CN103985946B - A kind of miniature parallel resonator - Google Patents

A kind of miniature parallel resonator Download PDF

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Publication number
CN103985946B
CN103985946B CN201410196575.5A CN201410196575A CN103985946B CN 103985946 B CN103985946 B CN 103985946B CN 201410196575 A CN201410196575 A CN 201410196575A CN 103985946 B CN103985946 B CN 103985946B
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China
Prior art keywords
parallel
resonator
electric capacity
resonant inductor
miniature
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Expired - Fee Related
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CN201410196575.5A
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Chinese (zh)
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CN103985946A (en
Inventor
戴永胜
陈相治
李雁
朱丹
罗鸣
周围
周衍芳
张超
潘航
李永帅
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Nanjing University of Science and Technology
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Nanjing University of Science and Technology
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Abstract

The invention discloses a kind of miniature parallel resonator of new construction, including being applicable to surface-pasted input/output interface, realizing inductance and the parallel connection of electric capacity up-down structure in lump mode, said structure all uses multilamellar LTCC Technology to realize.Parallel resonator structure in the present invention solves not enough and mutually crosstalk the problem of circuit model placement space under complicated circuit topology well, significantly reduces than the resonator dimensions under lower frequency and the space occupied.Volume, electrical property, temperature stability and reliability are had occasion and the corresponding system of rigors by this resonator be applicable to the communication of corresponding microwave frequency band, digital radar, radio communication handheld terminal etc., are particularly well-suited to design the multiple microwave device such as band filter and band elimination filter of extremely low frequency range.

Description

A kind of miniature parallel resonator
Technical field
The present invention relates to parallel resonator, particularly a kind of miniature parallel resonator of new construction.
Background technology
In recent years, the developing rapidly of miniaturization along with mobile communication, satellite communication and Defensive Avionics System, high-performance, low cost and miniaturization have become as the developing direction of microwave current/RF application, all have higher requirement performance, size, reliability and the cost of microwave filter.In the systems such as modern wireless communication systems and microwave and millimeter wave communication, radar, need to use multiple microwave passive component, such as wave filter, and at microwave filter, especially in the application of low-frequency range, the inductance capacitance value used required for resonance is bigger, if so using the mode of traditional LC to be taken up space very greatly, and LTCC parallel resonator can be used to realize being substantially reduced the volume of resonant element to realize resonant element.
LTCC is a kind of Electronic Encapsulating Technology, uses multi-layer ceramics technology, it is possible to be built in by passive element inside medium substrate, and active component can also be mounted on substrate surface makes passive/active integrated functional module simultaneously.LTCC technology all shows many merits at cost, integration packaging, wiring live width and distance between centers of tracks, low impedance metal, design diversity and the aspect such as motility and high frequency performance, it has also become the mainstream technology of passive integration.It has high q-factor, it is simple to embedded passive device, and thermal diffusivity is good, and reliability is high, high temperature resistant, rushes the advantages such as shake, utilizes LTCC technology, can well process size little, and precision is high, and tight type is good, and little microwave device is lost.Owing to LTCC technology has the integrated advantage of 3 D stereo, it is widely used for manufacturing various microwave passive components at microwave frequency band, it is achieved passive element highly integrated.Stack technology based on LTCC technique, can realize three-dimensionally integrated, so that various miniature microwave devices have, size is little, lightweight, performance is excellent, reliability is high, performance concordance is good and the plurality of advantages such as low cost in batch production, utilize its three-dimensionally integrated construction features, it is possible to achieve the parallel resonator of new structure.
Summary of the invention
It is an object of the invention to provide the parallel resonator of the new structure that a kind of volume is little, lightweight, reliability is high, simple in construction, temperature performance are stable.
The technical scheme realizing the object of the invention is: include surface-pasted 50 ohmage input port P1, parallel resonant inductor L, parallel resonance electric capacity C, surface-pasted 50 ohmage output port P2;In this parallel resonator, input port P1 connects with parallel resonant inductor L, and parallel resonance electric capacity C is in parallel with parallel resonant inductor L, and its position is placed on below parallel resonant inductor, and whole parallel resonator by metal column ground connection or is connected with output port P2.Output port P2 and input port P1 or parallel resonance electric capacity C connects.
Compared with prior art, owing to the present invention uses low-loss low-temperature co-burning ceramic material and 3 D stereo integrated, the remarkable advantage brought is: (1) volume is little, lightweight, reliability is high;(2) circuit realiration simple in construction, can realize producing in enormous quantities;(3) low cost;(4) easy to install and use, it is possible to use full-automatic chip mounter is installed and welding.
Accompanying drawing explanation
Fig. 1 is profile and the internal structure schematic diagram that a kind of new construction of the present invention miniature parallel resonator earth realizes bandpass structures.
Fig. 2 is profile and the internal structure schematic diagram that a kind of new construction of the present invention miniature parallel resonator series connection outfan realizes band resistance structure.
Fig. 3 is the amplitude-versus-frequency curve that a kind of new construction of the present invention miniature parallel resonator earth realizes the outfan of bandpass structures.
Fig. 4 is the amplitude-versus-frequency curve that a kind of new construction of the present invention miniature parallel resonator series connection outfan realizes the outfan of band resistance structure.
Detailed description of the invention
Below in conjunction with the accompanying drawings the present invention is described in further detail.
In conjunction with Fig. 1, Fig. 2, the miniature parallel resonator of one new construction of the present invention, this parallel resonator includes surface-pasted 50 ohmage input port P1, parallel resonant inductor L, parallel resonance electric capacity C, surface-pasted 50 ohmage output port P2;In this parallel resonator, input port P1 connects with parallel resonant inductor L, and parallel resonance electric capacity C is in parallel with parallel resonant inductor L, and its position is placed on below parallel resonant inductor, and whole parallel resonator by metal column ground connection or is connected with output port P2.Output port P2 and input port P1 or parallel resonance electric capacity C connects.
In conjunction with Fig. 1, Fig. 2, the miniature parallel resonator of one new construction of the present invention, all uses multilamellar LTCC technique to realize including surface-pasted 50 ohmage input port P1, parallel resonant inductor L, parallel resonance electric capacity C, surface-pasted 50 ohmage output port P2 and earth terminal.Wherein parallel resonant inductor L, parallel resonance electric capacity C all use multilayer laminate constructions.
In conjunction with Fig. 1, the miniature parallel resonator of one new construction of the present invention, this parallel resonator includes surface-pasted 50 ohmage input port P1, parallel resonant inductor L, parallel resonance electric capacity C, surface-pasted 50 ohmage output port P2;This parallel resonator is upper and lower displacement structure, input port P1 connects with parallel resonant inductor L, parallel resonance electric capacity C is in parallel with parallel resonant inductor L, its position is placed on below parallel resonant inductor, parallel resonance unit passes through earthing rod earth, output port P2 connects with input port P1, it is achieved have the resonator of band-pass function.
In conjunction with Fig. 2, the miniature parallel resonator of one new construction of the present invention, this parallel resonator includes surface-pasted 50 ohmage input port P1, parallel resonant inductor L, parallel resonance electric capacity C, surface-pasted 50 ohmage output port P2;This parallel resonator is upper and lower displacement structure, input port P1 connects with parallel resonant inductor L, and parallel resonance electric capacity C is in parallel with parallel resonant inductor L, and its position is placed on below parallel resonant inductor, output port P2 connects with parallel resonance electric capacity C, it is achieved have the resonator of belt-resistance function.
The miniature parallel resonator of one new construction of the present invention, owing to being employing multilamellar LTCC technique realization, its low-temperature co-burning ceramic material and metallic pattern sinter at a temperature of about 900 DEG C and form, so having extreme high reliability and temperature stability, owing to structure uses, 3 D stereo is integrated to be grounded and encapsulates with multilayer folding structure and outer surface metallic shield, so that volume significantly reduces.Its resonant frequency is at about 40MHz, and compared with other existing resonators, its frequency range is lower.

Claims (3)

1. a miniature parallel resonator, it is characterised in that: include surface-pasted 50 ohmage input ports (P1), parallel resonant inductor (L), parallel resonance electric capacity (C), surface-pasted 50 ohmage output ports (P2);In this parallel resonator, input port (P1) is connected with parallel resonant inductor (L), parallel resonance electric capacity (C) is in parallel with parallel resonant inductor (L), its position is placed on parallel resonant inductor (L) lower section, and the parallel resonance unit being made up of parallel resonant inductor (L) and parallel resonance electric capacity (C) is connected with output port (P2) by metal column ground connection or parallel resonance unit;Output port (P2) is connected with input port (P1) or parallel resonance electric capacity (C).
Miniature parallel resonator the most according to claim 1, it is characterized in that: surface-pasted 50 ohmage input ports (P1), parallel resonant inductor (L), parallel resonance electric capacity (C), surface-pasted 50 ohmage output ports (P2) and earth terminal all use multilamellar LTCC technique to realize, and wherein parallel resonant inductor (L), parallel resonance electric capacity (C) all use multilayer laminate constructions to realize.
Miniature parallel resonator the most according to claim 1, it is characterized in that: the parallel resonance unit being made up of parallel resonant inductor (L) and parallel resonance electric capacity (C), can ground connection and series connection output port two ways realize carrying logical and band two kinds of resonators of resistance in parallel.
CN201410196575.5A 2014-05-09 2014-05-09 A kind of miniature parallel resonator Expired - Fee Related CN103985946B (en)

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Application Number Priority Date Filing Date Title
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CN103985946B true CN103985946B (en) 2017-01-04

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10607777B2 (en) * 2017-02-06 2020-03-31 Avx Corporation Integrated capacitor filter and integrated capacitor filter with varistor function
CN113556094B (en) * 2021-07-28 2023-12-12 南京邮电大学 Miniaturized resonator with capacitor and inductor nested structure

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JP2008017243A (en) * 2006-07-07 2008-01-24 Tdk Corp Electronic component
CN201243075Y (en) * 2008-03-28 2009-05-20 深圳市麦捷微电子科技股份有限公司 Lamination sheet type microwave band-pass filter
TW201036245A (en) * 2009-03-30 2010-10-01 Univ Nat Sun Yat Sen Stacked LC resonator and bandpass filter of using the same

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Inventor after: Dai Yongsheng

Inventor after: Li Yongshuai

Inventor after: Chen Xiangzhi

Inventor after: Li Yan

Inventor after: Zhu Dan

Inventor after: Luo Ming

Inventor after: Zhou Wei

Inventor after: Zhou Yanfang

Inventor after: Zhang Chao

Inventor after: Pan Hang

Inventor before: Chen Xiangzhi

Inventor before: Li Yongshuai

Inventor before: Li Yan

Inventor before: Zhu Dan

Inventor before: Luo Ming

Inventor before: Dai Yongsheng

Inventor before: Zhou Wei

Inventor before: Zhou Yanfang

Inventor before: Zhang Chao

Inventor before: Pan Hang

COR Change of bibliographic data

Free format text: CORRECT: INVENTOR; FROM: CHEN XIANGZHI LI YAN ZHU DAN LUO MING DAI YONGSHENG ZHOU WEI ZHOU YANFANG ZHANG CHAO PAN HANG LI YONGSHUAI TO: DAI YONGSHENG CHEN XIANGZHI LI YAN ZHU DAN LUO MING ZHOU WEI ZHOU YANFANG ZHANG CHAO PAN HANG LI YONGSHUAI

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Granted publication date: 20170104

Termination date: 20200509