CN104362413A - High-performance VHF (very high frequency)-band band-pass filter - Google Patents
High-performance VHF (very high frequency)-band band-pass filter Download PDFInfo
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Abstract
The invention discloses a high-performance VHF (very high frequency)-band band-pass filter. The prototype of a deformed Chebyshew band-pass filter with controllable transmission zeros is adopted, equivalent lumped components are realized through an LTCC (low-temperature co-fired ceramic) multilayer structure, the band-pass filter can be greatly downsized under the condition of same technical indicators; meanwhile, two four-stage filter bodies of the band-pass filter are cascaded, restraint effect outside the band can be effectively increased, and requirements of insertion loss of the band-pass filter on a passing band and a stop band are well met. In addition, the high-performance VHF-band band-pass filter is low in cost, favorable for mass production, good in frequency-selection characteristic and temperature performance and the like, thereby being widely applicable to a radio-frequency wireless communication system.
Description
Technical field
The present invention relates to a kind of filter, particularly a kind of VHF wave band high-performance band-pass filter device.
Background technology
In recent years, along with the developing rapidly of microminiaturization of mobile communication, satellite communication and Defensive Avionics System, high-performance, low cost and miniaturization have become the developing direction of current RF application, all have higher requirement to the performance of filter, size, reliability and cost.The leading indicator describing performance of filter has: passband operating frequency range, stop band frequency range, pass band insertion loss, stopband attenuation, passband input/output voltage standing-wave ratio, insertion phase shift and delay/frequency characteristic, temperature stability, volume, weight, reliability etc.
LTCC is a kind of Electronic Encapsulating Technology, adopts multi-layer ceramics technology, passive component can be built in medium substrate inside, and also active element can be mounted on substrate surface makes passive/active integrated functional module simultaneously.LTCC technology all shows many merits in cost, integration packaging, wiring live width and distance between centers of tracks, low impedance metal, design diversity and flexibility and high frequency performance etc., has become the mainstream technology of passive integration.The advantages such as it has high q-factor, is convenient to embedded passive device, and thermal diffusivity is good, and reliability is high, high temperature resistant, punching shake, utilize LTCC technology, can well process size little, precision is high, and tight type is good, the microwave device that loss is little.Because LTCC technology has the integrated advantage of 3 D stereo, be widely used for manufacturing various microwave passive components at microwave frequency band, the height realizing passive component is integrated.Based on the stack technology of LTCC technique, can realize three-dimensional integrated, thus various filter is had, and size is little, lightweight, performance is excellent, reliability is high, batch production performance consistency is good and the plurality of advantages such as low cost.Current most of filters, if will suppress the clutter frequency of near pass-band, the decay in stopband just seems not enough.
Summary of the invention
The object of the present invention is to provide the half lump semi VHF wave band high-performance band-pass filter device that a kind of Out-of-band rejection degree is excellent, in-band insertion loss is little, reliability is high, integrated level is high, size is little.
The technical scheme realizing the object of the invention is: a kind of VHF wave band high-performance band-pass filter device, comprises surface-pasted 50 ohmage input ports, input transmission line, the first resonator, the second resonator, the 3rd resonator, the 4th resonator, the 5th resonator, sixth resonator, the 7th resonator, the 8th resonator, exports transmission line, the first Z-shaped interstage coupling strip line, the second Z-shaped interstage coupling strip line, surface-pasted 50 ohmage output ports, wherein, the first resonator is formed by the first coil and the first Capacitance parallel connection, and one end of the first coil is connected with one end of the first electric capacity, the other end of the first coil and the other end of the first electric capacity ground connection respectively, second resonator is formed by the second coil and the second Capacitance parallel connection, and one end of the second coil is connected with one end of the second electric capacity, the other end of the second coil and the other end of the second electric capacity ground connection respectively, 3rd resonator is formed by tertiary coil and the 3rd Capacitance parallel connection, and one end of tertiary coil is connected with one end of the 3rd electric capacity, the other end of tertiary coil and the other end of the 3rd electric capacity ground connection respectively, 4th resonator is formed by the 4th coil and the 4th Capacitance parallel connection, and one end of the 4th coil is connected with one end of the 4th electric capacity, the other end of the 4th coil and the other end of the 4th electric capacity ground connection respectively, 5th resonator is formed by the 5th coil and the 5th Capacitance parallel connection, and one end of the 5th coil is connected with one end of the 5th electric capacity, the other end of the 5th coil and the other end of the 5th electric capacity ground connection respectively, sixth resonator is formed by the 6th coil and the 6th Capacitance parallel connection, and one end of the 6th coil is connected with one end of the 6th electric capacity, the other end of the 6th coil and the other end of the 6th electric capacity ground connection respectively, 7th resonator is formed by the 7th coil and the 7th Capacitance parallel connection, and one end of the 7th coil is connected with one end of the 7th electric capacity, the other end of the 7th coil and the other end of the 7th electric capacity ground connection respectively, 8th resonator is formed by the 8th coil and the 8th Capacitance parallel connection, and one end of the 8th coil is connected with one end of the 8th electric capacity, the other end of the 8th coil and the other end of the 8th electric capacity ground connection respectively, input transmission line, output transmission line are individual layer strip lines configuration, first coil, the second coil, tertiary coil, the 4th coil, the 5th coil, the 6th coil, the 7th coil, the 8th coil are six layers of square spiral coil structure, and the first electric capacity, the second electric capacity, the 3rd electric capacity, the 4th electric capacity, the 5th electric capacity, the 6th electric capacity, the 7th electric capacity, the 8th electric capacity are double-level-metal plate structure, surface-pasted 50 ohmage input ports are connected with one end of input transmission line, the other end of input transmission line is connected with the first electric capacity with the first coil, surface-pasted 50 ohmage output ports are connected with the one end exporting transmission line, the other end exporting transmission line is connected with the 7th electric capacity with the 7th coil, first Z-shaped interstage coupling strip line is positioned at the first resonator, second resonator, 3rd resonator, on 4th resonator, second Z-shaped interstage coupling strip line is positioned at the 5th resonator, sixth resonator, 7th resonator, on 8th resonator.
The present invention compared with prior art, its remarkable advantage is: (1) adopt low-loss low-temperature co-burning ceramic material and 3 D stereo integrated, use multilayer dielectric substrate, take full advantage of 3-dimensional multi-layered space, thus it is volume required to significantly reduce element, can greatly increase Out-of-band rejection degree under the prerequisite not improving logical in-band insertion loss by the cascade structure of filter; (2) this band pass filter is by the cascade of two level Four filters, can effectively increase Out-of-band rejection effect, thus the insertion loss taking into account band pass filter is better to the requirement of passband and stopband; (3) also have cost low, be conducive to advantages such as producing in batches, good selecting frequency characteristic, temperature performance are good, can be widely used in RF wireless communication system.
Accompanying drawing explanation
Fig. 1 is profile and the internal structure schematic diagram of VHF wave band high-performance band-pass filter device of the present invention.
Fig. 2 is the amplitude-versus-frequency curve of VHF wave band high-performance band-pass filter device of the present invention and the stationary wave characteristic curve of input/output port.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
Composition graphs 1, VHF wave band high-performance band-pass filter device of the present invention, comprises surface-pasted 50 ohmage input port P1, input transmission line R1, the first resonator L1, C1, the second resonator L2, C2, the 3rd resonator L3, C3, the 4th resonator L4, C4, the 5th resonator L5, C5, sixth resonator L6, C6, the 7th resonator L7, C7, the 8th resonator L8, C8, output transmission line R2, the first Z-shaped interstage coupling strip line Z1, the second Z-shaped interstage coupling strip line Z2, surface-pasted 50 ohmage output port P2.Wherein, first resonator L1, C1 is formed in parallel by the first coil L1 and the first electric capacity C1, and one end of the first coil L1 is connected with one end of the first electric capacity C1, the other end of the first coil L1 and the other end of the first electric capacity C1 ground connection respectively; Second resonator L2, C2 is formed in parallel by the second coil L2 and the second electric capacity C2, and one end of the second coil L2 is connected with one end of the second electric capacity C2, the other end of the second coil L2 and the other end of the second electric capacity C2 ground connection respectively; 3rd resonator L3, C3 is formed in parallel by tertiary coil L3 and the 3rd electric capacity C3, and one end of tertiary coil L3 is connected with one end of the 3rd electric capacity C3, the other end of tertiary coil L3 and the other end of the 3rd electric capacity C3 ground connection respectively; 4th resonator L4, C4 is formed in parallel by the 4th coil L4 and the 4th electric capacity C4, and one end of the 4th coil L4 is connected with one end of the 4th electric capacity C4, the other end of the 4th coil L4 and the other end of the 4th electric capacity C4 ground connection respectively; 5th resonator L5, C5 is formed in parallel by the 5th coil L5 and the 5th electric capacity C5, and one end of the 5th coil L5 is connected with one end of the 5th electric capacity C5, the other end of the 5th coil L5 and the other end of the 5th electric capacity C5 ground connection respectively; Sixth resonator L6, C6 are formed in parallel by the 6th coil L6 and the 6th electric capacity C6, and one end of the 6th coil L6 is connected with one end of the 6th electric capacity C6, the other end of the 6th coil L6 and the other end of the 6th electric capacity C6 ground connection respectively; 7th resonator L7, C7 is formed in parallel by the 7th coil L7 and the 7th electric capacity C7, and one end of the 7th coil L7 is connected with one end of the 7th electric capacity C7, the other end of the 7th coil L7 and the other end of the 7th electric capacity C7 ground connection respectively; 8th resonator L8, C8 is formed in parallel by the 8th coil L8 and the 8th electric capacity C8, and one end of the 8th coil L8 is connected with one end of the 8th electric capacity C8, the other end of the 8th coil L8 and the other end of the 8th electric capacity C8 ground connection respectively.Input transmission line R1, output transmission line R2 are individual layer strip lines configuration, first coil L1, the second coil L2, tertiary coil L3, the 4th coil L4, the 5th coil L5, the 6th coil L6, the 7th coil L7, the 8th coil L8 are six layers of square spiral coil structure, and the first electric capacity C1, the second electric capacity C2, the 3rd electric capacity C3, the 4th electric capacity C4, the 5th electric capacity C5, the 6th electric capacity C6, the 7th electric capacity C7, the 8th electric capacity C8 are double-level-metal plate structure.Surface-pasted 50 ohmage input port P1 are connected with one end of input transmission line R1, the other end of input transmission line R1 is connected with the first electric capacity C1 with the first coil L1, surface-pasted 50 ohmage output port P2 are connected with the one end exporting transmission line R2, the other end exporting transmission line R2 is connected with the 7th electric capacity C7 with the 7th coil L7, first Z-shaped interstage coupling strip line Z1 is positioned at the first resonator L1, C1, second resonator L2, C2, 3rd resonator L3, C3, 4th resonator L4, on C4, second Z-shaped interstage coupling strip line Z2 is positioned at the 5th resonator L5, C5, sixth resonator L6, C6, 7th resonator L7, C7, 8th resonator L8, on C8.
Coil central axe in each resonator and earth terminal perpendicular, the electric capacity in resonator all parallels with earth terminal.
First resonator L1, C1, 3rd resonator L3, C3, 5th resonator L5, C5, 7th resonator L7, C7 is positioned at same level, second resonator L2, C2, 4th resonator L4, C4, sixth resonator L6, C6, 8th resonator L8, C8 is positioned at another horizontal plane, first resonator L1, C1 and the second resonator L2, C2 is identical in the projection of earth terminal, 3rd resonator L3, C3 and the 4th resonator L4, C4 is identical in the projection of earth terminal, 5th resonator L5, C5 and sixth resonator L6, C6 is identical in the projection of earth terminal, 7th resonator L7, C7 and the 8th resonator L8, C8 is identical in the projection of earth terminal.
First coil L1, the second coil L2, tertiary coil L3, the 4th coil L4, the first electric capacity C1, the second electric capacity C2, the 3rd electric capacity C3, the 4th electric capacity C4 form the first band pass filter, and the 5th coil L5, the 6th coil L6, the 7th coil L7, the 8th coil L8, the 5th electric capacity C5, the 6th electric capacity C6, the 7th electric capacity C7, the 8th electric capacity C8 form the second band pass filter.
First coil L1, the second coil L2, tertiary coil L3, the 4th coil L4, the 5th coil L5, the 6th coil L6, the 7th coil L7, the 8th coil L8 are laminated construction.
First electric capacity C1, the second electric capacity C2, the 3rd electric capacity C3, the 4th electric capacity C4, the 5th electric capacity C5, the 6th electric capacity C6, the 7th electric capacity C7, the 8th electric capacity C8 are the capacity plate antenna of metal-dielectric-metal form, and the medium in the middle of capacity plate antenna is made up of LTCC ceramic substrate.
Surface-pasted 50 ohmage input port P1, surface-pasted 50 ohmage output port P2, input transmission line R1, export transmission line R2, first coil L1, second coil L2, tertiary coil L3, 4th coil L4, 5th coil L5, 6th coil L6, 7th coil L7, 8th coil L8, first electric capacity C1, second electric capacity C2, 3rd electric capacity C3, 4th electric capacity C4, 5th electric capacity C5, 6th electric capacity C6, 7th electric capacity C7, 8th electric capacity C8 all adopts multilayer LTCC technique to realize.
The size of VHF wave band high-performance band-pass filter device of the present invention is only 9mm × 5mm × 1.5mm, its performance can be as can be seen from Figure 2, pass band width is 110MHz ~ 170MHz, insertion loss in passband is less than 3.6dB, when DC<f<80MHz, Out-of-band rejection is better than 49dB, and when f>200MHz, Out-of-band rejection is due to 38dB.
In sum, present invention employs the band pass filter that half lump half distributed architecture realizes, sandwich construction adopts LTCC technique to realize, this technology is compared with other multi-layer substrate, be easier to realize multilayer wiring and encapsulation integral structure, reduce volume and weight further, improve reliability, therefore this technology significantly can reduce device volume under the prerequisite realizing identical index, improves device integration.
Claims (7)
1. a VHF wave band high-performance band-pass filter device, it is characterized in that: comprise surface-pasted 50 ohmage input ports (P1), input transmission line (R1), first resonator (L1, C1), second resonator (L2, C2), 3rd resonator (L3, C3), 4th resonator (L4, C4), 5th resonator (L5, C5), sixth resonator (L6, C6), 7th resonator (L7, C7), 8th resonator (L8, C8), export transmission line (R2), first Z-shaped interstage coupling strip line (Z1), second Z-shaped interstage coupling strip line (Z2), surface-pasted 50 ohmage output ports (P2), wherein, first resonator (L1, C1) is formed in parallel by the first coil (L1) and the first electric capacity (C1), one end of first coil (L1) is connected with one end of the first electric capacity (C1), the other end of the first coil (L1) and the other end of the first electric capacity (C1) ground connection respectively, second resonator (L2, C2) is formed in parallel by the second coil (L2) and the second electric capacity (C2), one end of second coil (L2) is connected with one end of the second electric capacity (C2), the other end of the second coil (L2) and the other end of the second electric capacity (C2) ground connection respectively, 3rd resonator (L3, C3) is formed in parallel by tertiary coil (L3) and the 3rd electric capacity (C3), one end of tertiary coil (L3) is connected with one end of the 3rd electric capacity (C3), the other end of tertiary coil (L3) and the other end of the 3rd electric capacity (C3) ground connection respectively, 4th resonator (L4, C4) is formed in parallel by the 4th coil (L4) and the 4th electric capacity (C4), one end of 4th coil (L4) is connected with one end of the 4th electric capacity (C4), the other end of the 4th coil (L4) and the other end of the 4th electric capacity (C4) ground connection respectively, 5th resonator (L5, C5) is formed in parallel by the 5th coil (L5) and the 5th electric capacity (C5), one end of 5th coil (L5) is connected with one end of the 5th electric capacity (C5), the other end of the 5th coil (L5) and the other end of the 5th electric capacity (C5) ground connection respectively, sixth resonator (L6, C6) is formed in parallel by the 6th coil (L6) and the 6th electric capacity (C6), one end of 6th coil (L6) is connected with one end of the 6th electric capacity (C6), the other end of the 6th coil (L6) and the other end of the 6th electric capacity (C6) ground connection respectively, 7th resonator (L7, C7) is formed in parallel by the 7th coil (L7) and the 7th electric capacity (C7), one end of 7th coil (L7) is connected with one end of the 7th electric capacity (C7), the other end of the 7th coil (L7) and the other end of the 7th electric capacity (C7) ground connection respectively, 8th resonator (L8, C8) is formed in parallel by the 8th coil (L8) and the 8th electric capacity (C8), one end of 8th coil (L8) is connected with one end of the 8th electric capacity (C8), the other end of the 8th coil (L8) and the other end of the 8th electric capacity (C8) ground connection respectively, input transmission line (R1), exporting transmission line (R2) is individual layer strip lines configuration, first coil (L1), second coil (L2), tertiary coil (L3), 4th coil (L4), 5th coil (L5), 6th coil (L6), 7th coil (L7), 8th coil (L8) is six layers of square spiral coil structure, first electric capacity (C1), second electric capacity (C2), 3rd electric capacity (C3), 4th electric capacity (C4), 5th electric capacity (C5), 6th electric capacity (C6), 7th electric capacity (C7), 8th electric capacity (C8) is double-level-metal plate structure, surface-pasted 50 ohmage input ports (P1) are connected with one end of input transmission line (R1), the other end of input transmission line (R1) is connected with the first electric capacity (C1) with the first coil (L1), surface-pasted 50 ohmage output ports (P2) are connected with the one end exporting transmission line (R2), the other end exporting transmission line (R2) is connected with the 7th electric capacity (C7) with the 7th coil (L7), first Z-shaped interstage coupling strip line (Z1) is positioned at the first resonator (L1, C1), second resonator (L2, C2), 3rd resonator (L3, C3), 4th resonator (L4, C4) on, second Z-shaped interstage coupling strip line (Z2) is positioned at the 5th resonator (L5, C5), sixth resonator (L6, C6), 7th resonator (L7, C7), 8th resonator (L8, C8) on.
2. VHF wave band high-performance band-pass filter device according to claim 1, is characterized in that: the coil central axe in described each resonator is mutually vertical with earth terminal, and the electric capacity in resonator all parallels with earth terminal.
3. VHF wave band high-performance band-pass filter device according to claim 1, it is characterized in that: described first resonator (L1, C1), 3rd resonator (L3, C3), 5th resonator (L5, C5), 7th resonator (L7, C7) same level is positioned at, second resonator (L2, C2), 4th resonator (L4, C4), sixth resonator (L6, C6), 8th resonator (L8, C8) another horizontal plane is positioned at, first resonator (L1, C1) and the second resonator (L2, C2) identical in the projection of earth terminal, 3rd resonator (L3, C3) the and four resonator (L4, C4) identical in the projection of earth terminal, 5th resonator (L5, and sixth resonator (L6 C5), C6) identical in the projection of earth terminal, 7th resonator (L7, C7) the and eight resonator (L8, C8) identical in the projection of earth terminal.
4. VHF wave band high-performance band-pass filter device according to claim 1, it is characterized in that: described first coil (L1), second coil (L2), tertiary coil (L3), 4th coil (L4), first electric capacity (C1), second electric capacity (C2), 3rd electric capacity (C3), 4th electric capacity (C4) forms the first band pass filter, 5th coil (L5), 6th coil (L6), 7th coil (L7), 8th coil (L8), 5th electric capacity (C5), 6th electric capacity (C6), 7th electric capacity (C7), 8th electric capacity (C8) forms the second band pass filter.
5. VHF wave band high-performance band-pass filter device according to claim 1, is characterized in that: described first coil (L1), the second coil (L2), tertiary coil (L3), the 4th coil (L4), the 5th coil (L5), the 6th coil (L6), the 7th coil (L7), the 8th coil (L8) are laminated construction.
6. VHF wave band high-performance band-pass filter device according to claim 1, it is characterized in that: described first electric capacity (C1), the second electric capacity (C2), the 3rd electric capacity (C3), the 4th electric capacity (C4), the 5th electric capacity (C5), the 6th electric capacity (C6), the 7th electric capacity (C7), the 8th electric capacity (C8) are the capacity plate antenna of metal-dielectric-metal form, and the medium in the middle of capacity plate antenna is made up of LTCC ceramic substrate.
7. VHF wave band high-performance band-pass filter device according to claim 1, it is characterized in that: surface-pasted 50 ohmage input ports (P1), surface-pasted 50 ohmage output ports (P2), input transmission line (R1), export transmission line (R2), first coil (L1), second coil (L2), tertiary coil (L3), 4th coil (L4), 5th coil (L5), 6th coil (L6), 7th coil (L7), 8th coil (L8), first electric capacity (C1), second electric capacity (C2), 3rd electric capacity (C3), 4th electric capacity (C4), 5th electric capacity (C5), 6th electric capacity (C6), 7th electric capacity (C7), 8th electric capacity (C8) all adopts multilayer LTCC technique to realize.
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| CN104835999A (en) * | 2015-05-21 | 2015-08-12 | 南京理工大学 | VLF (very low frequency) ultra-narrow band low-pass filter |
| CN104967424A (en) * | 2015-07-14 | 2015-10-07 | 南京理工大学 | UHF and SHF waveband miniature duplexer |
| CN104967423A (en) * | 2015-07-14 | 2015-10-07 | 南京理工大学 | UHF waveband miniature duplexer |
| CN104993198A (en) * | 2015-07-13 | 2015-10-21 | 南京理工大学 | Ultrahigh-frequency mixing diplexer filter |
| CN105024123A (en) * | 2015-08-07 | 2015-11-04 | 南京理工大学 | High-performance filter bank based on LTCC lumped and semi-lumped structure |
| CN105119031A (en) * | 2015-08-27 | 2015-12-02 | 南京理工大学 | One-out-three minisize microwave filter set in VHF waveband and UHF waveband |
| CN105206901A (en) * | 2015-08-27 | 2015-12-30 | 南京理工大学 | VHF-waveband miniature duplexer |
| CN106099277A (en) * | 2016-06-01 | 2016-11-09 | 南京理工大学 | Ultrahigh frequency band is double selects a microwave filter group |
| CN107517042A (en) * | 2017-08-21 | 2017-12-26 | 南京理工大学 | Low pass integrated filter with numerical control attenuation |
| CN109216837A (en) * | 2017-07-03 | 2019-01-15 | Tdk株式会社 | Laminated electronic component |
| CN110651393A (en) * | 2017-05-11 | 2020-01-03 | 伊根图有限公司 | Band-pass filter based on coupling transmission line |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104835999A (en) * | 2015-05-21 | 2015-08-12 | 南京理工大学 | VLF (very low frequency) ultra-narrow band low-pass filter |
| CN104993198A (en) * | 2015-07-13 | 2015-10-21 | 南京理工大学 | Ultrahigh-frequency mixing diplexer filter |
| CN104967424A (en) * | 2015-07-14 | 2015-10-07 | 南京理工大学 | UHF and SHF waveband miniature duplexer |
| CN104967423A (en) * | 2015-07-14 | 2015-10-07 | 南京理工大学 | UHF waveband miniature duplexer |
| CN105024123A (en) * | 2015-08-07 | 2015-11-04 | 南京理工大学 | High-performance filter bank based on LTCC lumped and semi-lumped structure |
| CN105119031A (en) * | 2015-08-27 | 2015-12-02 | 南京理工大学 | One-out-three minisize microwave filter set in VHF waveband and UHF waveband |
| CN105206901A (en) * | 2015-08-27 | 2015-12-30 | 南京理工大学 | VHF-waveband miniature duplexer |
| CN106099277A (en) * | 2016-06-01 | 2016-11-09 | 南京理工大学 | Ultrahigh frequency band is double selects a microwave filter group |
| CN110651393A (en) * | 2017-05-11 | 2020-01-03 | 伊根图有限公司 | Band-pass filter based on coupling transmission line |
| CN109216837A (en) * | 2017-07-03 | 2019-01-15 | Tdk株式会社 | Laminated electronic component |
| CN107517042A (en) * | 2017-08-21 | 2017-12-26 | 南京理工大学 | Low pass integrated filter with numerical control attenuation |
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