected between the second capacitance C2 and third capacitance C3
Node, it is in parallel after other end ground connection, one end after the 4th inductance C4 is in parallel with the 9th capacitance C9 be connected to third capacitance C3 and
Node between 4th capacitance C4, the other end ground connection after parallel connection, one end after the 5th inductance L5 is in parallel with the tenth capacitance C10 connects
The node being connected between the 4th capacitance C4 and the 5th capacitance C5, the other end ground connection after parallel connection；One end of 11st capacitance C11 connects
The node being connected between the 5th capacitance C5 and the second inductance L2, the other end ground connection of the 11st capacitance C11.
As shown in Figure 1, being embedded in the inside of multilager base plate in spiral inductance L1~L5, pass through via phase between multilager base plate 1
Connect conducting, is isolated between adjacent component by strip line 11, is additionally provided with grounding through hole 12, aforesaid substrate on substrate 1
It is made of ceramic chips sintering.Adjacent substrate is connected by the via 13 of its cooperation of outer two circle of spiral inductance, on every laminar substrate
Connection between inductance is interconnected by vertical vias 13, and every layer of inductance has only used outer two circle of spiral inductance, each layer electric current
Direction of rotation is consistent.Each layer of conduction band, which only revolves to turn around, will pass through vertical vias and is connected to adjacent one layer, it is all in（Outside）Circle is equal
It is rotated again to after the completion of rotation outer（It is interior）Circle.Current direction is consistent in the utility model only levels conduction band, and two sections of same layer
The current direction of conduction band is also consistent, and more positive mutual inductances is produced, so as to increase inductance value.
When the utility model uses conventional type multi-layer helical induction structure 130MHz, the inductance value and Q values of inductance are respectively
28nH and 132, inductance planar dimension are 2.6mm*2.6mm.And when using improved multilayer spiral inductance structure 130MHz, inductance
Inductance value and Q values be respectively 39nH and 140, inductance planar dimension is 2.4mm*2.4mm.Therefore, using improved multilayer spiral shell
Rotation induction structure realizes the increase of inductance value, and inductor size reduces 8% or so, while the inductance Q in the range of available band
Value also has about 5% raising.Conventional type and the inductance value of improved multilayer spiral inductance structure Electromagnetic Simulation and Q values such as Fig. 4 institutes
Show.
Inductance L1, L2 of the present embodiment use the high impedance line of 0.25mm wide using improved multilayer helical structure
To realize.Inductance L1 is designed to square, as shown in figure 8, to reduce Optimal Parameters；Inductance L2 designs are rectangular, such as Fig. 7 institutes
Show, to reduce the size of entire wave filter.When frequency is 130MHz, the inductance value of L1, L2 is respectively 39nH and 50nH, Q values
Respectively 140 and 176.The plan view of L1 and L2 and the inductance value of Electromagnetic Simulation and Q values are as shown in Figure 5.
The utility model intersects strip line and side ground through-hole using substrate is bilevel, passes through between strip line
Vertical vias connects.Effectively weaken undesirable mutual inductance.Fig. 9 is the simulation result figure of existing wave filter, and Figure 10 is this practicality
The simulation result figure of Novel Filter, in terms of simulation result, the low side zero of the wave filter simulation curve of the prior art disappears, point
Analysis is caused by the reason is that bury the mutual inductance generated between inductance in adjacent.And the wave filter low side zero of the utility model is reappeared, filtering
The Out-of-band rejection of device is also improved.
The utility model is directed to the centre frequency of 130MHz, it is proposed that a kind of miniaturization lumped parameter based on LTCC techniques
Bandpass filter.It mounts high Q sheet arrangeds capacitance by substrate surface and designs multi-layer helical inductance using high impedance line and realize
The miniaturization of wave filter, high-performance.By being improved to conventional type multi-layer helical induction structure, realize inductance value increase and
The reduction of inductor size, while inductance Q value is also improved to some extent.It is tied by addition shielding between burying inductance coil inside
Structure effectively attenuates undesirable inductance, improves the performance of wave filter.Wave filter overall dimensions are greatly reduced, are accorded with
The characteristics of closing mini filter.
Embodiment described above is only that the preferred embodiment of the utility model is described, not to this practicality
Novel range is defined, and under the premise of the spirit of the design of the utility model is not departed from, those of ordinary skill in the art are to this
The various modifications and improvement that the technical solution of utility model is made should all fall into the protection that the utility model claims book determines
In the range of.
Claims (5)
1. a kind of bandpass filter, it is characterised in that：Filter circuit composition including multilager base plate and on substrate, the filter
Wave circuit includes multiple inductance and multiple capacitances, and the capacitance uses patch capacitor, and the patch capacitor is mounted on the table of substrate
Face, the inductance use spiral inductance, and the inside of multilager base plate is embedded in the spiral inductance, passes through via between multilager base plate
Conducting is connected with each other, is isolated between adjacent component by strip line, grounding through hole is additionally provided on the substrate.
2. bandpass filter according to claim 1, it is characterised in that：The filter circuit is by five inductance and 13 electricity
Hold composition, by the first capacity earth, the other end of the first inductance passes sequentially through the second capacitance, third electricity for one end of the first inductance
Appearance, the 4th capacitance, the 5th capacitance are connect with one end of the second inductance, and the other end of the second inductance is through the 12nd capacity earth, and
Six capacitances are connected in parallel on the both ends of the second inductance, and the 13rd capacitance is connected in parallel on the both ends of the third and fourth capacitance；
One end of 7th capacitance is connected to the node between the first inductance and the second capacitance, and the other end of the 7th capacitance is grounded, the
One end after three inductance are in parallel with the 8th capacitance is connected to the node between the second capacitance and third capacitance, the other end after parallel connection
Ground connection, one end after the 4th inductance is in parallel with the 9th capacitance is connected to the node between third capacitance and the 4th capacitance, after in parallel
The other end ground connection, one end after the 5th inductance is in parallel with the tenth capacitance is connected to the section between the 4th capacitance and the 5th capacitance
Point, the other end ground connection after parallel connection；One end of 11st capacitance is connected to the node between the 5th capacitance and the second inductance, and the tenth
The other end ground connection of one capacitance.
3. bandpass filter according to claim 1, it is characterised in that：The substrate is made of ceramic chips sintering.
4. bandpass filter according to claim 1, it is characterised in that：The adjacent substrate pass through spiral inductance outer two
The via for enclosing its cooperation connects, and the electric current direction of rotation of inductance is consistent on every laminar substrate.
5. bandpass filter according to claim 1, it is characterised in that：The inductance includes square and rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721898575.5U CN207559957U (en) | 2017-12-29 | 2017-12-29 | A kind of bandpass filter |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721898575.5U CN207559957U (en) | 2017-12-29 | 2017-12-29 | A kind of bandpass filter |
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| CN207559957U true CN207559957U (en) | 2018-06-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107947752A (en) * | 2017-12-29 | 2018-04-20 | 中国电子科技集团公司第四十三研究所 | A kind of bandpass filter |
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- 2017-12-29 CN CN201721898575.5U patent/CN207559957U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107947752A (en) * | 2017-12-29 | 2018-04-20 | 中国电子科技集团公司第四十三研究所 | A kind of bandpass filter |
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