CN211127739U

CN211127739U - Laminated sheet type low-pass filter

Info

Publication number: CN211127739U
Application number: CN201922399978.0U
Authority: CN
Inventors: 卓群飞; 刘月泳; 付迎华; 梁启新; 马龙; 韦鹏
Original assignee: Shenzhen Microgate Technology Co ltd
Current assignee: Shenzhen Microgate Technology Co ltd
Priority date: 2019-12-27
Filing date: 2019-12-27
Publication date: 2020-07-28
Anticipated expiration: 2029-12-27

Abstract

The utility model provides a stromatolite formula low pass filter, the utility model provides a novel miniaturized stromatolite formula low pass filter, this low pass filter adopt lumped parameter design structure, by the low pass filter prototype plus transmit zero point and form, this kind of low pass filter adopts L TCC technique, then burns low temperature through about 900 ℃ and forms altogether, the beneficial effects of the utility model are that the utility model discloses use L TCC (low temperature burns pottery altogether) technique as the basis, adopt lumped parameter model design to realize stromatolite formula low pass filter's special electrical property requirement, the utility model discloses effectively realized low pass filter's characteristic, and had advantages such as low-loss, high suppression, high reliability, low-cost and be suitable for large-scale production, still adapted to new electronic component in addition and integrated, miniaturized development trend.

Description

Laminated sheet type low-pass filter

Technical Field

The invention discloses a novel miniaturized laminated low-pass filter which can be used in satellite televisions, tablet computers and other various communication devices.

Background

The low Temperature Co-fired Ceramic (L w Temperature Co-fired Ceramic, L TCC) is a high density packaging technology with a wide application range, and has excellent electronic, mechanical and thermal characteristics which become the first choice for integrating and modularizing future electronic elements, and is generally applied to multi-layer Chip Module (MICMI) design, L TCC technology is used as a base for designing and producing radio frequency microwave elements and modules, including balun filters, multiplexers, duplexers, antennas, couplers, balun, receiving front end modules, antenna switch modules and the like.

In the communication product design, can adopt the discrete low-pass filter to process the input signal of different frequency bands, the chip low-pass filter made by adopting L TCC technology has the advantages of high reliability, low insertion loss, high selectivity, small volume, light weight, easy integration, low cost and the like, is suitable for large-scale production, and therefore, the application is very wide.

SUMMERY OF THE UTILITY MODEL

The invention provides a novel miniaturized laminated low-pass filter, which adopts a lumped parameter design structure and is formed by adding a transmission zero point outside a low-pass filter prototype, wherein the low-pass filter is formed by adopting L TCC technology and then co-firing at a low temperature of about 900 ℃.

The technical scheme adopted by the invention for solving the technical problems is as follows: the utility model provides a novel miniaturized stromatolite piece formula low pass filter, includes the base member, sets up the terminal and the circuit layer of setting in the base member outside the base member, the inside circuit layer of base member be laminated structure, be specifically exactly:

a laminated low-pass filter comprises a substrate, an input end P1 arranged outside the substrate, an output end P2, a grounding end P3, a grounding end P4 and a circuit layer arranged inside the substrate, wherein the circuit layer comprises four layers:

a first layer: a metal plane conductor is printed on the ceramic dielectric substrate and is respectively a first layer first internal endpoint connected with a grounding terminal P3 and a first layer second internal endpoint connected with a grounding terminal P4;

a second layer: a metal plane conductor is printed on the ceramic dielectric substrate and respectively comprises a second layer of first capacitor substrate, a second layer of second capacitor substrate, a second layer of first internal endpoint and a second layer of second internal endpoint, wherein the second layer of first internal endpoint is connected with a grounding terminal P3, and the second layer of second internal endpoint is connected with a grounding terminal P3;

and a third layer: a metal plane conductor is printed on the ceramic dielectric substrate and is respectively a third layer of first metal coil, a third layer of second metal coil, a third layer of third metal coil, a third layer of first capacitor substrate, a third layer of second capacitor substrate and a third layer of third capacitor substrate, and a third layer of first internal endpoint, a third layer of second internal endpoint and a third layer of third internal endpoint are respectively connected to the first point column, the second point column and the third point column;

a fourth layer: three mutually insulated metal plane conductors are printed on the ceramic dielectric substrate, namely a fourth layer of first capacitor substrate, a fourth layer of second capacitor substrate and a fourth layer of third capacitor substrate, wherein a fourth layer of first internal end point, a fourth layer of second internal end point and a fourth layer of third internal end point are respectively connected to the first point column, the second point column and the third point column, and a fourth layer of fourth internal end point and a fourth layer of fifth internal end point are respectively connected with the input end P1 and the output end P2 of the port.

The invention has the advantages that the invention realizes the special electrical property requirement of the laminated low-pass filter by adopting the lumped parameter model design on the basis of L TCC (low temperature co-fired ceramic) technology, effectively realizes the characteristics of the low-pass filter, has the advantages of low loss, high inhibition, high reliability, low cost, suitability for large-scale production and the like, and is suitable for the development trend of integration and miniaturization of new electronic elements.

The invention will be further described with reference to the accompanying drawings and specific embodiments.

Drawings

FIG. 1 is a schematic diagram of an equivalent circuit of a novel stacked low-pass filter according to the present invention;

FIG. 2 is a perspective view of the novel stacked low-pass filter according to the present invention;

FIG. 3 is a schematic diagram of the internal structure of the novel stacked low-pass filter according to the present invention;

FIG. 4 is a schematic diagram of a first layer circuit plan structure according to the present invention;

FIG. 5 is a schematic diagram of a second layer circuit structure according to the present invention;

FIG. 6 is a schematic diagram of a third layer circuit plan structure according to the present invention;

FIG. 7 is a schematic view of a point-pillar connection plane between the third layer and the fourth layer according to the present invention;

FIG. 8 is a schematic diagram of a fourth layer circuit layout according to the present invention.

In the figure, 1-a first layer of circuit plane structure, 2-a second layer of circuit plane structure, 3-a third layer of circuit plane structure, 4-a fourth layer of circuit plane structure, 6-a connecting point post between a capacitor substrate 4-C1 and a metal coil 3-L1, 7-a connecting point post between a capacitor substrate 3-C4 and a capacitor substrate 4-C2, and 8-a connecting point post between a capacitor substrate 4-C3 and a metal coil 3-L3.

Detailed Description

The invention will be further explained and explained with reference to the drawings, in which:

the signal enters from a port L0 to be output from a port L1, the low-pass filter is composed of inductors L1, L2 and L3 and capacitors C1, C2, C3, C4 and C5, L1 and C1 are in parallel resonance to form a first transmission zero in a stop band of the low-pass filter, L2 and C2 are in parallel resonance to form a second transmission zero in the stop band of the low-pass filter, L3 and C3 are in parallel resonance to form a third transmission zero in the stop band of the low-pass filter, so that the stop band attenuation of the low-pass filter is effectively improved, the common end of C1 and C2 is connected with the common end of L1 and L2 through C4 to the ground terminal, and the common end of C2 and C3 is connected with the common end of L2 and L3 through C5 to the ground terminal.

Fig. 2 is an external appearance structure of the stacked-layer low-pass filter, in which P1 is an input terminal of a signal, P2 is an output terminal of the signal, and P3 and P4 are ground ports.

The internal structure of the laminated low-pass filter is shown in fig. 3, and the circuit structure is distributed in the ceramic substrate. Circuit structure one has 4 layers in total:

in the first layer, a metal plane conductor is printed on a ceramic dielectric substrate, and the inner end (1 a) of the metal plane conductor is connected with a grounding port P3, and the inner end (1 b) of the metal plane conductor is connected with a grounding port P4.

And a second layer, wherein a metal plane conductor is printed on the ceramic dielectric substrate and is respectively a capacitor substrate (2-c 4) and a capacitor substrate (2-c 5), and the inner end point (2 a) is connected with the port P3, and the inner end point (2 b) is connected with the port P3.

And a metal plane conductor is printed on the ceramic dielectric substrate and is respectively an inductance metal coil (3-L1), an inductance metal coil (3-L2) and an inductance metal coil (3-L3), a capacitance substrate (3-C1), a capacitance substrate (3-C2) and a capacitance substrate (3-C3), and the internal end point (3 a), the internal end point (3 b) and the internal end point (3C) are respectively connected with the point post (6), the point post (7) and the point post (8).

And a fourth layer, wherein three mutually insulated metal plane conductors are printed on the ceramic dielectric substrate and are respectively a capacitor substrate (4-C1), a capacitor substrate (4-C2) and a capacitor substrate (4-C3), an internal end point (4 b), an internal end point (4C) and an internal end point (4 d) are respectively connected with the point post (6), the point post (7) and the point post (8), and an internal end point (4 a) and an internal end point (4 e) are respectively connected with the ports P1 and P2.

The inductor (L1) in the circuit is formed by connecting metal coils (3-L1), the inductor (L2) in the circuit is formed by connecting metal coils (3-L2), the inductor (L3) in the circuit is formed by connecting metal coils (3-L3), the capacitor (C1) in the circuit is formed by connecting a capacitor substrate (3-C1) and a capacitor substrate (4-C1), the capacitor (C2) in the circuit is formed by connecting a capacitor substrate (3-C2) and a capacitor substrate (4-C2), the capacitor (C3) in the circuit is formed by connecting a capacitor substrate (3-C3) and a capacitor substrate (4-C3), the capacitor (C4) in the circuit is formed by connecting a capacitor substrate (2-C4) and a capacitor substrate (3-C4), and the capacitor (C5) in the circuit is formed by connecting a capacitor substrate (2-C5) and a capacitor substrate (3-C5).

Claims

1. The laminated low-pass filter is characterized by comprising a base body, an input end P1, an output end P2, a grounding end P3 and a grounding end P4 which are arranged outside the base body, and a circuit layer arranged inside the base body, wherein the circuit layer comprises four layers:

a first layer: a metal plane conductor is printed on the ceramic dielectric substrate, and is respectively a first layer first inner endpoint 1a connected with a grounding terminal P3 and a first layer second inner endpoint 1b connected with a grounding terminal P4;

a second layer: a metal plane conductor is printed on the ceramic dielectric substrate and is respectively a second layer of first capacitor substrate 2-c4, a second layer of second capacitor substrate 2-c5, a second layer of first internal endpoint 2a and a second layer of second internal endpoint 2b, wherein the second layer of first internal endpoint 2a is connected with a grounding end P3, and the second layer of second internal endpoint 2b is connected with a grounding end P3;

a metal plane conductor is printed on the ceramic dielectric substrate and is respectively a third layer of a first metal coil 3-L1, a third layer of a second metal coil 3-L2, a third layer of a third metal coil 3-L3, a third layer of a first capacitor substrate 3-C1, a third layer of a second capacitor substrate 3-C2 and a third layer of a third capacitor substrate 3-C3, and a third layer of a first internal end point 3a, a third layer of a second internal end point 3b and a third layer of a third internal end point 3C are respectively connected to the first point column 6, the second point column 7 and the third point column 8;

a fourth layer: three mutually insulated metal plane conductors are printed on the ceramic dielectric substrate, namely a fourth layer of first capacitor substrate 4-C1, a fourth layer of second capacitor substrate 4-C2 and a fourth layer of third capacitor substrate 4-C3, wherein a fourth layer of first internal end point 4b, a fourth layer of second internal end point 4C and a fourth layer of third internal end point 4d are respectively connected to the first point post 6, the second point post 7 and the third point post 8, and a fourth layer of fourth internal end point 4a and a fourth layer of fifth internal end point 4e are respectively connected with the input end P1 and the output end P2 of the port.